Electronic Instrumentation Laboratory
Department of Microelectronics

Selected publications

  1. Chameleon: A Multiplier-Free Temporal Convolutional Network Accelerator for End-to-End Few-Shot and Continual Learning from Sequential Data
    Blanken, Douwe den; Frenkel, Charlotte;
    IEEE Journal of Solid-State Circuits,
    pp. 1-16, 2026. DOI: 10.1109/JSSC.2025.3645640
    Keywords: ... System-on-chip;Accuracy;Training;Metalearning;Computational modeling;Vectors;Testing;Prototypes;Integrated circuit modeling;Edge AI;Continual learning (CL);digital accelerator;few-shot learning (FSL);keyword spotting (KWS);multiplier-free;sequential data;system-on-chip (SoC);temporal convolutional network (TCN).

  2. A PNP-Based Temperature Sensor With Continuous-Time Readout and ±0.1 ∘C (3σ) Inaccuracy From -55 ∘C to 125 ∘C
    Toth, Nandor G.; Tang, Zhong; Someya, Teruki; Pan, Sining; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 60, Issue 2, pp. 593-602, 2025. DOI: 10.1109/JSSC.2024.3402131
    Keywords: ... Temperature sensors;Resistors;Energy efficiency;Instruments;Temperature dependence;Modulation;Energy resolution;Bitstream-controlled (BSC) dynamic-element-matching (DEM);continuous-time (CT) ΔΣ-modulator;current-mode readout;PNP-based temperature sensor;resistor ratio self-calibration.

  3. A 0.028-mm2 32-MHz RC Frequency Reference With an Inaccuracy of ±900 ppm From -40 ∘C to 125 ∘C and ±1600 ppm After Accelerated Aging
    Pan, Sining; Cheng, Yihang; Wu, Guohua; Wang, Zhihua; Makinwa, Kofi A. A.; Wu, Huaqiang;
    IEEE Journal of Solid-State Circuits,
    pp. 1-11, 2025. DOI: 10.1109/JSSC.2025.3530944
    Keywords: ... Resistors;Temperature dependence;Frequency locked loops;Accelerated aging;Voltage-controlled oscillators;Voltage;Capacitors;Standards;Transistors;Temperature measurement;Accelerated aging;bipolar junction transistor (BJT);CMOS frequency reference;long-term inaccuracy;RC frequency reference;temperature compensation.

  4. A 0.8-V BJT-Based Temperature Sensor With an Inaccuracy of $\pm$ 0.4 $^\circ$ C (3 $\sigma$ ) From $-$ 40 $^\circ$ C to 125 $^\circ$ C in 22-nm CMOS
    Tang, Zhong; Yu, Xiao-Peng; Makinwa, Kofi A. A.; Tan, Nick Nianxiong;
    IEEE Journal of Solid-State Circuits,
    pp. 1-9, 2025. DOI: 10.1109/JSSC.2024.3523482
    Keywords: ... Temperature sensors;Capacitors;Sensors;Voltage;Charge pumps;Switches;Voltage control;Accuracy;Transistors;Discharges (electric); $\Delta\Sigma$ modulator;capacitively biased (CB) bipolar junction transistor (BJT);charge pump;inverter-based amplifier;temperature sensor;temperature to digital converter.

  5. A Sub-1-V Capacitively-Biased Voltage Reference With an Auto-Zeroed Buffer and a TC of 18-ppm/°C
    Eum, Heungsik; Makinwa, Kofi A. A.; Lee, Inhee; Chae, Youngcheol;
    IEEE Transactions on Circuits and Systems II: Express Briefs,
    Volume 72, Issue 1, pp. 8-12, 2025. DOI: 10.1109/TCSII.2024.3454348
    Keywords: ... Circuits;Discharges (electric);Timing;Temperature measurement;Noise;Capacitors;CMOS process;CMOS voltage reference;capacitively-bias circuit;sub-threshold voltage reference;CMOS analog design;sub-1-V;high-precision circuits.

  6. Inverted Pyramid 3-axis Silicon Hall Effect Magnetic Sensor With Offset Cancellation
    Jacopo Ruggeri; Udo Ausserlechner; Helmut Köck; Karen Dowling;
    Microsystems & Nanonengineering,
    Jan 2025. accepted for publication.
    Abstract: ... Microelectronic magnetic sensors are essential in diverse applications, including automotive, industrial, and consumer electronics. Hall-effect devices hold the largest share of the magnetic sensor market, and they are particularly valued for their reliability, low cost and CMOS compatibility. This paper introduces a novel 3-axis Hall-effect sensor element based on an inverted pyramid structure, realized by leveraging MEMS micromachining and CMOS processing. The devices are manufactured by etching the pyramid openings with TMAH and implanting the sloped walls with n-dopants to define the active area. Through the use of various bias-sense detection modes, the device is able to detect both in-plane and out-of-plane magnetic fields within a single compact structure. In addition, the offset can be significantly reduced by one to three orders of magnitude by employing the current-spinning method. The device presented in this work demonstrated high in-plane and out-of-plane current- and voltage-related sensitivities ranging between 64.1 to 198 V A^−1 T^−1 and 14.8 to 21.4 mV V^−1 T^−1, with crosstalk below 4.7 %. The sensor exhibits a thermal noise floor which corresponds to approximately 0.5 μV√Hz at 1.31 V supply. This novel Hall-effect sensor represents a promising and simpler alternative to existing state-of-the-art 3-axis magnetic sensors, offering a viable solution for precise and reliable magnetic field sensing in various applications such as position feedback and power monitoring.

  7. An Amplitude-Programmable Energy-Recycling High-Voltage Resonant Pulser for Battery-Powered Ultrasound Devices
    Bellouki, Imad; Rozsa, Nuriel N. M.; Chang, Zu-Yao; Chen, Zhao; Tan, Mingliang; Pertijs, Michiel A. P.;
    IEEE Journal of Solid-State Circuits,
    Volume 60, Issue 6, pp. 2048--2059, June 2025. DOI: 10.1109/JSSC.2024.3494536
    Abstract: ... This article presents an application-specific integrated circuit (ASIC) for battery-powered ultrasound (US) devices. The ASIC implements a novel energy-efficient high-voltage (HV) pulser that generates HV transmit (TX) pulses directly from a low-voltage (LV) battery supply. By means of a single off-chip inductor, energy is supplied to a US transducer in a resonant fashion, directly generating half-period sinusoidal HV pulses on the transducer, while consuming substantially less energy than a conventional class-D pulser. By recycling residual reactive energy from the transducer back to the input, the energy consumption is further reduced by more than 50%. The autocalibration techniques are leveraged to deal with tolerances of the inductor, transducer, and battery supply and thus maximize the energy efficiency. A prototype chip was fabricated in TSMC 0.18-μm HV BCD technology and used to drive external 120pF capacitive micromachined US transducers (CMUTs) with a center frequency of approximately 2.5 MHz. Electrical measurements show that the prototype can generate pulses with a peak amplitude between 10 and 30 V accurate to within ±1 V. Acoustic measurements demonstrate successful ultrasonic pulse transmission and pulse-echo measurements. The prototype reaches a peak efficiency of 0.23 fCV2, which is the highest reported to date for HV pulsers targeting US imaging.

  8. A 2000-volumes/s 3-D Ultrasound Probe With Monolithically-Integrated 23 $\times$ 23-mm2 4096-Element CMUT Array
    Rozsa, Nuriel N. M.; Chen, Zhao; Kim, Taehoon; Guo, Peng; Hopf, Yannick M.; Voorneveld, Jason; dos Santos, Djalma Simoes; Noothout, Emile; Chang, Zu-Yao; Chen, Chao; Henneken, Vincent A.; de Jong, Nico; Vos, Hendrik J.; Bosch, Johan G.; Verweij, Martin D.; Pertijs, Michiel A. P.;
    IEEE Journal of Solid-State Circuits,
    Volume 60, Issue 4, pp. 1397--1410, April 2025. DOI: 10.1109/JSSC.2025.3534087
    Abstract: ... This article presents a 4096-element ultrasound probe for high volume-rate (HVR) cardiovascular imaging. The probe consists of two application-specific integrated circuits (ASICs), each of which interfaces with a 2048-element monolithically-integrated capacitive micro-machined ultrasound transducer (CMUT) array. The probe can image a 60∘ × 60∘ × 10-cm volume at 2000 volumes/s, the highest volume-rate with in-probe channel-count reduction reported to date. It uses 2 × 2 delay-and-sum micro-beamforming (μBF) and 2× time-division multiplexing (TDM) to achieve an 8× receive (RX) channel-count reduction. Equalization, trained using a pseudorandom bit-sequence generated on the chip, reduces TDM-induced crosstalk by 10 dB, enabling power-efficient scaling of the cable drivers. The ASICs also implement a novel transmit (TX) beamformer (BF) that operates as a programmable digital pipeline, which enables steering of arbitrary pulse-density modulated (PDM) waveforms. The TX BF drives element-level 65 V unipolar pulsers, which in turn drive the CMUT array. Both the TX BF and RX μBF are programmed with shift-registers (SRs) that can either be programmed in a row-column fashion for fast upload times, or daisy-chain fashion for a higher flexibility. The layout of the ASICs is matched to the 365-μm-pitch monolithically-integrated CMUT array. While operating, the RX and logic power consumption per element is 0.85 and 0.10 mW, respectively. TX power consumption is highly waveform dependent, but is nominally 0.34 mW. Compared to the prior art, the probe has the highest volume rate, and features among the largest imaging arrays (both in terms of element-count and aperture) with a high flexibility in defining the TX waveform. These properties make it a suitable option for applications requiring HVR imaging of a large region of interest.

  9. Energy dissipation in silicon nitride microbeam resonators with a 3D-printed polymer layer
    Crocetto, Lucia; Manzaneque, Tomás; Ghatkesar, Murali Krishna;
    Micro and Nano Engineering,
    Volume 28, pp. 100300, September 2025. DOI: 10.1016/j.mne.2025.100300

  10. Using Image Quality Metrics to Optimize the Design of Integrated Medical Ultrasound ADCs
    Nikola Radeljic-Jakic; Adriaan J. Flikweert; Nuriel N. M.Rozsa; Hendrik J. Vos; Michiel A. P. Pertijs;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 72, Issue 8, pp. 1065--1078, August 2025. DOI: 10.1109/TUFFC.2025.3577258

  11. Biodegradable Microwave Cavity Resonator
    Bathaei, Mohammad Javad; Hashemizadeh, Sina; Arroyo Cardoso, Filipe; Nikolayev, Denys; Boutry, Clementine M.;
    IEEE Microwave and Wireless Technology Letters,
    pp. 1-4, 2025. DOI: 10.1109/LMWT.2025.3588738
    Keywords: ... Impedance;Biomembranes;Sensors;Antennas;Wireless sensor networks;Resonant frequency;Resonance;Couplers;Wireless communication;Robot sensing systems;3-D printing;biodegradable materials;cavity resonator;laser cutting.

    Abstract: ... This letter presents the first fabrication and characterization of a biodegradable coaxial cavity resonator, focusing on the measurement of complex permittivity of encapsulation as well as |S11| and impedance parameters. The resonator components are 3D-printed from plant-based resin, coated with silver-coated copper flakes, and enclosed by a laser-cut zinc membrane. A monopole coupler antenna, inspired by the “Great Seal Bug,” is co-designed with the cavity to enable near-field coupling and achieve frequency-selective, near- 50 Ω impedance-matched wireless sensing. Numerical and experimental analysis of the gap between post and membrane (G-post), and between the coupler antenna and post, resulted in | S11| of −30.3 dB at 1.7 GHz, and a quality factor of 307, outperforming existing flat biodegradable resonators. A 40-MHz resonance shift is observed with a 20 μ m variation in G-post, highlighting the resonator’s high sensitivity to membrane position. This system enables battery-free wireless sensing with biodegradable antennas for biodiversity monitoring.

  12. Wearable and Implantable Devices for Continuous Monitoring of Muscle Physiological Activity: A Review
    Liao, Zhengwei; Golparvar, Ata; Bathaei, Mohammad Javad; Cardoso, Filipe Arroyo; Boutry, Clementine M.;
    Advanced Science,
    pp. e09934, 2025. DOI: https://doi.org/10.1002/advs.202509934
    Keywords: ... bioelectronics, biomechanics, electrophysiology, soft and flexible electronics, tissue oxygenation.

    Abstract: ... Abstract Muscle plays a vital role in movement and metabolic regulation, establishing it as a cornerstone of overall health. Monitoring muscular parameters is critical for disease diagnosis, post-surgical recovery, and human–machine interface control. In recent decades, numerous technologies have emerged to monitor muscular biophysical and biochemical processes. The field has transitioned significantly from reliance on large, clinic-bound instrumentation to the development of miniaturized wearable and implantable systems capable of continuous real-time monitoring in everyday settings. This article presents a critical overview of recent advances, with a focus on material and device innovations in muscular monitoring. Starting with the fundamental characteristics of muscle tissue and the physiological origins of biosignals, the discussion subsequently shifts to recent developments in wearable and implantable bioelectronic systems tailored to monitor electrophysiological, biomechanical, and tissue oxygenation signals. Finally, current research challenges and outline emerging opportunities are highlighted in muscular monitoring. Owing to its interdisciplinary nature and growing societal demand for personalized healthcare, muscular monitoring is poised to catalyze transformative innovations in both clinical and consumer applications.

    document

  13. A Single-Inductor-Based High-Voltage Transmit Beamformer for Wearable Ultrasound Devices Achieving 88\% $fCV^2$ Power Reduction
    Peng Guo; Zu-Yao Chang; Michiel A. P. Pertijs; Tiago L. Costa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2025. accepted.

  14. Piezoelectric Micromachined Ultrasonic Transducer (PMUT) Based on Bilayer X-Cut Lithium Niobate
    X. Zhao; M. Pertijs; T. Manzaneque;
    In Proc. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    June 2025. accepted.

  15. A BJT-Based Temperature Sensor with an 80fJ.K2 Resolution FoM
    Toth, Nandor G.; Makinwa, Kofi A. A.;
    In 2025 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 476-478, 2025. DOI: 10.1109/ISSCC49661.2025.10904777
    Keywords: ... Temperature sensors;Accuracy;Energy resolution;Energy efficiency;Sensors;Solid state circuits.

  16. A 125μm-Pitch-Matched Transceiver ASIC with Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography
    Peng Guo; Fabian Fool; Zu-Yao Chang; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Nico de Jong; Martin D. Verweij; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 8, pp. 2604--2617, August 2024. DOI: 10.1109/JSSC.2024.3355854
    Abstract: ... This article presents a pitch-matched transceiver application-specific integrated circuit (ASIC) for a wearable ultrasound device intended for transfontanelle ultrasonography, which includes element-level 20-V unipolar pulsers with transmit (TX) beamforming, and receive (RX) circuitry that combines eightfold multiplexing, four-channel micro-beamforming (μBF), and subgroup-level digitization to achieve an initial 32-fold channel-count reduction. The μBF is based on passive boxcar integration, merged with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering (AAF) and power-hungry ADC drivers. A compact and low-power reference generator employs an area-efficient MOS capacitor as a reservoir to quickly set a reference for the ADC in the charge domain. A low-power multi-level data link, based on 16-level pulse-amplitude modulation, concatenates the outputs of four ADCs, providing an overall 128-fold channel-count reduction. A prototype transceiver ASIC was fabricated in a 180-nm BCD technology, and interfaces with a 2-D PZT transducer array of 16×16 elements with a pitch of 125 μm and a center frequency of 9 MHz. The ASIC consumes 1.83 mW/element. The data link achieves an aggregate 3.84 Gb/s data rate with 3.3 pJ/bit energy efficiency. The ASIC’s functionality has been demonstrated through electrical, acoustic, and imaging experiments.

  17. An Ultrasound Matrix Transducer for High-Frame-Rate 3-D Intra-cardiac Echocardiography
    dos Santos, Djalma Simões; Ossenkoppele, Boudewine; Hopf, Yannick M.; Soozande, Mehdi; Noothout, Emile; Vos, Hendrik J.; Bosch, Johan G.; Pertijs, Michiel A. P.; Verweij, Martin D.; de Jong, Nico;
    Ultrasound in Medicine \& Biology,
    Volume 50, Issue 2, pp. 285--294, February 2024. DOI: 10.1016/j.ultrasmedbio.2023.11.001
    Abstract: ... Objective - Described here is the development of an ultrasound matrix transducer prototype for high-frame-rate 3-D intra-cardiac echocardiography. Methods - The matrix array consists of 16 × 18 lead zirconate titanate elements with a pitch of 160 µm × 160 µm built on top of an application-specific integrated circuit that generates transmission signals and digitizes the received signals. To reduce the number of cables in the catheter to a feasible number, we implement subarray beamforming and digitization in receive and use a combination of time-division multiplexing and pulse amplitude modulation data transmission, achieving an 18-fold reduction. The proposed imaging scheme employs seven fan-shaped diverging transmit beams operating at a pulse repetition frequency of 7.7 kHz to obtain a high frame rate. The performance of the prototype is characterized, and its functionality is fully verified. Results - The transducer exhibits a transmit efficiency of 28 Pa/V at 5 cm per element and a bandwidth of 60% in transmission. In receive, a dynamic range of 80 dB is measured with a minimum detectable pressure of 10 Pa per element. The element yield of the prototype is 98%, indicating the efficacy of the manufacturing process. The transducer is capable of imaging at a frame rate of up to 1000 volumes/s and is intended to cover a volume of 70° × 70° × 10 cm. Conclusion - These advanced imaging capabilities have the potential to support complex interventional procedures and enable full-volumetric flow, tissue, and electromechanical wave tracking in the heart.

  18. A 120-MHz BW, 122-dBFS SFDR CTΔΣ ADC With a Multi-Path Multi-Frequency Chopping Scheme
    Javvaji, Sundeep; Bolatkale, Muhammed; Bajoria, Shagun; Rutten, Robert; Essink, Bert Oude; Beijens, Koen; Makinwa, Kofi A. A.; Breems, Lucien J.;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 4, pp. 1184-1193, 2024. DOI: 10.1109/JSSC.2024.3354574
    Keywords: ... Quantization (signal);1/f noise;Resistors;Capacitors;Inverters;Clocks;Switches;Analog-to-digital converter (ADC);continuous time (CT);delta–sigma (ΔΣ);multi-path chopping;wideband receiver.

  19. A PNP-Based Temperature Sensor With Continuous-Time Readout and ± 0.1 °C (3σ) Inaccuracy From -55 °C to 125 °C
    Toth, Nandor G.; Tang, Zhong; Someya, Teruki; Pan, Sining; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    pp. 1-10, 2024. DOI: 10.1109/JSSC.2024.3402131
    Keywords: ... Temperature sensors; Resistors; Energy efficiency; Instruments; Temperature dependence; Modulation; Energy resolution;Bitstream-controlled (BSC) dynamic-element-matching (DEM);continuous-time (CT) ΔΣ-modulator; current-mode readout; PNP-based temperature sensor; resistor ratio self-calibration.

    Abstract: ... This article describes a PNP-based temperature sensor that achieves both high energy efficiency and accuracy. Two resistors convert the CTAT and PTAT voltages generated by a PNP-based front-end into two currents whose ratio is then digitized by a continuous-time (CT) ΔΣ-modulator. Chopping and dynamic-element-matching (DEM) are used to mitigate the effects of component mismatch and 1/f noise, while the spread in VBE and in the ratio of the two resistors is digitally trimmed at room temperature (RT). Fabricated in a 0.18 μm CMOS process, the sensor occupies 0.12 mm2, and draws 9.5 μA from a supply voltage ranging from 1.7 to 2.2 V. Measurements on 40 samples from one batch show that it achieves an inaccuracy of ±0.1 °C (3σ ) from −55 °C to 125 °C, and a commensurate supply sensitivity of only 0.01 °C/V. Furthermore, it achieves high energy efficiency, with a resolution Figure of Merit (FoM) of 0.85 pJ·K2.

  20. A Coupling-Adaptive Wireless Power Transfer System With Voltage-/Current-Mode Receiver and Global Digital-PWM Regulation
    Lu, Tianqi; Du, Sijun;
    IEEE Journal of Solid-State Circuits,
    pp. 1-13, 2024. DOI: 10.1109/JSSC.2024.3461857

  21. A Bias-Flip Rectifier With Duty-Cycle-Based MPPT for Piezoelectric Energy Harvesting
    Yue, Xinling; Javvaji, Sundeep; Tang, Zhong; Makinwa, Kofi A. A.; Du, Sijun;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 6, pp. 1771-1781, 2024. DOI: 10.1109/JSSC.2023.3313733
    Keywords: ... Rectifiers;Maximum power point trackers;Power generation;Vibrations;Voltage measurement;Energy harvesting;Capacitors;Bias-flip rectifier;duty-cycle-based (DCB);energy harvesting;maximum power point tracking (MPPT);piezoelectric energy harvester;synchronized switch harvesting on inductor (SSHI).

  22. A Single-Stage Dual-Output Regulating Voltage Doubler for Wireless Power Transfer
    Lu, Tianqi; Makinwa, Kofi A. A.; Du, Sijun;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 9, pp. 2922-2933, 2024. DOI: 10.1109/JSSC.2024.3378675
    Keywords: ... Video recording;Voltage control;Rectifiers;Topology;Coils;Power transistors;Periodic structures;Biomedical implantable devices;dual output;regulating rectifier;single-stage receiver (RX);voltage doubler (VD);wireless power transfer (WPT).

  23. A β-Compensated NPN-Based Temperature Sensor With ±0.1 °C (3σ) Inaccuracy From -55 °C to 125 °C and 200fJ · K² Resolution FoM
    Toth, Nandor G.; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 12, pp. 4068-4076, 2024. DOI: 10.1109/JSSC.2024.3440071
    Keywords: ... Temperature sensors;Accuracy;Energy efficiency;Resistors;Energy resolution;Noise;Calibration;β-compensation;continuous-time (CT) ΔΣ-modulator;current-mode readout;NPN-based temperature sensor;resistor ratio calibration.

  24. A 14-b BW /Power Scalable Sensor Interface With a Dynamic Bandgap Reference
    Tang, Zhong; Liu, Yuyan; Chen, Pengpeng; Wang, Haining; Yu, Xiao-Peng; Makinwa, Kofi A. A.; Nianxiong Tan, Nick;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 12, pp. 4077-4087, 2024. DOI: 10.1109/JSSC.2024.3471820
    Keywords: ... Capacitors;Noise;Discharges (electric);Photonic band gap;Modulation;Temperature sensors;Time-domain analysis;Temperature measurement;Turning;Inverters; $\Delta \Sigma $ ADC;analog-to-digital converter;bandgap reference (BGR);capacitively biased (CB) BJT;floating inverter amplifier (FIA);poly-phase filter (PPF).

  25. Pitch-Matched Integrated Circuits for Ultrasound Transducer Arrays
    Pertijs, Michiel; Hopf, Yannick; Guo, Peng;
    In Imaging Sensors, Power Management, PLLs and Frequency Synthesizers ‐ Advances in Analog Circuit Design,
    Springer Science \& Business Media, December 2024. DOI: 10.1007/978-3-031-71559-4_1
    Abstract: ... While medical imaging using ultrasound is an established field, technical advances are enabling a range of new-use cases and associated new ultrasound imaging devices. Examples include catheters capable of providing real-time 3D images to guide minimally invasive interventions and wearable devices for new monitoring and diagnostic applications. In contrast with conventional probes, which contain little or no electronics, these new devices need to become “smart”: integrated circuits need to be integrated into the probe to interface in a pitch-matched fashion with the many transducer elements (typically 1000+) needed for real-time 3D imaging. This chapter discusses the challenges associated with the design of such pitch-matched integrated circuits, focusing on strategies for channel-count reduction, beamforming, and digitization. The chapter includes a case study of a state-of-the-art catheter-based design for high-frame-rate 3D intracardiac imaging.

  26. A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7x23.4mm² 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer
    Nuriel M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1--2, June 2024. DOI: 10.1109/VLSITechnologyandCir46783.2024.10631363

  27. A Switching-Mode Single-Stage Dual-Output Regulating Rectifier Achieving 92.33% Efficiency and Extended Range for Wireless Power Transfer
    Lu, Tianqi; Du, Sijun;
    In 2024 IEEE European Solid-State Electronics Research Conference (ESSERC),
    pp. 169-172, 2024. DOI: 10.1109/ESSERC62670.2024.10719538

  28. A Fully Integrated Recursive Switched-Capacitor DC-DC Converter with Hybrid Hysteresis-CFM Control
    Li, Shuangmu; Lu, Tianqi; Jiang, Junmin; Du, Sijun;
    In 2024 IEEE European Solid-State Electronics Research Conference (ESSERC),
    pp. 57-60, 2024. DOI: 10.1109/ESSERC62670.2024.10719469

  29. A 3-Phase Resonant Current-Mode Wireless Power Receiver with Residual-Free Energy Delivery and Digital-Assisted ZVS Achieving 94.5% Efficiency
    Lu, Tianqi; Du, Sijun;
    In 2024 IEEE Custom Integrated Circuits Conference (CICC),
    pp. 1-2, 2024. DOI: 10.1109/CICC60959.2024.10529042

  30. 27.4 A 13.56MHz Wireless Power Transfer System with Hybrid Voltage-/Current-Mode Receiver and Global Digital-PWM Regulation Achieving 150% Transfer Range Extension and 72.3% End-to-End Efficiency
    Lu, Tianqi; Du, Sijun;
    In 2024 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 450-452, 2024. DOI: 10.1109/ISSCC49657.2024.10454547

  31. A Resonant High-Voltage Pulser for Battery-Powered Ultrasound Devices
    I. Bellouki; N. Rozsa; Z.-Y. Chang; Z. Chen; M. Tan; M. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2024. DOI: 10.1109/ISSCC49657.2024.10454286

  32. An ASIC for Efficient Generation of High-Voltage Transmit Pulses for Battery-Powered Ultrasound Devices
    Imad Bellouki; Nuriel Rozsa; Zu-Yao Chang; Zhao Chen; Mingliang Tan; Michiel Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2024.

  33. A 3D Ultrasound Probe with Monolithically-Integrated 4096-Element CMUT Array Imaging 60° x 60° x 10cm at 2000 Volumes/s
    Nuriel N. M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2024.

  34. An ASIC for Efficient Generation of High-Voltage Transmit Pulses for Battery-Powered Ultrasound Devices
    I. Bellouki; N. Rozsa; Z. Y. Chang; Z. Chen; M. Tan; M. A. P. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, September 2024. abstract.

  35. A 3D Ultrasound Probe with Monolithically-Integrated 4096-Element CMUT Array Imaging 60° x 60° x 10cm at 2000 Volumes/s
    Nuriel N. M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, September 2024. abstract, Best Student Paper Award.

  36. Piezoelectric Micromachined Ultrasonic Transducer (PMUT) Based on Bilayer X-cut Lithium Niobate
    X. Zhao; M. Pertijs; T. Manzaneque;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, September 2024. abstract.

  37. A Pitch-matched Low-noise Analog Front-end with Accurate Continuous Time-gain Compensation for High-density Ultrasound Transducer Arrays
    Peng Guo; Zu-Yao Chang; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Nico de Jong; Martin D. Verweij; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 6, pp. 1693--1705, June 2023. DOI: 10.1109/jssc.2022.3200160

  38. Performance Optimization of SSHC Rectifiers for Piezoelectric Energy Harvesting
    Yue, X.; Du, S.;
    IEEE Transactions on Circuits and Systems II: Express Briefs,
    Volume 70, Issue 4, pp. 1560-1564, 2023. DOI: 10.1109/TCSII.2022.3224033

  39. A Dynamically Reconfigurable Recursive Switched- Capacitor DC–DC Converter With Adaptive Load Ability Enhancement
    Q. Lu, S. Li, B. Zhao, J. Jiang, Z. Chen; S. Du;
    IEEE Transactions on Power Electronics,
    Volume 38, Issue 4, pp. 5032-5040, 2023. DOI: 10.1109/TPEL.2023.3235305

  40. A Single-Stage Regulating Voltage-Doubling Rectifier for Wireless Power Transfer
    Tianqi Lu; Sijun Du;
    IEEE Solid-State Circuits Letters,
    Volume 6, pp. 29-32, 2023. DOI: 10.1109/LSSC.2023.3239691

  41. A 1.2 mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging
    Peng Guo; Fabian Fool; Zu-Yao Chang; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Nico de Jong; Martin D. Verweij; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 9, pp. 2607--2618, September 2023. DOI: 10.1109/jssc.2023.3271270

  42. An ultrasound matrix transducer for high-frame-rate 3D intracardiac echocardiography
    Djalma Simoes dos Santos; Boudewine Ossenkoppele; Yannick M. Hopf; Mehdi Soozande; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Michiel A. P. Pertijs; Martin D. Verweij; Nico de Jong;
    Ultrasound in Medicine \& Biology,
    2023. accepted.
    Abstract: ... Objective: This paper presents the development of an ultrasound matrix transducer prototype for high frame rate three-dimensional (3D) intracardiac echocardiography (ICE). Methods: The matrix array consists of 16 ×18 lead zirconate titanate (PZT) elements with a pitch of 160 µm × 160 µm built on top of an application-specific integrated circuit (ASIC) that generates transmission signals and digitizes the received signals. To reduce the number of cables in the catheter to a feasible number, we implement subarray beamforming and digitization in receive and use a combination of time-division multiplexing and pulse amplitude modulation data transmission, achieving an 18-fold reduction. The proposed imaging scheme employs seven fan-shaped diverging transmit beams operating at a pulse repetition frequency of 7.7 kHz to obtain a high frame rate. The performance of the prototype is characterized and its functionality is fully verified. Results: The transducer exhibits a transmit efficiency of 28 Pa/V at 5 cm per element and a bandwidth of 60% in transmission. In receive, a dynamic range of 80 dB is measured with a minimum detectable pressure of 10 Pa per element. The element yield of the prototype is 98%, indicating the efficacy of the manufacturing process. The transducer is capable of imaging at a frame rate of up to 1000 volumes/s and is intended to cover a volume of 70° × 70° × 10 cm. Conclusion: These advanced imaging capabilities have the potential to support complex interventional procedures and enable full-volumetric flow, tissue, and electro-mechanical wave tracking in the heart.

  43. A 120.9-dB DR Digital-Input Capacitively Coupled Chopper Class-D Audio Amplifier
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    IEEE Journal of Solid-State Circuits,
    pp. 1-11, 2023. DOI: 10.1109/JSSC.2023.3318731

  44. A Hybrid Magnetic Current Sensor With a Dual Differential DC Servo Loop
    Jouyaeian, Amirhossein; Fan, Qinwen; Ausserlechner, Udo; Motz, Mario; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    pp. 1-8, 2023. DOI: 10.1109/JSSC.2023.3307471

  45. A Sub-1 V Capacitively Biased BJT-Based Temperature Sensor With an Inaccuracy of ±0.15°C (3σ) from −55°C to 125°C
    Tang, Zhong; Pan, Sining; Grubor, Miloš; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    pp. 1-9, 2023. DOI: 10.1109/JSSC.2023.3308554

  46. A Chopper-Stabilized Amplifier With a Relaxed Fill-In Technique and 22.6-pA Input Current
    Rooijers, Thije; Huijsing, Johan H.; Makinwa, Kofi A. A.;
    IEEE Solid-State Circuits Letters,
    Volume 6, pp. 165-168, 2023. DOI: 10.1109/LSSC.2023.3286779

  47. A Glimpse of the History of Analog ICs: A Tale of Amplifiers, Data Converters, and Sensor Interfaces
    Chae, Youngcheol; Lopez, Carolina Mora; Makinwa, Kofi A.A.; Ortmanns, Maurits; Sansen, Willy;
    IEEE Solid-State Circuits Magazine,
    Volume 15, Issue 3, pp. 43-52, 2023. DOI: 10.1109/MSSC.2023.3282557

  48. Quantifying Biomedical Amplifier Efficiency: The noise efficiency factor
    Hall, Drew A.; Makinwa, Kofi A.A.; Jang, Taekwang;
    IEEE Solid-State Circuits Magazine,
    Volume 15, Issue 2, pp. 28-33, 2023. DOI: 10.1109/MSSC.2023.3256353

  49. A Hybrid Magnetic Current Sensor With a Multiplexed Ripple-Reduction Loop
    Jouyaeian, Amirhossein; Fan, Qinwen; Zamparette, Roger; Ausserlechner, Udo; Motz, Mario; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 10, pp. 2874-2882, 2023. DOI: 10.1109/JSSC.2023.3273389

  50. A Bias-Flip Rectifier With Duty-Cycle-Based MPPT for Piezoelectric Energy Harvesting
    Yue, Xinling; Javvaji, Sundeep; Tang, Zhong; Makinwa, Kofi A. A.; Du, Sijun;
    IEEE Journal of Solid-State Circuits,
    pp. 1-11, 2023. DOI: 10.1109/JSSC.2023.3313733

  51. Resolution Limits of Resonant Sensors
    Tomás Manzaneque; Murali K. Ghatkesar; Farbod Alijani; Minxing Xu; Richard A. Norte; Peter G. Steeneken;
    Physical Review Applied,
    Volume 19, pp. 054074, 5 2023. DOI: 10.1103/PhysRevApplied.19.054074
    Abstract: ... Resonant sensors hold great promise in measuring small masses, to enable future mass spectrometers, and small forces in applications like atomic and magnetic force microscopy. During the last decades, scaling down the size of resonators has led to huge enhancements in sensing resolution, but has also raised the question of what the ultimate limit is. Current knowledge suggests that this limit is reached when a resonator oscillates at the maximum amplitude for which its response is predominantly linear. We present experimental evidence that it is possible to obtain better resolutions by oscillation amplitudes beyond the onset of nonlinearities. An analytical model is developed that explains the observations and unravels the relation between ultimate sensing resolution and speed. In the high-speed limit, we find that the ultimate resolution of a resonator is improved when decreasing its damping. This conclusion contrasts with previous works, which proposed that lowering the damping does not affect or even harms the ultimate sensing resolution.

    document

  52. Discrete Femtolitre Pipetting with 3D Printed Axisymmetrical Phaseguides
    Blankespoor, Maarten; Manzaneque, Tomás; Ghatkesar, Murali Krishna;
    Small Methods,
    pp. 2300942, 2023.

  53. Damping of 3D-printed polymer microbeam resonators
    de Winter, Jikke; Manzaneque, Tomás; Ghatkesar, Murali Krishna;
    Journal of Micromechanics and Microengineering,
    2023.

  54. A Bias-Flip Rectifier With Duty-Cycle-Based MPPT for Piezoelectric Energy Harvesting
    Yue, X.; Javvaji, S.; Tang, Z.; Makinwa, K. A. A.; Du, S.;
    IEEE Journal of Solid-State Circuits,
    pp. 1-11, 2023. DOI: 10.1109/JSSC.2023.3313733

  55. A Level Shifter With Almost Full Immunity to Positive dv/dt for Buck Converters
    Yang, Y.; Huang, M.; Du, S.; Martins, R. P.; Lu, Y.;
    IEEE Transactions on Circuits and Systems I: Regular Papers,
    Volume 70, Issue 11, pp. 4595-4604, 2023. DOI: 10.1109/TCSI.2023.3307869

  56. A Self-Bias-Flip With Charge Recycle Interface Circuit With No External Energy Reservoir for Piezoelectric Energy Harvesting Array
    Li, Z.; Chen, Z.; Wang, J.; Wang, J.; Jiang, J.; Du, S.; Cheng, X.; Zeng, X.; Han, J.;
    IEEE Transactions on Power Electronics,
    Volume 38, Issue 9, pp. 11630-11641, 2023. DOI: 10.1109/TPEL.2023.3286399

  57. The Advances in Conversion Techniques in Triboelectric Energy Harvesting: A Review
    Peng, W.; Du, S.;
    IEEE Transactions on Circuits and Systems I: Regular Papers,
    Volume 70, Issue 7, pp. 3049-3062, 2023. DOI: 10.1109/TCSI.2023.3261780

  58. A Synchronized Switch Harvesting Rectifier With Reusable Storage Capacitors for Piezoelectric Energy Harvesting
    Yue, X.; Du, S.;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 9, pp. 2597-2606, 2023. DOI: 10.1109/JSSC.2023.3260145

  59. A Single-Stage Three-Mode Reconfigurable Regulating Rectifier for Wireless Power Transfer
    Liu, S.; Lu, T.; Tang, Z.; Chen, Z.; Jiang, J.; Zhao, B.; Du, S.;
    IEEE Transactions on Power Electronics,
    Volume 38, Issue 7, pp. 9195-9205, 2023. DOI: 10.1109/TPEL.2023.3262728

  60. A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3D Probes
    Yannick M. Hopf; Djalma Simoes dos Santos; Boudewine W. Ossenkoppele; Mehdi Soozande; Emile Noothout; Zu-Yao Chang; Chao Chen; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Nico de Jong; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 59, Issue 2, pp. 476--491, February 2023. DOI: 10.1109/JSSC.2023.3299749
    Abstract: ... This article presents an application-specific integrated circuit (ASIC) for catheter-based 3-D ultrasound imaging probes. The pitch-matched design implements a comprehensive architecture with high-voltage (HV) transmitters, analog front ends, hybrid beamforming analog-to-digital converters (ADCs), and data transmission to the imaging system. To reduce the number of cables in the catheter while maintaining a small footprint per element, transmission (TX) beamforming is realized on the chip with a combination of a shift register (SR) and a row/column (R/C) approach. To explore an additional cable-count reduction in the receiver part of the design, a channel with a combination of time-division multiplexing (TDM), subarray beamforming, and multi-level pulse amplitude modulation (PAM) data transmission is also included. This achieves an 18-fold cable-count reduction and minimizes the power consumption in the catheter by a load modulation (LM) cable driver. It is further explored how common-mode interference can limit beamforming gain and a strategy to reduce its impact with local regulators is discussed. The chip was fabricated in TSMC 0.18-μm HV BCD technology and a 2-D PZT transducer matrix of 16 × 18 elements with a pitch of 160 μm and a center frequency of 6 MHz was manufactured on the chip. The system can generate all required TX patterns at up to 30 V, provides quick settling after the TX phase, and has an reception (RX) power consumption of only 1.12 mW/element. The functionality and operation of up to 1000 volumes/s have been demonstrated in electrical and acoustic imaging experiments.

  61. A 120.9-dB DR Digital-Input Capacitively Coupled Chopper Class-D Audio Amplifier
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 12, pp. 3470-3480, 2023. DOI: 10.1109/JSSC.2023.3318731
    Keywords: ... Pulse width modulation;Quantization (signal);Gain;Choppers (circuits);Preamplifiers;Jitter;Finite impulse response filters;DC-AC power converters;Intersymbol interference;Capacitively coupled chopper amplifier (CCCA);class-D amplifier (CDA);digital-to-analog converter;dynamic element matching (DEM);intersymbol interference (ISI).

  62. A Hybrid Magnetic Current Sensor With a Dual Differential DC Servo Loop
    Jouyaeian, Amirhossein; Fan, Qinwen; Ausserlechner, Udo; Motz, Mario; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 12, pp. 3442-3449, 2023. DOI: 10.1109/JSSC.2023.3307471
    Keywords: ... Coils;Capacitors;DSL;Servomotors;Bandwidth;Sensors;Magnetic tunneling;Temperature measurement;Contactless sensing;dc servo loop (DSL);high resolution;hybrid current sensors;magnetic current sensing;temperature compensation.

  63. A Sub-1 V Capacitively Biased BJT-Based Temperature Sensor With an Inaccuracy of ±0.15 °C (3σ) From—55 °C to 125 °C
    Tang, Zhong; Pan, Sining; Grubor, Miloš; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 12, pp. 3433-3441, 2023. DOI: 10.1109/JSSC.2023.3308554
    Keywords: ... Temperature sensors;Voltage;Switches;Energy efficiency;Capacitors;Switching circuits;Mathematics;Inverters;Converters;Δ Σ ADC;capacitively biased bipolar junction transistor (BJT);inverter-based amplifier;temperature sensor;temperature to digital converter.

  64. A Chopper-Stabilized Amplifier With a Relaxed Fill-In Technique and 22.6-pA Input Current
    Rooijers, Thije; Huijsing, Johan H.; Makinwa, Kofi A. A.;
    IEEE Solid-State Circuits Letters,
    Volume 6, pp. 165-168, 2023. DOI: 10.1109/LSSC.2023.3286779
    Keywords: ... Choppers (circuits);Current measurement;Solid state circuits;Voltage measurement;Floors;1/f noise;Clocks;Chopping;duty-cycled OTA;intermodulation distortion (IMD);relaxed fill-in technique.

  65. A Glimpse of the History of Analog ICs: A Tale of Amplifiers, Data Converters, and Sensor Interfaces
    Chae, Youngcheol; Lopez, Carolina Mora; Makinwa, Kofi A.A.; Ortmanns, Maurits; Sansen, Willy;
    IEEE Solid-State Circuits Magazine,
    Volume 15, Issue 3, pp. 43-52, 2023. DOI: 10.1109/MSSC.2023.3282557
    Keywords: ... Integrated circuits;Technological innovation;System performance;Analog circuits;Sensor systems;Sensors;Transistors;Electronic circuits;History;Integrated circuit synthesis.

  66. Quantifying Biomedical Amplifier Efficiency: The noise efficiency factor
    Hall, Drew A.; Makinwa, Kofi A.A.; Jang, Taekwang;
    IEEE Solid-State Circuits Magazine,
    Volume 15, Issue 2, pp. 28-33, 2023. DOI: 10.1109/MSSC.2023.3256353
    Keywords: ... Integrated circuits;Low-noise amplifiers;Power demand;Instruments;Recording;Glucose;Biomedical monitoring.

  67. A Hybrid Magnetic Current Sensor With a Multiplexed Ripple-Reduction Loop
    Jouyaeian, Amirhossein; Fan, Qinwen; Zamparette, Roger; Ausserlechner, Udo; Motz, Mario; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 10, pp. 2874-2882, 2023. DOI: 10.1109/JSSC.2023.3273389
    Keywords: ... Coils;Sensitivity;Magnetic fields;Temperature sensors;Sensors;System-on-chip;Multiplexing;Galvanic isolation;hybrid current sensors;magnetic current sensing;ripple-reduction loop (RRL);temperature compensation;wide bandwidth.

  68. A Compact 10-MHz RC Frequency Reference With a Versatile Temperature Compensation Scheme
    Pan, Sining; An, Xiaomeng; Yu, Zheru; Jiang, Hui; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 12, pp. 3450-3458, 2023. DOI: 10.1109/JSSC.2023.3322307
    Keywords: ... Resistors;Capacitors;Frequency locked loops;Voltage-controlled oscillators;Prototypes;Voltage;Time-frequency analysis;CMOS technology;Temperature measurement;CMOS frequency reference;on-chip trimming;resistor aging;temperature compensation.

  69. Biomedical Electronics, Noise Shaping ADCs, and Frequency References: Advances in Analog Circuit Design 2022
    Pieter Harpe; Andrea Baschirotto; Makinwa, {Kofi A.A.} (Ed.);
    Springer, , 2023. DOI: 10.1007/978-3-031-28912-5
    Keywords: ... Analog circuit design, Analog to digital converters, CMOS ADCs, High-performance ADCs, Nanoscale CMOS.

    Abstract: ... This book is based on the 18 tutorials presented during the 30th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, with specific contributions focusing on analog circuits for machine learning, current/voltage/temperature sensors, and high-speed communication via wireless, wireline, or optical links. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development.

  70. The Zoom ADC: An Evolving Architecture
    Eland, Efraïm; Mehrotra, Shubham; Karmakar, Shoubhik; van Veldhoven, Robert; Makinwa, Kofi A. A.;
    Harpe, Pieter; Baschirotto, Andrea; Makinwa, Kofi A.A. (Ed.);
    Cham: Springer International Publishing, , pp. 179--201, 2023. DOI: 10.1007/978-3-031-28912-5_10
    Abstract: ... Zoom ADCs combine a coarse SAR ADC with a fine delta-sigma modulator ($\Delta$$\Sigma$M) to efficiently obtain high energy efficiency and high dynamic range. This makes them well suited for use in various instrumentation and audio applications. However, zoom ADCs also have drawbacks. The use of over-ranging in their fine modulators may limit SNDR, large out-of-band interferers may cause slope overload, and the quantization noise of their coarse ADC may leak into the baseband. This chapter presents an overview of recent advances in zoom ADCs that tackle these challenges while maintaining high energy efficiency. Prototypes designed in standard 0.16 $\mu$m technology achieve SNDRs over 100 dB in bandwidths ranging from 1 to 24 kHz while consuming only hundreds of $\mu$Ws.

  71. 30.3 A Bias-Flip Rectifier with a Duty-Cycle-Based MPPT Algorithm for Piezoelectric Energy Harvesting with 98% Peak MPPT Efficiency and 738% Energy-Extraction Enhancement
    Yue, X.; Javvaji, S.; Tang, Z.; Makinwa, K. A. A.; Du, S.;
    In 2023 IEEE International Solid- State Circuits Conference (ISSCC),
    pp. 442-444, 2023. DOI: 10.1109/ISSCC42615.2023.10067284

  72. A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink
    Guo, P.; Chang, Z. Y.; Noothout, E.; Vos, H. J.; Bosch, J. G.; de Jong, N.; Verweij, M. D.; Pertijs, M. A. P.;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, IEEE, pp. 1-2, June 2023. DOI: 10.23919/VLSITechnologyandCir57934.2023.10185159

  73. A prototype matrix transducer for high frame rate 3D intracardiac echography
    D. Santos; Y. Hopf; B. Ossenkoppele; J. Bosch; R. Vos; M. Pertijs; N. de Jong; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2023. abstract.

  74. Effect of SAR-ADC Non-Idealities on Medical Ultrasound B-Mode Imaging
    N. Radeljic-Jakic; A. Flikweert; Y. Hopf; N. Rozsa; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2023. abstract.

  75. Pitch-Matched Integrated Circuits for Ultrasound Transducer Arrays
    Y. Hopf; P. Guo; M. Pertijs;
    In Proc. Workshop on Advances in Analog Circuit Design (AACD),
    April 2023. invited presentation.

  76. Large Matrix array aperture for 3D vascular imaging capture
    Q. Colas; C. Bantignies; M. Perroteau; N. Porcher; S. Vassal; B. Guérif; T. Kim; J. G. Bosch; N. de Jong; M. D. Verweij; M. A. P. Pertijs; G. Férin; M. Flesch;
    In Smart Systems Integration Conference,
    2023. abstract.

  77. A 6GHz Multi-Path Multi-Frequency Chopping CTΔΣ Modulator achieving 122dBFS SFDR from 150kHz to 120MHz BW
    Javvaji, Sundeep; Bolatkale, Muhammed; Bajoria, Shagun; Rutten, Robert; Essink, Bert Oude; Beijens, Koen; Makinwa, Kofi; Breems, Lucien;
    In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
    pp. 1-2, 2023. DOI: 10.23919/VLSITechnologyandCir57934.2023.10185356

  78. A 720 nW Current Sensor with 0-to-15 V Input Common-Mode Range and ±0.5% Gain Error from −40 to 85 °C
    Zamparette, Roger; Makinwa, Kofi;
    In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
    pp. 1-2, 2023. DOI: 10.23919/VLSITechnologyandCir57934.2023.10185309

  79. A 13.56MHz Fully Integrated 91.8% Efficiency Single-Stage Dual-Output Regulating Voltage Doubler for Biomedical Wireless Power Transfer
    Lu, Tianqi; Chang, Zu-Yao; Jiang, Junmin; Makinwa, Kofi; Du, Sijun;
    In 2023 IEEE Custom Integrated Circuits Conference (CICC),
    pp. 1-2, 2023. DOI: 10.1109/CICC57935.2023.10121186

  80. A 120.9dB DR, -111.2dB THD+N Digital-Input Capacitively-Coupled Chopper Class-D Audio Amplifier
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 54-56, 2023. DOI: 10.1109/ISSCC42615.2023.10067400

  81. A Chopper-Stabilized Amplifier with a Relaxed Fill-In Technique and 22.6pA Input Current
    Rooijers, Thije; Huijsing, Johan H.; A. Makinwa, Kofi A.;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 2-4, 2023. DOI: 10.1109/ISSCC42615.2023.10067656

  82. A 51A Hybrid Magnetic Current Sensor with a Dual Differential DC Servo Loop and 43mArms Resolution in a 5MHz Bandwidth
    Jouyaeian, Amirhossein; Fan, Qinwen; Motz, Mario; Ausserlechner, Udo; Makinwa, Kofi A. A.;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 22-24, 2023. DOI: 10.1109/ISSCC42615.2023.10067677

  83. A BJT-Based Temperature Sensor with±0.1°C (3σ) Inaccuracy from -55°C to 125°C and a 0.85pJ.K2 Resolution FoM Using Continuous-Time Readout
    Toth, Nandor G.; Tang, Zhong; Someya, Teruki; Pan, Sining; Makinwa, Kofi A. A.;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 358-360, 2023. DOI: 10.1109/ISSCC42615.2023.10067457

  84. A Sub-1V 810nW Capacitively-Biased BJT-Based Temperature Sensor with an Inaccuracy of ±0.15°C (3σ) from −55°C to 125°C
    Tang, Zhong; Pan, Sining; Makinwa, Kofi A. A.;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 22-24, 2023. DOI: 10.1109/ISSCC42615.2023.10067695

  85. A 40A Shunt-Based Current Sensor with ±0.2% Gain Error from −40°C to 125°C and Self-Calibration
    Tang, Zhong; Toth, Nandor G.; Zamparette, Roger; Nezuka, Tomohiro; Furuta, Yoshikazu; Makinwa, Kofi A. A.;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 348-350, 2023. DOI: 10.1109/ISSCC42615.2023.10067304

  86. A 0.01 mm2 10MHz RC Frequency Reference with a 1-Point On-Chip-Trimmed Inaccuracy of 0.28% from −45°C to 125°C in 0.18μm CMOS
    An, Xiaomeng; Pan, Sining; Jiang, Hui; Makinwa, Kofi A. A.;
    In 2023 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 60-62, 2023. DOI: 10.1109/ISSCC42615.2023.10067530

  87. A Bias-Flip Rectifier with a Duty-Cycle-Based MPPT Algorithm for Piezoelectric Energy Harvesting with 98% Peak MPPT Efficiency and 738% Energy-Extraction Enhancement
    Yue, X.; Javvaji, S.; Tang, Z.; Makinwa, K. A. A.; Du, S.;
    In 2023 IEEE International Solid- State Circuits Conference (ISSCC),
    pp. 442-444, 2023. DOI: 10.1109/ISSCC42615.2023.10067284

  88. A Self Bias-flip Piezoelectric Energy Harvester Array without External Energy Reservoirs achieving 488% Improvement with 4-Ratio Switched-PEH DC-DC Converter
    Li, Z.; Chen, Z.; Law, M. K.; Du, S.; Cheng, X.; Zeng, X.; Han, J.;
    In 2023 IEEE Custom Integrated Circuits Conference (CICC),
    pp. 1-2, 2023. DOI: 10.1109/CICC57935.2023.10121219

  89. A 13.56MHz Fully Integrated 91.8% Efficiency Single-Stage Dual-Output Regulating Voltage Doubler for Biomedical Wireless Power Transfer
    Lu, T.; Chang, Z. Y.; Jiang, J.; Makinwa, K.; Du, S.;
    In 2023 IEEE Custom Integrated Circuits Conference (CICC),
    pp. 1-2, 2023. DOI: 10.1109/CICC57935.2023.10121186

  90. Effect of SAR-ADC Non-Idealities on Medical Ultrasound B-Mode Imaging
    N. Radeljic-Jakic; A. Flikweert; Y. Hopf; N. Rozsa; M. Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2023.

  91. Piezoelectric Micromachined Ultrasound Transducer (PMUT) Based on Lithium Niobate – Design and Modelling
    Xiaoxi Zhao; Michiel Pertijs; Tomás Manzaneque;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2023.

  92. Electrical Pulser for a Load Having a Capacitance
    M.A.P. Pertijs; Z. Chen; M. Tan; I. Bellouki;
    Patent, Dutch 2035728, September 2023.

  93. Measurement of Pipe and Fluid Properties with a Matrix Array-based Ultrasonic Clamp-on Flow Meter
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; A. Sabbadini; N. de Jong; M. A. P. Pertijs; M. D. Verweij;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 69, Issue 1, pp. 309--322, January 2022. DOI: 10.1109/TUFFC.2021.3111710

  94. A Compact Integrated High-Voltage Pulser Insensitive to Supply Transients for 3D Miniature Ultrasound Probes
    Yannick M. Hopf; Boudewine Ossenkoppele; Mehdi Soozande; Emile Noothout; Zu-Yao Chang; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Nico de Jong; Michiel A. P. Pertijs;
    IEEE Solid-State Circuits Letters,
    Volume 5, pp. 166--169, 2022. DOI: 10.1109/lssc.2022.3180071
    Abstract: ... In this paper, a compact high-voltage (HV) transmit circuit for dense 2D transducer arrays used in 3D ultrasonic imaging systems is presented. Stringent area requirements are addressed by a unipolar pulser with embedded transmit/receive switch. Combined with a capacitive HV level shifter, it forms the ultrasonic HV transmit circuit with the lowest reported HV transistor count and area without any static power consumption. The balanced latched-based level shifter implementation makes the design insensitive to transients on the HV supply caused by pulsing, facilitating application in probes with limited local supply decoupling, such as imaging catheters. Favorable scaling through resource sharing benefits massively arrayed architectures while preserving full individual functionality. A prototype of 8 x 9 elements was fabricated in TSMC 0.18 μm HV BCD technology and a 160 μm x 160 μm PZT transducer matrix is manufactured on the chip. The system is designed to drive 65 V peak-to-peak pulses on 2 pF transducer capacitance and hardware sharing of 6 elements allows for an area of only 0.008 mm2 per element. Electrical characterization as well as acoustic results obtained with the 6 MHz central frequency transducer are demonstrated.

  95. Imaging Scheme for 3-D High Frame Rate Intracardiac Echography: a Simulation Study
    M. Soozande; B. Ossenkoppele; Y. Hopf; M. Pertijs; M. Verweij; N. de Jong; H. Vos; J. Bosch;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 69, Issue 10, pp. 2862--2874, October 2022. DOI: 10.1109/TUFFC.2022.3186487
    Abstract: ... Atrial fibrillation is the most common cardiac arrhythmia, and normally treated by RF ablation. Intracardiac echography (ICE) is widely employed during RF ablation procedures to guide the electrophysiologist in navigating the ablation catheter, although only 2-D probes are currently clinically used. A 3-D ICE catheter would not only improve visualization of the atrium and ablation catheter, it might also provide 3-D mapping of the electromechanical wave propagation pattern, which represents the mechanical response of cardiac tissue to electrical activity. The detection of this electromechanical wave needs 3-D high frame rate imaging, which is generally only realizable in trade-off with channel count and image quality. In this simulation-based study, we propose a high volume rate imaging scheme for a 3-D ICE probe design that employs 1-D micro-beamforming in elevation direction. Such probe can achieve a high frame rate while reducing the channel count sufficiently for realization in a 10-Fr catheter. To suppress the grating-lobe artifacts associated with micro-beamforming in elevation direction, a limited number of fan-shaped beams with a wide azimuthal and narrow elevational opening angle are sequentially steered to insonify slices of the region of interest. An angular weighted averaging of reconstructed sub-volumes further reduces the grating lobe artifacts. We optimize the transmit beam divergence and central frequency based on the required image quality for electromechanical wave imaging (EWI). Numerical simulation results show that a set of 7 fan-shaped transmission beams can provide a frame rate of 1000 Hz and a sufficient spatial resolution to visualize the electromechanical wave propagation on a large 3-D surface.

  96. Design and Proof-of-Concept of a Matrix Transducer Array for Clamp-on Ultrasonic Flow Measurements
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; E. C. Noothout; N. de Jong; M. A. P. Pertijs; M. D. Verweij;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 69, Issue 8, pp. 2555--2568, August 2022. DOI: 10.1109/tuffc.2022.3186170
    Abstract: ... Common clamp-on ultrasonic flow meters consist of two single-element transducers placed on the pipe wall. Flow speed is measured non-invasively, i.e. without interrupting the flow and without perforating the pipe wall, which also minimizes safety risks and avoids pressure drops inside the pipe. However, before metering, the transducers have to be carefully positioned along the pipe axis to correctly align the acoustic beams and obtain a well-calibrated flow meter. This process is done manually, is dependent on the properties of the pipe and the liquid, does not account for pipe imperfections, and becomes troublesome on pipelines with an intricate shape. Matrix transducer arrays are suitable to dynamically steer acoustic beams and realize self-alignment upon reception, without user input. In this work, the design of a broadband 37x17 matrix array (center frequency of 1 MHz) to perform clamp-on ultrasonic flow measurements over a wide range of liquids (c = 1000 - 2000m/s, α≤1 dB/MHz.cm) and pipe sizes is presented. Three critical aspects were assessed: efficiency, electronic beam steering, and wave mode conversion in the pipe wall. A prototype of a proof-of-concept flow meter consisting of two 36-element linear arrays (center frequency of 1.1 MHz) was fabricated and placed on a 1 mm-thick, 40 mm-inner diameter stainless steel pipe in a custom-made flow loop filled with water. At resonance, simulated and measured efficiencies in water of the linear arrays compared well: 0.88 kPa/V and 0.81 kPa/V, respectively. Mean flow measurements were achieved by electronic beam steering of the acoustic beams and using both compressional and shear waves generated in the pipe wall. Correlation coefficients of R2 > 0.99 between measured and reference flow speeds were obtained, thus showing the operational concept of an array-based clamp-on ultrasonic flow meter.

  97. A Pitch-Matched Transceiver ASIC with Shared Hybrid Beamforming ADC for High-Frame-Rate 3D Intracardiac Echocardiography
    Yannick M. Hopf; Boudewine W. Ossenkoppele; Mehdi Soozande; Emile Noothout; Zu-Yao Chang; Chao Chen; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Nico de Jong; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 11, pp. 3228--3242, November 2022. DOI: 10.1109/jssc.2022.3201758
    Abstract: ... In this article, an application-specific integrated circuit (ASIC) for 3-D, high-frame-rate ultrasound imaging probes is presented. The design is the first to combine element-level, high-voltage (HV) transmitters and analog front-ends, subarray beamforming, and in-probe digitization in a scalable fashion for catheter-based probes. The integration challenge is met by a hybrid analog-to-digital converter (ADC), combining an efficient charge-sharing successive approximation register (SAR) first stage and a compact single-slope (SS) second stage. Application in large ultrasound imaging arrays is facilitated by directly interfacing the ADC with a charge-domain subarray beamformer, locally calibrating interstage gain errors and generating the SAR reference using a power-efficient local reference generator. Additional hardware-sharing between neighboring channels ultimately leads to the lowest reported area and power consumption across miniature ultrasound probe ADCs. A pitch-matched design is further enabled by an efficient split between the core circuitry and a periphery block, the latter including a datalink performing clock data recovery (CDR) and time-division multiplexing (TDM), which leads to a 12-fold total channel count reduction. A prototype of 8×9 elements was fabricated in a TSMC 0.18- μm HV BCD technology and a 2-D PZT transducer matrix with a pitch of 160μm , and a center frequency of 6 MHz was manufactured on the chip. The imaging device operates at up to 1000 volumes/s, generates 65-V transmit pulses, and has a receive power consumption of only 1.23 mW/element. The functionality has been demonstrated electrically as well as in acoustic and imaging experiments.

  98. Algorithm to Correct Measurement Offsets Introduced by Inactive Elements of Transducer Arrays in Ultrasonic Flow Metering
    Jack Massaad; Paul L. M. J. van Neer; Douwe M. van Willigen; Michiel A. P. Pertijs; Nicolaas de Jong; Martin D. Verweij;
    Sensors,
    Volume 22, Issue 23, pp. 2--14, November 2022. DOI: 10.3390/s22239317
    Abstract: ... Ultrasonic flow meters (UFMs) based on transducer arrays offer several advantages. With electronic beam steering, it is possible to tune the steering angle of the beam for optimal signal-tonoise ratio (SNR) upon reception. Moreover, multiple beams can be generated to propagate through different travel paths, covering a wider section of the flow profile. Furthermore, in a clamp-on configuration, UFMs based on transducer arrays can perform self-calibration. In this manner, userinput is minimized and measurement repeatability is increased. In practice, transducer array elements may break down. This could happen due to aging, exposure to rough environments, and/or rough mechanical contact. As a consequence of inactive array elements, the measured transit time difference contains two offsets. One offset originates from non-uniform spatial sampling of the generated wavefield. Another offset originates from the ill-defined beam propagating through a travel path different from the intended one. In this paper, an algorithm is proposed that corrects for both of these offsets. The algorithm also performs a filtering operation in the frequency-wavenumber domain of all spurious (i.e., flow-insensitive) wave modes. The advantage of implementing the proposed algorithm is demonstrated on simulations and measurements, showing improved accuracy and precision of the transit time differences compared to the values obtained when the algorithm is not applied. The proposed algorithm can be implemented in both in-line and clamp-on configuration of UFMs based on transducer arrays.

    document

  99. A Tiled Ultrasound Matrix Transducer for Volumetric Imaging of the Carotid Artery
    dos Santos, Djalma Simões; Fool, Fabian; Mozaffarzadeh, Moein; Shabanimotlagh, Maysam; Noothout, Emile; Kim, Taehoon; Rozsa, Nuriel; Vos, Hendrik J.; Bosch, Johan G.; Pertijs, Michiel A. P.; Verweij, Martin D.; de Jong, Nico;
    Sensors,
    Volume 22, Issue 24, pp. 1--23, 2022. DOI: 10.3390/s22249799
    Abstract: ... High frame rate three-dimensional (3D) ultrasound imaging would offer excellent possibilities for the accurate assessment of carotid artery diseases. This calls for a matrix transducer with a large aperture and a vast number of elements. Such a matrix transducer should be interfaced with an application-specific integrated circuit (ASIC) for channel reduction. However, the fabrication of such a transducer integrated with one very large ASIC is very challenging and expensive. In this study, we develop a prototype matrix transducer mounted on top of multiple identical ASICs in a tiled configuration. The matrix was designed to have 7680 piezoelectric elements with a pitch of 300 μm × 150 μm integrated with an array of 8 × 1 tiled ASICs. The performance of the prototype is characterized by a series of measurements. The transducer exhibits a uniform behavior with the majority of the elements working within the −6 dB sensitivity range. In transmit, the individual elements show a center frequency of 7.5 MHz, a −6 dB bandwidth of 45%, and a transmit efficiency of 30 Pa/V at 200 mm. In receive, the dynamic range is 81 dB, and the minimum detectable pressure is 60 Pa per element. To demonstrate the imaging capabilities, we acquired 3D images using a commercial wire phantom.

    document

  100. A 90.6% Efficient, 0.333 W/mm2 Power Density Direct 48V-to-1V Dual Inductor Hybrid Converter with Delay-line Based V2D Controller
    Hua, Y.; Lu, Q.; Li, S.; Zhao, B.; Du, S.;
    IEEE Transactions on Circuits and Systems II: Express Briefs,
    pp. 1-5, 2022. DOI: 10.1109/TCSII.2022.3219243

  101. A Crystal-Less Clock Generation Technique for Battery-Free Wireless Systems
    Chang, Z.; Zhang, Y.; Yang, C.; Luo, Y.; Du, S.; Chen, Y.; Zhao, B.;
    IEEE Transactions on Circuits and Systems I: Regular Papers,
    pp. 1-12, 2022. DOI: 10.1109/TCSI.2022.3201196

  102. An Output Bandwidth Optimized 200-Gb/s PAM-4 100-Gb/s NRZ Transmitter With 5-Tap FFE in 28-nm CMOS
    Wang, Z.; Choi, M.; Lee, K.; Park, K.; Liu, Z.; Biswas, A.; Han, J.; Du, S.; Alon, E.;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 1, pp. 21-31, 2022. DOI: 10.1109/JSSC.2021.3109562

  103. Measurement of pipe and liquid parameters using the beam steering capabilities of array-based clamp-on ultrasonic flow meters
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; M. A. P. Pertijs; N. de Jong; M. D. Verweij;
    Sensors,
    Volume 22, Issue 14, pp. 5068, July 2022. DOI: 10.3390/s22145068
    Abstract: ... Clamp-on ultrasonic flow meters (UFMs) are installed on the outside of the pipe wall. Typically, they consist of two single-element transducers mounted on angled wedges, which are acoustically coupled to the pipe wall. Before flow metering, the transducers are placed at the correct axial position by manually moving one transducer along the pipe wall until the maximum amplitude of the relevant acoustic pulse is obtained. This process is time-consuming and operator-dependent. Next to this, at least five parameters of the pipe and the liquid need to be provided manually to compute the flow speed. In this work, a method is proposed to obtain the five parameters of the pipe and the liquid required to compute the flow speed. The method consists of obtaining the optimal angles for different wave travel paths by varying the steering angle of the emitted acoustic beam systematically. Based on these optimal angles, a system of equations is built and solved to extract the desired parameters. The proposed method was tested experimentally with a custom-made clamp-on UFM consisting of two linear arrays placed on a water-filled stainless steel pipe. The obtained parameters of the pipe and the liquid correspond very well with the expected (nominal) values. Furthermore, the performed experiment also demonstrates that a clamp-on UFM based on transducer arrays can achieve self-alignment without the need to manually move the transducers.

  104. A MEMS Coriolis-Based Mass-Flow-to-Digital Converter for Low Flow Rate Sensing
    de Oliveira, Arthur Campos; Pan, Sining; Wiegerink, Remco J.; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 12, pp. 3681-3692, 2022. DOI: 10.1109/JSSC.2022.3210003

  105. A −91 dB THD+N, Class-D Piezoelectric Speaker Driver Using Dual Voltage/Current Feedback for Resistor-Less LC Resonance Damping
    Karmakar, Shoubhik; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 12, pp. 3726-3735, 2022. DOI: 10.1109/JSSC.2022.3207386

  106. A 121.4-dB DR Capacitively Coupled Chopper Class-D Audio Amplifier
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 12, pp. 3736-3745, 2022. DOI: 10.1109/JSSC.2022.3207907

  107. A Versatile ±25-A Shunt-Based Current Sensor With ±0.25% Gain Error From −40 °C to 85 °C
    Tang, Zhong; Zamparette, Roger; Furuta, Yoshikazu; Nezuka, Tomohiro; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 12, pp. 3716-3725, 2022. DOI: 10.1109/JSSC.2022.3204520

  108. A 210 nW NPN-Based Temperature Sensor With an Inaccuracy of ±0.15 °C (3σ) From −15 °C to 85 °C Utilizing Dual-Mode Frontend
    Someya, Teruki; van Hoek, Vincent; Angevare, Jan; Pan, Sining; Makinwa, Kofi;
    IEEE Solid-State Circuits Letters,
    Volume 5, pp. 272-275, 2022. DOI: 10.1109/LSSC.2022.3222578

  109. A 2.5-µW Beyond-the-Rails Current Sensor With a Tunable Voltage Reference and ±0.6% Gain Error From −40 °C to +85 °C
    Zamparette, Roger; Makinwa, Kofi;
    IEEE Solid-State Circuits Letters,
    Volume 5, pp. 264-267, 2022. DOI: 10.1109/LSSC.2022.3219214

  110. A 16 MHz CMOS RC Frequency Reference With ±90 ppm Inaccuracy From −45 °C to 85 °C
    Gürleyük, Çağrı; Pan, Sining; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 8, pp. 2429-2437, 2022. DOI: 10.1109/JSSC.2022.3142662

  111. A 0.9-V 28-MHz Highly Digital CMOS Dual-RC Frequency Reference With ±200 ppm Inaccuracy From −40 °C to 85 °C
    Choi, Woojun; Angevare, Jan; Park, Injun; Makinwa, Kofi A. A.; Chae, Youngcheol;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 8, pp. 2418-2428, 2022. DOI: 10.1109/JSSC.2021.3135939

  112. An Auto-Zero-Stabilized Voltage Buffer With a Quiet Chopping Scheme and Constant Sub-pA Input Current
    Rooijers, Thije; Huijsing, Johan H.; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 8, pp. 2438-2448, 2022. DOI: 10.1109/JSSC.2021.3127462

  113. A −121.5-dB THD Class-D Audio Amplifier With 49-dB LC Filter Nonlinearity Suppression
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    IEEE Journal of Solid-State Circuits,
    Volume 57, Issue 4, pp. 1153-1161, 2022. DOI: 10.1109/JSSC.2021.3125526

  114. Measuring nanoparticles in liquid with attogram resolution using a microfabricated glass suspended microchannel resonator
    Mehdi Mollaie Daryani; Tomás Manzaneque; Jia Wei; Murali Krishna Ghatkesar;
    Microsystems and Nanoengineering,
    Volume 8, 12 2022. DOI: 10.1038/s41378-022-00425-8
    Abstract: ... The use of nanoparticles has been growing in various industrial fields, and concerns about their effects on health and the environment have been increasing. Hence, characterization techniques for nanoparticles are essential. Here, we present a silicon dioxide microfabricated suspended microchannel resonator (SMR) to measure the mass and concentration of nanoparticles in a liquid as they flow. We measured the mass detection limits of the device using laser Doppler vibrometry. This limit reached a minimum of 377 ag that correspond to a 34 nm diameter gold nanoparticle or a 243 nm diameter polystyrene particle, when sampled every 30 ms. We compared the fundamental limits of the measured data with an ideal noiseless measurement of the SMR. Finally, we measured the buoyant mass of gold nanoparticles in real-time as they flowed through the SMR. [Figure not available: see fulltext.].

  115. Analog Circuits for Machine Learning, Current/Voltage/Temperature Sensors, and High-speed Communication: Advances in Analog Circuit Design 2021
    Harpe, Pieter; Makinwa, Kofi AA; Baschirotto, Andrea;
    Springer Nature, , 2022.

  116. Resistor-Based Temperature Sensors
    Pan, Sining; Makinwa, Kofi A. A.;
    Harpe, Pieter; Makinwa, Kofi A.A.; Baschirotto, Andrea (Ed.);
    Cham: Springer International Publishing, , pp. 209--230, 2022. DOI: 10.1007/978-3-030-91741-8_12
    Abstract: ... This paper presents an overview of resistor-based sensors, with a focus on their energy efficiency. First, the theoretical energy efficiency limit of resistor-based sensors is determined and compared to that of traditional BJT-based sensors. This is followed by a review of the different types of resistor-based sensors. Finally, the design of a high-resolution Wheatstone bridge sensor is discussed in detail. Read out by a continuous-time Delta-Sigma modulator, the sensor achieves state-of-the-art energy efficiency, with a resolution FoM of 10 fJ{\textperiodcentered}K2, which approaches the theoretical energy efficiency limit.

  117. Electronic Platforms and Signal Processing for Magnetoresistive-Based Biochips
    Germano, José; Costa, Tiago; Cardoso, Filipe Arroyo; Amaral, José; Cardoso, Susana; Freitas, Paulo P; Piedade, Moisés S;
    In Handbook of Biochips: Integrated Circuits and Systems for Biology and Medicine,
    Springer New York New York, NY, 2022.

  118. Smart Ultrasound Probes: Going Digital in the Probe Tip
    M. Pertijs;
    In IEEE Sensor Interfaces Meeting,
    2022. Keynote presentation.
    Abstract: ... While medical ultrasound imaging is currently mainly done using hand-held probes connected to relatively bulky imaging systems, various new application areas are emerging that call for advanced miniaturized ultrasound devices. Examples include catheters capable of providing real-time 3D images to guide minimally-invasive interventions, and wearable devices for new monitoring and diagnostic applications. In contrast with conventional probes, which contain little or no electronics, these new devices need to become “smart”: integrated circuits need to be integrated into the probe to interface with the many transducer elements (typically 1000+) needed for real-time 3D imaging. This talk discusses the challenges and opportunities associated with integrated circuit design for smart ultrasound probes, focusing on strategies for channel-count reduction and digitization that pave the way towards probes with fully-digital interfaces. The talk will include examples of state-of-the-art designs featuring transducer-on-CMOS integration and pitch-matched circuits for high-voltage pulsing, beamforming and digitization.

  119. A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes
    Y. Hopf; B. Ossenkoppele; M. Soozande; E. Noothout; Z. Y. Chang; C. Chen; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2022. DOI: 10.1109/ISSCC42614.2022.9731597
    Abstract: ... With applications moving to 3D imaging, catheter-based ultrasound probes need to reach a new level of integration. This paper presents the first chip to combine high-voltage transmitters, analog front-ends, micro-beamforming, digitization and transducers, enabling high-frame-rate 3D imaging. Its pitch-matched architecture, made possible by a shared SAR/slope ADC that is 4x smaller and consumes 1.5x less power than the prior art, makes it a scalable solution for future digital imaging catheters.

  120. A 1.2mW/channel 100μm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging
    P. Guo; F. Fool; E. Noothout; Z. Y. Chang; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2022. DOI: 10.1109/ISSCC42614.2022.9731784

  121. Transceiver ASIC Design for High-Frame-Rate 3D Intracardiac Echocardiography
    Yannick M. Hopf; Boudewine Ossenkoppele; Mehdi Soozande; Emile Noothout; Zu-Yao Chang; Chao Chen; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Nico de Jong; Michiel A. P. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2022.

  122. Large Matrix array aperture for 3D vascular imaging capture
    Q. Colas; C. Bantignies; M. Perroteau; N. Porcher; S. Vassal; B. Guérif; T. Kim; J. G. Bosch; N. de Jong; M. D. Verweij; M. A. P. Pertijs; G. Férin; M. Flesch;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2022.

  123. A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes
    Yannick Hopf; Michiel Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2022. Best presentation award.

  124. Automated Characterization of Matrix Transducer Arrays using the Verasonics Imaging System
    Djalma Simoes dos Santos; Fabian Fool; Taehoon Kim; Emile Noothout; Nuriel Rozsa; Hendrik J. Vos; Johan G. Bosch; Michiel A. P. Pertijs; Martin D. Verweij; Nico de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2022.

  125. A Nanopower 95.6% Efficiency Voltage Regulator with Adaptive Supply-Switching for Energy Harvesting Applications
    Zou, Y.; Yue, X.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 3557-3561, 2022. DOI: 10.1109/ISCAS48785.2022.9937775

  126. A Reconfigurable Cold-Startup SSHI Rectifier with 4X Lower Input Amplitude Requirement for Piezoelectric Energy Harvesting
    Yue, X.; Zou, Y.; Chen, Z.; Liang, J.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 649-653, 2022. DOI: 10.1109/ISCAS48785.2022.9937838

  127. A Highly Efficient Fully Integrated Active Rectifier for Ultrasonic Wireless Power Transfer
    Yue, X.; Chen, Z.; Zou, Y.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 531-535, 2022. DOI: 10.1109/ISCAS48785.2022.9937532

  128. Performance Enhancement with a Capacitor-Scaling Design for SSHC Piezoelectric Energy Harvesting Interfaces
    Zou, Y.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 2758-2762, 2022. DOI: 10.1109/ISCAS48785.2022.9937764

  129. A Nano-power Wake-up Circuit for Energy-driven IoT Applications
    Teng, L.; Liang, J.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 2383-2387, 2022. DOI: 10.1109/ISCAS48785.2022.9937295

  130. A 10-mV-Startup-Voltage Thermoelectric Energy Harvesting System With a Piezoelectric Starter
    Wang, R.; Liang, Y.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 1482-1486, 2022. DOI: 10.1109/ISCAS48785.2022.9937554

  131. A PV-assisted 10-mV Startup Boost Converter for Thermoelectric Energy Harvesting
    Liang, Y.; Wang, R.; Chen, Z.; Du, S.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 644-648, 2022. DOI: 10.1109/ISCAS48785.2022.9937311

  132. A Ring-Oscillator Sub-Sampling PLL With Hybrid Loop Using Generator-Based Design Flow
    Wang, Z.; Choi, M.; Wright, J.; Lee, K.; Liu, Z.; Yin, B.; Han, J.; Du, S.; Alon, E.;
    In 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 2881-2885, 2022. DOI: 10.1109/ISCAS48785.2022.9937615

  133. A 200Gb/s PAM-4 Transmitter with Hybrid Sub-Sampling PLL in 28nm CMOS Technology
    Wang, Z.; Choi, M.; Kwon, P.; Lee, K.; Yin, B.; Liu, Z.; Park, K.; Biswas, A.; Han, J.; Du, S.; Alon, E.;
    In 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
    pp. 34-35, 2022. DOI: 10.1109/VLSITechnologyandCir46769.2022.9830237

  134. A 6.78 MHz Dual-output Reconfigurable Rectifier with Hysteretic Output Regulation for Wireless Power Transfer Systems
    Lu, T.; Du, S.;
    In 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS),
    pp. 1-4, 2022. DOI: 10.1109/ICECS202256217.2022.9971112

  135. A 2-Mode Reconfigurable SSHI Rectifier with 3.2X Lower Cold-Start Requirement for Piezoelectric Energy Harvesting*
    Yue, X.; Du, S.;
    In 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS),
    pp. 1-4, 2022. DOI: 10.1109/ICECS202256217.2022.9970776

  136. Automated Characterization of Matrix Transducer Arrays using the Verasonics Imaging System
    Djalma Simoes dos Santos; Fabian Fool; Taehoon Kim; Emile Noothout; Nuriel Rozsa; Hendrik J. Vos; Johan G. Bosch; Michiel A. P. Pertijs; Martin D. Verweij; Nico de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2022.

  137. A -91 dB THD+N Resistor-Less Class-D Piezoelectric Speaker Driver Using a Dual Voltage/ Current Feedback for LC Resonance Damping
    Karmakar, Shoubhik; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    In 2022 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 1-3, 2022. DOI: 10.1109/ISSCC42614.2022.9731736

  138. A 121.4dB DR, -109.8dB THD+N Capacitively-Coupled Chopper Class-D Audio Amplifier
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    In 2022 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 1-3, 2022. DOI: 10.1109/ISSCC42614.2022.9731737

  139. A MEMS Coriolis-Based Mass-Flow-to-Digital Converter with 100g/h/surdHz Noise i Floor and Zero Stability of pm 0.35mg/h
    De Oliveira, Arthur C.; Pan, Sining; Makinwa, Kofi A. A.;
    In 2022 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 1-3, 2022. DOI: 10.1109/ISSCC42614.2022.9731704

  140. A 210nW BJT-based Temperature Sensor with an Inaccuracy of ±0.15°C (3σ) from −15°C to 85°C
    Someya, Teruki; Van Hoek, Vincent; Angevare, Jan; Pan, Sining; Makinwa, Kofi;
    In 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
    pp. 120-121, 2022. DOI: 10.1109/VLSITechnologyandCir46769.2022.9830266

  141. A ±25A Versatile Shunt-Based Current Sensor with 10kHz Bandwidth and ±0.25% Gain Error from -40°C to 85°C Using 2-Current Calibration
    Tang, Zhong; Zamparette, Roger; Furuta, Yoshikazu; Nezuka, Tomohiro; Makinwa, Kofi A. A.;
    In 2022 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 66-68, 2022. DOI: 10.1109/ISSCC42614.2022.9731777

  142. A 590 µW, 106.6 dB SNDR, 24 kHz BW Continuous-Time Zoom ADC with a Noise-Shaping 4-bit SAR ADC
    Mehrotra, Shubham; Eland, Efraïm; Karmakar, Shoubhik; Liu, Angqi; Gönen, Burak; Bolatkale, Muhammed; Van Veldhoven, Robert; Makinwa, Kofi A.A.;
    In ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC),
    pp. 253-256, 2022. DOI: 10.1109/ESSCIRC55480.2022.9911295

  143. A Self-Calibrated Hybrid Thermal-Diffusivity/Resistor-Based Temperature Sensor
    S. Pan; and J. A Angevare; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    July 2021. DOI: 10.1109/JSSC.2021.3094166
    Abstract: ... This article describes a hybrid temperature sensor in which an accurate, but energy-inefficient, thermal diffusivity (TD) sensor is used to calibrate an inaccurate, but efficient, resistor-based sensor. The latter is based on silicided polysilicon resistors embedded in a Wien-bridge (WB) filter, while the former is based on an electrothermal filter (ETF) made from a p-diffusion/metal thermopile and an n-diffusion heater. The use of an on-chip sensor for calibration obviates the need for an external temperature reference and a temperature-stabilized environment, thus reducing the cost. To mitigate the area overhead of the TD sensor, it reuses the WB filter's readout circuitry. Realized in a 180-nm CMOS technology, the hybrid sensor occupies 0.2 mm². After calibration at room temperature (~25 °C) and at an elevated temperature (~85 °C), it achieves an inaccuracy of 0.25 °C (3σ) from -55 °C to 125 °C. The WB sensor dissipates 66 μ W from a 1.8-V supply and achieves a resolution of 450 μ K_rms in a 10-ms conversion time, which corresponds to a resolution figure-of-merit (FoM) of 0.13 pJ·K². The sensor also achieves a sub-10-mHz 1/f noise corner, which is comparable to that of bipolar junction transistor (BJT)-based temperature sensors.

  144. Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3-D Carotid Artery Imaging
    T. Kim; F. Fool; D. Simoes dos Santos; Z. Y. Chang; E. Noothout; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    Sensors,
    Volume 21, Issue 1, pp. 150, January 2021. DOI: 10.3390/s21010150
    Abstract: ... This paper presents an ultrasound transceiver application-specific integrated circuit (ASIC) directly integrated with an array of 12 × 80 piezoelectric transducer elements to enable next-generation ultrasound probes for 3D carotid artery imaging. The ASIC, implemented in a 0.18 µm high-voltage Bipolar-CMOS-DMOS (HV BCD) process, adopted a programmable switch matrix that allowed selected transducer elements in each row to be connected to a transmit and receive channel of an imaging system. This made the probe operate like an electronically translatable linear array, allowing large-aperture matrix arrays to be interfaced with a manageable number of system channels. This paper presents a second-generation ASIC that employed an improved switch design to minimize clock feedthrough and charge-injection effects of high-voltage metal–oxide–semiconductor field-effect transistors (HV MOSFETs), which in the first-generation ASIC caused parasitic transmissions and associated imaging artifacts. The proposed switch controller, implemented with cascaded non-overlapping clock generators, generated control signals with improved timing to mitigate the effects of these non-idealities. Both simulation results and electrical measurements showed a 20 dB reduction of the switching artifacts. In addition, an acoustic pulse-echo measurement successfully demonstrated a 20 dB reduction of imaging artifacts.

    document

  145. A Readout IC for Capacitive Touch Screen Panels with 33.9 dB Charge-Overflow Reduction Using Amplitude-Modulated Multi-Frequency Excitation
    J.-S. An; J.-H. Ra; E. Kang; M. Pertijs; S.-H. Han;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 11, pp. 3486-3498, November 2021. DOI: 10.1109/JSSC.2021.3100470
    Abstract: ... This paper presents a readout integrated circuit (ROIC) for capacitive touch-screen panels employing an amplitude-modulated multiple-frequency excitation (AM-MFE) technique. To prevent charge overflow, which occurs periodically at the beat frequency of the excitation frequencies, the ROIC modulates the amplitude of the excitation voltages at a mixing frequency derived from the excitation frequencies. Thus, the ROIC can sense the charge signal without charge overflow and maximize the signal-to-noise ratio (SNR) by increasing the amplitude of the excitation voltages up to the sensing range of the readout circuit. The proposed ROIC was fabricated in a 0.13-µm standard CMOS process and was measured with a 32-inch 104×64 touch-screen panel using 1 mm and 10 mm metal pillars. It reduces charge overflow up to 33.9 dB compared to operation without AM-MFE. In addition, the ROIC achieves a frame rate of 2.93 kHz, and SNRs of 41.7 dB and 61.6 dB with 1 mm and 10 mm metal pillars, respectively.

  146. A Transceiver ASIC for a Single-Cable 64-Element Intra-Vascular Ultrasound Probe
    D. van Willigen; J. Janjic; E. Kang; Z. Y. Chang; E. Noothout; M. Verweij; N. de Jong; M. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 10, pp. 3157-3166, October 2021. DOI: 10.1109/jssc.2021.3083217
    Abstract: ... This article presents an application-specific integrated circuit (ASIC) designed for intra-vascular ultrasound imaging that interfaces 64 piezoelectric transducer elements to an imaging system using a single micro-coaxial cable. Thus, it allows a single-element transducer to be replaced by a transducer array to enable 3-D imaging. The 1.5-mm-diameter ASIC is intended to be mounted at the tip of a catheter, directly integrated with a 2-D array of piezoelectric transducer elements. For each of these elements, the ASIC contains a high-voltage (HV) switch, allowing the elements to transmit an acoustic wave in response to an HV pulse generated by the imaging system. A low-noise amplifier then amplifies the resulting echo signals and relays them as a signal current to the imaging system, while the same cable provides a 3-V supply. Element selection and other settings can be programmed by modulating configuration data on the supply, thus enabling full synthetic aperture imaging. An integrated element test mode measures the element capacitance to detect bad connections to the transducer elements. The ASIC has been fabricated in a 0.18-μm HV CMOS technology and consumes only 6 mW in receive. Electrical measurements show correct switching of 30-V transmit pulses and a receive amplification with a 71-dB dynamic range, including 12 dB of programmable gain over a 3-dB bandwidth of 21 MHz. The functionality of the ASIC has been successfully demonstrated in a 3-D imaging experiment.

  147. Exploiting nonlinear wave propagation to improve the precision of ultrasonic flow meters
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; N. de Jong; M. A. P. Pertijs; M. D. Verweij;
    Ultrasonics,
    Volume 116, pp. 106476, September 2021. DOI: 10.1016/j.ultras.2021.106476

  148. A 200-μW Interface for High-Resolution Eddy-Current Displacement Sensors
    M. Pimenta; Ç. Gürleyük; P. Walsh; D. O’Keeffe; M. Babaie; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, pp. 1036-1045, January 2021. DOI: 10.1109/JSSC.2020.3044027
    Abstract: ... This article presents a low-power eddy-current sensor interface for touch applications. It is based on a bang-bang digital phase-locked loop (DPLL) that converts the displacement of a metal target into digital information. The PLL consists of a digitally controlled oscillator (DCO) built around a sensing coil and a capacitive DAC, a comparator-based bang-bang phase/frequency detector (PFD), and a digital loop filter (DLF). The PLL locks the DCO to a reference frequency, making its digital input a direct representation of the sensing coil inductance. To compensate for the coil inductance tolerances, the DCO’s center frequency can be trimmed by a second capacitive DAC. This approach obviates the need for a reference coil. When combined with a 5-mm-diameter sensing coil located 500 μm from a metal target, the interface achieves a displacement resolution of 6.7 nm (rms) in a 3-kHz bandwidth. It consumes 200 μW from a 1.8-V power supply, which represents the best-reported tradeoff between power consumption, bandwidth, and resolution.

  149. A 440-μW, 109.8-dB DR, 106.5-dB SNDR Discrete-Time Zoom ADC With a 20-kHz BW
    E. Eland; S. Karmakar; B. Gönen; R. van Veldhoven; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, pp. 1207-1215, January 2021. DOI: 10.1109/JSSC.2020.3044896
    Abstract: ... This article describes a discrete-time zoom analog-to-digital converter (ADC) intended for audio applications. It uses a coarse 5-bit SAR ADC in tandem with a fine third-order delta–sigma modulator ( ΔΣM ) to efficiently obtain a high dynamic range. To minimize its over-sampling ratio (OSR) and, thus, its digital power consumption, the modulator employs a 2-bit quantizer and a loop filter notch. In addition, an extra feed-forward path minimizes the leakage of the SAR ADC’s quantization noise into the audio band. The prototype ADC occupies 0.27 mm 2 in a 0.16- μm technology. It achieves 109.8-dB DR, 106.5-dB SNDR, and 107.5-dB SNR in a 20-kHz bandwidth while dissipating 440 μW . It also achieves state-of-the-art energy efficiency, as demonstrated by a Schreier FoM of 186.4 dB and an SNDR FoM of 183.6 dB.

  150. Integrated Transceivers for Emerging Medical Ultrasound Imaging Devices: A Review
    C. Chen; M. Pertijs;
    IEEE Open Journal of the Solid-State Circuits Society,
    Volume 1, pp. 104-114, September 2021. DOI: 10.1109/OJSSCS.2021.3115398

  151. A High-Linearity and Low-EMI Multilevel Class-D Amplifier
    Zhang, Huajun; Karmakar, Shoubhik; Breems, Lucien J.; Sandifort, Quino; Berkhout, Marco; Makinwa, Kofi A. A.; Fan, Qinwen;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 4, pp. 1176-1185, 2021. DOI: 10.1109/JSSC.2020.3043815

  152. A Mechanically Flexible, Implantable Neural Interface for Computational Imaging and Optogenetic Stimulation Over 5.4×5.4 mm 2 FoV
    Moazeni, Sajjad; Pollmann, Eric H; Boominathan, Vivek; Cardoso, Filipe Arroyo; Robinson, Jacob T; Veeraraghavan, Ashok; Shepard, Kenneth L;
    IEEE Transactions on Biomedical Circuits and Systems,
    Volume 15, Issue 6, pp. 1295-1305, 2021.

  153. An integrated 2D ultrasound phased array transmitter in CMOS with pixel pitch-matched beamforming
    Costa, Tiago; Shi, Chen; Tien, Kevin; Elloian, Jeffrey; Cardoso, Filipe Arroyo; Shepard, Kenneth L;
    IEEE Transactions on Biomedical Circuits and Systems,
    Volume 15, Issue 4, pp. 731-742, 2021.

  154. A Fill-In Technique for Robust IMD Suppression in Chopper Amplifiers
    Rooijers, Thije; Karmakar, Shoubhik; Kusuda, Yoshinori; Huijsing, Johan H.; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 12, pp. 3583-3592, 2021. DOI: 10.1109/JSSC.2021.3107350

  155. A Self-Calibrated Hybrid Thermal-Diffusivity/Resistor-Based Temperature Sensor
    S. Pan; and J. A Angevare; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 12, pp. 3551-3559, July 2021. DOI: 10.1109/JSSC.2021.3094166
    Abstract: ... This article describes a hybrid temperature sensor in which an accurate, but energy-inefficient, thermal diffusivity (TD) sensor is used to calibrate an inaccurate, but efficient, resistor-based sensor. The latter is based on silicided polysilicon resistors embedded in a Wien-bridge (WB) filter, while the former is based on an electrothermal filter (ETF) made from a p-diffusion/metal thermopile and an n-diffusion heater. The use of an on-chip sensor for calibration obviates the need for an external temperature reference and a temperature-stabilized environment, thus reducing the cost. To mitigate the area overhead of the TD sensor, it reuses the WB filter's readout circuitry. Realized in a 180-nm CMOS technology, the hybrid sensor occupies 0.2 mm². After calibration at room temperature (~25 °C) and at an elevated temperature (~85 °C), it achieves an inaccuracy of 0.25 °C (3σ) from -55 °C to 125 °C. The WB sensor dissipates 66 μ W from a 1.8-V supply and achieves a resolution of 450 μ K_rms in a 10-ms conversion time, which corresponds to a resolution figure-of-merit (FoM) of 0.13 pJ·K². The sensor also achieves a sub-10-mHz 1/f noise corner, which is comparable to that of bipolar junction transistor (BJT)-based temperature sensors.

  156. A 200-μW Interface for High-Resolution Eddy-Current Displacement Sensors
    M. Pimenta; Ç. Gürleyük; P. Walsh; D. O’Keeffe; M. Babaie; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 4, pp. 1036-1045, January 2021. DOI: 10.1109/JSSC.2020.3044027
    Abstract: ... This article presents a low-power eddy-current sensor interface for touch applications. It is based on a bang-bang digital phase-locked loop (DPLL) that converts the displacement of a metal target into digital information. The PLL consists of a digitally controlled oscillator (DCO) built around a sensing coil and a capacitive DAC, a comparator-based bang-bang phase/frequency detector (PFD), and a digital loop filter (DLF). The PLL locks the DCO to a reference frequency, making its digital input a direct representation of the sensing coil inductance. To compensate for the coil inductance tolerances, the DCO’s center frequency can be trimmed by a second capacitive DAC. This approach obviates the need for a reference coil. When combined with a 5-mm-diameter sensing coil located 500 μm from a metal target, the interface achieves a displacement resolution of 6.7 nm (rms) in a 3-kHz bandwidth. It consumes 200 μW from a 1.8-V power supply, which represents the best-reported tradeoff between power consumption, bandwidth, and resolution.

  157. A 440-μW, 109.8-dB DR, 106.5-dB SNDR Discrete-Time Zoom ADC With a 20-kHz BW
    E. Eland; S. Karmakar; B. Gönen; R. van Veldhoven; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 4, pp. 1207-1215, January 2021. DOI: 10.1109/JSSC.2020.3044896
    Abstract: ... This article describes a discrete-time zoom analog-to-digital converter (ADC) intended for audio applications. It uses a coarse 5-bit SAR ADC in tandem with a fine third-order delta–sigma modulator ( ΔΣM ) to efficiently obtain a high dynamic range. To minimize its over-sampling ratio (OSR) and, thus, its digital power consumption, the modulator employs a 2-bit quantizer and a loop filter notch. In addition, an extra feed-forward path minimizes the leakage of the SAR ADC’s quantization noise into the audio band. The prototype ADC occupies 0.27 mm 2 in a 0.16- μm technology. It achieves 109.8-dB DR, 106.5-dB SNDR, and 107.5-dB SNR in a 20-kHz bandwidth while dissipating 440 μW . It also achieves state-of-the-art energy efficiency, as demonstrated by a Schreier FoM of 186.4 dB and an SNDR FoM of 183.6 dB.

  158. A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays
    P. Guo; Z. Y. Chang; E. Noothout; H. J. Vos; J. Bosch; N. de Jong; M. D. Verweij; M. A. P. Pertijs;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    pp. 163-166, September 2021.
    Abstract: ... This paper presents a compact programmable high-voltage (HV) pulser for ultrasound imaging, designed for driving capacitive micro-machined ultrasonic transducers (CMUTs) in miniature ultrasound probes. To enable bipolar return-to-zero pulsing and embedded transmit/receive switching, a compact back-to-back isolating HV switch is proposed that employs HV floating-gate drivers with only one HV MOS transistor each. The pulser can be digitally programmed to generate bipolar pulses with and without return-to-zero, with a peak-to-peak swing up to 60 V, as well as negative and positive unipolar pulses. It can generate bursts of up to 63 pulses, with a maximum pulse frequency of 9 MHz for an 18 pF transducer capacitance. Realized in TSMC 0.18 μm HV BCD technology, the pulser occupies only 0.167 mm2. Electrical characterization results of the pulser, as well as acoustic results obtained in combination with a 7.5-MHz CMUT transducer, are presented.

  159. A Low-Field Portable Nuclear Magnetic Resonance (NMR) Microfluidic Flowmeter
    E. Aydin; K.A.A. Makinwa;
    In Proc. IEEE Transducers,
    August 2021. DOI: 10.1109/Transducers50396.2021.9495479

  160. A ±2A/15A Current Sensor with 1.4 μA Supply Current and ±0.35%/0.6% Gain Error From −40 to 85°C using an Analog Temperature-Compensation Scheme
    R. Zamparette; K. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    June 2021. DOI: 10.23919/VLSICircuits52068.2021.9492361

  161. A Chopper-Stabilized Amplifier with -107dB IMD and 28dB Suppression of Chopper-Induced IMD
    T. Rooijers; S. Karmakar; Y. Kusuda; J. H. Huijsing; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2021. DOI: 10.1109/ISSCC42613.2021.9365790

  162. A Hybrid Thermal-Diffusivity/Resistor-Based Temperature Sensor with a Self-Calibrated Inaccuracy of ±0.25° C (3σ) from -55°C to 125°C
    S. Pan; and J. A Angevare; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2021. DOI: 10.1109/ISSCC42613.2021.9366032

  163. A MEMS Coriolis Mass Flow Sensor with 300 μ g/h/√Hz Resolution and ± 0.8mg/h Zero Stability
    A. C. de Oliveira; J. Groenesteijn; R. J. Wiegerink; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2021. DOI: 10.1109/ISSCC42613.2021.9365946

  164. A 0.9V 28MHz Dual-RC Frequency Reference with 5pJ/Cycle and ±200 ppm Inaccuracy from -40°C to 85°C
    W. Choi; J. A. Angevare; I. Park; K. A. A. Makinwa; Y. Chae;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2021. DOI: 10.1109/ISSCC42613.2021.9366021

  165. A Highly Digital 2210μm2 Resistor-Based Temperature Sensor with a 1-Point Trimmed Inaccuracy of ± 1.3 ° C (3 σ) from -55 ° C to 125 ° C in 65nm CMOS
    J. A. Angevare; Y. Chae; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2021. DOI: 10.1109/ISSCC42613.2021.9365995

  166. A 0.14mm2 16MHz CMOS RC Frequency Reference with a 1-Point Trimmed Inaccuracy of ±400ppm from -45°C to 85°C
    H. Jiang; S. Pan; Ç. Gürleyük; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    February 2021. DOI: 10.1109/ISSCC42613.2021.9365795

  167. Experimental Investigation of the Effect of Subdicing on an Ultrasound Matrix Transducer
    D. Simoes dos Santos; F. Fool; T. Kim; E. Noothout; H. J. Vos; J. G. Bosch; M. A. P. Pertijs; M. D. Verweij; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2021. DOI: 10.1109/ius52206.2021.9593315
    Abstract: ... Over the past decades, real-time three-dimensional (3D) medical ultrasound has attracted much attention since it enables clinicians to diagnose more accurately. This calls for ultrasound matrix transducers with a large number of elements, which can be interfaced with an application-specific integrated circuit (ASIC) for data reduction. An important aspect of the design of such a transducer is the geometry of each element, since it affects the mode of vibration and, consequently, the efficiency of the transducer. In this paper, we experimentally investigate the effect of subdicing on a piezoelectric (PZT) transducer. We fabricate and acoustically characterize a prototype PZT matrix transducer built on top of ASICs. The prototype transducer contains subdiced and non-subdiced elements, whose performance can be directly compared under the same conditions. Measurement results show that subdiced elements have a better performance compared to non-subdiced ones. Subdicing increases the peak pressure by 25%, raises the bandwidth by 10% and reduces the ringing time by 25%.

  168. Automatic beam alignment in a clamp-on ultrasonic flow meter based on array transducers
    J. Massaad; P. van Neer; D. van Willigen; N. de Jong; M. Pertijs; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2021. abstract.

  169. Feasibility of measuring flow velocity profiles with array-based clamp-on ultrasonic flow meters
    D. van Willigen; P. van Neer; J. Massaad; N. de Jong; M. Verweij; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2021. abstract.

  170. A Compact Integrated High -Voltage Pulserfor 3D Miniature Ultrasound Probes
    Yannick Hopf; Mehdi Soozande; Boudewine Ossenkoppele; Hendrik J. Vos; Martin D. Verweij; Johan G. Bosch; Nico de Jong; Michiel A. P. Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2021. poster.

  171. A Low-Power Reconfigurable Transceiver ASIC for a CMUT-based Wearable Ultrasound Patch
    Mingliang Tan; Tim Hosman; Jae-Sung An; Zu-Yao Chang; Michiel Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2021.

  172. An Area-Efficient Continuous Time-Gain Compensation Amplifier for Ultrasound Application
    P. Guo; Z.Y. Chang; E. Noothout; H.J. Vos; J.G. Bosch; N. de Jong; M.D. Verweij; M.A.P. Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2021. poster.

  173. An Automated and Process-Portable Generator for Phase-Locked Loop
    Wang, Z.; Choi, M.; Chang, E.; Wright, J.; Bae, W.; Du, S.; Liu, Z.; Narevsky, N.; Schmidt, C.; Biwas, A.; Nikolic, B.; Alon, E.;
    In 2021 58th ACM/IEEE Design Automation Conference (DAC),
    pp. 511-516, 2021. DOI: 10.1109/DAC18074.2021.9586318

  174. Voltage Flip Efficiency Optimization of SSHC Rectifiers for Piezoelectric Energy Harvesting
    Yue, X.; Du, S.;
    In 2021 IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 1-5, 2021. DOI: 10.1109/ISCAS51556.2021.9401330

  175. An Automated and Process-Portable Generator for Phase-Locked Loop
    Wang, Z.; Choi, M.; Chang, E.; Wright, J.; Bae, W.; Du, S.; Liu, Z.; Narevsky, N.; Schmidt, C.; Biwas, A.; Nikolic, B.; Alon, E.;
    In 2021 58th ACM/IEEE Design Automation Conference (DAC),
    pp. 511-516, 2021. DOI: 10.1109/DAC18074.2021.9586318

  176. A Mechanically Flexible Implantable Neural Interface for Computational Imaging and Optogenetic Stimulation over 5.4×5.4 mm 2 FoV
    Moazeni, Sajjad; Pollmann, Eric H.; Boominathan, Vivek; Cardoso, Filipe Arroyo; Robinson, Jacob T.; Veeraraghavan, Ashok; Shepard, Kenneth L.;
    In 2021 IEEE International Solid- State Circuits Conference (ISSCC),
    pp. 288-290, 2021. DOI: 10.1109/ISSCC42613.2021.9365796

  177. A −121.5 dB THD Class-D Audio Amplifier with 49 dB Suppression of LC Filter Nonlinearity and Robust to +/−30% LC Filter Spread
    Zhang, Huajun; Berkhout, Marco; Makinwa, Kofi; Fan, Qinwen;
    In 2021 Symposium on VLSI Circuits,
    pp. 1-2, 2021. DOI: 10.23919/VLSICircuits52068.2021.9492441

  178. A 25A Hybrid Magnetic Current Sensor with 64mA Resolution, 1.8MHz Bandwidth, and a Gain Drift Compensation Scheme
    Jouyaeian, Amirhossein; Fan, Qinwen; Motz, Mario; Ausserlechner, Udo; Makinwa, Kofi A. A.;
    In 2021 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 82-84, 2021. DOI: 10.1109/ISSCC42613.2021.9365767

  179. A ±2A/15A Current Sensor with 1.4 μA Supply Current and ±0.35%/0.6% Gain Error From −40 to 85°C using an Analog Temperature-Compensation Scheme
    R. Zamparette; K. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    pp. 1-2, June 2021. DOI: 10.23919/VLSICircuits52068.2021.9492361

  180. A Low-Field Portable Nuclear Magnetic Resonance (NMR) Microfluidic Flowmeter
    E. Aydin; K.A.A. Makinwa;
    In Proc. IEEE Transducers,
    pp. 1020-1023, August 2021. DOI: 10.1109/Transducers50396.2021.9495479

  181. A 0.14mm2 16MHz CMOS RC Frequency Reference with a 1-Point Trimmed Inaccuracy of ±400ppm from -45°C to 85°C
    H. Jiang; S. Pan; Ç. Gürleyük; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 436-438, February 2021. DOI: 10.1109/ISSCC42613.2021.9365795

  182. A Hybrid Thermal-Diffusivity/Resistor-Based Temperature Sensor with a Self-Calibrated Inaccuracy of ±0.25° C (3σ) from -55°C to 125°C
    S. Pan; and J. A Angevare; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 78-80, February 2021. DOI: 10.1109/ISSCC42613.2021.9366032

  183. A Chopper-Stabilized Amplifier with -107dB IMD and 28dB Suppression of Chopper-Induced IMD
    T. Rooijers; S. Karmakar; Y. Kusuda; J. H. Huijsing; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 438-440, February 2021. DOI: 10.1109/ISSCC42613.2021.9365790

  184. A MEMS Coriolis Mass Flow Sensor with 300 μ g/h/√Hz Resolution and ± 0.8mg/h Zero Stability
    A. C. de Oliveira; J. Groenesteijn; R. J. Wiegerink; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 84-86, February 2021. DOI: 10.1109/ISSCC42613.2021.9365946

  185. A Highly Digital 2210μm2 Resistor-Based Temperature Sensor with a 1-Point Trimmed Inaccuracy of ± 1.3 ° C (3 σ) from -55 ° C to 125 ° C in 65nm CMOS
    J. A. Angevare; Y. Chae; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 76-78, February 2021. DOI: 10.1109/ISSCC42613.2021.9365995

  186. A 0.9V 28MHz Dual-RC Frequency Reference with 5pJ/Cycle and ±200 ppm Inaccuracy from -40°C to 85°C
    W. Choi; J. A. Angevare; I. Park; K. A. A. Makinwa; Y. Chae;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 434-436, February 2021. DOI: 10.1109/ISSCC42613.2021.9366021

  187. Resistor-Based Temperature Sensors
    S. Pan, K.A.A. Makinwa;
    In Proc. Advances in Analog Circuit Design Workshop (AACD),
    March 2021.

  188. Impact of Bit Errors in Digitized RF Data on Ultrasound Image Quality
    Z. Chen; M. Soozande; H. Vos; J. Bosch; M. Verweij; N. de Jong; M. Pertijs;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 67, Issue 1, pp. 13-24, January 2020. DOI: 10.1109/TUFFC.2019.2937462
    Abstract: ... This paper quantitatively analyzes the impact of bit errors in digitized RF data on ultrasound image quality. The quality of B-mode images in both linear and phased array imaging is evaluated by means of three objective image quality metrics: peak signal-to-noise ratio, structural similarity index and contrast-to-noise ratio, when bit errors are introduced to the RF data with different bit-error rates (BERs). The effectiveness of coding schemes for forward error detection and correction to improve the image quality is also studied. The results show that ultrasound imaging is inherently resilient to high BER. The image quality suffers unnoticeable degradation for BER lower than 1E-6. Simple 1-bit parity coding with 9% added redundancy helps to retain similar image quality for BER up to 1E-4, and Hamming coding with 33.3% added redundancy allows the BER to increase to 1E-3. These results can serve as a guideline in the datalink design for ultrasound probes with in-probe receive digitization. With much more relaxed BER requirements than in typical datalinks, the design can be optimized by allowing fewer cables with higher data rate per cable or lower power consumption with the same cable count.

  189. A 117-dB In-Band CMRR 98.5-dB SNR Capacitance-to-Digital Converter for Sub-nm Displacement Sensing With an Electrically Floating Target
    Hui Jiang; Samira Amani; Johan G. Vogel; Saleh Heidary Shalmany; Stoyan Nihtianov;
    IEEE Solid-State Circuits Letters,
    Volume 3, pp. 9--12, 2020. DOI: 10.1109/lssc.2019.2952851

  190. An Algorithm to Minimize the Zero-Flow Error in Transit-Time Ultrasonic Flow Meters
    Douwe M. van Willigen; Paul L.M.J. van Neer; Jack Massaad; Nico de Jong; Martin D. Verweij; Michiel A.P. Pertijs;
    IEEE Transactions on Instrumentation and Measurement,
    2020. DOI: 10.1109/TIM.2020.3007907
    Abstract: ... Transit-time ultrasonic flow meters are widely used in industry to measure fluid flow. In practice ultrasonic flow meters either show a zero-flow error or suffer from a significant random error due to a limited signal-to-noise ratio, requiring a significant amount of averaging to achieve good precision. This work presents a method that minimizes the zero-flow error whilst keeping the random error low, independent of the hardware used. The proposed algorithm can adjust to changing zero-flow errors while a flow is present. The technique combines the benefits of two common methods of determining the transit-time difference between the upstream and downstream ultrasonic waves: cross-correlation and zero-crossing detection. The algorithm is verified experimentally using a flow-loop. It is shown that the zero-flow error can be greatly reduced without compromising the random error or increasing circuit complexity.

  191. A 64-Channel Transmit Beamformer with ±30V Bipolar High-Voltage Pulsers for Catheter-Based Ultrasound Probes
    M. Tan; E. Kang; J.-S. An; Z. Y. Chang; P. Vince; T. Matéo; N. Sénégond; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 55, Issue 7, pp. 1796-1806, July 2020. DOI: 10.1109/JSSC.2020.2987719
    Abstract: ... This article presents a fully integrated 64-channel programmable ultrasound transmit beamformer for catheter-based ultrasound probes, designed to interface with a capacitive micro-machined ultrasound transducer (CMUT) array. The chip is equipped with programmable high-voltage (HV) pulsers that can generate ±30-V return-to-zero (RZ) and non-RZ pulses. The pulsers employ a compact back-to-back isolating HV switch topology that employs HV floating-gate drivers with only one HV MOS transistor each. Further die-size reduction is achieved by using the RZ switches also as the transmit/receive (T/R) needed to pass received echo signals to low-voltage receive circuitry. On-chip digital logic clocked at 200 MHz allows the pulse timing to be programmed with a resolution of 5 ns, while supporting pulses of 1 cycle up to 63 cycles. The chip has been implemented in 0.18-μm HV Bipolar-CMOS-DMOS (BCD) technology and occupies an area of 1.8 mm x 16.5 mm, suitable for integration into an 8-F catheter. Each pulser with embedded T/R switch and digital logic occupies only 0.167 mm². The pulser successfully drives an 18-pF transducer capacitance at pulse frequencies up to 9 MHz. The T/R switch has a measured ON-resistance of ~180 Ω . The acoustic results obtained in combination with a 7.5-MHz 64-element CMUT array demonstrate the ability to generate steered and focused acoustic beams.

  192. Suppression of Lamb wave excitation via aperture control of a transducer array for ultrasonic clamp-on flow metering
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; M. A. P. Pertijs; N. de Jong; M. D. Verweij;
    Journal of the Acoustical Society of America,
    Volume 147, Issue 4, pp. 2670-2681, February 2020. DOI: 10.1121/10.0001135
    Abstract: ... During ultrasonic clamp-on flow metering, Lamb waves propagating in the pipe wall may limit the measurement accuracy by introducing absolute errors in the flow estimates. Upon reception, these waves can interfere with the up and downstream waves refracting from the liquid, and disturb the measurement of the transit time difference that is used to obtain the flow speed. Thus, suppression of the generation of Lamb waves might directly increase the accuracy of a clamp-on flow meter. Existing techniques apply to flow meters with single element transducers. This paper considers the application of transducer arrays and presents a method to achieve a predefined amount of suppression of these spurious Lamb waves based on appropriate amplitude weightings of the transducer elements. Finite element simulations of an ultrasonic clamp-on flow measurement setting will be presented to show the effect of array aperture control on the suppression of the Lamb waves in a 1-mm-thick stainless steel pipe wall. Furthermore, a proof-of-principle experiment will be shown that demonstrates a good agreement with the simulations.

  193. Towards a calibration-free ultrasonic clamp-on flow meter: Pipe geometry measurements using matrix arrays
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; M. A. P. Pertijs; N. de Jong; M. D. Verweij;
    Proceedings of Meetings on Acoustics,
    Volume 39, Issue 1, February 2020. DOI: 10.1121/2.0001187
    Abstract: ... Current ultrasonic clamp-on flow meters are manually calibrated. This process is based on manual placement of two single-element transducers along a pipe wall. Due to the usually unknown pipe properties and inhomogeneities in the pipe geometry, the axial distance of the transducers needs to be manually calibrated to align the location of the emitted beam on the receiver. In this work it is presented an automatic calibration procedure, based on matrix transducer arrays, to provide calibration information that would normally be entered into the instrument manually prior to ultrasonic clamp-on flow measurements. The calibration consists of two steps: First, along the axial direction of the pipe, Lamb waves are excited and recorded. Then, the measured time signals are combined with the Rayleigh-Lamb dispersion equation to extract pipe wall thickness and bulk wave sound speeds. Second, along the circumferential direction of the pipe, a specific Lamb wave mode is excited and recorded, from which the pipe diameter is estimated. The potential of both calibration procedures is shown, and the necessity of a matrix transducer array (i.e. small elements) is highlighted.

  194. An Algorithm to Minimize the Zero-Flow Error in Transit-Time Ultrasonic Flow Meters
    D. M. van Willigen; P. L. M. J. van Neer; J. Massaad; N. de Jong; M. D. Verweij; M. A. P. Pertijs;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 70, pp. 1-9, July 2020. DOI: 10.1109/TIM.2020.3007907
    Abstract: ... Transit-time ultrasonic flowmeters are widely used in industry to measure fluid flow. In practice, ultrasonic flowmeters either show a zero-flow error or suffer from a significant random error due to a limited signal-to-noise ratio, requiring a significant amount of averaging to achieve good precision. This work presents a method that minimizes the zero-flow error while keeping the random error low, independent of the hardware used. The proposed algorithm can adjust to changing zero-flow errors, while a flow is present. The technique combines the benefits of two common methods of determining the transit time difference between the upstream and downstream ultrasonic waves: cross correlation and zero-crossing detection. The algorithm is verified experimentally using a flow loop. It is shown that the zero-flow error can be greatly reduced without compromising the random error or increasing circuit complexity.

  195. Receive/Transmit Aperture Selection for 3D Ultrasound Imaging with a 2D Matrix Transducer
    M. Mozaffarzadeh; M. Soozande; F. Fool; M. A. P. Pertijs; H. J. Vos; M. D. Verweij; J. G. Bosch; N. de Jong;
    MDPI Applied Sciences,
    Volume 10, Issue 15, July 2020. DOI: 10.3390/app10155300
    Abstract: ... Recently, we realized a prototype matrix transducer consisting of 48 rows of 80 elements on top of a tiled set of Application Specific Integrated Circuits (ASICs) implementing a row-level control connecting one transmit/receive channel to an arbitrary subset of elements per row. A fully sampled array data acquisition is implemented by a column-by-column (CBC) imaging scheme (80 transmit-receive shots) which achieves 250 volumes/second (V/s) at a pulse repetition frequency of 20 kHz. However, for several clinical applications such as carotid pulse wave imaging (CPWI), a volume rate of 1000 per second is needed. This allows only 20 transmit-receive shots per 3D image. In this study, we propose a shifting aperture scheme and investigate the effects of receive/transmit aperture size and aperture shifting step in the elevation direction. The row-level circuit is used to interconnect elements of a receive aperture in the elevation (row) direction. An angular weighting method is used to suppress the grating lobes caused by the enlargement of the effective elevation pitch of the array, as a result of element interconnection in the elevation direction. The effective aperture size, level of grating lobes, and resolution/sidelobes are used to select suitable reception/transmission parameters. Based on our assessment, the proposed imaging sequence is a full transmission (all 80 elements excited at the same time), a receive aperture size of 5 and an aperture shifting step of 3. Numerical results obtained at depths of 10, 15, and 20 mm show that, compared to the fully sampled array, the 1000 V/s is achieved at the expense of, on average, about two times wider point spread function and 4 dB higher clutter level. The resulting grating lobes were at −27 dB. The proposed imaging sequence can be used for carotid pulse wave imaging to generate an informative 3D arterial stiffness map, for cardiovascular disease assessment.

  196. A Variable-Gain Low-Noise Transimpedance Amplifier for Miniature Ultrasound Probes
    E. Kang; M. Tan; J. S. An; Z. Y. Chang; P. Vince; N. Sénégond; T. Mateo; C. Meynier; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 55, Issue 12, pp. 3157--3168, December 2020. DOI: 10.1109/jssc.2020.3023618
    Abstract: ... This article presents a low-noise transimpedance amplifier (TIA) designed for miniature ultrasound probes. It provides continuously variable gain to compensate for the time-dependent attenuation of the received echo signal. This time-gain compensation (TGC) compresses the echo-signal dynamic range (DR) while avoiding imaging artifacts associated with discrete gain steps. Embedding the TGC function in the TIA reduces the output DR, saving power compared to prior solutions that apply TGC after the low-noise amplifier. The TIA employs a capacitive ladder feedback network and a current-steering circuit to obtain a linear-in-dB gain range of 37 dB. A variable-gain loop amplifier based on current-reuse stages maintains constant bandwidth in a power-efficient manner. The TIA has been integrated in a 64-channel ultrasound transceiver application-specific integrated circuit (ASIC) in a 180-nm BCDMOS process and occupies a die area of 0.12 mm². It achieves a gain error below ±1 dB and a 1.7 pA/√ Hz noise floor and consumes 5.2 mW from a ±0.9 V supply. B-mode images of a tissue-mimicking phantom are presented that show the benefits of the TGC scheme.

  197. A 6.6-μW Wheatstone-Bridge Temperature Sensor for Biomedical Applications
    S. Pan; K. A. A. Makinwa;
    IEEE Solid-State Circuits Letters,
    Volume 3, pp. 334-337, August 2020. DOI: 10.1109/LSSC.2020.3019078
    Abstract: ... This letter presents a compact, energy-efficient, and low-power Wheatstone-bridge temperature sensor for biomedical applications. To maximize sensitivity and reduce power dissipation, the sensor employs a high-resistance (600 kΩ) bridge that consists of resistors with positive (silicided-poly) and negative (n-poly) temperature coefficients. Resistor spread is then mitigated by trimming the n -poly arms with a 12-bit DAC, which consists of a 5-bit series DAC whose LSB is trimmed by a 7-bit PWM generator. The bridge is readout by a second-order delta–sigma modulator, which dynamically balances the bridge by tuning the resistance of the silicided-poly arms via a 1-bit series DAC. As a result, the modulator’s bitstream average is an accurate and near-linear function of temperature, which does not require further correction in the digital domain. Fabricated in a 180-nm CMOS technology, the sensor occupies 0.12mm2 . After a 1-point trim, it achieves +0.2 °C/−0.1 °C (3σ) inaccuracy in a ±10 °C range around body temperature (37.5 °C). It consumes 6.6 μW from a 1.6-V supply, and achieves 200-μK resolution in a 40-ms conversion time, which corresponds to a state-of-the-art resolution FoM of 11 fJ⋅K2 . Duty cycling the sensor results in even lower average power: 700nW at 10 conversions/s.

  198. A 10 fJ·K² Wheatstone Bridge Temperature Sensor With a Tail-Resistor-Linearized OTA
    S. Pan; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 501-510, September 2020. DOI: 10.1109/JSSC.2020.3018164
    Abstract: ... This article describes a highly energy-efficient Wheatstone bridge temperature sensor. To maximize sensitivity, the bridge is made from resistors with positive (silicided diffusion) and negative (poly) temperature coefficients. The bridge is balanced by a resistive (poly) FIR-DAC, which is part of a 2nd-order continuous-time delta-sigma modulator (CTΔ ΣM). Each stage of the modulator is based on an energy-efficient current-reuse OTA. To efficiently suppress quantization noise foldback, the 1st stage OTA employs a tail-resistor linearization scheme. Sensor accuracy is enhanced by realizing the poly arms of the bridge and the DAC from identical unit elements. Fabricated in a 180-nm CMOS technology, the sensor draws 55 μW from a 1.8-V supply and achieves a resolution of 150 μK_rms in an 8-ms conversion time. This translates into a state-of-the-art resolution figure-of-merit (FoM) of 10 fJ·K². Furthermore, the sensor achieves an inaccuracy of ±0.4 °C (3σ) from -55 °C to 125 °C after a ratio-based one-point trim and systematic non-linearity removal, which improves to ±0.1 °C (3σ) after a 1st-order fit.

  199. A wearable fluidic collection patch and ion chromatography method for sweat electrolyte monitoring during exercise
    Steijlen, Annemarijn SM; Bastemeijer, Jeroen; Groen, Pim; Jansen, Kaspar MB; French, Patrick J; Bossche, Andre;
    Analytical Methods,
    Volume 12, Issue 48, pp. 5885--5892, 2020. DOI: 10.1039/D0AY02014A
    Abstract: ... This paper presents a method to continuously collect and reliably measure sweat analyte concentrations during exercise. The method can be used to validate newly developed sweat sensors and to obtain insight into intraindividual variations of sweat analytes in athletes. First, a novel design of a sweat collection system is created. The sweat collection patch, that is made from hydrophilized foil and a double-sided acrylate adhesive, consists of a reservoir array that collects samples consecutively in time. During a physiological experiment, sweat can be collected from the back of a participant and the filling speed of the collector is monitored by using a camera. After the experiment, Na+, Cl− and K+ levels are measured with ion chromatography. Sweat analyte variations are measured during exercise for an hour at three different locations on the back. The Na+ and Cl− variations show a similar trend and the absolute concentrations vary with the patch location. Na+ and Cl− concentrations increase and K+ concentrations seem to decrease during this exercise. With this new sweat collection system, sweat Na+, Cl− and K+ concentrations can be collected over time during exercise at medium to high intensity, to analyse the trend in electrolyte variations per individual.

  200. An Inertial Measurement Unit Based Method to Estimate Hip and Knee Joint Kinematics in Team Sport Athletes on the Field
    Bastiaansen, Bram JC; Wilmes, Erik; Brink, Michel S; de Ruiter, Cornelis J; Savelsbergh, Geert JP; Steijlen, Annemarijn; Jansen, Kaspar MB; van der Helm, Frans CT; Goedhart, Edwin A; van der Laan, Doris; others;
    JoVE (Journal of Visualized Experiments),
    Issue 159, pp. e60857, 2020. DOI: 10.3791/60857
    Abstract: ... Current athlete monitoring practice in team sports is mainly based on positional data measured by global positioning or local positioning systems. The disadvantage of these measurement systems is that they do not register lower extremity kinematics, which could be a useful measure for identifying injury-risk factors. Rapid development in sensor technology may overcome the limitations of the current measurement systems. With inertial measurement units (IMUs) securely fixed to body segments, sensor fusion algorithms and a biomechanical model, joint kinematics could be estimated. The main purpose of this article is to demonstrate a sensor setup for estimating hip and knee joint kinematics of team sport athletes in the field. Five male subjects (age 22.5 ± 2.1 years; body mass 77.0 ± 3.8 kg; height 184.3 ± 5.2 cm; training experience 15.3 ± 4.8 years) performed a maximal 30-meter linear sprint. Hip and knee joint angles and angular velocities were obtained by five IMUs placed on the pelvis, both thighs and both shanks. Hip angles ranged from 195° (± 8°) extension to 100.5° (± 8°) flexion and knee angles ranged from 168.6° (± 12°) minimal flexion and 62.8° (± 12°) maximal flexion. Furthermore, hip angular velocity ranged between 802.6 °·s-1 (± 192 °·s-1) and -674.9 °·s-1 (± 130 °·s-1). Knee angular velocity ranged between 1155.9 °·s-1 (± 200 °·s-1) and -1208.2 °·s-1 (± 264 °·s-1). The sensor setup has been validated and could provide additional information with regard to athlete monitoring in the field. This may help professionals in a daily sports setting to evaluate their training programs, aiming to reduce injury and optimize performance.

  201. A Resistive Degeneration Technique for Linearizing Open-Loop Amplifiers
    M. S. Akter; R. Sehgal; K. Bult;
    IEEE Transactions on Circuits and Systems II: Express Briefs,
    Volume 67, Issue 11, pp. 2322-2326, 2020. DOI: 10.1109/TCSII.2020.2966276

  202. A 28-W, −102.2-dB THD+N Class-D Amplifier Using a Hybrid ΔΣM-PWM Scheme
    Karmakar, Shoubhik; Zhang, Huajun; van Veldhoven, Robert; Breems, Lucien J.; Berkhout, Marco; Fan, Qinwen; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 55, Issue 12, pp. 3146-3156, 2020. DOI: 10.1109/JSSC.2020.3023874

  203. A BJT-Based Temperature-to-Digital Converter With a ±0.25 °C 3 $\sigma$ -Inaccuracy From −40 °C to +180 °C Using Heater-Assisted Voltage Calibration
    Yousefzadeh, Bahman; Makinwa, Kofi A. A.;
    IEEE Journal of Solid-State Circuits,
    Volume 55, Issue 2, pp. 369-377, 2020. DOI: 10.1109/JSSC.2019.2953834

  204. A 10 fJ·K² Wheatstone Bridge Temperature Sensor With a Tail-Resistor-Linearized OTA
    S. Pan; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 56, Issue 501-510, pp. 501-510, September 2020. DOI: 10.1109/JSSC.2020.3018164
    Abstract: ... This article describes a highly energy-efficient Wheatstone bridge temperature sensor. To maximize sensitivity, the bridge is made from resistors with positive (silicided diffusion) and negative (poly) temperature coefficients. The bridge is balanced by a resistive (poly) FIR-DAC, which is part of a 2nd-order continuous-time delta-sigma modulator (CTΔ ΣM). Each stage of the modulator is based on an energy-efficient current-reuse OTA. To efficiently suppress quantization noise foldback, the 1st stage OTA employs a tail-resistor linearization scheme. Sensor accuracy is enhanced by realizing the poly arms of the bridge and the DAC from identical unit elements. Fabricated in a 180-nm CMOS technology, the sensor draws 55 μW from a 1.8-V supply and achieves a resolution of 150 μK_rms in an 8-ms conversion time. This translates into a state-of-the-art resolution figure-of-merit (FoM) of 10 fJ·K². Furthermore, the sensor achieves an inaccuracy of ±0.4 °C (3σ) from -55 °C to 125 °C after a ratio-based one-point trim and systematic non-linearity removal, which improves to ±0.1 °C (3σ) after a 1st-order fit.

  205. A 6.6-μW Wheatstone-Bridge Temperature Sensor for Biomedical Applications
    S. Pan; K. A. A. Makinwa;
    IEEE Solid-State Circuits Letters,
    Volume 3, pp. 334-337, August 2020. DOI: 10.1109/LSSC.2020.3019078
    Abstract: ... This letter presents a compact, energy-efficient, and low-power Wheatstone-bridge temperature sensor for biomedical applications. To maximize sensitivity and reduce power dissipation, the sensor employs a high-resistance (600 kΩ) bridge that consists of resistors with positive (silicided-poly) and negative (n-poly) temperature coefficients. Resistor spread is then mitigated by trimming the n -poly arms with a 12-bit DAC, which consists of a 5-bit series DAC whose LSB is trimmed by a 7-bit PWM generator. The bridge is readout by a second-order delta–sigma modulator, which dynamically balances the bridge by tuning the resistance of the silicided-poly arms via a 1-bit series DAC. As a result, the modulator’s bitstream average is an accurate and near-linear function of temperature, which does not require further correction in the digital domain. Fabricated in a 180-nm CMOS technology, the sensor occupies 0.12mm2 . After a 1-point trim, it achieves +0.2 °C/−0.1 °C (3σ) inaccuracy in a ±10 °C range around body temperature (37.5 °C). It consumes 6.6 μW from a 1.6-V supply, and achieves 200-μK resolution in a 40-ms conversion time, which corresponds to a state-of-the-art resolution FoM of 11 fJ⋅K2 . Duty cycling the sensor results in even lower average power: 700nW at 10 conversions/s.

  206. Next-Generation ADCs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits: Advances in Analog Circuit Design 2019
    Baschirotto, Andrea; Harpe, Pieter; Makinwa, Kofi AA;
    Springer, , 2020.

  207. Low-Power Analog Techniques, Sensors for Mobile Devices, and Energy Efficient Amplifiers
    Baschirotto, Andrea; Harpe, Pieter;
    Springer, , 2020.

  208. A Capacitive Touch Chipset with 33.9dB Charge-Overflow Reduction using Amplitude-Modulated Multi-Frequency Excitation and Wireless Power and Data Transfer to an Active Stylus
    J.-S. An; J.-H. Ra; E. Kang; M. Pertijs; S.-H. Han;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 430-431, February 2020.

  209. A CMOS Resistor-Based Temperature Sensor with a 10fJ· K2 Resolution FoM and 0.4° C (3σ) Inaccuracy From− 55°C to 125°C After a 1-point Trim
    S. Pan; K.A.A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 68-70, 2 2020. DOI: 10.1109/ISSCC19947.2020.9063064

  210. A 16MHz CMOS RC Frequency Reference with±400ppm Inaccuracy from− 45° C to 85° C After Digital Linear Temperature Compensation
    Ç. Gürleyük; S. Pan; K. A. A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 64-66, 2 2020. DOI: 10.1109/ISSCC19947.2020.9063029

  211. A 2 pA/√Hz Transimpedance Amplifier for Miniature Ultrasound Probes with 36dB Continuous Time-Gain Compensation
    E. Kang; M. Tan; J. An; P. Vince; N. Sénégond; T. Mateo; Cyril Meynier; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 354-355, February 2020.

  212. A 440μW, 109.8dB DR, 106.5dB SNDR Discrete-Time Zoom ADC with a 20kHz BW
    E. Eland; S. Karmakar; B. Gönen; R. van Veldhoven; K. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    June 2020. DOI: 10.1109/VLSICircuits18222.2020.9162856.

  213. A 200μW Eddy Current Displacement Sensor with 6.7nmRMS Resolution
    M. Pimenta; Ç. Gürleyük; P. Walsh; D. O'Keeffe; M. Babaie; K. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    June 2020. DOI: 10.1109/VLSICircuits18222.2020.9162849

  214. A novel sweat rate and conductivity sensor patch made with low-cost fabrication techniques
    Steijlen, ASM; Bastemeijer, J; Jansen, KMB; French, PJ; Bossche, A;
    In 2020 IEEE Sensors,
    IEEE, pp. 1--4, 2020. DOI: 10.1109/SENSORS47125.2020.9278850
    Abstract: ... Sweat sensor patches offer new opportunities for unobtrusive monitoring of an athlete's physical status. This paper presents a novel sweat rate and sweat conductivity patch that is easy to prototype and can be made with common low-cost production techniques: laser cutting and standard printed circuit board (PCB) manufacturing. The device consists of a patch made from hydrophilic PET foil, a double-sided adhesive and a thin PCB with gold electrodes. Two electrodes, which are continuously in contact with the inflowing fluid, measure the sweat conductivity and a separate system with interdigitated electrodes measures the filling process of the reservoirs. Impedance measurement results of both systems demonstrate the working of the concept.

  215. Development of Sensor Tights with Integrated Inertial Measurement Units for Injury Prevention in Football
    Steijlen, ASM; Bastemeijer, J; Plaude, L; French, PJ; Bossche, A; Jansen, KMB;
    In Proceedings of the 6th International conference on Design4Health,
    2020.
    Abstract: ... In elite European football, 6 to 7 hamstring muscle injuries occur per team per season, which results in an absence of 14 to 180 days. These injuries occur typically in the last part of a training or match. This implies that the accumulation of demanding actions is an important factor for hamstring injury risk. In current practice, physical player load is measured at the field by deriving the global location of the player with GPS and RFID systems. However, these systems are not able to monitor leg movement and to distinguish demanding actions like kicking, cutting and jumping.In order to monitor these actions in the field, a novel design is being developed. The design consists of five sensor nodes with IMUs (Inertial measurement units), integrated in sports tights. IMUs can measure linear accelerations, angular velocities and magnetic fields in three directions. From these measurements, 3D kinematics of the lower limbs can be derived. An iterative design approach is used to develop the tights. Four prototypes will be developed. Each prototype is tested in a football specific setting, to identify areas of improvement from a technical point of view as well as from a user’s perspective. The final aim of this research is to develop sensor tights that can be worn unobtrusively by football players in the field. Real-time data are retrieved by the coach. This allows the coach to intervene when there is a high injury risk.

  216. Development of a microfluidic collection system to measure electrolyte variations in sweat during exercise
    Steijlen, ASM; Bastemeijer, J; Groen, WA; Jansen, KMB; French, PJ; Bossche, A;
    In 2020 42nd Annual International Conference of the IEEE Engineering in Medicine \& Biology Society (EMBC),
    IEEE, pp. 4085--4088, 2020. DOI: 10.1109/EMBC44109.2020.9176123
    Abstract: ... A wide variety of electrochemical sweat sensors are recently being developed for real-time monitoring of biomarkers. However, from a physiological perspective, little is known about how sweat biomarkers change over time. This paper presents a method to collect and analyze sweat to identify inter and intraindividual variations of electrolytes during exercise. A new microfluidic sweat collection system is developed which consists of a patch covering the collection surface and a sequence of reservoirs. Na + , Cl - and K + are measured with ion chromatography afterwards. The measurements show that with the new collector, variations in these ion concentrations can be measured reliably over time.

  217. Experimental Characterization of a Linear Transducer Array Prototype for Ultrasonic Clamp-on Flow Metering
    J. Massaad; D. van Willigen; P. van Neer; E. Noothout; N. de Jong; M. Pertijs; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. abstract.

  218. Energy Consumption Model for Front-End Electronics of Battery-Powered Ultrasound Devices
    M. Tan; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. abstract.

  219. A 12×80 Element Ultrasound Transceiver ASIC With Enhanced Charge Injection Performance for 3-D Carotid Artery Imaging
    T. Kim; F. Fool; E. Kang; Z. Y. Chang; E. Noothout; J. G. Bosch; M. D. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. abstract.

  220. Integrated Front-End Electronics for Miniature Ultrasound Probes
    M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. invited paper.

  221. A 1-D CMUT Transducer with Front-end ASIC in a 9 French Catheter for Intracardiac Echocardiography: Acoustic and Imaging Evaluation
    T. Matéo; P. Vince; N. Sénégond; M. Tan; E. Kang; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. DOI: 10.1109/IUS46767.2020.9251715
    Abstract: ... In this work, we report the acoustical characterization of a 9 French (Fr) CMUT-based 1D catheter tip (2.5×12.8 mm2 - 64 elements - 7.5 MHz) embedding a 64 channels analog transceiver ASIC (180 nm HV BCD technology) dedicated to Intra-cardiac Echocardiography. To this end, a Through-Silicon-Via process has been integrated in the CMUT process flow to ensure suitable vertical integration level needed to accommodate with the catheter's form factor. Good overall functioning of essential ASIC functionalities with the CMUT, i.e. transmit, beamforming, and receive, is first reported, starting from elementary characterization up to imaging. Additionally, a comparison with a custom discrete solution based on Commercial Off-The-Shelf components (COTS) to provide suitable CMUT preamplification in receive is performed. Using the same CMUT chip either with the ASIC, either with the COTS, allowed to quantify the benefit brought by the ASIC compared to a more straightforward but less integrated solution. Main results highlight that CMUT-on-ASIC allows to recover a much wider bandwidth (BW), increasing by 3 MHz the -6dB upper limit, and therefore getting closer the theoretical BW of the CMUT itself. Moreover, lower element crosstalk is measured on CMUT-on-ASIC device, showing that the ASIC decreases the electrical coupling compared to the COTS. Finally, noise equivalent pressure measurements in comparison with simulations in realistic ICE configuration promise much higher receive sensitivity with the ASIC solution, hence, confirming its great interest for the CMUT technology compared to less integrated solution, especially for catheter application.

  222. 3D High Frame Rate Imaging Scheme for Ultrasound Carotid Imaging
    M. Soozande; M. Mozzaffarzadeh; F. Fool; T. Kim; E. Kang; M. Pertijs; M. Verweij; H. J. Vos; J. G. Bosch; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. abstract.

  223. A 0.72 nW, 1 sample/s fully integrated pH sensor with 65.8 LSB/pH sensitivity
    Zhang, Yihan; Cardoso, Filipe Arroyo; Shepard, Kenneth L;
    In 2020 IEEE Symposium on VLSI Circuits,
    IEEE, pp. 1-2, 2020.

  224. A 440μW, 109.8dB DR, 106.5dB SNDR Discrete-Time Zoom ADC with a 20kHz BW
    Eland, Efraïm; Karmakar, Shoubhik; Gönen, Burak; van Veldhoven, Robert; Makinwa, Kofi;
    In 2020 IEEE Symposium on VLSI Circuits,
    pp. 1-2, 2020. DOI: 10.1109/VLSICircuits18222.2020.9162856

  225. A −107.8 dB THD+N Low-EMI Multi-Level Class-D Audio Amplifier
    Zhang, Huajun; Karmakar, Shoubhik; Breems, Lucien; Sandifort, Quino; Berkhout, Marco; Makinwa, Kofi; Fan, Qinwen;
    In 2020 IEEE Symposium on VLSI Circuits,
    pp. 1-2, 2020. DOI: 10.1109/VLSICircuits18222.2020.9162793

  226. A 28W -108.9dB/-102.2dB THD/THD+N Hybrid $\Delta\Sigma-$-PWM Class-D Audio Amplifier with 91% Peak Efficiency and Reduced EMI Emission
    Karmakar, Shoubhik; Zhang, Huajun; Van Veldhoven, Robert; Breems, Lucien; Berkhout, Marco; Fan, Qinwen; Makinwa, Kofi A.A.;
    In 2020 IEEE International Solid-State Circuits Conference - (ISSCC),
    pp. 350-352, 2020. DOI: 10.1109/ISSCC19947.2020.9063001

  227. A 200μW Eddy Current Displacement Sensor with 6.7nmRMS Resolution
    M. Pimenta; Ç. Gürleyük; P. Walsh; D. O'Keeffe; M. Babaie; K. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    pp. 1-2, June 2020. DOI: 10.1109/VLSICircuits18222.2020.9162849

  228. A 16MHz CMOS RC Frequency Reference with±400ppm Inaccuracy from− 45° C to 85° C After Digital Linear Temperature Compensation
    Ç. Gürleyük; S. Pan; K. A. A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 64-66, 2 2020. DOI: 10.1109/ISSCC19947.2020.9063029

  229. A CMOS Resistor-Based Temperature Sensor with a 10fJ· K2 Resolution FoM and 0.4° C (3σ) Inaccuracy From− 55°C to 125°C After a 1-point Trim
    S. Pan; K.A.A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 68-70, 2 2020. DOI: 10.1109/ISSCC19947.2020.9063064

  230. Heater-Assisted Bandgap trimming of BJT-based Temperature-to-Digital converters
    B. Yousefzadeh; K. Souri; K.A.A. Makinwa;
    Patent, 10605676, 2020.

  231. High performance inductive sensing all digital phase locked loop
    P. M Walsh; D. MacSweeney; D. O'keeffe; K. Makinwa; M. Pimenta; D. R Seguine; Ç. Gürleyük;
    Patent, 16721222, November 2020.

  232. Capacitance-to-digital converter
    H. Fan; M. Pertijs; B. A. J. Buter;
    Patent, US 10,732,577, August 2020.

  233. Miniaturized Broadband Microwave Permittivity Sensing for Biomedical Applications
    G. Vlachogiannakis; Z. Hu; H. T. Shivamurthy; A. Neto; M. A. P. Pertijs; M. Spirito; L. C. N. de Vreede;
    IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology,
    Volume 3, Issue 1, pp. 48--55, March 2019. DOI: 10.1109/JERM.2018.2882564
    Abstract: ... A compact sensing pixel for the determination of the localized complex permittivity at microwave frequencies is proposed. Implemented in the 40-nm CMOS, the architecture comprises a square patch, interfaced to the material-under-test sample, that provides permittivity-dependent admittance. The patch admittance is read out by embedding the patch in a double-balanced, RF-driven Wheatstone bridge. The bridge is cascaded by a linear, low-intermediate frequency switching downconversion mixer, and is driven by a square wave that allows simultaneous characterization of multiple harmonics, thus increasing measurement speed and extending the frequency range of operation. In order to allow complex permittivity measurement, a calibration procedure has been developed for the sensor. Measurement results of liquids show good agreement with theoretical values, and the measured relative permittivity resolution is better than 0.3 over a 0.1-10-GHz range. The proposed implementation features a measurement speed of 1 ms and occupies an active area of 0.15x0.3 mm², allowing for future compact arrays of multiple sensors that facilitate 2-D dielectric imaging based on permittivity contrast.

  234. An Energy-Efficient 3.7nV/√Hz Bridge-Readout IC with a Stable Bridge Offset Compensation Scheme
    H. Jiang; S. Nihtianov; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, pp. 856-864, 3 2019. DOI: 10.1109/JSSC.2018.2885556
    Abstract: ... This paper describes an energy-efficient bridge readout IC (ROIC), which consists of a capacitively coupled instrumentation amplifier (CCIA) that drives a continuous-time delta-sigma modulator (CTΔΣM). By exploiting the CCIA's ability to block dc common-mode voltages, the bridge's bias voltage may exceed the ROIC's supply voltage, allowing these voltages to be independently optimized. Since bridge output is typically much smaller than bridge offset, a digital to analog converter (DAC) is used to compensate this offset before amplification and thus increase the CCIA's useful dynamic range. Bridge loading is reduced by using a dual-path positive feedback scheme to boost the CCIA's input impedance. Furthermore, the CCIA's output is gated to avoid digitizing its output spikes, which would otherwise limit the ROIC's linearity and stability. The ROIC achieves an input-referred noise density of 3.7 nV/√Hz, a noise efficiency factor (NEF) of 5, and a power efficiency factor (PEF) of 44, which both represent the state of the art. A pressure sensing system, built with the ROIC and a differential pressure sensor (AC4010), achieves 10.1-mPa (1ιι) resolution in a 0.5-ms conversion time. The ROIC dissipates about 30% of the system's power dissipation and contributes about 6% of its noise power. To reduce the sensor's offset drift, a temperature compensation scheme based on an external reference resistor is used. After a two-point calibration, this scheme reduces bridge offset drift by 80× over a 50 °C range.

  235. A 15nW per Button Interference-Immune Readout IC for Capacitive Touch Sensors
    S. Hussaini; H. Jiang; P. Walsh; D. MacSweeney; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 54, pp. 1874-1882, 7 2019. DOI: 10.1109/JSSC.2019.2907041
    Abstract: ... This paper presents a readout IC that uses an asynchronous capacitance-to-digital-converter (CDC) to digitize the capacitance of a touch sensor. A power-efficient tracking algorithm ensures that the CDC consumes negligible power consumption in the absence of touch events. To facilitate its use in wake-on-touch applications, the CDC can be periodically triggered by a co-integrated ultra-low-power relaxation oscillator. At a 38-Hz scan rate, the readout IC consumes 15 nW per touch sensor, which is the lowest reported to date.

  236. A 6800‐μm² Resistor‐Based Temperature Sensor in 180‐nm CMOS
    J. Angevare; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 54, pp. 2649-2657, 10 2019. DOI: 10.1109/JSSC.2019.2921450
    Abstract: ... This paper describes a compact resistor-based temperature sensor that has been realized in a 180-nm CMOS process. It occupies only 6800 μm 2 , thanks to the use of a highly digital voltage-controlled oscillator (VCO)-based phase-domain sigma-delta modulator, whose loop filter consists of a compact digital counter. Despite its small size, the sensor achieves ±0.35 °C (3σ) inaccuracy from -35 °C to 125 °C. Furthermore, it achieves 0.12 °C (1σ) resolution at 2.8 kSa/s, which is mainly limited by the time-domain quantization imposed by the counter.

  237. A 5800 μm2 Resistor-based Temperature Sensor with a one-point Trimmed 3σ Inaccuracy of ±1.1 °C from −50 to 105 °C in 65 nm CMOS
    Y-T Lee; W. Choi; T. Kim; S. Song; K. Makinwa; Y. Chae;
    IEEE Solid-State Circuits Letters,
    Volume 2, pp. 67-70, 10 2019. DOI: 10.1109/LSSC.2019.2937441
    Abstract: ... This letter describes a compact resistor-based temperature sensor intended for the thermal monitoring of microprocessors and DRAMs. It consists of an RC poly phase filter (PPF) that is read out by a frequency-locked loop (FLL) based on a dual zero-crossing (ZC) detection scheme. The sensor, fabricated in 65-nm CMOS, occupies 5800 μm 2 and achieves moderate accuracy [±1.2 °C (3σ)] over a wide temperature range (-50 °C to 105 °C) after a one-point trim. This is 2x better than the previous compact resistor-based sensors. Operating from 0.85 to 1.3-V supplies, it consumes 32.5-μA and achieves 2.8-mK resolution in a 1-ms conversion time, which corresponds to a resolution FoM of 0.26 pJ·K 2.

  238. Pixel Optimizations and Digital Calibration Methods of a CMOS Image Sensor Targeting High Linearity
    Fei Wang; Albert Theuwissen;
    IEEE Transactions on Circuits and Systems I: Regular Papers,
    Volume 66, Issue 3, pp. 930--940, March 2019. DOI: 10.1109/tcsi.2018.2872627
    Abstract: ... In this paper, different methodologies are employed to improve the linearity performance of a prototype CMOS image sensor (CIS). First, several pixel structures, including a novel pixel design based on a capacitive trans-impedance amplifier (CTIA), are proposed to achieve a higher pixel-level linearity. Furthermore, three types of digital linearity calibration methods are explored. A prototype image sensor designed in 0.18-μm, 1-poly, and 4-metal CIS technology with a pixel array of 128×160 is used to verify these linearity improvement techniques. The measurement results show that the proposed CTIA pixel has the best linearity result out of all pixel structures. Meanwhile, the proposed calibration methods further improved the linearity of the CIS without changing the pixel structure. The pixel mode method achieves the most significant improvement on the linearity. One type of 4T pixel attains a nonlinearity of 0.028% with pixel mode calibration, which is two times better than the state of the art. Voltage mode (VM) and current mode (CM) calibration methods get rid of the limitation on the illumination condition during calibration operation; especially, CM calibration can further suppress the nonlinearity caused by the integration capacitor C FD on the floating diffusion node, which is remnant in VM.

  239. Compensation for Process and Temperature Dependency in a CMOS Image Sensor
    Shuang Xie; Albert Theuwissen;
    Sensors,
    Volume 19, Issue 4, pp. 870, February 2019. DOI: 10.3390/s19040870

  240. A CMOS-Imager-Pixel-Based Temperature Sensor for Dark Current Compensation
    Shuang Xie; Accel Abarca Prouza; Albert Theuwissen;
    IEEE Transactions on Circuits and Systems II: Express Briefs,
    pp. 1--1, May 2019. DOI: 10.1109/tcsii.2019.2914588
    Abstract: ... This paper proposes employing each of the classical 4 transistor (4T) pinned photodiode (PPD) CMOS image sensor (CIS) pixels, for both imaging and temperature measurement, intended for compensating the CISs’ dark current and dark signal non-uniformity (DSNU). The proposed temperature sensors rely on the thermal behavior of MOSFETs working in subthreshold region, when biased with ratiometric currents sequentially. Without incurring any additional hardware or penalty to the CIS, they are measured to have thermal curvature errors less than ±0.3 ∘C and 3 σ process variations within ±1.3 ∘C, from 108 sensors on 4 chips, over a temperature range from -20 ∘C to 80 ∘C. Each of them consumes 576 nJ/conversion at a conversion rate of 62 samples/s, when quantized by 1st-order 14 bit delta-sigma ADCs and fabricated using 0.18 μm CIS technology. Experimental results show that they facilitate digital compensation for average dark current and DSNU by 78 % and 20 %, respectively.

  241. Suppression of spatial and temporal noise in a CMOS image sensor
    Shuang Xie; Albert Theuwissen;
    IEEE Sensors Journal,
    pp. 1--1, 2019. DOI: 10.1109/jsen.2019.2941122
    Abstract: ... This paper presents methodologies for suppressing the spatial and the temporal noise in a CMOS image sensor (CIS). First of all, it demonstrates by using a longer-length column bias transistor, both the fixed pattern noise (FPN) and temporal noise can be suppressed. Meantime, it employs column-level oversampling delta-sigma ADCs to suppress temporal noise as well as to facilitate the realization of the thermal compensation of dark signal non-uniformity (DSNU). In addition, the image pixels are re-configured as temperature sensors with inaccuracies within ±0.65°C, between -20 and 80°C. If the dark current and its non-uniformities are caused by thermal gradients, the obtained in-pixel thermal information can be employed to compensate for the measured dark current by 95 % and DSNU, up to 13 %. All the column-level 13 bit 2nd-order incremental delta-sigma ADCs are measured with SNR around 65 dB and INL around 1.5 LSB, when tested with a -8 dB input signal and sampling at 2 MHz with an oversampling ratio (OSR) of 128, when the full scale voltage is 2 Vp-p. The 4T Pinned Photodiode (PPD) CIS is measured to have a temporal noise of 34 μV rms (with an OSR of 128, or, an input referred temporal noise of 0.5 e-rms, with a conversion gain, CG, of 73 μV/ e- ), a column gain FPN of 0.06 %, a dynamic range (DR) of 92 dB (with OSR=512), as well as a linearity of 1 %. It has a measured DSNU of 3.2 %, after the thermal compensation using the in-pixel temperature sensors, a dark current of 290 pA/cm2 and 15 pA/cm2, measured at 60 °C, before and after the thermal compensation, respectively.

  242. All-MOS self-referenced temperature sensor
    Shuang Xie; Albert Theuwissen;
    Electronics Letters,
    Volume 55, Issue 19, pp. 1045--1047, September 2019. DOI: 10.1049/el.2019.1784
    Abstract: ... This Letter presents an all-MOS self-referenced temperature sensor, intended for thermal compensation of dark current in CMOS image sensors (CIS). Its thermal sensing front-end is based on a self-biased nMOS pair working in the subthreshold region. Biased with ratiometric currents, the differential voltage output of the nMOS pair is proportional to the absolute temperature. The thermal sensing voltage is quantised by a self-referenced first-order incremental delta–sigma ADC, which obtains its reference voltage from the thermal sensing front-end. This reference voltage has been virtually attenuated, through switch capacitor charge sampling, to improve the resolution of the temperature sensor. Measured between −20 and 80°C, the proposed temperature sensor achieves an inaccuracy within ±0.55°C.

  243. On-Chip Smart Temperature Sensors for Dark Current Compensation in CMOS Image Sensors
    Shuang Xie; Albert Theuwissen;
    IEEE Sensors Journal,
    Volume 19, Issue 18, pp. 7849--7860, September 2019. DOI: 10.1109/jsen.2019.2919655
    Abstract: ... This paper proposes various types of on-chip smart temperature sensors, intended for thermal compensation of dark current in CMOS image sensors (CIS). It proposes four different architectures of metal-oxide-semiconductor (MOS)-based and bipolar junction transistor (BJT)-based temperature sensors inside and outside the CIS array. Both of the MOS-based temperature sensors make use of the thermal dependence of MOS transistors working in the subthreshold region with ratiometric currents and are quantized by the 14-bit first-order incremental delta-sigma analog-to-digital converters (ADCs). Fabricated using 0.18-μm CIS technology and measured on four chips, the proposed temperature sensors are compared, on their resolution and process variability, as well as on their effects on the neighboring image pixels implemented on the same chip. Experimental results show that the MOS-based temperature sensors inside and outside the array consume a power of 36 and 40 μW, respectively, both achieving 3-sigma (σ) inaccuracy less than ±0.75 °C on four different chips, over a temperature range from -20°C to 80 °C at a conversion time of 16 ms. The temperature sensors facilitate the digital thermal compensation of dark current in the CIS array, by at least 80%, in experiments.

  244. A 10 bit 5 MS/s column SAR ADC with digital error correction for CMOS image sensors
    Shuang Xie; Albert Theuwissen;
    IEEE Transactions on Circuits and Systems II: Express Briefs,
    pp. 1--1, May 2019. DOI: 10.1109/tcsii.2019.2928204
    Abstract: ... This paper proposes a SAR ADC whose readout speed is improved by 33%, through applying a digital error correction (DEC) method, compared to an alternative without using the DEC technique. The proposed addition-only DEC alleviates the ADC’s incomplete settling errors, hence improving conversion rate while maintaining accuracy. It is based on a binary bridged SAR architecture with 4 redundant capacitors and conversion cycles, which ensure the ADC’s linearity of 10 bit within a 5 bit accuracy’s settling time. The proposed SAR keeps the same straightforward timing diagram as that in a conventional SAR ADC, incurring no offset to the ADC. Measurement results of 15 columns of SAR ADCs, sampling at 5 MS/s on the same CMOS image sensor (CIS) chip, show integral nonlinearity (INL) around 3 LSB (1LSB = 1mV), when sampling at 5 MHz, after a proposed swift digital background calibration that incurs no additional hardware complexity. The CIS array read out by the proposed column-level SAR ADCs is measured reasonable photoelectron transfer characteristics.

  245. Heart Rate Extraction in a Headphone Using Infrared Thermometry
    Ger de Graaf; Daniel Kuratomi Cruz; Jaap Haartsen; Frank Hooijschuur; Paddy French;
    IEEE Transactions on Biomedical Circuits and Systems,
    pp. 1--1, July 2019. DOI: 10.1109/tbcas.2019.2930312
    Abstract: ... In this work we have analyzed, built and tested a novel system that uses infrared differential thermometry to detect the heart rate in the auricle. The sensor system was fitted into a commercial headphone since this work is a first step into integration of the system in a Bluetooth headset. Infrared thermography is a non-contact technique with improved user comfort and low power consumption. Positive results have been obtained after extraction of the frequency features of the bioheat transfer signal on test persons in rest. The heart rate is a vital indicator of the health state of an individual. By continuously monitoring it, the fitness and health of the cardiovascular system of a user can be analyzed and impending problematic health episodes could be addressed better.

  246. Vertical SiC taper with a small angle fabricated by slope transfer method
    Yu Xin; Gregory Pandraud; Paddy J. French;
    Electronics Letters,
    Volume 55, Issue 11, pp. 661--663, May 2019. DOI: 10.1049/el.2019.0232
    Abstract: ... In this Letter, a slope transfer method to fabricate vertical waveguide couplers is proposed. This method utilises wet etched Si as a mask, and takes advantage of dry etching selectivity between Si and SiC, to successfully transfer the profile from the Si master into SiC. By adopting this method, a <2° slope is achieved. Such a taper can bring the coupling efficiency in SiC waveguides to 80% (around 1 dB loss) or better from around 10% (10 dB loss) without taper. It further increases the alignment tolerance at the same time, which ensures the successful development of a plug-and-play solution for optical sensing. This is the first reported taper made in SiC.

  247. Single-Mode Tapered Vertical SU-8 Waveguide Fabricated by E-Beam Lithography for Analyte Sensing
    Yu Xin; Gregory Pandraud; Yongmeng Zhang; Paddy French;
    Sensors,
    Volume 19, Issue 15, pp. 3383, August 2019. DOI: 10.3390/s19153383

  248. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer
    Venkatesh, Manjunath R; Sachdeva, Sumit; El Mansouri, Brahim; Wei, Jia; Bossche, Andre; Bosma, Duco; de Smet, Louis CPM; Sudhölter, Ernst JR; Zhang, Guo Qi;
    Sensors,
    Volume 19, Issue 4, pp. 888, 2019.
    Abstract: ... Capacitors made of interdigitated electrodes (IDEs) as a transducer platform for the sensing of volatile organic compounds (VOCs) have advantages due to their lower power operation and fabrication using standard micro-fabrication techniques. Integrating a micro-electromechanical system (MEMS), such as a microhotplate with IDE capacitor, further allows study of the temperature dependent sensing response of VOCs. In this paper, the design, fabrication, and characterization of a low-power MEMS microhotplate with IDE capacitor to study the temperature-dependent sensing response to methanol using Zeolitic imidazolate framework (ZIF-8), a class of metal-organic framework (MOF), is presented. A Titanium nitride (TiN) microhotplate with aluminum IDEs suspended on a silicon nitride membrane is fabricated and characterized. The power consumption of the ZIF-8 MOF-coated device at an operating temperature of 50 °C is 4.5 mW and at 200 °C it is 26 mW. A calibration methodology for the effects of temperature of the isolation layer between the microhotplate electrodes and the capacitor IDEs is developed. The device coated with ZIF-8 MOF shows a response to methanol in the concentration range of 500 ppm to 7000 ppm. The detection limit of the sensor for methanol vapor at 20 °C is 100 ppm. In situ study of sensing properties of ZIF-8 MOF to methanol in the temperature range from 20 °C to 50 °C using the integrated microhotplate and IDE capacitor is presented. The kinetics of temperature-dependent adsorption and desorption of methanol by ZIF-8 MOF are fitted with double-exponential models. With the increase in temperature from 20 °C to 50 °C, the response time for sensing of methanol vapor concentration of 5000 ppm decreases by 28%, whereas the recovery time decreases by 70%.

  249. An accurate and power-efficient period-modulator-based interface for grounded capacitive sensors
    Arash Ahmadpour Bijargah; Ali Heidary; Pooya Torkzadeh; Stoyan Nihtianov;
    International Journal of Circuit Theory and Applications,
    May 2019. DOI: 10.1002/cta.2642
    Abstract: ... A low‐power and high‐resolution capacitance‐to‐period converter (CPC) based on period modulation (PM) for subnanometer displacement measurement systems is proposed. The presented circuit employs the interface developed in a previous work, “a grounded capacitance‐to‐voltage converter (CVC) based on a zoom‐in structure,” further improving its performance through a symmetrical design of the applied autocalibration technique. The scheme is based on the use of a relaxation oscillator. To minimize the error contributed by the CPC circuitry, different precision techniques such as chopping, autocalibration, and active shielding are applied. The proposed CPC is realized in a 0.18‐μm complementary metal‐oxide‐semiconductor (CMOS) technology, occupies an area of 0.5 mm2, and consumes 135 μA from a 2‐V power supply. In order to achieve optimal performance and avoid overdesigning, a noise estimation of various parts of the CPC has been done. Accordingly, for a 10‐pF sensor capacitance, the overall CPC demonstrates a capacitance resolution of 0.5 fF for a latency of 128 microseconds, corresponding to an effective number of bits (ENOB) of 12.5 bits and an energy efficiency of 6 pJ/step. The nonlinearity error has been evaluated as well, resulting in a less than 0.03% full‐scale span (FSS).

  250. A Low Power Continuous-Time Zoom ADC for Audio Applications
    B. Gönen; S. Karmakar; R. van Veldhoven; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 55, pp. 1023-1031, 12 2019. DOI: 10.1109/JSSC.2019.2959480
    Abstract: ... This article presents a continuous-time zoom analog to digital converter (ADC) for audio applications. It employs a high-speed asynchronous SAR ADC that dynamically updates the references of a continuous-time delta-sigma modulator (CTDSM). Compared to previous switched-capacitor (SC) zoom ADCs, its input impedance is essentially resistive, which relaxes the power dissipation of its reference and input buffers. Fabricated in a 160-nm CMOS process, the ADC occupies 0.27 mm 2 and achieves 108.1-dB peak SNR, 106.4-dB peak signal to noise and distortion ratio (SNDR), and 108.5-dB dynamic range in a 20-kHz bandwidth while consuming 618 μW. This results in a Schreier figure of merit (FoM) of 183.6 dB.

  251. An Integrated Programmable High-Voltage Bipolar Pulser with Embedded Transmit/Receive Switch for Miniature Ultrasound Probes
    M. Tan; E. Kang; J.-S. An; Z. Y. Chang; P. Vince; N. Sénégond; M. A. P. Pertijs;
    IEEE Solid-State Circuits Letters,
    Volume 2, Issue 9, pp. 79-82, September 2019. DOI: 10.1109/LSSC.2019.2938141
    Abstract: ... This letter presents a compact programmable high-voltage (HV) pulser for ultrasound imaging, designed for driving capacitive micromachined ultrasonic transducers (CMUTs) in miniature ultrasound probes. To enable bipolar return-to-zero (RZ) pulsing and embedded transmit/receive switching, a compact back-to-back isolating HV switch is proposed that employs HV floating-gate drivers with only one HV MOS transistor each. The pulser can be digitally programmed to generate bipolar pulses with and without RZ, with a peak-to-peak swing up to 60 V, as well as negative and positive unipolar pulses. It can generate bursts of up to 63 pulses, with a maximum pulse frequency of 9 MHz for an 18-pF transducer capacitance. Realized in TSMC 0.18um HV BCD technology, the pulser occupies only 0.167mm2 . Electrical characterization results of the pulser, as well as acoustic results obtained in the combination with a 7.5-MHz CMUT transducer, are presented.

  252. Go with the flow: advances and trends in magnetic flow cytometry
    Soares, Rita; Martins, Verónica C; Macedo, Rita; Cardoso, Filipe Arroyo; Martins, Sofia AM; Caetano, Diogo M; Fonseca, Pedro H; Silvério, Vânia; Cardoso, Susana; Freitas, Paulo P;
    Analytical and bioanalytical chemistry,
    Volume 411, pp. 1839-1862, 2019.

  253. Biosensors for on-farm diagnosis of mastitis
    Martins, Sofia AM; Martins, Ver{\'o}nica C; Cardoso, Filipe Arroyo; Germano, José; Rodrigues, Mónica; Duarte, Carla; Bexiga, Ricardo; Cardoso, Susana; Freitas, Paulo P;
    Frontiers in bioengineering and biotechnology,
    Volume 7, pp. 186, 2019.

  254. A Low Power Continuous-Time Zoom ADC for Audio Applications
    B. Gönen; S. Karmakar; R. van Veldhoven; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 55, Issue 4, pp. 1023-1031, 12 2019. DOI: 10.1109/JSSC.2019.2959480
    Abstract: ... This article presents a continuous-time zoom analog to digital converter (ADC) for audio applications. It employs a high-speed asynchronous SAR ADC that dynamically updates the references of a continuous-time delta-sigma modulator (CTDSM). Compared to previous switched-capacitor (SC) zoom ADCs, its input impedance is essentially resistive, which relaxes the power dissipation of its reference and input buffers. Fabricated in a 160-nm CMOS process, the ADC occupies 0.27 mm 2 and achieves 108.1-dB peak SNR, 106.4-dB peak signal to noise and distortion ratio (SNDR), and 108.5-dB dynamic range in a 20-kHz bandwidth while consuming 618 μW. This results in a Schreier figure of merit (FoM) of 183.6 dB.

  255. A 6800‐μm² Resistor‐Based Temperature Sensor in 180‐nm CMOS
    J. Angevare; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 54, Issue 10, pp. 2649-2657, 10 2019. DOI: 10.1109/JSSC.2019.2921450
    Abstract: ... This paper describes a compact resistor-based temperature sensor that has been realized in a 180-nm CMOS process. It occupies only 6800 μm 2 , thanks to the use of a highly digital voltage-controlled oscillator (VCO)-based phase-domain sigma-delta modulator, whose loop filter consists of a compact digital counter. Despite its small size, the sensor achieves ±0.35 °C (3σ) inaccuracy from -35 °C to 125 °C. Furthermore, it achieves 0.12 °C (1σ) resolution at 2.8 kSa/s, which is mainly limited by the time-domain quantization imposed by the counter.

  256. A 15nW per Button Interference-Immune Readout IC for Capacitive Touch Sensors
    S. Hussaini; H. Jiang; P. Walsh; D. MacSweeney; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 54, Issue 7, pp. 1874-1882, 7 2019. DOI: 10.1109/JSSC.2019.2907041
    Abstract: ... This paper presents a readout IC that uses an asynchronous capacitance-to-digital-converter (CDC) to digitize the capacitance of a touch sensor. A power-efficient tracking algorithm ensures that the CDC consumes negligible power consumption in the absence of touch events. To facilitate its use in wake-on-touch applications, the CDC can be periodically triggered by a co-integrated ultra-low-power relaxation oscillator. At a 38-Hz scan rate, the readout IC consumes 15 nW per touch sensor, which is the lowest reported to date.

  257. An Energy-Efficient 3.7nV/√Hz Bridge-Readout IC with a Stable Bridge Offset Compensation Scheme
    H. Jiang; S. Nihtianov; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 3, pp. 856-864, 3 2019. DOI: 10.1109/JSSC.2018.2885556
    Abstract: ... This paper describes an energy-efficient bridge readout IC (ROIC), which consists of a capacitively coupled instrumentation amplifier (CCIA) that drives a continuous-time delta-sigma modulator (CTΔΣM). By exploiting the CCIA's ability to block dc common-mode voltages, the bridge's bias voltage may exceed the ROIC's supply voltage, allowing these voltages to be independently optimized. Since bridge output is typically much smaller than bridge offset, a digital to analog converter (DAC) is used to compensate this offset before amplification and thus increase the CCIA's useful dynamic range. Bridge loading is reduced by using a dual-path positive feedback scheme to boost the CCIA's input impedance. Furthermore, the CCIA's output is gated to avoid digitizing its output spikes, which would otherwise limit the ROIC's linearity and stability. The ROIC achieves an input-referred noise density of 3.7 nV/√Hz, a noise efficiency factor (NEF) of 5, and a power efficiency factor (PEF) of 44, which both represent the state of the art. A pressure sensing system, built with the ROIC and a differential pressure sensor (AC4010), achieves 10.1-mPa (1ιι) resolution in a 0.5-ms conversion time. The ROIC dissipates about 30% of the system's power dissipation and contributes about 6% of its noise power. To reduce the sensor's offset drift, a temperature compensation scheme based on an external reference resistor is used. After a two-point calibration, this scheme reduces bridge offset drift by 80× over a 50 °C range.

  258. Low-Power Analog Techniques, Sensors for Mobile Devices, and Energy Efficient Amplifiers
    K.A.A. Makinwa; A. Baschirotto; P. Harpe;
    Springer, , 2019.

  259. Low-Power Analog Techniques, Sensors for Mobile Devices, and Energy Efficient Amplifiers
    K. Bult; M. S. Akter; R. Sehgal;
    Springer, Chapter High-efficiency, , pp. 253-296, 2019.

  260. CMOS-Compatible Carbon Dioxide Sensors
    Cai, Zeyu; van Veldhoven, Robert; Suy, Hilco; de Graaf, Ger; Makinwa, Kofi A. A.; Pertijs, Michiel;
    Makinwa, Kofi A. A.; Baschirotto, Andrea; Harpe, Pieter (Ed.);
    Cham: Springer International Publishing, , pp. 199--219, 2019. DOI: 10.1007/978-3-319-97870-3_11
    Abstract: ... This chapter presents two cost-effective sensors that measure ambient carbon dioxide (CO2) concentration, intended for application in smart ventilation systems in buildings or in mobile devices. Both sensors employ a suspended hot-wire transducer to detect the CO2-dependent thermal conductivity (TC) of the ambient air. The resistive transducer is realized in the VIA layer of a standard CMOS process using a single etch step. The first sensor determines the transducer's CO2-dependent thermal resistance to the surrounding air by measuring its steady-state temperature rise and power dissipation. A ratiometric measurement is realized by employing an identical but capped transducer as a reference. An incremental delta-sigma ADC digitizes the temperature and power ratios of the transducers, from which the ratio of the thermal resistances is calculated. The second sensor is based on a transient measurement of the CO2-dependent thermal time constant of the transducer. The readout circuit periodically heats up the transducer and uses a phase-domain delta-sigma modulator to digitize the CO2-dependent phase shift of the resulting temperature transients. Compared to the ratiometric steady-state measurement, this approach significantly reduces the measurement time and improves the energy efficiency, resulting in a state-of-the-art CO2 resolution of 94 ppm at an energy consumption of 12 mJ per measurement.

  261. Sensing magnetic nanoparticles
    Sandhu, Adarsh; Southern, Paul; de Freitas, Susana Cardoso; Knudde, Simon; Cardoso, Filipe Arroyo; Freitas, Paulo P; Kurlyandskaya, Galina V;
    In Magnetic Nanoparticles in Biosensing and Medicine,
    Cambridge University Press, 2019.

  262. Feasibility of High Frame Rate 3-D Intracardiac Echography using Fan-Beam Transmissions
    M. Soozande; B. Ossenkoppele; Y. Hopf; M. A. P. Pertijs; M. D. Verweij; H. J. Vos; J. G. Bosch; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2019.

  263. Fabrication and characterization of a prototype forward-looking single-cable 64-element intra-vascular ultrasound probe
    D. van Willigen; M. Mozaffarzadeh; E. Noothout; M. Verweij; N. de Jong; M. Pertijs; V. Daeichin;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2019.

  264. 3D high frame rate flow measurement using a prototype matrix transducer for carotid imaging
    F. Fool; H. J. Vos; M. Shabanimotlagh; T. Kim; E. Kang; M. Pertijs; N. de Jong; M. D. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2019.

  265. A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes
    J. Li; Z. Chen; M. Tan; D. van Willigen; C. Chen; Z. Y. Chang; E. Noothout; N. de Jong; M. D. Verweij; M. A. P. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1-2, June 2019.

  266. An Auto-Zero Stabilized Voltage Buffer with a Quiet Chopping Scheme and Constant Input Current
    T. Rooijers; J.H. Huijsing; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    2 2019. DOI: 10.1109/ISSCC.2019.8662437

  267. A 0.12mm2 Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C
    S. Pan; Ç. Gürleyük; M.F. Pimenta; K.A.A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    2 2019. DOI: 10.1109/ISSCC.2019.8662457

  268. A Wheatstone-Bridge Temperature Sensor with a Resolution FoM of 20fJ·K2
    S. Pan; K.A.A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    2 2019. DOI: 10.1109/ISSCC.2019.8662337

  269. A Low Power Continuous-Time Zoom ADC for Audio Applications
    B. Gönen; S. Karmakar; R. van Veldhoven; K. A. A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    6 2019. DOI: 10.23919/VLSIC.2019.8778021

  270. A 3.2mW SAR-assisted CTSD ADC with 77.5dB SNDR and 40MHz BW in 28nm CMOS
    P. Cenci; M. Bolatkale; R. Rutten; M. Ganzerli; G. Lassche; K. Makinwa; L. Breems;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    6 2019. DOI: 10.23919/VLSIC.2019.8778176

  271. An Auto-Zero Stabilized Voltage Buffer with a Trimmed Input Current of 0.2pA
    T. Rooijers; J.H. Huijsing; K.A.A. Makinwa;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    9 2019. DOI: 10.1109/ESSCIRC.2019.8902895

  272. A 5800 μm2 Resistor-based Temperature Sensor with a one-point Trimmed 3σ Inaccuracy of ±1.1 °C from −50 to 105 °C in 65 nm CMOS
    Y-T Lee; W. Choi; T. Kim; S. Song; K. Makinwa; Y. Chae;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    9 2019. DOI: 10.1109/ESSCIRC.2019.8902650

  273. An Energy-Efficient BJT-Based Temperaure-to-Digital Converter with ±0.13 °C (3σ) Inaccuracy from -40 to 125°C
    R.K. Kumar; H. Jiang; K. A.A. Makinwa;
    In Proc. IEEE Asian Solid-State Circuits Conference (ASSCC),
    11 2019.

  274. Development of Front-End Electronics for Low-Field NMR Applications
    E. Aydin; K.A.A. Makinwa;
    In MFHS,
    2019.

  275. Temperature Sensors Incorporated into a CMOS Image Sensor with Column Zoom ADCs
    Shuang Xie; Xiaoliang Ge; Albert Theuwissen;
    In 2019 IEEE International Symposium on Circuits and Systems (ISCAS),
    IEEE, May 2019. DOI: 10.1109/iscas.2019.8702321
    Abstract: ... This paper proposes an array of nMOS based temperature sensors incorporated into a CMOS image sensor (CIS) for thermal compensation of the latter. Each temperature sensor features the same area as that of an image pixel. Both the temperature and the image sensors' outputs are read out by the column-level zoom ADCs, each of which offers 16 bits, with a 4-bit unit capacitor array (UCA) SAR and a 13-bit 2 nd -order incremental delta-sigma ADC (DSADC) as the first and the second stage, respectively. The proposed UCA with improved switching and decoding technique minimizes capacitor area and switching energy, by 50% and 75%, respectively, compared to a conventional binary weight array (BWA) counterpart. The column zoom ADC samples twice as fast while keeping its linearity, or, expands the dynamic range by 15 dB, for the image sensors, compared to a DSADC only alternative. To digitize the temperature sensor, the proposed zoom ADC is capable of quantization errors less than 16 μV, which is equivalent to a 0.125 °C resolution for a 130 μV/°C temperature coefficient. The proposed temperature sensor is simulated to keep its errors within ±0.21 °C upon 2 nd -order curve fitting, with 3 sigma Monte Carlo inaccuracies less than ±0.74 °C, between 0 and 100 °C, at a power and an area of 144 μW and 121 μm 2 , respectively, with a sampling period of 64 μs.

  276. A CMOS Image Sensor with Improved Readout Speed using Column SAR ADC with Digital Error Correction
    Shuang Xie; Albert Theuwissen;
    In 2019 IEEE International Symposium on Circuits and Systems (ISCAS),
    IEEE, May 2019. DOI: 10.1109/iscas.2019.8702292
    Abstract: ... This paper proposes a CMOS image sensor (CIS) whose readout speed is improved by 33%, through applying a digital error correction (DEC) method to its column-level successive approximation register (SAR) analog to digital converters (ADC), compared to an alternative without using the DEC technique. The proposed addition-only DEC alleviates the ADC's incomplete settling errors, hence improving conversion rate while maintaining accuracy. It is based on a binary bridged SAR architecture with 4 redundant capacitors and conversion cycles, which ensure the ADC's linearity of 10 bit within a 5 bit accuracy's settling time. Simulation results show the DEC method improves the ADC's static and dynamic linearity, eliminating its missing codes and increasing its signal to noise plus distortion ratio (SNDR) from 64.5 dB to 67.5 dB, when operating at the same sampling speed. The proposed SAR keeps the same straightforward timing diagram as that in a conventional SAR ADC, incurring no offset to the ADC, while increasing the sampling rate by 33%. The simulated linearity of the prototype CIS is within ±0.07%, when sampled at a column readout rate of 10 MHz.

  277. A CMOS Image Sensor with In-Pixel Temperature Sensors for Dark Signal Non-Uniformity Compensation
    Shuang Xie; Accel Abarca Prouza; Albert Theuwissen;
    In 2019 International Image Sensor Workshop (IISW),
    June 2019.
    Abstract: ... This paper presents a CMOS image sensor with in-pixel temperature sensors, for dark signal non-uniformity (DSNU) compensation between -20 ⁰C and 80 ⁰C. Two types of in-pixel temperature sensors, either based on a BJT or on the in-pixel source follower (SF) itself, are implemented, measured and compared, both implemented inside a 64×64 CIS array fabricated using 0.18 μm technology. Both temperature sensors achieve inaccuracies less than ±0.3 ⁰C, between -20 ⁰C and 80 ⁰C, when measured on 3 test chips. Dark current measured on the neighboring image pixels of the two types of temperature sensors show that the SF based one incurs no penalty to the image sensor array, while the BJT based alternative can introduce 100 times more dark current to its surrounding pixels. Using the temperature information provided by the in-pixel temperature sensors, the average dark current can be predicted and compensated by at least 70 %, on 3 measured chips.

  278. 10b 1MS/s column parallel SAR ADC for high speed CMOS image sensors with offset compensation technique using analog summation method
    Jaekyum Lee; Albert Theuwissen;
    In Scientific CMOS Image Sensors Workshop,
    Toulouse, November 2019.

  279. Acoustic Stack Design of a Transducer Array for Ultrasonic Clamp-on Flow Metering
    J. Massaad; D. van Willigen; P. van Neer; N. de Jong; M. Pertijs; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2019.

  280. Analyzing sweat to determine state of fatigue
    Miguel Thomas; Andre Bossche; Pim Groen; Jeroen Bastemeijer; Annemarijn Steijlen; Paddy French;
    In Proceedings SSI conference,
    Barcelona, Spain, April 2019.

  281. Plantenna: towards a network of vegetation-integrated sensors for plant and environmental monitoring
    MC. ten Veldhuis; R. Uijlenhoet; J. Schmitz; B. Smolders; B. Nauta; P. Baltus; K. Makinwa; P. Steeneken;
    In Geophysical Research Abstracts,
    April 2019. EGU General Assembly 2019 ; Conference date: 07-04-2019 Through 12-04-2019.
    document

  282. An Energy Efficiency Figure of Merit for Radio Transceivers
    Reza Taherkhani; Stoyan Nihtianov;
    In 2019 IEEE Radio and Antenna Days of the Indian Ocean (RADIO),
    IEEE, September 2019. DOI: 10.23919/radio46463.2019.8968843
    Abstract: ... Selection of an energy efficient wireless transceiver is an important step in the design of any low power wireless system, specifically wireless sensor networks or IoT devices. In this paper, a figure of merit (FoM) for evaluating the energy efficiency of wireless radio transceivers is proposed. Using this FoM, it is possible to easily compare the performance of transceivers built with completely different technologies, in term of energy efficiency. This FoM can be used as a practical tool for researchers and engineers to evaluate wireless transceivers and determine the state-of-the-art or select a desired transceiver.

  283. Power Consumption Optimization of a Wireless Temperature Sensor Node Using Unidirectional Communication
    Reza Taherkhani; Stoyan Nihtianov;
    In 2019 IEEE 17th International Conference on Industrial Informatics (INDIN),
    IEEE, July 2019. DOI: 10.1109/indin41052.2019.8972226

  284. Pipe geometry calibration measurements for the improvement of ultrasonic clamp-on flow meters
    J. Massaad; D. van Willigen; P. van Neer; N. de Jong; M. Pertijs; M. Verweij;
    In Meeting of the Acoustical Society of America,
    November 2019. (abstract),. DOI: 10.1121/1.5136993

  285. An Integrated Programmable High-Voltage Bipolar Pulser with Embedded Transmit/Receive Switch for Miniature Ultrasound Probes
    M. Tan; E. Kang; J.-S. An; Z. Y. Chang; P. Vince; N. Sénégond; M. A. P. Pertijs;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    pp. 325--328, October 2019.
    Abstract: ... This paper presents a compact programmable high-voltage (HV) pulser for ultrasound imaging, designed for driving capacitive micro-machined ultrasonic transducers (CMUTs) in miniature ultrasound probes. To enable bipolar return-to-zero pulsing and embedded transmit/receive switching, a compact back-to-back isolating HV switch is proposed that employs HV floating-gate drivers with only one HV MOS transistor each. The pulser can be digitally programmed to generate bipolar pulses with and without return-to-zero, with a peak-to-peak swing up to 60 V, as well as negative and positive unipolar pulses. It can generate bursts of up to 63 pulses, with a maximum pulse frequency of 9 MHz for an 18 pF transducer capacitance. Realized in TSMC 0.18 μm HV BCD technology, the pulser occupies only 0.167 mm2. Electrical characterization results of the pulser, as well as acoustic results obtained in combination with a 7.5-MHz CMUT transducer, are presented.

  286. A Low-Power ASIC with On-Chip Receive Digitization and Bipolar High-Voltage Transmitters for Wearable Ultrasound Devices
    Jae-Sung An; Mingliang Tan; Michiel Pertijs;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    July 2019. poster.

  287. Plantenna: towards a network of vegetation-integrated sensors for plant and environmental monitoring
    {ten Veldhuis}, Marie-Claire; {Uijlenhoet}, Remko; {Schmitz}, Jurriaan; {Smolders}, Bart; {Nauta}, Bram; {Baltus}, Peter; {Makinwa}, Kofi; {Steeneken}, Peter;
    In EGU General Assembly Conference Abstracts,
    pp. 9863, April 2019.

  288. An Energy-Efficient BJT-Based Temperature-to-Digital Converter with ±0.13°C (3σ) Inaccuracy from -40 to 125°C
    Kumar, Rushil K.; Jiang, Hui; Makinwa, Kofi A. A.;
    In 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC),
    pp. 107-108, 2019. DOI: 10.1109/A-SSCC47793.2019.9056962

  289. A MEMS Coriolis Mass Flow Sensing System with Combined Drive and Sense Interface
    de Oliveira, A. C.; Schut, T. V. P.; Groenesteijn, J.; Fan, Q.; Wiegerink, R. J.; Makinwa, K. A. A.;
    In 2019 IEEE SENSORS,
    pp. 1-4, 2019. DOI: 10.1109/SENSORS43011.2019.8956695

  290. An Auto-Zero Stabilized Voltage Buffer with a Trimmed Input Current of 0.2pA
    T. Rooijers; J.H. Huijsing; K.A.A. Makinwa;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    pp. 257-260, 9 2019. DOI: 10.1109/ESSCIRC.2019.8902895

  291. A 3.2mW SAR-assisted CTSD ADC with 77.5dB SNDR and 40MHz BW in 28nm CMOS
    P. Cenci; M. Bolatkale; R. Rutten; M. Ganzerli; G. Lassche; K. Makinwa; L. Breems;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    pp. C230-C231, 6 2019. DOI: 10.23919/VLSIC.2019.8778176

  292. A Low Power Continuous-Time Zoom ADC for Audio Applications
    B. Gönen; S. Karmakar; R. van Veldhoven; K. A. A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    pp. C224-C225, 6 2019. DOI: 10.23919/VLSIC.2019.8778021

  293. A Wheatstone-Bridge Temperature Sensor with a Resolution FoM of 20fJ·K2
    S. Pan; K.A.A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 186-188, 2 2019. DOI: 10.1109/ISSCC.2019.8662337

  294. A 0.12mm2 Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C
    S. Pan; Ç. Gürleyük; M.F. Pimenta; K.A.A Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 184-186, 2 2019. DOI: 10.1109/ISSCC.2019.8662457

  295. An Auto-Zero Stabilized Voltage Buffer with a Quiet Chopping Scheme and Constant Input Current
    T. Rooijers; J.H. Huijsing; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 298-299, 2 2019. DOI: 10.1109/ISSCC.2019.8662437

  296. Design Considerations for a Mems Coriolis Mass Flow Sensing System
    A.C. de Oliveira, T. Schut, J. Groenesteijn, Q. Fan, R.Wiegerink; K.A.A. Makinwa;
    In Conf. on Microfluidic Handling Systems (MFHS),
    October 2019.

  297. Development of Front-End Electronics for Low-Field NMR Applications
    E. Aydin; K.A.A. Makinwa;
    In Conf. on Microfluidic Handling Systems (MFHS),
    October 2019.

  298. A 5800 μm2 Resistor-based Temperature Sensor with a one-point Trimmed 3σ Inaccuracy of ±1.1 °C from −50 to 105 °C in 65 nm CMOS
    Y-T Lee; W. Choi; T. Kim; S. Song; K. Makinwa; Y. Chae;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    pp. 68-71, 9 2019. DOI: 10.1109/ESSCIRC.2019.8902650

  299. Amplifier with continuous gain control
    M. A. P. Pertijs; E. Kang;
    Patent, WO2021/015618A2, July 2019.

  300. Measurement substrate and a measurement method
    S. Nihtianov; R.H.M.J. Bloks; J.P.M. de la Rosette; T.S.M. Laurent; K.A.A. Makinwa, P.J. Neefs, J.P.M.B. Vermeulen;
    Patent, United States US10508896B2, December 2019.
    Abstract: ... A measurement substrate for measuring a condition pertaining in an apparatus for processing production substrates during operation thereof, the measurement substrate including: a body having dimensions compatible with the apparatus; a plurality of sensor modules embedded in the body, each sensor module having: a sensor configured generate an analog measurement signal, an analog to digital converter to generate digital measurement information from the analog measurement signal, and a module controller configured to output the digital measurement information; and a central control module configured to receive the digital measurement information from each of the module controllers and to communicate the digital measurement information to an external device.

    document

  301. Nano-Power Capacitance-to-Digital Converter
    S. Hussaini; H. Jiang; D. MacSweeney; K.A.A. Makinwa;
    Patent, 20190072597, 2019.

  302. Lithographic apparatus and device manufacturing method involving a heater
    T.P.M. Cadee; JHW Jacobs; N ten Kate; E.R. Loopstra; A.L.H.J. van Meer; J.J.S.M. Mertens; C.G.M. de Mol; M.J.E.H. Muitjens; A.J. van der Net; J.J. Ottens; J.A. Quaedackers; M.E. Reuhman-huisken; M.K. Stavenga; Marco ;
    Patent, United States US20190235397A1, August 2019.
    Abstract: ... A lithographic apparatus is described having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a barrier member arranged to substantially contain the liquid within the space, and a heater.

    document

  303. Method and device for measuring dielectrics in fluids
    J. Hillebrand; M.J.J. Mayer; G.C.M. Meijer; L.C.P.M. de Smet E.J.R. Sudhölter;
    Patent, Netherlands NL1042400B1, April 2019.
    Abstract: ... The present invention relates to a method and device for measuring dielectrics in fluids, such as water, characterized by a first printed circuit board (PCB), a first conductor on the first side of said first PCB, a second conductor on the second side of said first PCB, a first polymer affinity layer and a second polymer affinity layer on top of the first and second sides of the first PCB respectively, a second PCB equipped with holes and a first conductor plate placed on top of the first affinity layer and a third PCB equipped with holes and a second conductor plate placed on top of the second affinity layer. The result is a sensor consisting of a first PCB sandwiched between the first and second polymer affinity layers and between the second and third PCBs. The sensor is placed in the fluid under investigation and the polymer affinity layers in the sensor absorb chemical compounds and / or ions present in the fluid. At lower frequencies the sensor acts as a capacitive sensor, where absorbed compounds can be characterized by changes in the capacitor value and in the losses. At higher frequencies, the sensor behaves electrically as a stub resonator, the absorbed compounds and / or ions can be characterized or identified through impedance spectroscopy.

  304. Deep Trench Isolation is Here to Stay
    Albert Theuwissen;
    October 2019. invited talk a 73rd Heidelberger Bildverarbeitungsforum, Stuttgart.

  305. Cryo-CMOS Circuits and Systems for Quantum Computing Applications
    Bishnu Patra; Rosario M. Incandela; Jeroen P. G. van Dijk; Harald A. R. Homulle; Lin Song; Mina Shahmohammadi; Robert B. Staszewski; Andrei Vladimirescu; Masoud Babaie; Fabio Sebastiano; Edoardo Charbon;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 1, pp. 1-13, Jan 2018. DOI: 10.1109/JSSC.2017.2737549
    Keywords: ... CMOS technology;Cryogenics;Oscillators;Process control;Quantum computing;Temperature;CMOS characterization;Class-F oscillator;cryo-CMOS;low-noise amplifier (LNA);noise canceling;phase noise (PN);quantum bit (qubit);quantum computing;qubit control;single-photon avalanche diode (SPAD)..

    Abstract: ... A fault-tolerant quantum computer with millions of quantum bits (qubits) requires massive yet very precise control electronics for the manipulation and readout of individual qubits. CMOS operating at cryogenic temperatures down to 4 K (cryo-CMOS) allows for closer system integration, thus promising a scalable solution to enable future quantum computers. In this paper, a cryogenic control system is proposed, along with the required specifications, for the interface of the classical electronics with the quantum processor. To prove the advantages of such a system, the functionality of key circuit blocks is experimentally demonstrated. The characteristic properties of cryo-CMOS are exploited to design a noise-canceling low-noise amplifier for spin-qubit RF-reflectometry readout and a class-F2,3 digitally controlled oscillator required to manipulate the state of qubits.

  306. A Resistor-Based Temperature Sensor with a 0.13pJ·K2 Resolution FOM
    S. Pan; Y. Luo; S.H. Shalmany; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 1, pp. 164-173, 1 2018. DOI: 10.1109/JSSC.2017.2746671
    Abstract: ... This paper describes a high-resolution energy-efficient CMOS temperature sensor, intended for the temperature compensation of MEMS/quartz frequency references. The sensor is based on silicided poly-silicon thermistors, which are embedded in a Wien-bridge RC filter. When driven at a fixed frequency, the filter exhibits a temperature-dependent phase shift, which is digitized by an energy-efficient continuous-time phase-domain delta-sigma modulator. Implemented in a 0.18-μm CMOS technology, the sensor draws 87 μA from a 1.8 V supply and achieves a resolution of 410 μKrms in a 5-ms conversion time. This translates into a state-of-the-art resolution figure-of-merit of 0.13 pJ·K². When packaged in ceramic, the sensor achieves an inaccuracy of 0.2 °C (3σ) from -40 °C to 85 °C after a single-point calibration and a correction for systematic nonlinearity. This can be reduced to ±0.03 °C (3σ) after a first-order fit. In addition, the sensor exhibits low 1/f noise and packaging shift.

  307. Self-aligning and self-calibrating capacitive sensor system for displacement measurement in inaccessible industrial environments
    Oscar S. van de Ven; Johan G. Vogel; Sha Xia; Jo W. Spronck; Stoyan Nihtianov;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 67, Issue 2, pp. 350-358, Feb 2018. DOI: 10.1109/TIM.2017.2764333
    Abstract: ... High-precision positioning often requires high speed and high resolution displacement measurements in order to compensate for the small vibrations of critical components. The displacement sensor must be precise and stable over a long period of time to avoid expensive recalibration. This requires tight mounting tolerances, which are especially difficult to meet in inaccessible environments. The proposed sensor system is based on a capacitive sensor and consists of three subsystems: 1) a mechanical “zoom-in” system that performs self-alignment of the capacitive sensor electrode in order to reduce the mounting tolerances of the sensor; 2) a real-time capacitance-to-digital converter that employs an internal reference and electrical zoom-in technique to effectively reduce the dynamic range of the measured capacitance, thus improving the power efficiency; and 3) a self-calibration circuit that periodically calibrates the internal references to eliminate their drift. In previous publications, the three subsystems have been introduced. This paper shows how the different subsystems can be integrated to achieve optimal performance and presents new repeatability and stability measurement results. The overall system demonstrates a displacement measurement resolution of 65 pm (in terms of capacitance 65 aF) for a measurement time of 20 μs . Furthermore, the thermal drift of the sensor is within 6 ppm/K, owing to the self-calibration circuit. In measurement mode, the system consumes less than 16 mW.

  308. A 40-nm CMOS Complex Permittivity Sensing Pixel for Material Characterization at Microwave Frequencies
    G. Vlachogiannakis; M. A. P. Pertijs; M. Spirito; L. C. N. de Vreede;
    IEEE Transactions on Microwave Theory and Techniques,
    Volume 66, Issue 3, pp. 1619-1634, March 2018. DOI: 10.1109/tmtt.2017.2753228
    Abstract: ... A compact sensing pixel for the determination of the localized complex permittivity at microwave frequencies is proposed. Implemented in the 40-nm CMOS, the architecture comprises a square patch, interfaced to the material-under-test sample, that provides permittivity-dependent admittance. The patch admittance is read out by embedding the patch in a double-balanced, RF-driven Wheatstone bridge. The bridge is cascaded by a linear, low-intermediate frequency switching downconversion mixer, and is driven by a square wave that allows simultaneous characterization of multiple harmonics, thus increasing measurement speed and extending the frequency range of operation. In order to allow complex permittivity measurement, a calibration procedure has been developed for the sensor. Measurement results of liquids show good agreement with theoretical values, and the measured relative permittivity resolution is better than 0.3 over a 0.1-10-GHz range. The proposed implementation features a measurement speed of 1 ms and occupies an active area of 0.15x0.3 mm², allowing for future compact arrays of multiple sensors that facilitate 2-D dielectric imaging based on permittivity contrast.

  309. Multiline 3D beamforming using micro-beamformed datasets for pediatric transesophageal echocardiography
    D. Bera; S. B. Raghunathan; C. Chen; Z. Chen; M. A. P. Pertijs; M. D. Verweij; V. Daeichin; H. J. Vos; A. F. W. van der Steen; N. de Jong; J. G. Bosch;
    Physics in Medicine \& Biology,
    Volume 63, Issue 7, pp. 1-16, March 2018. DOI: 10.1088/1361-6560/aab45e
    Abstract: ... Until now, no matrix transducer has been realized for 3D transesophageal echocardiography (TEE) in pediatric patients. In 3D TEE with a matrix transducer, the biggest challenges are to connect a large number of elements to a standard ultrasound system, and to achieve a high volume rate (>200 Hz). To address these issues, we have recently developed a prototype miniaturized matrix transducer for pediatric patients with micro-beamforming and a small central transmitter. In this paper we propose two multiline parallel 3D beamforming techniques (µBF25 and µBF169) using the micro-beamformed datasets from 25 and 169 transmit events to achieve volume rates of 300 Hz and 44 Hz, respectively. Both the realizations use angle-weighted combination of the neighboring overlapping sub-volumes to avoid artifacts due to sharp intensity changes introduced by parallel beamforming. In simulation, the image quality in terms of the width of the point spread function (PSF), lateral shift invariance and mean clutter level for volumes produced by µBF25 and µBF169 are similar to the idealized beamforming using a conventional single-line acquisition with a fully-sampled matrix transducer (FS4k, 4225 transmit events). For completeness, we also investigated a 9 transmit-scheme (3  ×  3) that allows even higher frame rates but found worse B-mode image quality with our probe. The simulations were experimentally verified by acquiring the µBF datasets from the prototype using a Verasonics V1 research ultrasound system. For both µBF169 and µBF25, the experimental PSFs were similar to the simulated PSFs, but in the experimental PSFs, the clutter level was ~10 dB higher. Results indicate that the proposed multiline 3D beamforming techniques with the prototype matrix transducer are promising candidates for real-time pediatric 3D TEE.

  310. A Reconfigurable Ultrasound Transceiver ASIC With 24 × 40 Elements for 3D Carotid Artery Imaging
    E. Kang; Q. Ding; M. Shabanimotlagh; P. Kruizinga; Z. Y. Chang; E. Noothout; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 7, pp. 2065-2075, July 2018. DOI: 10.1109/JSSC.2018.2820156
    Abstract: ... This paper presents an ultrasound transceiver application-specific integrated circuit (ASIC) designed for 3-D ultrasonic imaging of the carotid artery. This application calls for an array of thousands of ultrasonic transducer elements, far exceeding the number of channels of conventional imaging systems. The 3.6 x 6.8 mm² ASIC interfaces a piezo-electric transducer (PZT) array of 24 x 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels. Multiple ASICs can be tiled together to form an even bigger array. The ASIC, implemented in a 0.18 μm high-voltage (HV) BCD process, consists of a reconfigurable switch matrix and row-level receive circuits. Each element is associated with a compact bootstrapped HV transmit switch, an isolation switch for the receive circuits and programmable logic that enables a variety of imaging modes. Electrical and acoustic experiments successfully demonstrate the functionality of the ASIC. In addition, the ASIC has been successfully used in a 3-D imaging experiment.

  311. Fast volumetric imaging using a matrix TEE probe with partitioned transmit-receive array
    D. Bera; F. van den Adel; N. Radeljic-Jakic; B. Lippe; M. Soozande; M. A. P. Pertijs; M. D. Verweij; P. Kruizinga; V. Daeichin; H. J. Vos; A. F. W. van der Steen; J. G. Bosch; N. de Jong;
    Ultrasound in Medicine \& Biology,
    Volume 44, Issue 9, pp. 2025-2042, July 2018. DOI: 10.1016/j.ultrasmedbio.2018.05.017
    Abstract: ... We describe a 3-D multiline parallel beamforming scheme for real-time volumetric ultrasound imaging using a prototype matrix transesophageal echocardiography probe with diagonally diced elements and separated transmit and receive arrays. The elements in the smaller rectangular transmit array are directly wired to the ultrasound system. The elements of the larger square receive aperture are grouped in 4 × 4-element sub-arrays by micro-beamforming in an application-specific integrated circuit. We propose a beamforming sequence with 85 transmit–receive events that exhibits good performance for a volume sector of 60° × 60°. The beamforming is validated using Field II simulations, phantom measurements and in vivo imaging. The proposed parallel beamforming achieves volume rates up to 59 Hz and produces good-quality images by angle-weighted combination of overlapping sub-volumes. Point spread function, contrast ratio and contrast-to-noise ratio in the phantom experiment closely match those of the simulation. In vivo 3-D imaging at 22-Hz volume rate in a healthy adult pig clearly visualized the cardiac structures, including valve motion.

  312. A Front-End ASIC with High-Voltage Transmit Switching and Receive Digitization for 3D Forward-Looking Intravascular Ultrasound Imaging
    M. Tan; C. Chen; Z. Chen; J. Janjic; V. Daeichin; Z. Y. Chang; E. Noothout; G. van Soest; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 8, pp. 2284-2297, August 2018. DOI: 10.1109/JSSC.2018.2828826
    Abstract: ... This paper presents an area- and power-efficient application-specified integrated circuit (ASIC) for 3-D forward-looking intravascular ultrasound imaging. The ASIC is intended to be mounted at the tip of a catheter, and has a circular active area with a diameter of 1.5 mm on the top of which a 2-D array of piezoelectric transducer elements is integrated. It requires only four micro-coaxial cables to interface 64 receive (RX) elements and 16 transmit (TX) elements with an imaging system. To do so, it routes high-voltage (HV) pulses generated by the system to selected TX elements using compact HV switch circuits, digitizes the resulting echo signal received by a selected RX element locally, and employs an energy-efficient load-modulation datalink to return the digitized echo signal to the system in a robust manner. A multi-functional command line provides the required sampling clock, configuration data, and supply voltage for the HV switches. The ASIC has been realized in a 0.18-μm HV CMOS technology and consumes only 9.1 mW. Electrical measurements show 28-V HV switching and RX digitization with a 16-MHz bandwidth and 53-dB dynamic range. Acoustical measurements demonstrate successful pulse transmission and reception. Finally, a 3-D ultrasound image of a three-needle phantom is generated to demonstrate the imaging capability.

  313. Acoustic characterization of a miniature matrix transducer for pediatric 3D transesophageal echocardiography
    V. Daeichin; D. Bera; S. Raghunathan; M. ShabaniMotlagh; Z. Chen; C. Chen; E. Noothout; H. J. Vos; M. Pertijs; J. Bosch; N. de Jong; M. Verweij;
    Ultrasound in Medicine \& Biology,
    Volume 44, Issue 10, pp. 2143-2154, October 2018. DOI: 10.1016/j.ultrasmedbio.2018.06.009
    Abstract: ... This paper presents the design, fabrication and characterization of a miniature PZT-on-CMOS matrix transducer for real-time pediatric 3-dimensional (3D) transesophageal echocardiography (TEE). This 3D TEE probe consists of a 32 × 32 array of PZT elements integrated on top of an Application Specific Integrated Circuit (ASIC). We propose a partitioned transmit/receive array architecture wherein the 8 × 8 transmitter elements, located at the centre of the array, are directly wired out and the remaining receive elements are grouped into 96 sub-arrays of 3 × 3 elements. The echoes received by these sub-groups are locally processed by micro-beamformer circuits in the ASIC that allow pre-steering up to ±37°. The PZT-on-CMOS matrix transducer has been characterized acoustically and has a centre frequency of 5.8 MHz, -6 dB bandwidth of 67%, a transmit efficiency of 6 kPa/V at 30 mm, and a receive dynamic range of 85 dB with minimum and maximum detectable pressures of 5 Pa and 84 kPa respectively. The properties are very suitable for a miniature pediatric real-time 3D TEE probe.

  314. A Phase-Domain Readout Circuit for a CMOS-Compatible Hot-Wire CO$_2$ Sensor
    Z. Cai; R. van Veldhoven; H. Suy; G. de Graaf; K. Makinwa; M. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 11, pp. 3303--3313, November 2018. DOI: 10.1109/JSSC.2018.2866374
    Abstract: ... This paper presents a readout circuit for a carbon dioxide (CO2) sensor that measures the CO2-dependent thermal time constant of a hot-wire transducer. The readout circuit periodically heats up the transducer and uses a phase-domain modulator to digitize the phase shift of the resulting temperature transients. A single resistive transducer is used both as a heater and as a temperature sensor, thus greatly simplifying its fabrication. To extract the transducer’s resistance, and hence its temperature, in the presence of large heating currents, a pair of transducers is configured as a differentially driven bridge. The transducers and the readout circuit have been implemented in a standard 0.16-μm CMOS technology, with an active area of 0.3 and 3.14 mm2, respectively. The sensor consumes 6.8 mW from a 1.8-V supply, of which 6.3 mW is dissipated in the transducers. A resolution of 94-ppm CO2 is achieved in a 1.8-s measurement time, which corresponds to an energy consumption of 12 mJ per measurement, >10× less than prior CO2 sensors in CMOS technology.

  315. A Capacitively-Degenerated 100dB Linear 20-150MS/s Dynamic Amplifier
    M. S. Akter; K.A.A. Makinwa; K. Bult;
    IEEE Journal of Solid-State Circuits,
    Volume 53, pp. 1115 - 1126, 4 2018. DOI: 10.1109/JSSC.2017.2778277
    Abstract: ... This paper presents a new dynamic residue amplifier topology for pipelined analog-to-digital converters. With an input signal of 100 mVpp,diff and 4x gain, it achieves -100-dB total harmonic distortion, the lowest ever reported for a dynamic amplifier. Compared to the state of the art, it exhibits 25 dB better linearity with twice the output swing and similar noise performance. The key to this performance is a new linearization technique based on capacitive degeneration, which exploits the exponential voltage-to-current relationship of MOSFET in weak inversion. The prototype amplifier is fabricated in a 28-nm CMOS process and dissipates only 87 μW at a clock speed of 43 MS/s, thereby improving the energy per cycle by 26x compared with that of state-of-the-art high-linearity amplifiers.

  316. A 4.5 nV/\sqrtHz Capacitively-Coupled Continuous-Time Sigma-Delta Modulator with an Energy-Efficient Chopping Scheme
    H. Jiang; C. Ligouras; S. Nihtianov; K.A.A. Makinwa;
    IEEE Solid-State Circuits Letters,
    Volume 1, pp. 18-21, 2018. DOI: 10.1109/LSSC.2018.2803447
    Abstract: ... When chopping is applied to a continuous-time sigmadelta modulator (CTΣΔM), quantization noise fold-back often occurs, leading to increased in-band noise. This can be prevented by employing a return-to-zero (RZ) digital-to-analog converter (RZ DAC) in the modulator's feedback path and arranging the chopping transitions to coincide with its RZ phases. In this letter, this technique has been extended and implemented in an energy-efficient CTΣΔM intended for the readout of Wheatstone bridge sensors. To achieve a wide common-mode input range, the modulator's summing node is implemented as an embedded capacitively coupled instrumentation amplifier which can be readily combined with a highly linear 1-bit capacitive RZ DAC. Measurements show that the proposed chopping scheme does not suffer from quantization noise fold-back and also allows a flexible choice of chopping frequency. When chopped at one-tenth of the sampling frequency, the modulator achieves 15 ppm INL, 4.5 nV/√Hz input-referred noise and a state-of-the-art noise efficiency factor of 6.1.

  317. A 19.8 mW Sub-nanometer Eddy-current Displacement Sensor Interface
    V. Chaturvedi; M.R. Nabaviy; J.G. Vogel; K.A.A. Makinwa; S. Nihtianov;
    IEEE Journal of Solid-State Circuits,
    Volume 53, pp. 2273-2283, 5 2018. DOI: 10.1109/JSSC.2018.2832168
    Abstract: ... This paper presents an eddy-current sensor (ECS) interface intended for sub-nanometer (sub-nm) displacement sensing in hi-tech applications. The interface employs a 126-MHz excitation frequency to mitigate the skin effect, and achieve high resolution and stability. An efficient on-chip sensor offset compensation scheme is introduced which removes sensoroffset proportional to the standoff distance. To assist in the ratiometric suppression of noise and drift of the excitation oscillator, the ECS interface consists of a highly linear amplitude demodulation scheme that employs passive capacitors for voltageto-current (V2I) conversion. Using a printed circuit board-based pseudo-differential ECS, stability tests were performed which demonstrated a thermal drift of <;7.3 nm/°C and long-term drift of only 29.5 nm over a period of 60 h. The interface achieves an effective noise floor of 13.4 pm/√Hz which corresponds to a displacement resolution of 0.6 nm in a 2-kHz noise bandwidth. The ECS interface is fabricated in TSMC 0.18-μm CMOS technology and dissipates only 19.8 mW from a 1.8-V supply.

  318. A ±12A High-Side Current Sensor with 25V Input CM Range and 0.35% Gain Error from -40ºC to 85ºC
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    IEEE Solid-State Circuits Letters,
    Volume 1, pp. 94-97, 4 2018. DOI: 10.1109/LSSC.2018.2855407
    Abstract: ... This letter presents the most accurate shunt-based high-side current sensor ever reported. It achieves a 25 V input common-mode range from a single 1.8-V supply by using a beyond-the-rails ADC. A hybrid analog/digital temperature compensation scheme is proposed to simplify the circuit implementation while maintaining the state-of-the-art accuracy. Over a ±12-A current range, the sensor exhibits 0.35% gain error from -40 °C to 85 °C with 3× better power efficiency.

  319. An Element-Matched Electro-Mechanical ΔΣ ADC for Ultrasound Imaging
    M. D'Urbino; C. Chen; Z. Chen; Z. Y. Chang; J. Ponte; B. Lippe; M. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 10, pp. 2795-2805, October 2018. DOI: 10.1109/JSSC.2018.2859961
    Abstract: ... This paper presents a power- and area-efficient approach to digitizing the echo signals received by piezoelectric transducer elements, commonly used for ultrasound imaging. This technique utilizes such elements not only as sensors but also as the loop filter of an element-level Δ Σ analog to digital converter (ADC). The receiver chain is thus greatly simplified, yielding savings in area and power. Every ADC becomes small enough to fit underneath a 150 μ m x 150 μ m transducer element, enabling simultaneous acquisition and digitization from all the elements in a 2-D array. This is especially valuable for miniature 3-D probes. Experimental results are reported for a prototype receiver chip with an array of 5 x 4 element-matched ADCs and a transducer array fabricated on top of the chip. Each ADC consumes 800 μ W from a 1.8 V supply and achieves a SNR of 47 dB in a 75% bandwidth around a center frequency of 5 MHz.

  320. A Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes
    C. Chen; Z. Chen; D. Bera; E. Noothout; Z. Y. Chang; M. Tan; H. Vos; J. Bosch; M. Verweij; N. de Jong; M. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 11, pp. 3050-3064, November 2018. DOI: 10.1109/JSSC.2018.2864295
    Abstract: ... This paper presents a front-end application-specified integrated circuit (ASIC) integrated with a 2-D PZT matrix transducer that enables in-probe digitization with acceptable power dissipation for the next-generation endoscopic and catheter-based 3-D ultrasound imaging systems. To achieve power-efficient massively parallel analog-to-digital conversion (ADC) in a 2-D array, a 10-bit 30 MS/s beamforming ADC that merges the subarray beamforming and digitization functions in the charge domain is proposed. It eliminates the need for costly intermediate buffers, thus significantly reducing both power consumption and silicon area. Self-calibrated charge references are implemented in each subarray to further optimize the system-level power efficiency. High-speed datalinks are employed in combination with the subarray beamforming scheme to realize a 36-fold channel-count reduction and an aggregate output data rate of 6 Gb/s for a prototype receive array of 24 x 6 elements. The ASIC achieves a record power efficiency of 0.91 mW/element during receive. Its functionality has been demonstrated in both electrical and acoustic imaging experiments.

  321. Design of a temperature sensor with optimized noise-power performance
    A. Heidari; G. Wang; Motahareh Abdollahpour; G.C.M. Meijer;
    Sensors and Actuators A: Physical,
    Volume 282, pp. 79--89, October 2018. DOI: 10.1016/j.sna.2018.09.006
    Abstract: ... This paper presents the design aspect of a BJT-based temperature sensor implemented in standard CMOS technology that is optimized for its noise-power performance. The interface electronics of the sensor consists of a continuous-time duty-cycle modulator, where a capacitor is periodically charged and discharged, with two temperature-dependent current sources, between two thresholds determined by a Schmitt trigger. In order to optimize the noise properties of the sensor, the major noise sources have been analyzed and optimized using target specifications of the manufacturer. Experimental results are in agreement with those of simulations and analytical calculations. The sensor has been implemented in 0.7μm CMOS technology. At 3.3V supply, the measured temperature resolution amounts to 3mK for a measurement time of 1.8ms. The test results show that a Resolution Figure of Merit (RFoM) of 3.2pJK² has been achieved in this design, which is the best reported result for BJT-based temperature sensors in the market.

  322. A ±4-A High-Side Current Sensor With 0.9% Gain Error From −40 °C to 85 °C Using an Analog Temperature Compensation Technique
    L. Xu; J. H. Huijsing; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3368-3376, 12 2018. DOI: 10.1109/JSSC.2018.2875106
    Abstract: ... This paper presents a fully integrated shunt-based current sensor that supports a 25-V input common-mode range while operating from a single 1.5-V supply. It uses a high-voltage beyond-the-rails ADC to directly digitize the voltage across an on-chip shunt resistor. To compensate for the shunt's large temperature coefficient of resistance (~0.335%/°C), the ADC employs a proportional-to-absolute-temperature voltage reference. This analog compensation scheme obviates the need for the explicit temperature sensor and calibration logic required by digital compensation schemes. The sensor achieves 1.5-μVrms noise over a 2-ms conversion time while drawing only 10.9 μA from a 1.5-V supply. Over a ±4-A range, and after a one-point trim, the sensor exhibits a 0.9% (maximum) gain error from -40 °C to 85 °C and a 0.05% gain error at room temperature.

  323. A Compact Resistor-Based CMOS Temperature Sensor With an Inaccuracy of 0.12 °C (3σ) and a Resolution FoM of 0.43 pJ⋅K^2 in 65-nm CMOS
    W. Choi; Y. Lee; S. Kim; S. Lee; J. Jang; J. Chun; K. A. A. Makinwa; Y. Chae;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3356-3367, 12 2018. DOI: 10.1109/JSSC.2018.2871622
    Abstract: ... This paper presents a compact resistor-based CMOS temperature sensor intended for dense thermal monitoring. It is based on an RC poly-phase filter (PPF), whose temperature-dependent phase shift is read out by a frequency-locked loop (FLL). The PPF's phase shift is determined by a zero-crossing (ZC) detector, allowing the rest of the FLL to be realized in an area-efficient manner. Implemented in a 65-nm CMOS technology, the sensor occupies only 7000 μm². It can operate from supply voltages as low as 0.85 V and consumes 68 μW. A sensor based on a PPF made from silicided p-poly resistors and metal-insulator-metal (MIM) capacitors achieves an inaccuracy of ±0.12 °C (3σ) from -40 °C to 85 °C and a resolution of 2.5 mK (rms) in a 1-ms conversion time. This corresponds to a resolution figure-of-merit (FoM) of 0.43 pJ·K².

  324. A 0.25 mm2-Resistor-Based Temperature Sensor With an Inaccuracy of 0.12 °C (3σ) From −55 °C to 125 °C
    S. Pan; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3347-3355, 12 2018. DOI: 10.1109/JSSC.2018.2869595
    Abstract: ... This paper describes a compact, energy efficient, resistor-based temperature sensor that can operate over a wide temperature range (-55 °C-125 °C). The sensor is based on a Wheatstone bridge (WhB) made from silicided poly-silicon and non-silicided poly-silicon resistors. To achieve both area and energy efficiencies, the current output of the WhB is digitized by a continuous-time zoom analog-to-digital converter (ADC). Implemented in a standard 180-nm CMOS technology, the sensor consumes 52 μA from a 1.8-V supply and achieves a resolution of 280 μKrms in a 5-ms conversion time. This corresponds to a state-of-the-art resolution figure-of-merit (FoM) of 40 fJ · K². After a first-order fit, the sensor achieves an inaccuracy of ±,0.12 °C (3σ) from -55 °C to 125 °C.

  325. A 280μW Dynamic Zoom ADC With 120 dB DR and 118 dB SNDR in 1 kHz BW
    S. Karmakar; B. Gonen; F. Sebstiano; R. van Veldhoven; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3497-3507, 12 2018. DOI: 10.1109/JSSC.2018.2865466
    Abstract: ... This paper presents a dynamic zoom analog-to-digital converter for use in low-bandwidth (<1 kHz) instrumentation applications. It employs a high-speed asynchronous successive approximation register (SAR) ADC that dynamically updates the references of a fully differential ΔΣ ADC. Compared to previous zoom ADCs, faster reference updates relax the loop filter requirements, thus allowing the adoption of energy-efficient amplifiers. Fabricated in a 0.16- μm CMOS process, the prototype occupies 0.26 mm 2 and achieves 119.1-dB peak signal-to-noise ratio (SNR), 118.1-dB peak signal-to-noise-and-distortion-ratio (SNDR), and 120.3-dB dynamic range (DR) in a 1-kHz bandwidth while consuming 280 μW . This results in a Schreier figure of merit (FoM) of 185.8 dB.

  326. A CMOS Dual-RC Frequency Reference with ±200-ppm Inaccuracy from −45 °C to 85 °C
    Ç. Gürleyük; L. Pedalà; S. Pan; F. Sebastiano; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3386-3395, 12 2018. DOI: 10.1109/JSSC.2018.2869083
    Abstract: ... This paper presents a 7-MHz CMOS RC frequency reference. It consists of a frequency-locked loop in which the output frequency of a digitally controlled oscillator (DCO) is locked to the combined phase shifts of two independent RC (Wien bridge) filters, each employing resistors with complementary temperature coefficients. The filters are driven by the DCO’s output frequency and the resulting phase shifts are digitized by high-resolution phase-to-digital converters. Their outputs are then combined in the digital domain to realize a temperature-independent frequency error signal. This digitally assisted temperature compensation scheme achieves an inaccuracy of ±200 ppm from –45 °C to 85 °C after a two-point trim. The frequency reference draws 430 μA from a 1.8-V supply, while achieving a supply sensitivity of 0.18%/V and a 330-ppb Allan deviation floor in 3 s of measurement time.

  327. MEMS for biofuel composition measurement based on thermal impedance spectroscopy
    Ghaderi, Mohammadamir; Jiang, Bo; Bossche, Andre; Visser, Jaco H; Wolffenbuttel, Reinoud F;
    Sensors and Actuators B: Chemical,
    Volume 277, pp. 281--288, December 2018. DOI: 10.1016/j.snb.2018.08.098
    Abstract: ... Continuous monitoring of the composition of E85 biofuel is essential for a quick start and clean and efficient operation of Flex-Fuel Vehicles. The actual ethanol concentration in E85 fuel is in the range 50%–85% and fuel-line sensors are used for ethanol-gasoline composition measurement. However, also a small amount of water is typically present, which cannot be reliably detected using state-of-the-art capacitive fuel-line sensors. Thermal impedance spectroscopy has been investigated as a non-destructive technique to determine the composition of ternary mixtures of biofuels. The principle of the thermal conductivity detector has been extended for measuring both the thermal conductivity and the thermal capacity of biofuel in the range up to 10 kHz using an AC-operated polysilicon heater for injecting a sinusoidal heat flux, and another polysilicon strip at a well-defined spacing or thermopile sensors for measuring the in-phase and quadrature components of the resulting AC temperature difference. Measurements on the components are in reasonable agreement with simulations, with a −3 dB cut-off frequency at 422.5 Hz and 340.8 Hz for ethanol and gasoline, respectively. However, the cut-off frequency of water was found to be significantly lower than simulations due to its high surface tension, thus limiting access to the detector.

  328. A Novel 12-Lead Electrocardiographic System for Home Use: Development and Usability Testing
    Annemarijn SM Steijlen; Kaspar MB Jansen; Armagan Albayrak; Derk O Verschure; Diederik F Van Wijk;
    JMIR mHealth and uHealth,
    Volume 6, Issue 7, pp. e10126, July 2018. DOI: 10.2196/10126
    Abstract: ... Background: Cardiovascular diseases (CVD) are the leading cause of morbidity and mortality worldwide. Early diagnosis is of pivotal importance for patients with cardiac arrhythmias and ischemia to minimize the consequences like strokes and myocardial infarctions. The chance of capturing signals of arrhythmias or ischemia is substantially high when a 12-lead electrocardiogram (ECG) can be recorded at the moment when a patient experiences the symptoms. However, until now, available diagnostic systems (Holter monitors and other wearable ECG sensors) have not enabled patients to record a reliable 12-lead ECG at home. Objective: The objective of this project was to develop a user-friendly system that enables persons with cardiac complaints to record a reliable 12-lead ECG at home to improve the diagnostic process and, consequently, reduce the time between the onset of symptoms and adequate treatment. Methods: Using an iterative design approach, ECGraph was developed. The system consists of an ECG measurement system and a mobile app, which were developed with the help of several concept tests. To evaluate the design, a prototype of the final design was built and a final technical performance test and usability test were executed. Results: The ECG measurement system consists of a belt and 4 limb straps. Ten wet Ag/AgCl electrodes are placed in the belt to optimize skin-electrode contact. The product is controlled via an app on the mobile phone of the user. Once a person experiences symptoms, he or she can put on the belt and record ECGs within a few minutes. Short instructions, supported by visualizations, offer guidance during use. ECGs are sent wirelessly to the caregiver, and the designated expert can quickly interpret the results. Usability tests with the final prototype (n=6) showed that the participants were able to put on the product within 8 minutes during first-time use. However, we expect that the placement of the product can be executed faster when the user becomes more familiar with the product. Areas of improvement focus mainly on confidence during product use. In the technical performance test, a 12-lead ECG was made and reproduced 6 times. Conclusions: We developed a new 12-lead ECG system for home use. The product is expected to be more user-friendly than current hospital ECG systems and is designed to record more reliable data than current ECG systems for home use, which makes it suitable for expert interpretation. The system has great potential to be incorporated into an outpatient practice, so that arrhythmias and ischemia can be diagnosed and treated as early as possible.

  329. A 2D Ultrasound Transducer with Front-End ASIC and Low Cable Count for 3D Forward-Looking Intravascular Imaging: Performance and Characterization
    J. Janjic; M. Tan; E. Noothout; C. Chen; Z. Chan; Z. Y. Chang; R. H. S. H. Beurskens; G. van Soest; A. F. W. van der Steen; M. D. Verweij; M. A. P. Pertijs; N. de Jong;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 65, Issue 10, pp. 1832--1844, October 2018. Featured Cover Article. DOI: 10.1109/TUFFC.2018.2859824
    Abstract: ... Intravascular ultrasound is an imaging modality used to visualize atherosclerosis from within the inner lumen of human arteries. Complex lesions like chronic total occlusions require forward-looking intravascular ultrasound (FL-IVUS), instead of the conventional side-looking geometry. Volumetric imaging can be achieved with 2D array transducers, which present major challenges in reducing cable count and device integration. In this work we present an 80-element lead zirconium titanate (PZT) matrix ultrasound transducer for FL-IVUS imaging with a front-end application-specific integrated circuit (ASIC) requiring only 4 cables. After investigating optimal transducer designs we fabricated the matrix transducer consisting of 16 transmit (TX) and 64 receive (RX) elements arranged on top of an ASIC having an outer diameter of 1.5 mm and a central hole of 0.5 mm for a guidewire. We modeled the transducer using finite element analysis and compared the simulation results to the values obtained through acoustic measurements. The TX elements showed uniform behavior with a center frequency of 14 MHz, a -3 dB bandwidth of 44 % and a transmit sensitivity of 0.4 kPa/V at 6 mm. The RX elements showed center frequency and bandwidth similar to the TX elements, with an estimated receive sensitivity of 3.7 μV/Pa. We successfully acquired a 3D FL image of three spherical reflectors in water using delay-and-sum beamforming and the coherence factor method. Full synthetic aperture acquisition can be achieved with frame rates on the order of 100 Hz. The acoustic characterization and the initial imaging results show the potential of the proposed transducer to achieve 3D FL-IVUS imaging.

  330. A 66 dB SNDR Pipelined Split-ADC in 40 nm CMOS Using a Class-AB Residue Amplifier
    M. S. Akter; R. Sehgal; F. van der Goes; K. A. A. Makinwa; K. Bult;
    IEEE Journal of Solid-State Circuits,
    Volume 53, pp. 2939-2950, 10 2018. DOI: 10.1109/JSSC.2018.2859415
    Abstract: ... This paper presents a closed-loop class-AB residue amplifier for pipelined analog-to-digital converters (ADCs). It consists of a push–pull structure with a “split-capacitor” biasing circuit that enhances its power efficiency. The amplifier is inherently quite linear, and so incomplete settling can be used to save power while still maintaining sufficient linearity. This also allows the amplifier’s gain to be corrected by adjusting its bias current. When combined with digital gain-error detection, in this case the split-ADC technique, the result is a power-efficient gain calibration scheme. In a prototype pipelined ADC, this scheme converges in only 12 000 clock cycles. With a near-Nyquist input, the ADC achieves 66-dB SNDR and 77.3-dB SFDR at 53 MS/s. Implemented in 40-nm CMOS, it dissipates 9 mW, of which 0.83 mW is consumed in the residue amplifiers. This represents a 1.8 × improvement in power efficiency compared to state-of-the-art class-AB residue amplifiers.

  331. A 280μW Dynamic Zoom ADC With 120 dB DR and 118 dB SNDR in 1 kHz BW
    S. Karmakar; B. Gonen; F. Sebstiano; R. van Veldhoven; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3497-3507, 12 2018. DOI: 10.1109/JSSC.2018.2865466
    Abstract: ... This paper presents a dynamic zoom analog-to-digital converter for use in low-bandwidth (<1 kHz) instrumentation applications. It employs a high-speed asynchronous successive approximation register (SAR) ADC that dynamically updates the references of a fully differential ΔΣ ADC. Compared to previous zoom ADCs, faster reference updates relax the loop filter requirements, thus allowing the adoption of energy-efficient amplifiers. Fabricated in a 0.16- μm CMOS process, the prototype occupies 0.26 mm 2 and achieves 119.1-dB peak signal-to-noise ratio (SNR), 118.1-dB peak signal-to-noise-and-distortion-ratio (SNDR), and 120.3-dB dynamic range (DR) in a 1-kHz bandwidth while consuming 280 μW . This results in a Schreier figure of merit (FoM) of 185.8 dB.

  332. A CMOS Dual-RC Frequency Reference with ±200-ppm Inaccuracy from −45 °C to 85 °C
    Ç. Gürleyük; L. Pedalà; S. Pan; F. Sebastiano; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3386-3395, 12 2018. DOI: 10.1109/JSSC.2018.2869083
    Abstract: ... This paper presents a 7-MHz CMOS RC frequency reference. It consists of a frequency-locked loop in which the output frequency of a digitally controlled oscillator (DCO) is locked to the combined phase shifts of two independent RC (Wien bridge) filters, each employing resistors with complementary temperature coefficients. The filters are driven by the DCO’s output frequency and the resulting phase shifts are digitized by high-resolution phase-to-digital converters. Their outputs are then combined in the digital domain to realize a temperature-independent frequency error signal. This digitally assisted temperature compensation scheme achieves an inaccuracy of ±200 ppm from –45 °C to 85 °C after a two-point trim. The frequency reference draws 430 μA from a 1.8-V supply, while achieving a supply sensitivity of 0.18%/V and a 330-ppb Allan deviation floor in 3 s of measurement time.

  333. A ±4-A High-Side Current Sensor With 0.9% Gain Error From −40 °C to 85 °C Using an Analog Temperature Compensation Technique
    L. Xu; J. H. Huijsing; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3368-3376, 12 2018. DOI: 10.1109/JSSC.2018.2875106
    Abstract: ... This paper presents a fully integrated shunt-based current sensor that supports a 25-V input common-mode range while operating from a single 1.5-V supply. It uses a high-voltage beyond-the-rails ADC to directly digitize the voltage across an on-chip shunt resistor. To compensate for the shunt's large temperature coefficient of resistance (~0.335%/°C), the ADC employs a proportional-to-absolute-temperature voltage reference. This analog compensation scheme obviates the need for the explicit temperature sensor and calibration logic required by digital compensation schemes. The sensor achieves 1.5-μVrms noise over a 2-ms conversion time while drawing only 10.9 μA from a 1.5-V supply. Over a ±4-A range, and after a one-point trim, the sensor exhibits a 0.9% (maximum) gain error from -40 °C to 85 °C and a 0.05% gain error at room temperature.

  334. A Compact Resistor-Based CMOS Temperature Sensor With an Inaccuracy of 0.12 °C (3σ) and a Resolution FoM of 0.43 pJ⋅K^2 in 65-nm CMOS
    W. Choi; Y. Lee; S. Kim; S. Lee; J. Jang; J. Chun; K. A. A. Makinwa; Y. Chae;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3356-3367, 12 2018. DOI: 10.1109/JSSC.2018.2871622
    Abstract: ... This paper presents a compact resistor-based CMOS temperature sensor intended for dense thermal monitoring. It is based on an RC poly-phase filter (PPF), whose temperature-dependent phase shift is read out by a frequency-locked loop (FLL). The PPF's phase shift is determined by a zero-crossing (ZC) detector, allowing the rest of the FLL to be realized in an area-efficient manner. Implemented in a 65-nm CMOS technology, the sensor occupies only 7000 μm². It can operate from supply voltages as low as 0.85 V and consumes 68 μW. A sensor based on a PPF made from silicided p-poly resistors and metal-insulator-metal (MIM) capacitors achieves an inaccuracy of ±0.12 °C (3σ) from -40 °C to 85 °C and a resolution of 2.5 mK (rms) in a 1-ms conversion time. This corresponds to a resolution figure-of-merit (FoM) of 0.43 pJ·K².

  335. A 0.25 mm2-Resistor-Based Temperature Sensor With an Inaccuracy of 0.12 °C (3σ) From −55 °C to 125 °C
    S. Pan; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3347-3355, 12 2018. DOI: 10.1109/JSSC.2018.2869595
    Abstract: ... This paper describes a compact, energy efficient, resistor-based temperature sensor that can operate over a wide temperature range (-55 °C-125 °C). The sensor is based on a Wheatstone bridge (WhB) made from silicided poly-silicon and non-silicided poly-silicon resistors. To achieve both area and energy efficiencies, the current output of the WhB is digitized by a continuous-time zoom analog-to-digital converter (ADC). Implemented in a standard 180-nm CMOS technology, the sensor consumes 52 μA from a 1.8-V supply and achieves a resolution of 280 μKrms in a 5-ms conversion time. This corresponds to a state-of-the-art resolution figure-of-merit (FoM) of 40 fJ · K². After a first-order fit, the sensor achieves an inaccuracy of ±,0.12 °C (3σ) from -55 °C to 125 °C.

  336. A Phase-Domain Readout Circuit for a CMOS-Compatible Hot-Wire CO2 Sensor
    Z. Cai; R. van Veldhoven; H. Suy; G. de Graaf; K. Makinwa; M. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 11, pp. 3303--3313, November 2018. DOI: 10.1109/JSSC.2018.2866374
    Abstract: ... This paper presents a readout circuit for a carbon dioxide (CO2) sensor that measures the CO2-dependent thermal time constant of a hot-wire transducer. The readout circuit periodically heats up the transducer and uses a phase-domain modulator to digitize the phase shift of the resulting temperature transients. A single resistive transducer is used both as a heater and as a temperature sensor, thus greatly simplifying its fabrication. To extract the transducer’s resistance, and hence its temperature, in the presence of large heating currents, a pair of transducers is configured as a differentially driven bridge. The transducers and the readout circuit have been implemented in a standard 0.16-μm CMOS technology, with an active area of 0.3 and 3.14 mm2, respectively. The sensor consumes 6.8 mW from a 1.8-V supply, of which 6.3 mW is dissipated in the transducers. A resolution of 94-ppm CO2 is achieved in a 1.8-s measurement time, which corresponds to an energy consumption of 12 mJ per measurement, >10× less than prior CO2 sensors in CMOS technology.

  337. A 19.8 mW Sub-nanometer Eddy-current Displacement Sensor Interface
    V. Chaturvedi; M.R. Nabaviy; J.G. Vogel; K.A.A. Makinwa; S. Nihtianov;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 8, pp. 2273-2283, 5 2018. DOI: 10.1109/JSSC.2018.2832168
    Abstract: ... This paper presents an eddy-current sensor (ECS) interface intended for sub-nanometer (sub-nm) displacement sensing in hi-tech applications. The interface employs a 126-MHz excitation frequency to mitigate the skin effect, and achieve high resolution and stability. An efficient on-chip sensor offset compensation scheme is introduced which removes sensoroffset proportional to the standoff distance. To assist in the ratiometric suppression of noise and drift of the excitation oscillator, the ECS interface consists of a highly linear amplitude demodulation scheme that employs passive capacitors for voltageto-current (V2I) conversion. Using a printed circuit board-based pseudo-differential ECS, stability tests were performed which demonstrated a thermal drift of <;7.3 nm/°C and long-term drift of only 29.5 nm over a period of 60 h. The interface achieves an effective noise floor of 13.4 pm/√Hz which corresponds to a displacement resolution of 0.6 nm in a 2-kHz noise bandwidth. The ECS interface is fabricated in TSMC 0.18-μm CMOS technology and dissipates only 19.8 mW from a 1.8-V supply.

  338. A ±12A High-Side Current Sensor with 25V Input CM Range and 0.35% Gain Error from -40ºC to 85ºC
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    IEEE Solid-State Circuits Letters,
    Volume 1, Issue 4, pp. 94-97, 4 2018. DOI: 10.1109/LSSC.2018.2855407
    Abstract: ... This letter presents the most accurate shunt-based high-side current sensor ever reported. It achieves a 25 V input common-mode range from a single 1.8-V supply by using a beyond-the-rails ADC. A hybrid analog/digital temperature compensation scheme is proposed to simplify the circuit implementation while maintaining the state-of-the-art accuracy. Over a ±12-A current range, the sensor exhibits 0.35% gain error from -40 °C to 85 °C with 3× better power efficiency.

  339. A 4.5 nV/\sqrtHz Capacitively-Coupled Continuous-Time Sigma-Delta Modulator with an Energy-Efficient Chopping Scheme
    H. Jiang; C. Ligouras; S. Nihtianov; K.A.A. Makinwa;
    IEEE Solid-State Circuits Letters,
    Volume 1, Issue 1, pp. 18-21, 2018. DOI: 10.1109/LSSC.2018.2803447
    Abstract: ... When chopping is applied to a continuous-time sigmadelta modulator (CTΣΔM), quantization noise fold-back often occurs, leading to increased in-band noise. This can be prevented by employing a return-to-zero (RZ) digital-to-analog converter (RZ DAC) in the modulator's feedback path and arranging the chopping transitions to coincide with its RZ phases. In this letter, this technique has been extended and implemented in an energy-efficient CTΣΔM intended for the readout of Wheatstone bridge sensors. To achieve a wide common-mode input range, the modulator's summing node is implemented as an embedded capacitively coupled instrumentation amplifier which can be readily combined with a highly linear 1-bit capacitive RZ DAC. Measurements show that the proposed chopping scheme does not suffer from quantization noise fold-back and also allows a flexible choice of chopping frequency. When chopped at one-tenth of the sampling frequency, the modulator achieves 15 ppm INL, 4.5 nV/√Hz input-referred noise and a state-of-the-art noise efficiency factor of 6.1.

  340. A Capacitively-Degenerated 100dB Linear 20-150MS/s Dynamic Amplifier
    M. S. Akter; K.A.A. Makinwa; K. Bult;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 4, pp. 1115 - 1126, 4 2018. DOI: 10.1109/JSSC.2017.2778277
    Abstract: ... This paper presents a new dynamic residue amplifier topology for pipelined analog-to-digital converters. With an input signal of 100 mVpp,diff and 4x gain, it achieves -100-dB total harmonic distortion, the lowest ever reported for a dynamic amplifier. Compared to the state of the art, it exhibits 25 dB better linearity with twice the output swing and similar noise performance. The key to this performance is a new linearization technique based on capacitive degeneration, which exploits the exponential voltage-to-current relationship of MOSFET in weak inversion. The prototype amplifier is fabricated in a 28-nm CMOS process and dissipates only 87 μW at a clock speed of 43 MS/s, thereby improving the energy per cycle by 26x compared with that of state-of-the-art high-linearity amplifiers.

  341. A 66 dB SNDR Pipelined Split-ADC in 40 nm CMOS Using a Class-AB Residue Amplifier
    M. S. Akter; R. Sehgal; F. van der Goes; K. A. A. Makinwa; K. Bult;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 10, pp. 2939-2950, 10 2018. DOI: 10.1109/JSSC.2018.2859415
    Abstract: ... This paper presents a closed-loop class-AB residue amplifier for pipelined analog-to-digital converters (ADCs). It consists of a push–pull structure with a “split-capacitor” biasing circuit that enhances its power efficiency. The amplifier is inherently quite linear, and so incomplete settling can be used to save power while still maintaining sufficient linearity. This also allows the amplifier’s gain to be corrected by adjusting its bias current. When combined with digital gain-error detection, in this case the split-ADC technique, the result is a power-efficient gain calibration scheme. In a prototype pipelined ADC, this scheme converges in only 12 000 clock cycles. With a near-Nyquist input, the ADC achieves 66-dB SNDR and 77.3-dB SFDR at 53 MS/s. Implemented in 40-nm CMOS, it dissipates 9 mW, of which 0.83 mW is consumed in the residue amplifiers. This represents a 1.8 × improvement in power efficiency compared to state-of-the-art class-AB residue amplifiers.

  342. A Resistor-Based Temperature Sensor with a 0.13pJ·K2 Resolution FOM
    S. Pan; Y. Luo; S.H. Shalmany; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 1, pp. 164-173, 1 2018. DOI: 10.1109/JSSC.2017.2746671
    Abstract: ... This paper describes a high-resolution energy-efficient CMOS temperature sensor, intended for the temperature compensation of MEMS/quartz frequency references. The sensor is based on silicided poly-silicon thermistors, which are embedded in a Wien-bridge RC filter. When driven at a fixed frequency, the filter exhibits a temperature-dependent phase shift, which is digitized by an energy-efficient continuous-time phase-domain delta-sigma modulator. Implemented in a 0.18-μm CMOS technology, the sensor draws 87 μA from a 1.8 V supply and achieves a resolution of 410 μKrms in a 5-ms conversion time. This translates into a state-of-the-art resolution figure-of-merit of 0.13 pJ·K². When packaged in ceramic, the sensor achieves an inaccuracy of 0.2 °C (3σ) from -40 °C to 85 °C after a single-point calibration and a correction for systematic nonlinearity. This can be reduced to ±0.03 °C (3σ) after a first-order fit. In addition, the sensor exhibits low 1/f noise and packaging shift.

  343. Low-Power Active Electrodes for Wearable EEG Acquisition
    J. Xu; R. Yazicioglu; K.A.A. Makinwa; C. Van Hoof;
    Springer, , 2018.

  344. Energy-Efficient Smart Temperature Sensors in CMOS Technology
    K. Souri; K.A.A. Makinwa;
    Springer, , 2018.

  345. 智能传感器系统：新兴技术及应用 (Smart Sensor Systems: The new Technologies and Applications)
    杰拉德. 梅杰 ( Gerard Meijer ); 米切尔. 珀提斯 ( Michiel Pertijs ); 科菲. 马金瓦 ( Kofi Makinwa );
    机械工业出版社, , 2018. ISBN:978-7-111-59412-3, Translated by 靖向萌， 明安杰，刘丰满.

  346. Hybrid ADCs, Smart Sensors for the IoT, and Sub-1V \& Advanced Node Analog Circuit Design
    P. Harpe; K. A. A. Makinwa; A. Baschirotto;
    Springer, , 2018.

  347. Low power active electrode ICs for wearable EEG acquisition
    Xu, Jiawei; Van Hoof, Chris; Makinwa, Kofi;
    Springer, , 2018.

  348. Energy-Efficient Smart Temperature Sensors in CMOS Technology
    Souri, Kamran; Makinwa, Kofi;
    Springer, , 2018.

  349. Hybrid ADCs, Smart Sensors for the IoT, and Sub-1V \& Advanced Node Analog Circuit Design
    Harpe, Pieter; Baschirotto, Andrea;
    Springer, , 2018.

  350. Smart Sensors and MEMS: Intelligent Sensing Devices and Microsystems for Industrial Applications. (Ch 3: Smart temperature sensors and temperature-sensor systems)
    Gerard C.M. Meijer; Guijie Wang; Ali Heidary;
    Stoyan Nihtianov; Antonio Luque (Ed.);
    Woodhead Publishing, , pp. 57--85, 2018. ISBN:978-0-08-102055-5. DOI: 10.1016/C2016-0-01622-4

  351. Integrated inductive displacement sensors for harsh industrial environments
    Mohammad R. Nabavi; Vikram Chaturvedi; Johan G. Vogel; Stoyan Nihtianov;
    In Smart Sensors and MEMS: Intelligent Sensing Devices and Microsystems for Industrial Applications,
    Woodhead Publishing, 2018.

  352. CMOS-Compatible Carbon Dioxide Sensors
    Z. Cai; R. van Veldhoven; H. Suy; G. de Graaf; K. A. A. Makinwa; M. Pertijs;
    In Low-Power Analog Techniques, Sensors for Mobile Devices, and Energy Efficient Amplifiers,
    Springer Science \& Business Media, November 2018. DOI: 10.1007/978-3-319-97870-3
    Abstract: ... This chapter presents two cost-effective sensors that measure ambient carbon dioxide (CO2) concentration, intended for application in smart ventilation systems in buildings or in mobile devices. Both sensors employ a suspended hot-wire transducer to detect the CO2-dependent thermal conductivity (TC) of the ambient air. The resistive transducer is realized in the VIA layer of a standard CMOS process using a single etch step. The first sensor determines the transducer’s CO2-dependent thermal resistance to the surrounding air by measuring its steady-state temperature rise and power dissipation. A ratiometric measurement is realized by employing an identical but capped transducer as a reference. An incremental delta-sigma ADC digitizes the temperature and power ratios of the transducers, from which the ratio of the thermal resistances is calculated. The second sensor is based on a transient measurement of the CO2-dependent thermal time constant of the transducer. The readout circuit periodically heats up the transducer and uses a phase-domain delta-sigma modulator to digitize the CO2-dependent phase shift of the resulting temperature transients. Compared to the ratiometric steady-state measurement, this approach significantly reduces the measurement time and improves the energy efficiency, resulting in a state-of-the art CO2 resolution of 94 ppm at an energy consumption of 12 mJ per measurement.

    document

  353. A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes
    C. Chen; Z. Chen; D. Bera; E. Noothout; Z. Y. Chang; M. Tan; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 186-187, February 2018. DOI: 10.1109/ISSCC.2018.8310246

  354. A 5x5 Microwave Permittivity Sensor Matrix in 0.14-μm CMOS
    Z. Hu; G. Vlachogiannakis; M. A. P. Pertijs; L. C. N. de Vreede; M. Spirito;
    In Proc. IEEE MTT-S International Microwave Symposium (IMS),
    6 2018. DOI: 10.1109/MWSYM.2018.8439438

  355. A Phase-Domain Readout Circuit for a CMOS Compatible Thermal-Conductivity-Based Carbon Dioxide Sensor
    Z. Cai; R. van Veldhoven; H. Suy; G. de Graaf; K. A. A. Makinwa; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 332-333, February 2018. DOI: 10.1109/ISSCC.2018.8310319

  356. Clamp-on Ultrasonic Flow-metering via Matrix Transducers
    J. Massaad; P. van Neer; D. van Willigen; N. de Jong; M. Pertijs; Martin Verweij;
    In Proc. Int. Conf. on Ultrasonic-based Applications,
    June 2018.

  357. Monitoring infant brain perfusion by trans-fontanel echography
    A. J. Kortenbout; H. J. Vos; J. Dudink; M. D. Verweij; M. A. P. Pertijs; J. G. Bosch; N. de Jong;
    In Proc. PhD Training Course Dutch Heart Foundation,
    October 2018.

  358. A 0.25mm2 resistor-based temperature sensor with an inaccuracy of 0.12°C (3σ) from −55°C to 125°C and a resolution FOM of 32fJK2
    S. Pan; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 320 - 322, 2 2018. DOI: 10.1109/ISSCC.2018.8310313

  359. A 0.53pJK2 7000μm2 resistor-based temperature sensor with an inaccuracy of ±0.35°C (3σ) in 65nm CMOS
    W. Choi; Y.T. Lee; S. Kim; S. Lee; J. Jang; J. Chun; K.A.A. Makinwa; Y. Chae;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 322-324, 2 2018. DOI: 10.1109/ISSCC.2018.8310314

  360. A ±4A high-side current sensor with 25V input CM range and 0.9% gain error from −40° C to 85° C using an analog temperature compensation technique
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 324-326, 2 2018. DOI: 10.1109/ISSCC.2018.8310315

  361. A 280μW dynamic-zoom ADC with 120dB DR and 118dB SNDR in 1kHz BWA 280μW dynamic-zoom ADC with 120dB DR and 118dB SNDR in 1kHz BW
    S. Karmakar; B. Gònen; F. Sebastiano; R. van Veldhoven; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 238-240, 2 2018. DOI: 10.1109/ISSCC.2018.8310272

  362. A quiet digitally assisted auto-zero-stabilized voltage buffer with 0.6 pA input current and offset
    T. Rooijers; J.H. Huijsing; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 50-52, 2 2018. DOI: 10.1109/ISSCC.2018.8310178

  363. A CMOS Dual-RC frequency reference with±250ppm inaccuracy from− 45° C to 85° C
    C. Gürleyük; L. Pedala; F. Sebastiano; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 54-56, 2 2018. DOI: 10.1109/ISSCC.2018.8310180

  364. Energy-efficient bridge-to-digital converters
    H. Jiang; K.A.A. Makinwa;
    In Proc. IEEE Custom Integrated Circuits Conference (CICC),
    pp. 1-7, 4 2018. DOI: 10.1109/CICC.2018.8357027

  365. A 15nW Per Button Noise-Immune Readout IC for Capacitive Touch Sensor
    S. Hussaini; H. Jiang; P. Walsh; D. MacSweeney; K.A.A. Makinwa;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    2018. DOI: 10.1109/ESSCIRC.2018.8494283

  366. ASIC design for a single-cable 64-element ultrasound probe
    D. van Willigen; J. Janjic; E. Kang; Z. Y. Chang; E. Noothout; M. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2018.
    Abstract: ... This paper presents an ASIC (Application Specific Integrated Circuit) design for a catheter probe that interfaces 64 piezoelectric elements directly integrated on top of the ASIC to an imaging system using a single micro-coaxial cable. Each of the piezo elements can be used for both transmit (TX) and receive (RX), enabling full synthetic aperture imaging. A prototype has been realized with a 1.5mm diameter circular layout, intended for 3D intra-vascular ultrasound imaging. The functionality of this ASIC has been successfully demonstrated in a 3D imaging experiment. The design allows a single-element transducer to be replaced by a transdcuer array while using the same cable, making it a promising solution for 3D imaging with size constrained probes.

  367. A Power-Efficient Transmit Beamformer ASIC for 3-D Catheter-Based/ Endoscopic Probes
    Z. Chen; E. Kang; Z. Y. Chang; E. Noothout; J. G. Bosch; M. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, October 2018. (abstract).
    Abstract: ... To reduce cable count in 3D catheter-based or endoscopic probes, generation of the (HV) transmit (TX) signals using an in-probe ASIC is a promising solution. However, such ASICs are subject to stringent power-consumption constraints to limit self-heating. The power consumed by conventional HV pulsers is at least fCV^2, due to the periodic charging/discharging of the transducer element capacitance C. HV switches can be used to connect elements to a pulser in the imaging system, thus only dissipating a fraction of fCV^2 in the probe, but full TX beamforming (BF) cannot be realized using switches. In this work, we propose a power-efficient HV TX circuit capable of providing full TX BF using only 3 HV connections to the system. Implemented in a 0.18um BCD process, the ASIC was fully evaluated by means of post-layout simulations.

  368. Auto-alignment of a High-Precision Eddy-current Displacement Sensor Using a Thermal Slider Actuator
    J.G. Vogel; Stoyan Nihtianov;
    In Proceedings of the 18th international conference of the EUSPEN,
    pp. 171 -- 2, 2018.

  369. Probe design for high-precision eddy-current displacement sensors
    Vogel, Johan G.; Chaturvedi, Vikram; Nihtianov, Stoyan;
    In Proceedings of the 44th annual conference of the IEEE Industrial Electronics Society (IECON),
    2018.

  370. Shieldless eddy-current displacement sensor withimproved measurement sensitivity
    Vogel, Johan G.; Chaturvedi, Vikram; Nihtianov, Stoyan;
    In Proc. XXVII International Scientific Conference Electronics, Sozopol, Bulgaria,
    2018.

  371. A 117DB in-Band CMRR 98.5DB SNR Capacitance-to-Digital Converter for Sub-NM Displacement Sensing with an Electrically Floating Target
    H. Jiang; S. Amani; J. G. Vogel; S. H. Shalmany; S. Nihtianov;
    In 2018 IEEE Symposium on VLSI Circuits,
    pp. 159-160, June 2018. DOI: 10.1109/VLSIC.2018.8502363
    Keywords: ... analogue-digital conversion;CMOS integrated circuits;displacement measurement;nanosensors;high-performance capacitance-to-digital converter;in-band common-mode rejection ratio;decent electric field interference immunity;displacement sensor probe;CDC;electrically floating target;sub-nm displacement sensing;power 560.0 muW;time 1.0 ms;frequency 1.0 kHz;Sensors;Electrodes;Interference;Energy efficiency;Electric fields;Capacitors;Signal to noise ratio.

  372. A 6800‐μm2 Resistor‐Based Temperature Sensor in 180‐nm CMOS
    Jan Angevare; Kofi A. A. Makinwa;
    In Proc. IEEE Asian Solid-State Circuits Conference (ASSCC),
    11 2018. DOI: 10.1109/ASSCC.2018.8579332

  373. CMOS-Compatible Carbon Dioxide Sensors
    Z. Cai; R. van Veldhoven; H. Suy; G. de Graaf; K. A. A. Makinwa; M. Pertijs;
    In Proc. Workshop on Advances in Analog Circuit Design (AACD),
    pp. 68-91, April 2018. invited paper. DOI: 10.1007/978-3-319-97870-3
    document

  374. A Compact Energy Efficient CMOS Permittivity Sensor Based on Multi-Harmonic Downconversion and Tunable Impedance Bridge
    G. Vlachogiannakis; Z. Hu; H. T. Shivamurthy; A. Neto; M. A. P. Pertijs; L. C. N. de Vreede; M. Spirito;
    In Int. Microwave Biomedical Conference (IMBioC),
    pp. 1--3, June 2018. DOI: 10.1109/IMBIOC.2018.8428950
    Abstract: ... This paper presents a 0.15×0.3 mm2 complex permittivity sensor integrated in a 40-nm CMOS node. A single-ended patch, employed as a near-field sensing element, is integrated with a double-balanced, fully-differential tunable impedance bridge that is driven by a square RF pulse. The multi-harmonic, intermediate-frequency down-conversion architecture achieves a compact form factor and fast multi-frequency readout. Measurement results show good agreement with theoretical values and the measured relative permittivity variation remains below 0.3 over a 0.1-10 GHz range at a 1-ms measurement time. The energy efficiency resulting from the fast measurement time and the record-small active area allows integration in battery-operated wearables.

  375. Feasibility of ultrasound flow measurements via non-linear wave propagation
    J. Massaad; P. L. M. J. van Neer; D. M. van Willigen; N. de Jong; M. A. P. Pertijs; M. D. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2018. DOI: 10.1109/ULTSYM.2018.8579943
    Abstract: ... Typically, ultrasonic flow meters assume linear wave propagation. Nevertheless, if the transducers of an ultrasonic flow sensor excite a pressure wave with a high amplitude, nonlinear wave propagation effects become significant. The appearance of higher harmonics increases the bandwidth of the received signal, which may potentially lead to a more precise flow measurement. However, the question arises whether the increased bandwidth can be used in practice, since the intensity of the 2nd harmonic can be 25 dB below the fundamental. One exploit of the increased bandwidth is to filter the received signals and to obtain two components: the fundamental and the 2nd harmonic. Differences between the upstream and downstream transit times are directly related to the flow speed, and these can be computed for each component of the received signals. This paper shows that averaging the transit time differences of the fundamental signals and the 2nd harmonic signals results in a lower standard deviation compared to the standard deviation of the transit time differences of the fundamental or the 2nd harmonic signal alone. This demonstrates the feasibility of using non-linear wave propagation to improve the precision of flow measurements using ultrasound.

  376. Minimizing the zero-flow error in transit time ultrasonic flow meters
    D. van Willigen; P. van Neer; J. Massaad; N. de Jong; M. Verweij; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2018. DOI: 10.1109/ULTSYM.2018.8579771
    Abstract: ... Transit-time ultrasonic flow meters are based on the fundamental idea that the flow is the only non-reciprocal effect between an upstream and downstream measurement. Non-identical transducers can be used in a reciprocal manner if the circuit is made reciprocal. In this paper we analyze the effect of driver- and readout electronics on the zero-flow error in transit-time ultrasonic flow meters by simulation and measurement. Using the frequency characteristic of two nonidentical transducers, the cause of the zero-flow error in nonreciprocal circuits is evaluated. Both simulation and measurement results show that the lowest zero-flow error can be obtained by using circuits that have an impedance significantly higher or lower than the impedance of the transducers.

  377. A quantitative study on the impact of bit errors on image quality in ultrasound probes with in-probe digitization
    Z. Chen; M. Soozande; H. J. Vos; J. G. Bosch; M. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, October 2018. (abstract).
    Abstract: ... Integrating ultrasound transducers with ASICs which digitize and multiplex the received echo signals effectively mitigates the burden of signal transmission for 3-D catheter-based or endoscopic probes. Multiplexing the echo signals from multiple elements onto a cable reduces the cable count, but requires a higher data rate per cable, which typically involves a trade-off between power consumption and bit-error rate (BER). Understanding the impact of finite BER on the resulting image quality is a necessity to optimize the cable count and power consumption. In this work, this impact is quantitatively assessed using Matlab simulations. The effectiveness of error correction is also investigated.

  378. Virtually Extended Array imaging improves lateral resolution in high frame rate volumetric imaging
    M. Soozande; F. Fool; M. Shabanimotlagh; M. Pertijs; M. Verweij; H. J. Vos; J. G. Bosch; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2018. DOI: 10.1109/ULTSYM.2018.8580018
    Abstract: ... Matrix arrays for endoscopic and catheter-based applications are restricted to small physical apertures, which limits their lateral resolution. In addition, when aiming for high volume rate imaging and utilizing the recent methods of transmitting a single or few diverging waves (DW), lateral resolution further deteriorates. In this work, we propose a high frame rate transmission scheme which outperforms alternative methods in lateral resolution. To improve the lateral resolution and side-lobe level, we propose to transmit only on a sub-aperture on either side of the array and apply a specific weighting function to received data. Compared to single-DW imaging, the proposed Sub-aperture Virtually Extended Array reduces the PSF width and sidelobe level by 16% and 5dB respectively and provides a similar SNR at the cost of halving the frame rate.

  379. Capacitively-coupled Chopper Instrumentation Amplifiers: An Overview
    Fan, Qinwen; Makinwa, Kofi;
    In 2018 IEEE SENSORS,
    pp. 1-4, 2018. DOI: 10.1109/ICSENS.2018.8589958

  380. A 6800‐μm2 Resistor‐Based Temperature Sensor in 180‐nm CMOS
    Jan Angevare; Kofi A. A. Makinwa;
    In Proc. IEEE Asian Solid-State Circuits Conference (ASSCC),
    pp. 43-46, 11 2018. DOI: 10.1109/ASSCC.2018.8579332

  381. A 15nW Per Button Noise-Immune Readout IC for Capacitive Touch Sensor
    S. Hussaini; H. Jiang; P. Walsh; D. MacSweeney; K.A.A. Makinwa;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    pp. 190-193, 2018. DOI: 10.1109/ESSCIRC.2018.8494283

  382. Energy-efficient bridge-to-digital converters
    H. Jiang; K.A.A. Makinwa;
    In Proc. IEEE Custom Integrated Circuits Conference (CICC),
    pp. 1-7, 4 2018. DOI: 10.1109/CICC.2018.8357027

  383. A CMOS Dual-RC frequency reference with±250ppm inaccuracy from− 45° C to 85° C
    C. Gürleyük; L. Pedala; F. Sebastiano; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 54-56, 2 2018. DOI: 10.1109/ISSCC.2018.8310180

  384. A quiet digitally assisted auto-zero-stabilized voltage buffer with 0.6 pA input current and offset
    T. Rooijers; J.H. Huijsing; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 50-52, 2 2018. DOI: 10.1109/ISSCC.2018.8310178

  385. A 280μW dynamic-zoom ADC with 120dB DR and 118dB SNDR in 1kHz BWA 280μW dynamic-zoom ADC with 120dB DR and 118dB SNDR in 1kHz BW
    S. Karmakar; B. Gònen; F. Sebastiano; R. van Veldhoven; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 238-240, 2 2018. DOI: 10.1109/ISSCC.2018.8310272

  386. A Phase-Domain Readout Circuit for a CMOS Compatible Thermal-Conductivity-Based Carbon Dioxide Sensor
    Z. Cai; R. van Veldhoven; H. Suy; G. de Graaf; K. A. A. Makinwa; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 332-333, February 2018. DOI: 10.1109/ISSCC.2018.8310319

  387. A ±4A high-side current sensor with 25V input CM range and 0.9% gain error from −40° C to 85° C using an analog temperature compensation technique
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 324-326, 2 2018. DOI: 10.1109/ISSCC.2018.8310315

  388. A 0.53pJK2 7000μm2 resistor-based temperature sensor with an inaccuracy of ±0.35°C (3σ) in 65nm CMOS
    W. Choi; Y.T. Lee; S. Kim; S. Lee; J. Jang; J. Chun; K.A.A. Makinwa; Y. Chae;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 322-324, 2 2018. DOI: 10.1109/ISSCC.2018.8310314

  389. A 0.25mm2 resistor-based temperature sensor with an inaccuracy of 0.12°C (3σ) from −55°C to 125°C and a resolution FOM of 32fJK2
    S. Pan; K.A.A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 320 - 322, 2 2018. DOI: 10.1109/ISSCC.2018.8310313

  390. Data collection system, in particular suitable for imaging of a distant object
    D. M. van Willigen; M. A. P. Pertijs;
    Patent, Dutch NL2020426B1, February 2018.

  391. Heater-assisted voltage calibration of digital temperature sensors
    B. Yousefzadeh; K. Souri; K. A. A. Makinwa;
    Patent, US15422687, 2018.

  392. Delta modulator receive channel for capacitance measurement circuits
    R. R. Bacchu; K. Hosseini; D. MacSweeney; P. M. Walsh; K. A. A. Makinwa;
    Patent, US9923572, 2018.

  393. Front-End ASICs for 3-D Ultrasound: From Beamforming to Digitization
    Chao Chen;
    PhD thesis, Delft University of Technology, April 2018.

  394. A 7μW Offset-and Temperature-Compensated pH-to-Digital Converter
    S. H. Shalmany; M. Merz; A. Fekri; Z. Y. Chang; R. J. O. M. Hoofman; M. A. P. Pertijs;
    Journal of Sensors,
    Volume 2017, Issue 6158689, January 2017. DOI: 10.1155/2017/6158689
    Abstract: ... This paper demonstrates a micropower offset- and temperature-compensated smart pH sensor, intended for use in battery-powered RFID systems that monitor the quality of perishable products. Low operation power is essential in such systems to enable autonomous logging of environmental parameters, such as the pH level, over extended periods of time using only a small, low-cost battery. The pH-sensing element in this work is an ion-sensitive extended-gate field-effect transistor (EGFET), which is incorporated in a low-power sensor front-end. The front-end outputs a pH-dependent voltage, which is then digitized by means of a co-integrated incremental delta-sigma ADC. To compensate for the offset and temperature cross-sensitivity of the EGFET, a compensation scheme using a calibration process and a temperature sensor has been devised. A prototype chip has been realized in a 0.16 μm CMOS process. It occupies 0.35 × 3.9 mm2 of die area and draws only 4 μA from a 1.8 V supply. Two different types of custom packaging have been used for measurement purposes. The pH sensor achieves a linearity of better than ±0.1 for pH values ranging from 4 to 10. The calibration and compensation scheme reduces errors due to temperature cross-sensitivity to less than ±0.1 in the temperature range of 6°C to 25°C.

  395. Analysis and Design of VCO-Based Phase-Domain ΣΔ Modulators
    U. Sonmez; F. Sebastiano; K. Makinwa;
    IEEE Transactions on Circuits and Systems I,
    Volume 64, pp. 1075-1084, 5 2017. DOI: 10.1109/TCSI.2016.2638827

  396. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
    S. Sachdeva; M.R. Venkatesh; B.E. Mansouri; J. Wei; A. Bossche; F. Kapteijn; G.Q. Zhang; J. Gascon; L.C.P.M. de Smet; E.J.R. Sudhölter;
    Small,
    Volume 13, Issue 29, 08 2017. DOI: 10.1002/smll.201604150
    Abstract: ... The in situ electrochemical growth of Cu benzene-1,3,5-tricarboxylate (CuBTC) metal-organic frameworks, as an affinity layer, directly on custom-fabricated Cu interdigitated electrodes (IDEs) is described, acting as a transducer. Crystalline 5-7 µm thick CuBTC layers are grown on IDEs consisting of 100 electrodes with a width and a gap of both 50 µm and a height of 6-8 µm. These capacitive sensors are exposed to methanol and water vapor at 30 °C. The affinities show to be completely reversible with higher affinity toward water compared to methanol. For exposure to 1000 ppm methanol, a fast response is observed with a capacitance change of 5.57 pF at equilibrium. The capacitance increases in time followed diffusion-controlled kinetics (k = 2.9 mmol s-0.5 g-1CuBTC ). The observed capacitance change with methanol concentration follows a Langmuir adsorption isotherm, with a value for the equilibrium affinity Ke = 174.8 bar-1 . A volume fraction fMeOH = 0.038 is occupied upon exposure to 1000 ppm of methanol. The thin CuBTC affinity layer on the Cu-IDEs shows fast, reversible, and sensitive responses to methanol and water vapor, enabling quantitative detection in the range of 100-8000 ppm.

  397. Eddy-Current Sensing Principle in Inertial Sensors
    J. G. Vogel; V. Chaturvedi; S. Nihtianov;
    IEEE Sensors Letters,
    Volume 1, Issue 5, pp. 1-4, 2017. DOI: 10.1109/LSENS.2017.2737940
    Keywords: ... Eddy-current sensing;high-resolution;inertial sensor;thermal sensitivity.

    Abstract: ... The eddy-current displacement sensing principle is, to the best of our knowledge, not yet used in inertial sensors. The main reasons for this are the important performance limitations of the existing eddy-current sensor solutions, such as: low sensitivity, poor stability, high power consumption and bulkiness. Our novel high-frequency Eddy-Current Displacement Sensor (ECDS), however, has significantly improved performance with respect to these limitations and allows the use of planar, stable coils, making it a viable candidate for use in inertial sensors. An implementation example of an ECDS-based inertial sensor with a bandwidth of 370 Hz and a noise floor of 13 um/Hz^0.5 is proposed. Although not yet competitive with state-of-the-art inertial sensors, it performs better than other types of inductive accelerometers and offers the inherent advantages of ECDSs, such as insensitivity to the environment.

  398. Compact Thermal-Diffusivity-Based Temperature Sensors in 40-nm CMOS for SoC Thermal Monitoring
    U. Sonmez; F. Sebastiano; K. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 3, pp. 834-843, March 2017. DOI: 10.1109/jssc.2016.2646798

  399. Quantum information density scaling and qubit operation time constraints of CMOS silicon-based quantum computer architectures
    Davide Rotta; Fabio Sebastiano; Edoardo Charbon; Enrico Prati;
    npj Quantum Information,
    Volume 3, Issue 1, pp. 26, 2017. DOI: 10.1038/s41534-017-0023-5
    Abstract: ... Even the quantum simulation of an apparently simple molecule such as Fe2S2 requires a considerable number of qubits of the order of 106, while more complex molecules such as alanine (C3H7NO2) require about a hundred times more. In order to assess such a multimillion scale of identical qubits and control lines, the silicon platform seems to be one of the most indicated routes as it naturally provides, together with qubit functionalities, the capability of nanometric, serial, and industrial-quality fabrication. The scaling trend of microelectronic devices predicting that computing power would double every 2 years, known as Moore�s law, according to the new slope set after the 32-nm node of 2009, suggests that the technology roadmap will achieve the 3-nm manufacturability limit proposed by Kelly around 2020. Today, circuital quantum information processing architectures are predicted to take advantage from the scalability ensured by silicon technology. However, the maximum amount of quantum information per unit surface that can be stored in silicon-based qubits and the consequent space constraints on qubit operations have never been addressed so far. This represents one of the key parameters toward the implementation of quantum error correction for fault-tolerant quantum information processing and its dependence on the features of the technology node. The maximum quantum information per unit surface virtually storable and controllable in the compact exchange-only silicon double quantum dot qubit architecture is expressed as a function of the complementary metal�oxide�semiconductor technology node, so the size scale optimizing both physical qubit operation time and quantum error correction requirements is assessed by reviewing the physical and technological constraints. According to the requirements imposed by the quantum error correction method and the constraints given by the typical strength of the exchange coupling, we determine the workable operation frequency range of a silicon complementary metal�oxide�semiconductor quantum processor to be within 1 and 100?GHz. Such constraint limits the feasibility of fault-tolerant quantum information processing with complementary metal�oxide�semiconductor technology only to the most advanced nodes. The compatibility with classical complementary metal�oxide�semiconductor control circuitry is discussed, focusing on the cryogenic complementary metal�oxide�semiconductor operation required to bring the classical controller as close as possible to the quantum processor and to enable interfacing thousands of qubits on the same chip via time-division, frequency-division, and space-division multiplexing. The operation time range prospected for cryogenic control electronics is found to be compatible with the operation time expected for qubits. By combining the forecast of the development of scaled technology nodes with operation time and classical circuitry constraints, we derive a maximum quantum information density for logical qubits of 2.8 and 4?Mqb/cm2 for the 10 and 7-nm technology nodes, respectively, for the Steane code. The density is one and two orders of magnitude less for surface codes and for concatenated codes, respectively. Such values provide a benchmark for the development of fault-tolerant quantum algorithms by circuital quantum information based on silicon platforms and a guideline for other technologies in general.

    document

  400. A reconfigurable cryogenic platform for the classical control of quantum processors
    Harald Homulle; Stefan Visser; Bishnu Patra; Giorgio Ferrari; Enrico Prati; Fabio Sebastiano; Edoardo Charbon; Enrico Prati;
    Review of Scientific Instruments,
    Volume 88, Issue 4, pp. 045103, 2017. DOI: 10.1063/1.4979611
    Abstract: ... The implementation of a classical control infrastructure for large-scale quantum computers is challenging due to the need for integration and processing time, which is constrained by coherence time. We propose a cryogenic reconfigurable platform as the heart of the control infrastructure implementing the digital error-correction control loop. The platform is implemented on a field-programmable gate array (FPGA) that supports the functionality required by several qubit technologies and that can operate close to the physical qubits over a temperature range from 4 K to 300 K. This work focuses on the extensive characterization of the electronic platform over this temperature range. All major FPGA building blocks (such as look-up tables (LUTs), carry chains (CARRY4), mixed-mode clock manager (MMCM), phase-locked loop (PLL), block random access memory, and IDELAY2 (programmable delay element)) operate correctly and the logic speed is very stable. The logic speed of LUTs and CARRY4 changes less then 5%, whereas the jitter of MMCM and PLL clock managers is reduced by 20%. The stability is finally demonstrated by operating an integrated 1.2 GSa/s analog-to-digital converter (ADC) with a relatively stable performance over temperature. The ADCs effective number of bits drops from 6 to 4.5 bits when operating at 15 K.} url={https://doi.org/10.1063/1.4979611

  401. A Hybrid Multi-Path CMOS Magnetic Sensor with 76 ppm/˚C Sensitivity Drift and Discrete-Time Ripple Reduction Loops
    J. Jiang; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, pp. 1876 - 1884, 7 2017. DOI: 10.1109/jssc.2017.2685462

  402. Active Electrodes for Wearable EEG Acquisition: Review and Design Methodology
    J. Xu; S. Mitra; C. Van Hoof; R. Yazicioglu; K.A.A Makinwa;
    IEEE Reviews in Biomedical Engineering,
    Volume PP, pp. 1-1, 2017. DOI: 10.1109/RBME.2017.2656388

  403. A Dynamic Zoom ADC with 109-dB DR for Audio Applications
    B. Gonen; F. Sebastiano; K. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, pp. 1542-1550, 6 2017. DOI: 10.1109/jssc.2017.2669022

  404. A BJT-based Temperature-to-Digital Converter with ±60mK (3σ) Inaccuracy from −55°C to +125°C in 0.16μm Standard CMOS
    B. Yousefzadeh; S.H. Shalmany; K. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 1044-1052, 4 2017. DOI: 10.1109/JSSC.2016.2638464

  405. A Low-Power Microcontroller in a 40-nm CMOS Using Charge Recycling
    K. Blutman; A. Kapoor; A. Majumdar; J.G. Martinez; L. Sevat; A.P. van der Wel; H. Fatemi; K.A.A. Makinwa; J.P. de Gyvez;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 950-960, 1 2017. DOI: 10.1109/jssc.2016.2637003

  406. A ±36A Integrated Current-Sensing System with 0.3% Gain Error and 400μA Offset from −55°C to +85°C
    S.H. Shalmany; D. Draxelmayr; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 1034-1043, 4 2017. DOI: 10.1109/JSSC.2016.2639535

  407. An accurate BJT-based CMOS temperature sensor with Duty-Cycle-Modulated output
    G. Wang; A. Heidari; K.A.A. Makinwa; G.C.M. Meijer;
    IEEE Transactions on Industrial Electronics,
    Volume 64, 2 2017. DOI: 10.1109/tie.2016.2614273

  408. Multipath Wide-Bandwidth CMOS Magnetic Sensors
    J. Jiang; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, pp. 198-209, 1 2017. DOI: 10.1109/jssc.2016.2619711

  409. Multi-domain spectroscopy for composition measurement of water-containing bio-ethanol fuel
    L.M. Middelburg; G. de Graaf; A. Bossche; J. Bastemeijer; M. Ghaderi; F.S. Wolffenbuttel; J. Visser; R. Soltis; R.F. Wolffenbuttel;
    Fuel Processing Technology,
    Volume 167, pp. 127-135, 2017. DOI: 10.1016/j.fuproc.2017.06.007
    Abstract: ... Measuring the ethanol/water ratio in biofuel of high ethanol content, such as E85, is important when used in a flex-fuel engine. A capacitive probe is generally used for measuring the ethanol/gasoline ratio. However, the water content in E85 biofuel cannot be disregarded or considered constant and full composition measurement of biofuel is required. Electric impedance spectroscopy with a customized coaxial probe operating in the 10 kHz to 1 MHz frequency range was investigated. An in-depth investigation of the electrical impedance domain has led to the conclusion that additional information is required to unambiguously determine the composition of the ternary biofuel mixture. Among the different options of measurement domains and techniques, optical absorption spectroscopy in the UV spectral range between 230 and 300 nm was found to be the most appropriate. The typical absorbance in the UV range is highly dominated by gasoline, while ethanol and water are almost transparent. This approach is experimentally validated using actual fuels.

  410. A Front-end ASIC with Receive Sub-Array Beamforming Integrated with a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography
    C. Chen; Z. Chen; D. Bera; S. B. Raghunathan; M. Shabanimotlagh; E. Noothout; Z. Y. Chang; J. Ponte; C. Prins; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 994‒1006, April 2017. DOI: 10.1109/JSSC.2016.2638433
    Abstract: ... This paper presents a power- and area-efficient front-end application-specific integrated circuit (ASIC) that is directly integrated with an array of 32 × 32 piezoelectric transducer elements to enable next-generation miniature ultrasound probes for real-time 3-D transesophageal echocardiography. The 6.1 × 6.1 mm2 ASIC, implemented in a low-voltage 0.18-μm CMOS process, effectively reduces the number of receive (RX) cables required in the probe's narrow shaft by ninefold with the aid of 96 delay-and-sum beamformers, each of which locally combines the signals received by a sub-array of 3 × 3 elements. These beamformers are based on pipeline-operated analog sample-and-hold stages and employ a mismatch-scrambling technique to prevent the ripple signal associated with the mismatch between these stages from limiting the dynamic range. In addition, an ultralow-power low-noise amplifier architecture is proposed to increase the power efficiency of the RX circuitry. The ASIC has a compact element matched layout and consumes only 0.27 mW/channel while receiving, which is lower than the state-of-the-art circuit. Its functionality has been successfully demonstrated in 3-D imaging experiments.

  411. A Precision Capacitance-to-Digital Converter with 16.7-bit ENOB and 7.5 ppm/°C Thermal Drift
    R. Yang; M. A. P. Pertijs; S. Nihtianov;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 11, pp. 3018-3031, November 2017. DOI: 10.1109/jssc.2017.2734900
    Abstract: ... This paper presents a high-precision capacitance-to-digital converter (CDC) for displacement measurement in advanced industrial applications, based on a charge-balancing third-order delta–sigma modulator. To achieve high precision, this CDC employs a precision external resistive reference and a quartz-oscillator-based time reference instead of a reference capacitor. To minimize the error contribution of the CDC circuitry, various precision circuit techniques, such as chopping and auto-zeroing, are applied at both system and circuit level. Measurement results of the prototype realized in 0.35-μm CMOS technology show that the CDC achieves an rms resolution of 42 aF across a capacitance range from 6 to 22 pF, corresponding to an effective number of bits (ENOB) of 16.7 bit. The conversion time for one measurement is 10.5 ms, during which the CDC consumes 230 μA from a 3.3-V single supply. The measured thermal stability is within ±7.5 ppm/°C across a temperature range from 20 °C to 70 °C, which represents a significant improvement compared to the state of the art. After a two-point calibration, all ten measured samples from one batch show absolute accuracy below ±25 fF across the entire capacitance measurement range.

  412. A doping-less junction-formation mechanism between n-silicon and an atomically thin boron layer
    V. Mohammadi; S. Nihtianov; C. Fang;
    Scientific Reports,
    Volume 7, Issue 1, 2017. cited By 0. DOI: 10.1038/s41598-017-13100-0
    Abstract: ... The interest in nanostructures of silicon and its dopants has significantly increased. We report the creation of an ultimately-shallow junction at the surface of n-type silicon with excellent electrical and optical characteristics made by depositing an atomically thin boron layer at a relatively low temperature where no doping of silicon is expected. The presented experimental results and simulations of the ab initio quantum mechanics molecular dynamics prove that the structure of this new type of junction differs from all other known rectifying junctions at this time. An analysis of the junction formation has led to the conclusion that the chemical interaction between the surface atoms of crystalline silicon and the first atomic layer of the as-deposited amorphous boron is the dominant factor leading to the formation of a depletion zone in the crystalline silicon which originates from the surface. The simulation results show a very strong electric field across the c-Si/a-B interface systems where the charge transfer occurs mainly from the interface Si atoms to the neighboring B atoms. This electric field appears to be responsible for the creation of a depletion zone in the n-silicon resulting in a rectifying junction-formation between the n-silicon and the atomically thin boron layer.

    document

  413. New Trends in Smart Sensors for Industrial Applications - Part I
    S. Nihtianov; Z. Tan; B. George;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 9, pp. 7281-7283, Sept 2017. DOI: 10.1109/TIE.2017.2725558
    Keywords: ... manufacturing systems;sensors;industrial systems;production equipment;sensor performance;smart sensors;Intelligent sensors;Performance evaluation;Sensor arrays;Sensor phenomena and characterization;Smart devices;Special issues and sections;Wireless sensor networks.

    Abstract: ... In modern industry, productivity, quality, reliability, and safety heavily depend on the performance of the sensors employed. They form an interface between the production equipment and the surrounding environment providing feedback based on the results of the executed operations. Thus, sensors can be found in an extremely wide range of applications in industrial systems, in which they play a very important role. The first element in any control and measurement system is the sensor itself. Sensor performance defines the performance of the control/measurement system and that of the industrial system as a whole. It is not possible to distinguish between correct and incorrect information provided by a sensor, unless additional information provided by another sensor is used. This validates the statement: No machine can perform better than its sensors.

  414. New Trends in Smart Sensors for Industrial Applications - Part II
    S. Nihtianov; Z. Tan; B. George;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 12, pp. 9592-9594, Dec 2017. DOI: 10.1109/TIE.2017.2758038
    Keywords: ... Capacitive sensors;Gas detectors;Intelligent sensors;Magnetic sensors;Special issues and sections;Tactile sensors.

    Abstract: ... This Special Section is dedicated to the latest trends in smart sensors for industrial applications. It has in total 26 papers, published in two parts, each consisting of 13 papers. In the Guest Editorial of Part I, published in the September 2017 issue, we validate the indispensable role sensors have in modern industry. Productivity, quality, reliability, and safety heavily depend on the performance of the sensors employed. This is because sensors form an interface between the production equipment and the surrounding environment and provide feedback based on the results of the executed operations. Consequently, sensors can be found in an extremely wide range of applications in industrial systems. Here, we introduce and briefly summarize the remaining 13 papers from this "Special Section on New Trends in Smart Sensors for Industrial Applications" of the IEEE Transactions on Industrial Electronics .

  415. Stability, local structure and electronic properties of borane radicals on the Si(100) 2x1:H surface: A first-principles study
    C.M. Fang; V. Mohammadi; S. Nihtianov; M.H.F. Sluiter;
    Computational Materials Science,
    Volume 140, Issue Supplement C, pp. 253 - 260, 2017. DOI: https://doi.org/10.1016/j.commatsci.2017.08.036
    Keywords: ... Borane deposition, H passivated Si(001) surface, PureB process, Ab initio calculations.

    Abstract: ... Abstract Deposition of a thin B layer via decomposition of B2H6 on Si (PureB process) produces B-Si junctions which exhibit unique electronic and optical properties. Here we present the results of our systematic first-principles study of BHn (n=0-3) radicals on Si(100)2x1:H surfaces, the initial stage of the PureB process. The calculations reveal an unexpectedly high stability of BH2 and BH3 radicals on the surface and a plausible atomic exchange mechanism of surface Si atoms with B atoms from absorbed BHn radicals. The calculations show strong local structural relaxation and reconstructions, as well as strong chemical bonding between the surface Si and the BHn radicals. Electronic structure calculations show various defect states in the energy gap of Si due to the BHn absorption. These results shed light on the initial stages of the complicated PureB process and also rationalize the unusual electronic, optical and electrical properties of the deposited Si surfaces.

    document

  416. Advances in Capacitive, Eddy Current, and Magnetic Displacement Sensors and Corresponding Interfaces
    B. George; Z. Tan; S. Nihtianov;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 12, pp. 9595-9607, Dec 2017. DOI: 10.1109/TIE.2017.2726982
    Keywords: ... capacitance measurement;capacitive sensors;displacement measurement;eddy currents;electric current measurement;inductance measurement;inductive sensors;magnetic field measurement;magnetic sensors;position measurement;absolute displacement measurement;absolute displacement sensors;acceleration measurement;capacitive sensors;eddy current sensors;inductive sensor;inertia measurement;magnetic displacement sensors;micrometer scales;nanometer scales;position measurement;pressure measurement;subnanometer scales;vibration measurement;Capacitance;Capacitive sensors;Capacitors;Eddy currents;Electrodes;Magnetic sensors;Capacitive sensors;displacement;eddy current sensors;magnetic sensors.

    Abstract: ... This paper presents a review of the latest advances in the field of capacitive, inductive (eddy current), and magnetic sensors, for measurement of absolute displacement. The need for accurate displacement and position measurement in the micrometer, nanometer, and subnanometer scales has increased significantly over the last few years. Application examples can be found in high-tech industries, metrology, and space equipment. Besides measuring displacement as a primary quantity, absolute displacement sensors are also used when physical quantities such as pressure, acceleration, vibration, inertia, etc., have to be measured. A better understanding of the commonalities between capacitive, inductive, and magnetic displacement sensors, as well as the main performance differences and limitations, will help one make the best choice for a specific application. This review is based on both theoretical analysis and experimental results. The main performance criteria used are: sensitivity, resolution, compactness, long-term stability, thermal drift, and power efficiency.

  417. A Power-Efficient Readout for Wheatstone-Bridge Sensors With COTS Components
    H. Jiang; J. G. Vogel; S. Nihtianov;
    IEEE Sensors Journal,
    Volume 17, Issue 21, pp. 6986-6994, Nov 2017. DOI: 10.1109/JSEN.2017.2755074
    Keywords: ... bridge circuits;convertors;differential amplifiers;microsensors;operational amplifiers;piezoresistive devices;pressure measurement;pressure sensors;readout electronics;sigma-delta modulation;COTS component;CTΔΣM;MEMS piezoresistive differential pressure sensor;Wheatstone-bridge sensor;direct digital converter;off-the-shelf component;operational amplifier;power 7.58 mW;power 9.55 mW;power-efficient readout;pressure 12.7 mPa;resistance 0.41 mohm;second-order continuous-time sigma-delta modulator;time 0.5 ms;voltage 5 V;Bridge circuits;Clocks;Energy efficiency;Modulation;Radio frequency;Sensors;Topology;Direct digital converter;bridge sensor readout;continuous-time sigma-delta modulator;mPa-level differential pressure sensing.

    Abstract: ... This paper presents a direct digital converter for Wheatstone bridge sensors, which is realized with commercial off-the-shelf components. The power efficiency of the readout is enhanced by embedding the bridge sensor in a second-order continuous-time sigma-delta modulator (CTDeltaSigmaM). By directly digitizing the output signal of a Wheatstone bridge in the current mode, the noise performance is dominated by the operational amplifier in the first integrator and the bridge sensor. To demonstrate the performance of the proposed circuit, an MEMS piezoresistive differential pressure sensor is used. Measurement results show that a resolution of 12.7 mParms (0.41 mOhmrms), with a 0.5-ms conversion time, can be achieved. Powered by 5 V, the circuit and the bridge sensor draw 9.55 and 7.58 mW, respectively.

  418. Functionalizing a Tapered Microcavity as a Gas Cell for On-Chip Mid-Infrared Absorption Spectroscopy
    N. Pelin Ayerden; Julien Mandon; Frans J. M. Harren; Reinoud F. Wolffenbuttel;
    Sensors,
    Volume 17, Issue 9}, ARTICLE NUMBER = {204, 2017. DOI: 10.3390/s17092041
    document

  419. Fabrication Tolerance Sensitivity in Large-Area Mid-Infrared Metamaterial Absorbers
    Mohammadamir Ghaderi; Ehsan Karimi; N. Pelin Ayerden; Reinoud F. Wolffenbuttel;
    Proceedings,
    Volume 1, Issue 4}, ARTICLE NUMBER = {328, 2017. DOI: 10.3390/proceedings1040328
    document

  420. The Miniaturization of an Optical Absorption Spectrometer for Smart Sensing of Natural Gas
    N. P. Ayerden; R. F. Wolffenbuttel;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 12, pp. 9666 - 9674, 2017. DOI: 10.1109/TIE.2017.2719600
    Keywords: ... Absorption;Detectors;Mirrors;Optical device fabrication;Optical resonators;Optical sensors;Sensitivity;Gas sensor;microspectrometer;mid-IR;natural gas;optical absorption spectroscopy.

  421. PDMS Microlenses for Optical Biopsy Microsystems
    J. F. Ribeiro; A. C. Costa; J. M. Gomes; C. G. Costa; S. Goncalves; R. F. Wolffenbuttel; H. Correia;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 12, pp. 9683 - 9690, 2017. DOI: 10.1109/TIE.2017.2716874
    Keywords: ... Biomedical optical imaging;Biopsy;Lenses;Light emitting diodes;Microoptics;Optical device fabrication;Optical imaging;Biomedical imaging;Microlens;Optic microsystem;Optical biopsy;Polydimethylsiloxane (PDMS).

  422. A 0.5e-rms temporal noise CMOS image sensor with Gm-Cell-Based pixel and period-controlled variable conversion gain
    X. Ge; A.J.P. Theuwissen;
    IEEE transactions on electron devices,
    Volume 64, Issue 12, pp. 5019-5026, October 2017. DOI: 10.1109/TED.2017.2759787
    Abstract: ... A deep subelectron temporal noise CMOS image sensor (CIS) with a Gm-cell based pixel and a correlated-double charge-domain sampling technique has been developed for photon-starved imaging applications. With the proposed technique, the CIS, which is implemented in a standard 0.18-µm CIS process, features pixel level amplification and achieves an input-referred noise of 0.5 e−rms with a correlated double sampling period of 5 µs and a row read-out time of 10 µs. The proposed structure also realizes a variable conversion gain (CG) with a period controlled method. This enables the read-out path CG and the noise-equivalent number of electrons to be programmable according to the application without any change in hardware. The experiments show that the measured CG can be tuned from 50 µV/e- to 1.6 mV/e- with a charging period from 100 ns to 4 µs. The measured characteristics of the prototype CIS are in a good agreement with expectations, demonstrating the effectiveness of the proposed techniques.

    document

  423. A CMOS Readout Circuit for Resistive Transducers Based on Algorithmic Resistance and Power Measurement
    Z. Cai; L. Rueda Guerrero; A. Louwerse; H. Suy; R. van Veldhoven; K. Makinwa; M. Pertijs;
    IEEE Sensors Journal,
    Volume 17, Issue 23, pp. 7917-7927, December 2017. DOI: 10.1109/JSEN.2017.2764161
    Abstract: ... This paper reports a readout circuit capable of accurately measuring not only the resistance of a resistive transducer, but also the power dissipated in it, which is a critical parameter in thermal flow sensors or thermal-conductivity sensors. A front-end circuit, integrated in a standard CMOS technology, sets the voltage drop across the transducer, and senses the resulting current via an on-chip reference resistor. The voltages across the transducer and the reference resistor are digitized by a time-multiplexed high-resolution analog-todigital converter (ADC) and post-processed to calculate resistance and power dissipation. To obtain accurate resistance and power readings, a voltage reference and a temperature-compensated reference resistor are required. An accurate voltage reference is constructed algorithmically, without relying on precision analog signal processing, by using the ADC to successively digitize the base–emitter voltages of an on-chip bipolar transistor biased at several different current levels, and then combining the results to obtain the equivalent of a precision curvature-corrected bandgap reference with a temperature coefficient of 18 ppm/°C, which is close to the state-of-the-art. We show that the same ADC readings can be used to determine die temperature, with an absolute inaccuracy of ±0.25 °C (5 samples, min–max) after a 1-point trim. This information is used to compensate for the temperature dependence of the on-chip polysilicon reference resistor, effectively providing a temperature-compensated resistance reference. With this approach, the resistance and power dissipation of a 100 transducer have been measured with an inaccuracy of less than ±0.55 and ±0.8\%, respectively, from −40 °C to 125 °C.

  424. 2017 Index IEEE Transactions on Biomedical Circuits and Systems Vol. 11
    Abarbanel, HDI; Abbott, D; Abdelhalim, K; Adamantidis, A; Ahmad, IL; Ahmad, MR; Ahmadi, A; Akhter, M; Akinin, A; Alharbi, A; others;
    IEEE Transactions on Biomedical Circuits and Systems,
    Volume 11, Issue 6, pp. 1501, 2017.

  425. A CMOS front-end with integrated magnetoresistive sensors for biomolecular recognition detection applications
    Costa, Tiago; Cardoso, Filipe Arroyo; Germano, José; Freitas, Paulo P; Piedade, Mois{\'e}s S;
    IEEE transactions on biomedical circuits and systems,
    Volume 11, Issue 5, pp. 988-1000, 2017.

  426. Lab-on-chip devices: gaining ground losing size
    Romao, Veronica C; Martins, Sofia AM; Germano, Jose; Cardoso, Filipe Arroyo; Cardoso, Susana; Freitas, Paulo P;
    ACS nano,
    Volume 11, Issue 11, pp. 10659-10664, 2017.

  427. A CMOS Readout Circuit for Resistive Transducers Based on Algorithmic Resistance and Power Measurement
    Z. Cai; L. Rueda Guerrero; A. Louwerse; H. Suy; R. van Veldhoven; K. Makinwa; M. Pertijs;
    IEEE Sensors Journal,
    Volume 17, Issue 23, pp. 7917-7927, December 2017. DOI: 10.1109/JSEN.2017.2764161
    Abstract: ... This paper reports a readout circuit capable of accurately measuring not only the resistance of a resistive transducer, but also the power dissipated in it, which is a critical parameter in thermal flow sensors or thermal-conductivity sensors. A front-end circuit, integrated in a standard CMOS technology, sets the voltage drop across the transducer, and senses the resulting current via an on-chip reference resistor. The voltages across the transducer and the reference resistor are digitized by a time-multiplexed high-resolution analog-todigital converter (ADC) and post-processed to calculate resistance and power dissipation. To obtain accurate resistance and power readings, a voltage reference and a temperature-compensated reference resistor are required. An accurate voltage reference is constructed algorithmically, without relying on precision analog signal processing, by using the ADC to successively digitize the base–emitter voltages of an on-chip bipolar transistor biased at several different current levels, and then combining the results to obtain the equivalent of a precision curvature-corrected bandgap reference with a temperature coefficient of 18 ppm/°C, which is close to the state-of-the-art. We show that the same ADC readings can be used to determine die temperature, with an absolute inaccuracy of ±0.25 °C (5 samples, min–max) after a 1-point trim. This information is used to compensate for the temperature dependence of the on-chip polysilicon reference resistor, effectively providing a temperature-compensated resistance reference. With this approach, the resistance and power dissipation of a 100 transducer have been measured with an inaccuracy of less than ±0.55 and ±0.8\%, respectively, from −40 °C to 125 °C.

  428. A Hybrid Multi-Path CMOS Magnetic Sensor with 76 ppm/˚C Sensitivity Drift and Discrete-Time Ripple Reduction Loops
    J. Jiang; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 7, pp. 1876 - 1884, 7 2017. DOI: 10.1109/jssc.2017.2685462

  429. Active Electrodes for Wearable EEG Acquisition: Review and Design Methodology
    J. Xu; S. Mitra; C. Van Hoof; R. Yazicioglu; K.A.A Makinwa;
    IEEE Reviews in Biomedical Engineering,
    Volume PP, pp. 1-1, 2017. DOI: 10.1109/RBME.2017.2656388

  430. A Dynamic Zoom ADC with 109-dB DR for Audio Applications
    B. Gonen; F. Sebastiano; K. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 6, pp. 1542-1550, 6 2017. DOI: 10.1109/jssc.2017.2669022

  431. Analysis and Design of VCO-Based Phase-Domain ΣΔ Modulators
    U. Sonmez; F. Sebastiano; K. Makinwa;
    IEEE Transactions on Circuits and Systems I,
    Volume 64, Issue 5, pp. 1075-1084, 5 2017. DOI: 10.1109/TCSI.2016.2638827

  432. A BJT-based Temperature-to-Digital Converter with ±60mK (3σ) Inaccuracy from −55°C to +125°C in 0.16μm Standard CMOS
    B. Yousefzadeh; S.H. Shalmany; K. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 1044-1052, 4 2017. DOI: 10.1109/JSSC.2016.2638464

  433. A Low-Power Microcontroller in a 40-nm CMOS Using Charge Recycling
    K. Blutman; A. Kapoor; A. Majumdar; J.G. Martinez; L. Sevat; A.P. van der Wel; H. Fatemi; K.A.A. Makinwa; J.P. de Gyvez;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 950-960, 1 2017. DOI: 10.1109/jssc.2016.2637003

  434. A ±36A Integrated Current-Sensing System with 0.3% Gain Error and 400μA Offset from −55°C to +85°C
    S.H. Shalmany; D. Draxelmayr; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 4, pp. 1034-1043, 4 2017. DOI: 10.1109/JSSC.2016.2639535

  435. Compact Thermal-Diffusivity-Based Temperature Sensors in 40-nm CMOS for SoC Thermal Monitoring
    U. Sonmez; F. Sebastiano; K. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 3, pp. 834-843, March 2017. DOI: 10.1109/jssc.2016.2646798

  436. An accurate BJT-based CMOS temperature sensor with Duty-Cycle-Modulated output
    G. Wang; A. Heidari; K.A.A. Makinwa; G.C.M. Meijer;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 2, pp. 1572-1580, 2 2017. DOI: 10.1109/tie.2016.2614273

  437. Multipath Wide-Bandwidth CMOS Magnetic Sensors
    J. Jiang; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 52, Issue 1, pp. 198-209, 1 2017. DOI: 10.1109/jssc.2016.2619711

  438. Hybrid ADCs, Smart Sensors for the IoT, and Sub-1V \& Advanced Node Analog Circuit Design
    P. Harpe; K.A.A. Makinwa; A. Baschirotto;
    Springer, , 2017.

  439. Photon-counting image sensors
    E.R. Fossum; N. Teranishi; A. Theuwissen; D. Stoppa; E. Charbon;
    E.R. Fossum; N. Teranishi; A. Theuwissen; D. Stoppa; E. Charbon (Ed.);
    MDPI, , May 2017. ISBN 978-3-03842-374-4.

  440. Capacitively-coupled chopper amplifiers
    Fan, Qinwen; Makinwa, Kofi AA; Huijsing, Johan H;
    Springer, , 2017.

  441. Analysis and calibration of process variations for an array of temperature sensors
    S. Xie; A. Abarca; J. Markenhof; A. Theuwissen;
    conference, November 2017.
    Abstract: ... This paper presents an analysis and calibration of process variations for an array of temperature sensors, which are incorporated into a CMOS image sensor chip. Making use of the experimental results of more than 500 temperature sensors implemented on the same chip, the proposed calibration method has removed their process variations from 14.3 % to 2.5 % (3 sigma).

  442. Energy-Efficient High-Resolution Resistor-Based Temperature Sensors
    S. Pan; K.A.A. Makinwa;
    Springer, Chapter Hybrid ADCs, Sm, , 2017.

  443. A Hybrid ADC for High Resolution: The Zoom ADC
    B. Gönen; F. Sebastiano; R. van Veldhoven; K.A.A. Makinwa;
    Springer, , 2017.

  444. Acoustic Characterization of a 32 × 32 Element PZT-on-ASIC Matrix Transducer for 3D Transesophageal Echocardiography
    M. Shabanimotlagh; S. Raghunathan; D. Bera; Z. Chen; C. Chen; V. Daeichin; M. Pertijs; J. G. Bosch; N. de Jong; M. Verweij;
    In Dutch Bio-Medical Engineering Conference,
    The Netherlands, 2017.

  445. Optimum Synchronous Phase Detection and its Application in Smart Sensor Interfaces
    S. Pan; K.A.A. Makinwa;
    In IEEE International Symposium on Circuits and Systems (ISCAS),
    June 2017. DOI: 10.1109/iscas.2017.8050417

  446. A BJT-Based Temperature Sensor with a Packaging-Robust Inaccuracy of ±0.3°C (3σ) from -55°C to +125°C After Heater-Assisted Voltage Calibration
    B. Yousefzadeh; K.A.A. Makinwa;
    In IEEE International Solid-State Circuits Conference (ISSCC),
    February 2017. DOI: 10.1109/ISSCC.2017.7870311

  447. A 28 nm 2 GS/s 5-b Low-latency SAR ADC with gm-boosted StrongARM Comparator
    P. Cenci; M. Bolatkale; R. Rutten; G. Lassche; K. Makinwa; L. Breems;
    In European Solid-State Circuits Conference (ESSCIRC),
    2017. DOI: 10.1109/ESSCIRC.2017.8094553

  448. A 0.6 nm resolution 19.8mW eddy-current displacement sensor interface with 126MHz excitation
    V. Chaturvedi; M.R. Nabavi; J.G. Vogel; K.A.A. Makinwa; S. Nihtianov;
    In IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 174-175, 2017. DOI: 10.1109/ISSCC.2017.7870317

  449. Cryogenic CMOS interfaces for quantum devices
    Fabio Sebastiano; Harald A. R. Homulle; Jeroen P. G. van Dijk; Rosario M. Incandela; Bishnu Patra; M. Mehrpoo; Masoud Babaie; Andrei Vladimirescu; Edoardo Charbon;
    In 2017 7th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI),
    Vieste, Italy, pp. 59-62, June 2017. DOI: 10.1109/IWASI.2017.7974215
    Keywords: ... CMOS technology;Computers;Cryogenics;Process control;Quantum computing;Semiconductor device modeling;Standards;CMOS;cryo-CMOS;cryogenics;quantum computing;qubits.

    Abstract: ... Quantum computers could efficiently solve problems that are intractable by today's computers, thus offering the possibility to radically change entire industries and revolutionize our lives. A quantum computer comprises a quantum processor operating at cryogenic temperature and an electronic interface for its control, which is currently implemented at room temperature for the few qubits available today. However, this approach becomes impractical as the number of qubits grows towards the tens of thousands required for complex quantum algorithms with practical applications. We propose an electronic interface for sensing and controlling qubits operating at cryogenic temperature implemented in standard CMOS.

  450. Cryo-CMOS Electronic Control for Scalable Quantum Computing: Invited
    Fabio Sebastiano; Harald Homulle; Bishnu Patra; Rosario Incandela; Jeroen van Dijk; Lin Song; Masoud Babaie; Andrei Vladimirescu; Edoardo Charbon;
    In Proceedings of the 54th Annual Design Automation Conference 2017,
    New York, NY, USA, ACM, pp. 13:1--13:6, 2017. DOI: 10.1145/3061639.3072948
    Keywords: ... Cryo-CMOS, cryogenics, device models, error-correcting loop, quantum computation, qubit.

    document

  451. Nanometer CMOS Characterization and Compact Modeling at Deep-Cryogenic Temperatures
    Rosario M. Incandela, Lin Song, Harald Homulle, Fabio Sebastiano; Edoardo Charbon; Andrei Vladimirescu;
    In Proc. European European Solid-State Device Research Conference,
    Leuven, Belgium, pp. 395-398, September 2017. DOI: 10.1109/ESSCIRC.2014.6942105
    Keywords: ... CMOS integrated circuits;system-on-chip;temperature measurement;temperature sensors;thermal diffusivity;SoC thermal monitoring;area-optimized thermal-diffusivity-based temperature sensor;bulk silicon;microprocessors;size 160 nm;standard CMOS process;systems-on-chip;temperature-dependent thermal diffusivity;thermal monitoring;Accuracy;Heating;System-on-chip;Temperature measurement;Temperature sensors.

    Abstract: ... An array of temperature sensors based on the temperature-dependent thermal diffusivity of bulk silicon has been realized in a standard 160-nm CMOS process. The sensors achieve an inaccuracy of ±2.4 °C (3σ) from -40 to 125 °C with no trimming and ±0.65 °C (3σ) with a one temperature trim. Each sensor occupies 0.008 mm², and achieves a resolution of 0.21 °C (rms) at 1 kSa/s. This combination of accuracy, speed, and small size makes such sensors well suited for thermal monitoring in microprocessors and other systems-on-chip.

  452. Cryo-CMOS circuits and systems for scalable quantum computing
    Edoardo Charbon; Fabio Sebastiano; Masoud Babaie; Andrei Vladimirescu; Mina Shahmohammadi; R. B. Staszewski; Harald A. R. Homulle; Bishnu Patra; Jeroen P. G. van Dijk; Rosario M. Incandela; Lin Song; Bahador Valizadehpasha;
    In 2017 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 264-265, Feb 2017. DOI: 10.1109/ISSCC.2017.7870362
    Keywords: ... CMOS integrated circuits;logic circuits;quantum computing;cryo-CMOS circuits;error-correcting loop;quantum algorithm;quantum bits arrays;quantum coherence loss;qubit states;room-temperature controller;scalable quantum computing;state-of-the-art quantum processors;unprecedented computation power;Cryogenics;Oscillators;Program processors;Quantum computing;Semiconductor device modeling;Substrates;Temperature sensors.

    Abstract: ... In Paper 15.5, Delft University of Technology, EPFL, and Intel present building blocks for a scalable CMOS interface to solid-state quantum processors with a projected efficiency of 200�W/qubit. The circuits include an analog noise-canceled 1.2GHz LNA with 28dB gain, a 6.2GHz class-F local oscillator with better than �145dBc/Hz phase noise at 10MHz offset, a 12µm SPAD with 0.1Hz dark count rate at 2V excess bias, and digital logic, all designed using ad hoc deep-cryogenic models.

  453. A hybrid ADC for high resolution: the Zoom ADC
    Burak Gönen; Fabio Sebastiano; Robert H. M. van Veldhoven Kofi A. A. Makinwa;
    In Proc. Workshop on Advances in Analog Circuit Design (AACD),
    Eindhoven, The Netherlands, March 2017. DOI: 10.1109/IWASI.2017.7974215

  454. An Energy-Efficient Readout Method for Piezoresistive Differential Pressure Sensors
    H. Jiang; K.A.A. Makinwa; S. Nihitanov;
    In Annual Conference of the IEEE Industrial Electronics Society (IES) 2017: 43rd,
    2017.

  455. A 10kHz-BW 93.7dB-SNR Chopped ΔΣ ADC with 30V Input CM Range and 115dB CMRR at 10kHz
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    In 2017 IEEE Asian Solid-State Circuits Conference,
    2017.

  456. Combining impedance spectroscopy with optical absorption spectroscopy in the UV for biofuel composition measurement
    L. Middelburg; M. Ghaderi; A. Bossche; J. Bastemeijer; G. de Graaf; R.F. Wolffenbuttel; R. Soltis; J. Visser;
    In Instrumentation and Measurement Technology Conference (I2MTC), 2017 IEEE International,
    IEEE, IEEE, pp. 1-6, 05 2017. DOI: 10.1109/i2mtc.2017.7969676
    Abstract: ... A capacitive probe is generally used in a flex-fuel engine for measuring the ethanol content in biofuel. However, the water content in biofuel of high ethanol content cannot be disregarded or considered constant and the full composition measurement of ethanol, gasoline and water in biofuel is required. Electrical impedance spectroscopy with a customized capacitive probe operating in the 10 kHz to 1 MHz frequency range is combined with optical absorption spectroscopy in the UV spectral range between 230 and 300 nm for a full composition measurement. This approach is experimentally validated using actual fuels and the results demonstrate that electrical impedance spectroscopy when supplemented with optical impedance spectroscopy can be used to fully determine the composition of the biofuel and applied for a more effective engine management. A concept for a low-cost combined measurement system in the fuel line is presented.

  457. Microstructure for Thermal Impedance Spectroscopy for Biofuel Composition Measurement
    B. Jiang; M. Ghaderi; A. Bossche; J.H. Visser; R.F. Wolffenbuttel;
    In Multidisciplinary Digital Publishing Institute Proceedings,
    pp. 396, 2017. DOI: 10.3390/proceedings1040396
    Abstract: ... Thermal impedance spectroscopy has been investigated as a non-destructive technique to determine the composition of ternary mixtures of biofuels. The principle of the thermal conductivity detector has been extended for measuring both the thermal conductivity and the thermal capacity of biofuel in the range between 1 to 100 Hz, using an AC-operated polysilicon heater for injecting a sinusoidal heat flux, and another polysilicon strip at a well-defined spacing or thermopile sensors for measuring the in-phase and quadrature components of the resulting AC temperature difference.

  458. A Fresnel-inspired approach for steering and focusing a pulsed transmit beam with matrix array transducers
    M. Verweij; M. Pertijs; J. de Wit; F. Fool; H. Vos; N. de Jong;
    In The Journal of the Acoustical Society of America,
    June 2017. DOI: 10.1121/1.4987739
    Abstract: ... Matrix ultrasound transducers for medical diagnostic purposes are commercially available for a decade. A typical matrix transducer contains 1000 + elements, with a trend towards more and smaller elements. This number renders direct connection of each individual element to an ultrasound machine impractical. Consequently, it is cumbersome to employ traditional focusing and beamforming approaches that are based on transmit and receive signals having an individual time delay for each element. To reduce cable count during receive, one approach is to apply sub-arrays that locally combine the element signals using programmable delay-and-sum hardware, resulting in reduction by a factor 10. In transmit, achieving cable count reduction while keeping focusing and steering capabilities turns problematic once it becomes impossible to locally equip each element with its own high voltage pulser. To overcome this bottleneck for decreasing element size, here we present a Fresnel-inspired hardware and beam forming approach that is based on transmit pulses consisting of several periods of an oscillating waveform. These will be derived from one oscillating high voltage signal by using local switching and timing hardware. To demonstrate the feasibilities of our approach, we will show beam profiles and images for a miniature matrix transducer that we are currently developing.

  459. A Front-End ASIC with High-Voltage Transmit Switching and Receive Digitization for Forward-Looking Intravascular Ultrasound
    M. Tan; C. Chen; Z. Chen; J. Janjic; V. Daeichin; Z. Y. Chang; E. Noothout; G. van Soest; M. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE Custom Integrated Circuits Conference (CICC),
    IEEE, pp. 1‒4, April 2017. DOI: 10.1109/cicc.2017.7993708

  460. A 0.6 nm resolution 19.8mW eddy-current displacement sensor interface with 126MHz excitation
    V. Chaturvedi; M.R. Nabavi; J.G. Vogel; K.A.A. Makinwa; S. Nihtianov;
    In IEEE International Solid-State Circuits Conference (ISSCC),
    2017. DOI: 10.1109/ISSCC.2017.7870317

  461. A 12μW NPN-based Temperature Sensor with a 18.4pJ·K2 FOM in 0.18μM BCD CMOS
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    In Proc. Int. Workshop on Advances in Sensors and Interfaces (IWASI),
    June 2017. DOI: 10.1109/iwasi.2017.7974246

  462. A Hybrid ADC for High Resolution: The Zoom ADC
    B. Gönen; F. Sebastiano; R. van Veldhoven; K.A.A. Makinwa;
    In Proc. Advances in Analog Circuit Design Workshop (AACD),
    April 2017. DOI: 10.1007/978-3-319-61285-0_6

  463. Energy-Efficient High-Resolution Resistor-Based Temperature Sensors
    S. Pan; K.A.A. Makinwa;
    In Proc. Advances in Analog Circuit Design Workshop (AACD),
    April 2017. DOI: 10.1007/978-3-319-61285-0_10

  464. A Frequency-Locked Loop Based on an Oxide Electrothermal Filter in Standard CMOS
    L. Pedala; C. Gurleyuk; S. Pan; F. Sebastiano; K. Makinwa;
    In European Solid-State Circuits Conference (ESSCIRC),
    Leuven, Belgium, 9 2017. DOI: 10.1109/esscirc.2017.8094512

  465. A CMOS Temperature Sensor with a 49fJ·K2 Resolution FoM
    S. Pan; H. Jiang; K.A.A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    6 2017. DOI: 10.23919/vlsic.2017.8008557

  466. A Capacitively-Degenerated 100dB Linear 20-150MS/s Dynamic Amplifier
    M. S. Akter; K.A.A. Makinwa; K. Bult;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    6 2017. DOI: 10.23919/vlsic.2017.8008459

  467. An energy-efficient 3.7nV/ sqrtHz bridge-readout IC with a stable bridge offset compensation scheme
    H. Jiang; K. A. A. Makinwa; S. Nihtianov;
    In Proc. IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 172-173, Feb 2017. DOI: 10.1109/ISSCC.2017.7870316

  468. A 9.1 mW inductive displacement-to-digital converter with 1.85 nm resolution
    V. Chaturvedi; J. G. Vogel; K. A. A. Makinwa; S. Nihtianov;
    In 2017 Symposium on VLSI Circuits,
    pp. C80-C81, June 2017. DOI: 10.23919/vlsic.2017.8008556

  469. Next generation CMOS sensors
    K.A.A. Makinwa;
    In Proc. Int. Workshop on Advances in Sensors and Interfaces (IWASI),
    6 2017. DOI: 10.1109/IWASI.2017.7974250

  470. An Energy-Efficient Readout Method for Piezoresistive Differential Pressure Sensors
    H. Jiang; Kofi A. A. Makinwa; S. Nihtianov;
    In Proc. IEEE Industrial Electronics Conference (IECON), Beijing,
    Nov. 2017.

  471. Humidity Sensitivity and Coil Design of a High-Precision Eddy-Current Displacement Sensor
    Johan G. Vogel; Vikram Chaturvedi; Stoyan Nihtianov;
    In Proc. Eurosensors Paris, France,
    2017. DOI: 10.3390/proceedings1040283
    Abstract: ... Unlike capacitive displacement sensors, Eddy-Current Displacement Sensors (ECDSs) possess an inherently low sensitivity to environmental conditions, such as the humidity of the ambient air. By elevating the excitation frequency it is possible to mitigate their major limitations regarding stability and resolution, making them of interest for high-precision displacement sensing. However, by increasing the excitation frequency, ECDSs become less immune to environmental conditions, due to the inevitable parasitic capacitance of the sensing coil. In this work, we formulate a requirement for the minimum Self-Resonance Frequency (SRF) of the coil, based on the specified humidity variation and the allowable displacement error. This requirement provides an input for the design of the high-precision ECDS probe.

    document

  472. Chopping in Continuous-Time Sigma-Delta Modulators
    H. Jiang; B. Gonen; K.A.A. Makinwa; S. Nihtianov;
    In IEEE International Symposium on Circuits and Systems (ISCAS),
    June 2017. DOI: 10.1109/iscas.2017.8050951

  473. A Resistor-Based Temperature Sensor with a 0.13pJ·K2 Resolution FOM
    S. Pan; Y. Luo; S.H. Shalmany; K.A.A. Makinwa;
    In IEEE International Solid-State Circuits Conference (ISSCC),
    February 2017. DOI: 10.1109/jssc.2017.2746671

  474. Fabrication and characterization of MEMS airgap-based optical filters for the UV spectral range
    M. Ghaderi; R. F. Wolffenbuttel;
    In 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    pp. 1959-1962, June 2017. DOI: 10.1109/TRANSDUCERS.2017.7994453
    Keywords: ... micromechanical devices;optical filters;reflectivity;silicon compounds;MEMS airgap-based optical filters;airgap Bragg reflectors;fill-factor;membrane materials;nitride layers;optical characterization;reflectance;silicon oxide layers;silicon technology;spectral reflectance;ultraviolet spectral range;Optical device fabrication;Optical filters;Optical reflection;Optical refraction;Optical variables control;Reflectivity;Airgap optical filters;Distributed Bragg reflector;Optical MEMS;Optical bandwidth;UV filters;UV spectral range.

  475. How accurate is the Fabry-Perot approximation in high-finesse linear variable optical filters for gas absorption spectroscopy?
    N. P. Ayerden; R. F. Wolffenbuttel;
    In 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    pp. 2111-2114, June 2017. DOI: 10.1109/TRANSDUCERS.2017.7994491
    Keywords: ... Fabry-Perot interferometers;cavity resonators;gas sensors;optical filters;Fabry-Perot approximation;Fizeau interferometer;gas absorption spectroscopy;gas-filled linear variable optical filter;high-finesse linear variable optical filters;resonator cavity;wideband interference filter;Absorption;Cavity resonators;Mirrors;Optical filters;Optical interferometry;Optical resonators;Resonator filters;Fabry Perot;Fizeau interferometer;gas sensors;linear variable optical filter;optical absorption spectroscopy.

  476. A photonic microsystem for hydrocarbon gas analysis by mid-infrared absorption spectroscopy
    N. P. Ayerden; J. Mandon; M. Ghaderi; F. J. M. Harren; R. F. Wolffenbuttel;
    In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS),
    pp. 1052-1055, Jan 2017. DOI: 10.1109/MEMSYS.2017.7863593
    Keywords: ... Bragg gratings;gas sensors;infrared spectroscopy;light absorption;light reflection;micromechanical devices;optical filters;absorption path;effective optical absorption path length;functional integration;gas-filled LVOF;high-order filter operation;highly reflective Bragg mirror;hydrocarbon gas analysis;light source;linear variable optical filter;midinfrared absorption spectroscopy;on-chip gas absorption microspectrometer;photonic microsystem;physical path length;single MEMS device;tapered cavity;Absorption;Cavity resonators;Mirrors;Optical filters;Optical reflection;Optical resonators;Resonator filters.

  477. Nanometer CMOS characterization and compact modeling at deep-cryogenic temperatures
    R. M. Incandela; L. Song; H. A. R. Homulle; F. Sebastiano; E. Charbon; A. Vladimirescu;
    In 2017 47th European Solid-State Device Research Conference (ESSDERC),
    pp. 58-61, Sept 2017. DOI: 10.1109/ESSDERC.2017.8066591
    Keywords: ... CMOS integrated circuits;cryogenic electronics;integrated circuit modelling;nanoelectronics;augmented MOS11/PSP model;deep-cryogenic temperatures;nanometer CMOS transistors;size 160.0 nm;standard CMOS technologies;temperature 100.0 mK;temperature 4.0 K;Cryogenics;Current measurement;MOS devices;Performance evaluation;Semiconductor device modeling;Transistors.

  478. Temperature sensors integrated into a CMOS image sensor
    A. Abarca; S. Xie; J. Markenhof; A. Theuwissen;
    In Proceedings of Eurosensors,
    Eurosensors, pp. 358-361, September 2017. DOI: 10.3390/proceedings1040358
    Abstract: ... In this work, a novel approach is presented for measuring relative temperature variations inside the pixel array of a CMOS image sensor itself. This approach can give important information when compensation for dark (current) fixed pattern noise (FPN) is needed. The test image sensor consists of pixels and temperature sensors pixels (=Tixels). The size of the Tixels is 11 μm × 11 μm. Pixels and Tixels are placed next to each other in the active imaging array and use the same readout circuits. The design and the first measurements of the combined image-temperature sensor are presented.

    document

  479. A 0.5e- temporal noise CMOS image sensor with charge-domain CDS and period-controlled variable conversion gain
    X Ge; A Theuwissen;
    In International image sensor workshop,
    pp. 290-293, June 2017.
    Abstract: ... This paper introduces a proof-of-concept low-noise CMOS image sensor (CIS) intended for photon-starved imaging applications. The proposed architecture is based on a charge-sampling pixel featuring in-pixel amplification to reduce its input referred noise. With the proposed technique, the structure realizes a period-controlled variable conversion factor at pixel-level. This enables the conversion factor and the noise-equivalent number of electrons to be tunable according to the application without any change in hardware. The obtained noise performance is comparable to the state-of-the-art low noise CIS, while this work employs a simpler circuit, without suffering from dynamic range limitations. The device is fabricated in a low-cost, standard CIS process.

    document

  480. A highly linear CMOS image sensor with digitally assisted linearity calibration method
    F. Wang; L. Han; A. Theuwissen;
    In International image sensor workshop,
    pp. 336-339, June 2017.
    Abstract: ... A highly linear CMOS image sensor designed in 0.18μm CMOS image sensor (CIS) technology is presented in this paper. A new type of pixel design is adopted to cancel off the nonlinearity of the source follower (SF) and hence enhance the linearity. Furthermore, a digitally assisted calibration method is proposed to improve the linearity of the image sensor. The measurement results show that the new type of pixel can achieve better linearity performance comparing with the typical 4T pixel. With the calibration, the linearity of all types of pixels have been improved.

    document

  481. Linearity analysis of a CMOS image sensor
    F Wang; A Theuwissen;
    In Electronic Imaging,
    Electronic Imaging, Electronic Imaging, 2017. DOI: https://doi.org/10.2352/ISSN.2470-1173.2017.11.IMS
    Abstract: ... In this paper, we analyze the causes of the nonlinearity of a voltage-mode CMOS image sensor, including a theoretical derivation and a numerical simulation. A prototype chip designed in a 0.18 μm 1-poly 4-metal CMOS process technology is implemented to verify this analysis. The pixel array is 160 × 80 with a pitch of 15 μm, and it contains dozens of groups of pixels that have different design parameters. From the measurement results, we confirmed these factors affecting the linearity and can give guidance for a future design to realize a high linearity CMOS image sensor.

    document

  482. An Element-Matched Band-Pass Delta-Sigma ADC for Ultrasound Imaging
    M. D’Urbino; C. Chen; Z. Chen; Z. Y. Chang; J. Ponte; B. Lippe; M. Pertijs;
    In Proc. IEEE Asian Solid State Circuits Conference (A-SSCC),
    IEEE, pp. 137-140, November 2017. winner Student Design Contest. DOI: 10.1109/ASSCC.2017.8240235

  483. A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes
    E. Kang; Q. Ding; M. Shabanimotlagh; P. Kruizinga; Z. Y. Chang; E. Noothout; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 211-214, September 2017.

  484. A compact sensor readout circuit with temperature, capacitance and voltage sensing functionalities
    B. Yousefzadeh; W. Wu; B. Buter; K. Makinwa; M. Pertijs;
    In NXP Low-Power Design Conference,
    NXP, June 2017.
    Abstract: ... This paper presents an area- and energy-efficient sensor readout circuit, which can precisely digitize temperature, capacitance and voltage. The three modes use only on-chip references and employ a shared zoom ADC based on SAR and ΔΣ conversion to save die area. Measurements on 24 samples from a single wafer show a temperature inaccuracy of ±0.2 °C (3σ) over the military temperature range (-55°C to 125°C). The voltage sensing shows an inaccuracy of ±0.5\%. The sensor also offers 18.7-ENOB capacitance-to-digital conversion, which handles up to 3.8 pF capacitance with a 0.76 pJ/conv.-step energy-efficiency FoM. It occupies 0.33 mm² in a 0.16 μm CMOS process and draws 4.6 μA current from a 1.8 V supply.

  485. A Compact Sensor Readout Circuit with Combined Temperature, Capacitance and Voltage Sensing Functionality
    B. Yousefzadeh; W. Wu; B. Buter; K. A. A. Makinwa; M. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1‒2, June 2017. DOI: 10.23919/VLSIC.2017.8008555
    Abstract: ... This paper presents an area- and energy-efficient sensor readout circuit, which can precisely digitize temperature, capacitance and voltage. The three modes use only on-chip references and employ a shared zoom ADC based on SAR and ΔΣ conversion to save die area. Measurements on 24 samples from a single wafer show a temperature inaccuracy of ±0.2 °C (3σ) over the military temperature range (-55°C to 125°C). The voltage sensing shows an inaccuracy of ±0.5\%. The sensor also offers 18.7-ENOB capacitance-to-digital conversion, which handles up to 3.8 pF capacitance with a 0.76 pJ/conv.-step energy-efficiency FoM. It occupies 0.33 mm² in a 0.16 μm CMOS process and draws 4.6 μA current from a 1.8 V supply.

  486. A Front-End ASIC for Miniature 3-D Ultrasound Probes with In-Probe Receive Digitization
    C. Chen; Z. Chen; D. Bera; E. Noothout; Z. Y. Chang; H. Vos; J. Bosch; M. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, September 2017. Winner Best Student Paper Competition. DOI: 10.1109/ULTSYM.2017.8091913
    Abstract: ... This paper presents a front-end application-specific integrated circuit (ASIC) that demonstrates the feasibility of inprobe digitization for next-generation miniature 3-D ultrasound probes with acceptable power- and area-efficiency. The proposed design employs a low-power charge-domain ADC that is directly merged with the sample-and-hold delay lines in each subarray, and high-speed datalinks at the ASIC periphery to realize an additional channel-count reduction compared to prior work based on analog subarray beamforming. The 4.8 × 2 mm 2 ASIC, which has a compact layout element-matched to a 5-MHz 150-μm-pitch PZT matrix transducer, achieves an overall 36-fold channel-count reduction and a state-of-the-art power-efficiency with less than 1 mW/element power dissipation while receiving, which is acceptable even when scaled up to a 1000-element probe. The prototype ASIC has been fabricated in a 0.18 μm CMOS process. Its functionality has been successfully evaluated with both electrical and acoustical measurements.

  487. Forward-Looking IVUS Transducer with Front-End ASIC for 3D Imaging
    J. Janjic; M. Tan; C. Chen; Z. Chen; E. Noothout; Z. Y. Chang; G. van Soest; M. Verweij; A. F. W. van der Steen; M. Pertijs; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-1, September 2017. (abstract).
    Abstract: ... Forward-looking intravascular ultrasound (FL-IVUS) transducers are needed to image complex lesions in the coronary arteries, such as chronic total occlusions (CTOs). To achieve 2D and 3D FL-IVUS imaging, transducer arrays can be integrated at the tip of the catheter. However, connecting the elements is challenging due to the limited space available. In this work, we present a FL-IVUS matrix transducer consisting of 16 transmit and 64 receive elements, which are interfaced with an ASIC that requires only 4 micro-coaxial cables. The transducer performance was characterized by hydrophone measurements and FL imaging of three spherical reflectors.

  488. Volumetric imaging using adult matrix TEE with separated transmit and receive array
    D. Bera; F. van den Adel; N. Radeljic-Jakic; B. Lippe; M. Soozande; M. Pertijs; M. Verweij; P. Kruizinga; V. Daeichin; H. Vos; J. Bosch; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-1, September 2017. (abstract). DOI: 10.1109/ULTSYM.2017.8092906
    Abstract: ... The design of 3D TEE transducers poses severe technical challenges: channel count, electronics integration with high and low voltages, heat dissipation, etc. We present an adult matrix TEE probe with separate transmit (Tx) and receive (Rx) arrays allowing optimization in both Tx and Rx [1]. Tx elements are directly wired out, Rx employs integrated micro-beamformers in low-voltage (1.8/5.0V) chip technology. The prototype is fully integrated into a gastroscopic tube.

  489. Towards 3D ultrasound imaging of the carotid artery using a programmable and tileable matrix array
    P. Kruizinga; E. Kang; M. Shabanimotlagh; Q. Ding; E. Noothout; Z. Y. Chang; H. J. Vos; J. G. Bosch; M. D. Verweij; M. A. P. Pertijs; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-3, September 2017. DOI: 10.1109/ULTSYM.2017.8091570
    Abstract: ... Accurate assessment of carotid artery disease by measuring blood flow, plaque deformation and pulse wave velocity using ultrasound imaging requires 3D information. Additionally, the volume rates should be high enough (> 1 kHz) to capture the full range of these fast transient phenomena. For this purpose, we have built a programmable, tileable matrix array that is capable of providing 3D ultrasound imaging at such volume rates. This array contains an application-specific integrated circuit (ASIC) right beneath the acoustic piezo-stack. The ASIC enables fast programmable switching between various configurations of elements connected to the acquisition system via a number of channels far smaller than the number of transducer elements. This design also allows for expanding the footprint by tiling several of these arrays together into one large array. We explain the working principles and show the first basic imaging results of a 2-by-1 tiled array.

  490. Optimizing the directivity of piezoelectric matrix transducer elements mounted on an ASIC
    M. Shabanimotlagh; S. Raghunathan; V. Daeichin; P. Kruizinga; H. J. Vos; M. A. P. Pertijs; J. G. Bosch; N. de Jong; M. D. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, September 2017. DOI: 10.1109/ULTSYM.2017.8091752
    Abstract: ... Over the last decade, clinical studies show a strong interest in real-time 3D imaging. This calls for ultrasound probes with high-element-count 2D matrix transducer arrays. These may be interfaced to an imaging system using an in-probe Application Specific Integrated Circuit (ASIC) that takes care of signal amplification, element switching, sub-array beamforming, etc. Since the ASIC is made from silicon and is mounted directly behind the transducer elements, it can acoustically be regarded as a rigid plate that can sustain traveling lateral waves. These waves lead to acoustical cross-talk between the elements, and results in extra peaks in the directivity pattern. We propose two solutions to this problem, based on numerical simulations. One approach is to decrease the phase velocity in the silicon by reducing the silicon thickness and absorbing the energy using a proper backing material. Another solution is to disturb the waves inside the silicon plate by sub-dicing the back-side of the ASIC. We conclude that both solutions can be used to improve the directivity pattern.

  491. Ultra-low temperature FOWLP process for the embedding of low thermal budget sensors and components using SU-8 as dielectric
    Pinto, Raquel; Cardoso, Andréand Ribeiro, Sara; Brandão, Carlos; Cardoso, Filipe Arroyo; Antunes, M; Gaspar, J; Gill, R; Fonseca, H; Costa, M;
    In 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
    IEEE, pp. 292-299, 2017.

  492. An energy-efficient readout method for piezoresistive differential pressure sensors
    Jiang, Hui; Makinwa, Kofi A. A.; Nihitanov, Stoyan;
    In IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society,
    pp. 4287-4291, 2017. DOI: 10.1109/IECON.2017.8216736

  493. A resistor-based temperature sensor with a 0.13pJ·K2 resolution FOM
    Pan, Sining; Luo, Yanquan; Shalmany, Saleh Heidary; Makinwa, Kofi A. A.;
    In 2017 IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 158-159, 2017. DOI: 10.1109/ISSCC.2017.7870309

  494. A 10kHz-BW 93.7dB-SNR Chopped ΔΣ ADC with 30V Input CM Range and 115dB CMRR at 10kHz
    L. Xu; J.H. Huijsing; K.A.A. Makinwa;
    In 2017 IEEE Asian Solid-State Circuits Conference,
    pp. 49-52, 2017. DOI: 10.1109/ASSCC.2017.8240213

  495. A 28 nm 2 GS/s 5-b Low-latency SAR ADC with gm-boosted StrongARM Comparator
    P. Cenci; M. Bolatkale; R. Rutten; G. Lassche; K. Makinwa; L. Breems;
    In European Solid-State Circuits Conference (ESSCIRC),
    pp. 171-174, 2017. DOI: 10.1109/ESSCIRC.2017.8094553

  496. A Frequency-Locked Loop Based on an Oxide Electrothermal Filter in Standard CMOS
    L. Pedala; C. Gurleyuk; S. Pan; F. Sebastiano; K. Makinwa;
    In European Solid-State Circuits Conference (ESSCIRC),
    Leuven, Belgium, pp. 7-10, 9 2017. DOI: 10.1109/esscirc.2017.8094512

  497. A Compact Sensor Readout Circuit with Combined Temperature, Capacitance and Voltage Sensing Functionality
    B. Yousefzadeh; W. Wu; B. Buter; K. A. A. Makinwa; M. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1‒2, June 2017. DOI: 10.23919/VLSIC.2017.8008555
    Abstract: ... This paper presents an area- and energy-efficient sensor readout circuit, which can precisely digitize temperature, capacitance and voltage. The three modes use only on-chip references and employ a shared zoom ADC based on SAR and ΔΣ conversion to save die area. Measurements on 24 samples from a single wafer show a temperature inaccuracy of ±0.2 °C (3σ) over the military temperature range (-55°C to 125°C). The voltage sensing shows an inaccuracy of ±0.5\%. The sensor also offers 18.7-ENOB capacitance-to-digital conversion, which handles up to 3.8 pF capacitance with a 0.76 pJ/conv.-step energy-efficiency FoM. It occupies 0.33 mm² in a 0.16 μm CMOS process and draws 4.6 μA current from a 1.8 V supply.

  498. A 9.1 mW inductive displacement-to-digital converter with 1.85 nm resolution
    V. Chaturvedi; J. G. Vogel; K. A. A. Makinwa; S. Nihtianov;
    In 2017 Symposium on VLSI Circuits,
    pp. C80-C81, June 2017. DOI: 10.23919/vlsic.2017.8008556

  499. A Capacitively-Degenerated 100dB Linear 20-150MS/s Dynamic Amplifier
    M. S. Akter; K.A.A. Makinwa; K. Bult;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    pp. C136-C137, 6 2017. DOI: 10.23919/vlsic.2017.8008459

  500. Optimum Synchronous Phase Detection and its Application in Smart Sensor Interfaces
    S. Pan; K.A.A. Makinwa;
    In IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 1-4, June 2017. DOI: 10.1109/iscas.2017.8050417

  501. Chopping in Continuous-Time Sigma-Delta Modulators
    H. Jiang; B. Gonen; K.A.A. Makinwa; S. Nihtianov;
    In IEEE International Symposium on Circuits and Systems (ISCAS),
    pp. 1-4, June 2017. DOI: 10.1109/iscas.2017.8050951

  502. A BJT-Based Temperature Sensor with a Packaging-Robust Inaccuracy of ±0.3°C (3σ) from -55°C to +125°C After Heater-Assisted Voltage Calibration
    B. Yousefzadeh; K.A.A. Makinwa;
    In IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 162-163, February 2017. DOI: 10.1109/ISSCC.2017.7870311

  503. An energy-efficient 3.7nV/ sqrtHz bridge-readout IC with a stable bridge offset compensation scheme
    H. Jiang; K. A. A. Makinwa; S. Nihtianov;
    In Proc. IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 172-173, Feb 2017. DOI: 10.1109/ISSCC.2017.7870316

  504. A Hybrid ADC for High Resolution: The Zoom ADC
    B. Gönen; F. Sebastiano; R. van Veldhoven; K.A.A. Makinwa;
    In Harpe, Pieter; Makinwa, Kofi A. A.; Baschirotto, Andrea (Ed.), Proc. Advances in Analog Circuit Design Workshop (AACD),
    Cham, Springer International Publishing, pp. 99--117, April 2017. DOI: 10.1007/978-3-319-61285-0_6
    Abstract: ... This paper presents a dynamic zoom ADC for audio applications. It achieves 109-dB DR, 106-dB SNR, and 103-dB SNDR in a 20-kHz bandwidth, while dissipating 1.12 mW and occupying only 0.16 mm2 in 0.16-$\mu$m CMOS. This translates to state-of-the-art energy and area efficiency. In this paper, the system- and circuit-level design of the ADC will be presented.

  505. Energy-Efficient High-Resolution Resistor-Based Temperature Sensors
    S. Pan; K.A.A. Makinwa;
    In Harpe, Pieter; Makinwa, Kofi A. A.; Baschirotto, Andrea (Ed.), Proc. Advances in Analog Circuit Design Workshop (AACD),
    Cham, Springer International Publishing, pp. 183--200, April 2017. DOI: 10.1007/978-3-319-61285-0_10
    Abstract: ... This paper presents two high-resolution CMOS temperature sensors intended for the temperature compensation of MEMS/quartz frequency references. One is based on a Wien bridge RC filter, which outputs a temperature-dependent phase shift when driven by a stable frequency; the other is based on a Wheatstone bridge, which outputs a temperature-dependent current. The bridge outputs are digitized by energy-efficient continuous-time delta-sigma modulators. Two prototypes were fabricated in a standard 0.18 $\mu$m CMOS technology. Both dissipate less than 200 $\mu$W and achieve sub-mK resolution, as well as sub-0.2pJ{\textperiodcentered}K2 resolution FoMs, which corresponds to state-of-the-art energy efficiency.

  506. A CMOS Temperature Sensor with a 49fJ·K2 Resolution FoM
    S. Pan; H. Jiang; K.A.A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    pp. C82-C83, 6 2017. DOI: 10.23919/vlsic.2017.8008557

  507. A Capacitive Fingerprint Sensor Front-End Circuit Design
    C. Ligouras;
    MSc thesis, Delft University of Technology, 1 2017.

  508. Voltage Calibration of BJT Based Temperature Sensor
    Y.Yan;
    MSc thesis, Delft University of Technology, 1 2017.

  509. Low-Power Readout IC for a PMUT-based Bladder Scanner
    Weichen Xu;
    MSc thesis, Delft University of Technology, January 2017.
    document

  510. An Element-Level Sigma-Delta ADC for Ultrasound Imaging
    Michele D’Urbino;
    MSc thesis, Delft University of Technology, May 2017.
    document

  511. A Transceiver ASIC for a Single-Cable 64-Element Intra-Vascular Ultrasound Probe
    Douwe {van Willigen};
    MSc thesis, Delft University of Technology, July 2017.
    document

  512. A Low-Power Area-Efficient SAR-Assisted Hybrid ADC for Ultrasound imaging
    Yixin Shi;
    MSc thesis, Delft University of Technology, August 2017.
    document

  513. A High-Resolution Capacitance-to-Digital Converter based on Iterative Discharging
    Hao Fan;
    MSc thesis, Delft University of Technology, October 2017.
    document

  514. CMOS image sensors: Masterpieces of 3D integration
    A Theuwissen;
    Invited talk at Schleswig-Holsteinischen Bildverarbeitungstagen, Germany, June 2017.

  515. Recent developments in CMOS image sensors
    A Theuwissen;
    Invited talk at 2nd EMVA forum, Austria, September 2017.

  516. Monolithic device combining CMOS with magnetoresistive sensors
    Cardoso, Filipe Arroyo; Da Costa, Tiago Miguel Lopes Marta; Germano, José António Henriques; Piedade, Moisés Simões;
    February~14 2017. US Patent 9,567,626.

  517. Ratiometric device
    Z. Cai; M. A. P. Pertijs; R. H. M. van Veldhoven; K. A. A. Makinwa;
    Patent, United States 9,835,575B2, December 2017.

  518. Sensor system with a full bridge configuration of four resistive sensing elements
    Edwin Schapendonk, Piet van der Zee; Fabio Sebastiano; Robert H.M. van Veldhoven;
    Patent, Europe 2955492 B1, May 2017.

  519. Driver for switched-capacitor circuits
    Fabio Sebastiano;
    Patent, united States 9614519 B2, April 2017.

  520. Micro thermal conductivity detector with flow compensation using a dual MEMS device
    G. de Graaf; A.A. Prouza; M. Ghaderi; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical,
    Volume 249, pp. 186-198, 2016.

  521. A miniaturized optical gas-composition sensor with integrated sample chamber
    Ayerden, N. Pelin; Ghaderi, Mohammadamir; Enoksson, Peter; de Graaf, Ger; Wolffenbuttel, Reinoud F.;
    Sensors and Actuators B: Chemical,
    Volume 236, pp. 917-925, 2016.

  522. Thermal annealing of thin PECVD silicon-oxide films for airgap-based optical filters
    M. Ghaderi; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 26, Issue 8, pp. 084009, 2016.

  523. A 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography
    M.J. Maciel; C.G. Costa; M.F. Silva; S.B. Gonçalves; A.C. Peixoto; A.F Ribeiro; R.F. Wolffenbuttel; J.H. Correia;
    Journal of Micromechanics and Microengineering,
    Volume 26, Issue 8, pp. 084001, 2016.

  524. Compact gas cell integrated with a linear variable optical filter
    N.P. Ayerden; G. de Graaf; R.F. Wolffenbuttel;
    Optics Express,
    Volume 24, Issue 3, pp. 2981-3002, 2016.

  525. A wafer-level miniaturized Michelson interferometer on glass substrate for optical coherence tomography applications
    M.J. Maciel; C.G. Costa; M.F. Silva; A.C. Peixoto; R.F. Wolffenbuttel; J.H. Correia;
    Sensors and Actuators A: Physical,
    Volume 242, pp. 210-216, 2016.

  526. Medical apps in need of optical microspectrometers
    R.F. Wolffenbuttel; T.M. Hosli Wolffenbuttel;
    Microsystem Technologies,
    Volume 22, Issue 7, pp. 1549-1555, 2016.

  527. Optical microsystem design and fabrication for medical image magnification
    C.G. Costa; J.M. Gomes; R.F. Wolffenbuttel; J.H. Correia;
    Microsystem Technologies,
    Volume 22, Issue 7, pp. 1747-1755, 2016.

  528. NBI Optical Filters in Minimally Invasive Medical Devices
    M.F. Silva; J.A. Rodrigues; M. Ghaderi; L.M. Goncalves; G. de Graaf; R.F. Wolffenbuttel; J.H. Correia;
    IEEE Journal of Selected Topics in Quantum Electronics,
    Volume 22, Issue 4, pp. 1-7, 2016.

  529. A charge transfer model for CMOS image sensors
    H. Liqiang; S. Yao; A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 63, Issue 1, pp. 32-41, 2016.

  530. A ±5A Integrated Current-Sensing System with ±0.3% Gain Error and 16μA Offset from −55°C to +85°C
    S.H. Shalmany; D. Draxelmayr; K.A.A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 51, Issue 4, pp. 800-808, 2016. DOI: 10.1109/JSSC.2015.2511168

  531. A thin-film silicon/silicon hetero-junction hybrid solar cell for photoelectrochemical water-reduction applications
    R.A. Vasudevan; Z. Thanawala; L. Han; T. Buijse; D. Deligiannis; P. Perez Rodriguez; I.A. Digdaya; W.A. Smith; M. Zeman; A.H.M. Smets;
    Solar Energy Materials \& Solar Cells,
    Volume 150, Issue June, pp. 82-87, 2016.

  532. Lateral gas phase diffusion length of boron atoms over Si/B surfaces during CVD of pure boron layers
    V. Mohammadi; S. Nihtianov;
    AIP Advances,
    Volume 6, Issue 2, pp. 025103, 2016.
    document

  533. Introduction to the special issue on solid-state sensors
    A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 63, Issue 1, pp. 5-9, 2016.

  534. A potential-based characterization of the transfer gate in CMOS image sensors
    Y. Xu; X. Ge; A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 63, Issue 1, pp. 42-48, 2016.

  535. A VCO Based Highly Digital Temperature Sensor With 0.034°C/mV Supply Sensitivity
    T. Anand; K.A.A. Makinwa; P.K. Hanumolu;
    IEEE Journal of Solid-State Circuits,
    Volume 51, Issue 11, pp. 2651-2663, 2016. DOI: 10.1109/jssc.2016.2598765

  536. Tunable single hole regime of a silicon field effect transistor in standard CMOS technolog
    Marco Turchetti; Harald Homulle; Fabio Sebastiano; Giorgio Ferrari; Edoardo Charbon; Enrico Prati;
    Applied Physics Express,
    Volume 9, Issue 1, pp. 014001, 2016. DOI: 10.7567/APEX.9.014001
    Abstract: ... The electrical properties of a Single Hole Field Effect Transistor (SH-FET) based on CMOS technology are analyzed in a cryogenic environment. Few electron?hole Coulomb diamonds are observed using quantum transport spectroscopy measurements, down to the limit of single hole transport. Controlling the hole filling of the SH-FET is made possible by biasing the top gate, while the bulk contact is employed as a back gate that tunes the hole state coupling with the contacts and their distance from the interface. We compare the cryogenic Coulomb blockade regime with the room temperature regime, where the device operation is similar to that of a standard p-MOSFET.

    document

  537. A Broadband Polyvinylidene Difluoride-Based Hydrophone with Integrated Readout Circuit for Intravascular Photoacoustic Imaging
    V. Daeichin; C. Chen; Q. Ding; M. Wu; R. Beurskens; G. Springeling; E. Noothout; M. D. Verweij; K. W. A. van Dongen; J. G. Bosch; A. F. W. van der Steen; N. de Jong; M. Pertijs; G. van Soest;
    Ultrasound in Medicine \& Biology,
    Volume 42, Issue 5, pp. 1239‒1243, May 2016. DOI: 10.1016/j.ultrasmedbio.2015.12.016
    Abstract: ... Intravascular photoacoustic (IVPA) imaging can visualize the coronary atherosclerotic plaque composition on the basis of the optical absorption contrast. Most of the photoacoustic (PA) energy of human coronary plaque lipids was found to lie in the frequency band between 2 and 15 MHz requiring a very broadband transducer, especially if a combination with intravascular ultrasound is desired. We have developed a broadband polyvinylidene difluoride (PVDF) transducer (0.6 × 0.6 mm, 52 μm thick) with integrated electronics to match the low capacitance of such a small polyvinylidene difluoride element (<5 pF/mm2) with the high capacitive load of the long cable (∼100 pF/m). The new readout circuit provides an output voltage with a sensitivity of about 3.8 μV/Pa at 2.25 MHz. Its response is flat within 10 dB in the range 2 to 15 MHz. The root mean square (rms) output noise level is 259 μV over the entire bandwidth (1–20 MHz), resulting in a minimum detectable pressure of 30 Pa at 2.25 MHz.

  538. A Prototype PZT Matrix Transducer with Low-Power Integrated Receive ASIC for 3D Transesophageal Echocardiography.
    C. Chen; S. Raghunathan; Z. Yu; M. Shabanimotlag; Z. Chen; Z. Y. Chang; S. Blaak; C. Prins; J. Ponte; E. Noothout; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 63, Issue 1, pp. 47‒59, January 2016. DOI: 10.1109/tuffc.2015.2496580
    Abstract: ... This paper presents the design, fabrication, and experimental evaluation of a prototype lead zirconium titanate (PZT) matrix transducer with an integrated receive ASIC, as a proof of concept for a miniature three-dimensional (3-D) transesophageal echocardiography (TEE) probe. It consists of an array of 9 × 12 piezoelectric elements mounted on the ASIC via an integration scheme that involves direct electrical connections between a bond-pad array on the ASIC and the transducer elements. The ASIC addresses the critical challenge of reducing cable count, and includes front-end amplifiers with adjustable gains and microbeamformer circuits that locally process and combine echo signals received by the elements of each 3 × 3 subarray. Thus, an order-of-magnitude reduction in the number of receive channels is achieved. Dedicated circuit techniques are employed to meet the strict space and power constraints of TEE probes. The ASIC has been fabricated in a standard 0.18-μm CMOS process and consumes only 0.44 mW/channel. The prototype has been acoustically characterized in a water tank. The ASIC allows the array to be presteered across ±37° while achieving an overall dynamic range of 77 dB. Both the measured characteristics of the individual transducer elements and the performance of the ASIC are in good agreement with expectations, demonstrating the effectiveness of the proposed techniques.

  539. A 30-ppm <80 nJ Ring-Down-Based Readout Circuit for Resonant Sensors
    H. Jiang; Z. Y. Chang; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 51, Issue 1, pp. 187‒195, January 2016. DOI: 10.1109/JSSC.2015.2470552
    Abstract: ... This paper presents an energy-efficient readout circuit for micro-machined resonant sensors. It operates by briefly exciting the sensor at a frequency close to its resonance frequency, after which resonance frequency and quality factor are determined from a single ring-down transient. The circuit employs an inverter-based trans-impedance amplifier to sense the ring-down current, with a programmable feedback network to enable the readout of different resonant sensors. An inverter-based comparator with dynamically-adjusted threshold levels tracks the ring-down envelope to measure quality factor, and detects zero crossings to measure resonance frequency. The excitation frequency is dynamically adjusted to accommodate large resonance frequency shifts. Experimental results obtained with a prototype fabricated in 0.35 μm standard CMOS technology and three different SiN resonators are in good agreement with conventional impedance analysis. The prototype achieves a frequency resolution better than 30 ppm while consuming less than 80 nJ/meas from a 1.8 V supply, which is 7.8x less than the state-of-the-art.

  540. A Ratiometric Readout Circuit for Thermal-Conductivity-Based Resistive CO$_2$ Sensors
    Z. Cai; R. H. M. van Veldhoven; A. Falepin; H. Suy; E. Sterckx; C. Bitterlich; K. A. A. Makinwa; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 51, Issue 10, pp. 2453‒2474, October 2016. DOI: 10.1109/jssc.2016.2587861
    Abstract: ... This paper reports a readout circuit for a resistive CO2 sensor, which operates by measuring the CO2-dependent thermal conductivity of air. A suspended hot-wire transducer, which acts both as a resistive heater and temperature sensor, exhibits a CO2-dependent heat loss to the surrounding air, allowing CO2 concentration to be derived from its temperature rise and power dissipation. The circuit employs a dual-mode incremental delta-sigma ADC to digitize these parameters relative to those of an identical, but isolated, reference transducer. This ratiometric approach results in a measurement that does not require precision voltage or power references. The readout circuit uses dynamically-swapped transducer pairs to cancel their baseline-resistance, so as to relax the required dynamic range of the ADC. In addition, dynamic element matching (DEM) is used to bias the transducer pairs at an accurate current ratio, making the measurement insensitive to the precise value of the bias current. The readout circuit has been implemented in a standard 0.16 μm CMOS technology. With commercial resistive micro-heaters, a CO2 sensing resolution of about 200 ppm (1σ) was achieved in a measurement time of 30 s. Similar results were obtained with CMOS-compatible tungsten-wire transducers, paving the way for fully-integrated CO2 sensors for air-quality monitoring.

  541. Implementing a strategy for on-chip detection of cell-free DNA fragments using GMR sensors: A translational application in cancer diagnostics using ALU elements
    Dias, TM; Cardoso, Filipe Arroyo; Martins, SAM; Martins, VC; Cardoso, S; Gaspar, JF; Monteiro, G; Freitas, PP;
    Analytical Methods,
    Volume 8, Issue 1, pp. 119-128, 2016.

  542. Advanced NDT inspection tools for titanium surfaces based on high-performance magnetoresistive sensors
    Franco, Fernando; Cardoso, Filipe Arroyo; Rosado, Luís S; Ferreira, Ricardo; Cardoso, Susana; Piedade, Moisés; Freitas, Paulo P;
    IEEE Transactions on Magnetics,
    Volume 53, Issue 4, pp. 1-5, 2016.

  543. Wideband Continuous-time Σ∆ ADCs, Automotive Electronics, and Power Management: Advances in Analog Circuit Design 2016
    A. Baschirotto; P. Harpe; K.A.A. Makinwa;
    Springer, , 2016.

  544. Wideband Continuous-time Σ∆ ADCs, Automotive Electronics, and Power Management: Advances in Analog Circuit Design 2016
    A. Baschirotto; P. Harpe; K.A.A. Makinwa;
    Springer, , 2016.

  545. Chemical Vapor Deposition - Recent Advances and Applications in Optical, Solar Cells and Solid State Devices
    V. Mohammadi; S. Nihtianov;
    S. Neralla (Ed.);
    InTech publisher, Chapter Low-Temperature, , pp. 137-157, 2016. ISBN 978-953-51-2573-0.

  546. A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator
    S. Zaliasl; J. Salvia; T. Fiez; K.A.A. Makinwa; A. Partridge; V. Menon;
    Switzerland: Springer, , 2016.

  547. Fabrication of Ultrathin Large-area Dielectric Membrane Stacks for use as Interference Filters
    M. Ghaderi; G. de Graaf; R.F. Wolffenbuttel;
    In Procedia Engineering (Proceedings of the 30th Eurosensors Conference), vol. 168,
    Elsevier, pp. 1342-1345, 2016.

  548. Cryo-CMOS for Quantum Computing
    E. Charbon; F. Sebastiano; A. Vladimirescu; H. Homulle; S. Visser; L. Song; R. Incandela;
    In Internation Electon Devices Meeting (IEDM),
    December 2016.

  549. Implementation of CMOS-compatible Metamaterial Absorber for gas Sensing Application
    E. Karimi Shahmarvandi; M. Ghaderi; P. Ayerden; G. de Graaf; R.F. Wolffenbuttel;
    In Procedia Engineering (Proceedings of the 30th Eurosensors Conference), vol. 168,
    Elsevier, pp. 1241-1244, 2016.

  550. Influence of the surface oxide content of a boron capping layer on UV photodetector performance
    V. Mohammadi; R.W.E. van de Kruijs; P.R. Rao; J.M. Sturm; S. Nihtianov;
    In Proc. of the International Conference on Sensing Technology,
    pp. 656-660, March 2016.
    document

  551. Optical Spectroscopy for Biofuel Composition Sensing
    L.M. Middelburg; G. de Graaf; M. Ghaderi; A. Bossche; J.H. Bastemeijer; J.H. Visser; R.F. Wolffenbuttel;
    In Procedia Engineering (Proceedings of the 30th Eurosensors Conference), vol. 168,
    Elsevier, pp. 55-58, 2016.

  552. CMOS-compatible metamaterial-based wideband mid-infrared absorber for microspectrometer applications
    Karimi Shahmarvandi, Ehsan; Ghaderi, Mohammadamir; Ayerden, N. Pelin; de Graaf, Ger; Wolffenbuttel, Reinoud F.;
    In Proceedings of SPIE Photonics Europe, vol. 9883,
    SPIE, pp. 988309-988309-9, 2016.

  553. Design and fabrication of 45° inclined mirrors for wafer-level optical absorption spectroscopy
    N.P. Ayerden; M. Ghaderi; R.F. Wolffenbuttel;
    In Journal of Physics: Conference Series (Proceedings of the 27th Micromechanics and Microsystems Europe Workshop), vol. 757,
    IOP Publishing, pp. 012018, 2016.

  554. Analysis of the effect of stress-induced waviness in airgap-based optical filters
    M. Ghaderi; E.K. Shahmarvandi; G. de Graaf; R.F. Wolffenbuttel;
    In Proceedings of SPIE Photonics Europe, vol. 9889,
    SPIE, pp. 98890A-98890A, 2016.

  555. Design and fabrication of ripple-free CMOS-compatible stacked membranes for airgap optical filters for UV-visible spectrum
    M. Ghaderi; G. de Graaf; R.F. Wolffenbuttel;
    In Proceedings of SPIE Photonics Europe, vol. 9888,
    SPIE, pp. 98880R-98880R-8, 2016.

  556. Design and fabrication of ultrathin silicon-nitride membranes for use in UV-visible airgap-based MEMS optical filters
    M. Ghaderi; R.F. Wolffenbuttel;
    In Journal of Physics: Conference Series (Proceedings of the 27th Micromechanics and Microsystems Europe Workshop), vol. 757,
    IOP Publishing, pp. 012032, 2016.

  557. A highly miniaturized NDIR methane sensor
    N.P. Ayerden; G. de Graaf; P. Enoksson; R.F. Wolffenbuttel;
    In Proceedings of SPIE Photonics Europe, vol. 9888,
    SPIE, pp. 98880D-98880D, 2016.

  558. CMOS-compatible fabrication of metamaterial-based absorbers for the mid-IR spectral range
    E.K. Shahmarvandi; M. Ghaderi; R.F. Wolffenbuttel;
    In Journal of Physics: Conference Series (Proceedings of the 27th Micromechanics and Microsystems Europe Workshop), vol. 757,
    IOP Publishing, pp. 012033, 2016.

  559. Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications
    M.R. Venkatesh; B. El Mansouri; J. Wei; A. Bossche; G.Q. Zhang;
    In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    IEEE, pp. 1-9, 2016.

  560. A 1.65mW 0.16mm² Dynamic Zoom-ADC with 107.5dB DR in 20kHz BW
    B. Gönen; F. Sebastiano; van R. Veldhoven; K.A.A. Makinwa;
    In 2016 IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 282-283, Feb 2016. DOI: 10.1109/isscc.2016.7418017

  561. A CMOS image sensor with nearly unity-gain source follower and optimized column amplifier
    X. Ge; A. Theuwissen;
    In E. Fontana; C. Ruiz-Zamarreno (Ed.), 2016 IEEE SENSORS,
    IEEE, pp. 1-3, 2016. DOI: 10.1109/ICSENS.2016.7808589
    Abstract: ... This paper presents a CMOS image sensor with in-pixel nearly unity-gain pMOS transistor based source followers and optimized column-parallel amplifiers. The prototype sensor has been fabricated in a 0.18 μm CMOS process. By eliminating the body effect of the source follower transistor, the voltage gain for the pixel-level readout circuitry approaches unity. The use of a single-ended common-source cascode amplifier with ground rail regulation improves the PSRR of the column-parallel analog front-end circuitry and further the noise performance. Electrical characterization results show that the proposed pixel improves the conversion gain after the in-pixel source follower by 42% compared to that of the conventional structure. The prototype sensor with proposed readout architecture reaches a 1.1e- input-referred temporal noise with a column-level ×16 analog gain.

    document

  562. Characterization of bipolar transistors for cryogenic temperature sensors in standard CMOS
    L. Song; H. Homulle; E. Charbon; F. Sebastiano;
    In IEEE Sensors 2016,
    October 2016.

  563. A comparative noise analysis and measurement for n-type and p-type pixels with CMS technique
    X. Ge; B. Mamdy; A.J.P. Theuwissen;
    In A. Darmont; R. Widenhorn (Ed.), IS&T International Symposium on Electronic Imaging,
    Society for Imaging Science and Technology, pp. IMSE-261, 2016.

  564. An Integrated Carbon Dioxide Sensor for Air-Quality Monitoring
    Z. Cai; R. H. M. van Veldhoven; A. Falepin; H. Suy; E. Sterckx; C. Bitterlich; K. A. A. Makinwa; M. A. P. Pertijs;
    In Proc. Conference for ICT-Research in the Netherlands (ICT.OPEN),
    The Netherlands, March 2016.

  565. Acoustic Characterisation of a 32 × 32 Element PZT-on-CMOS Matrix Transducer for 3D TEE
    S. Raghunathan; D. Bera; C. Chen; Z. Chen; M. Shabanimotlagh; E. Noothout; Z. Y. Chang; H. Vos; C. Prins; J. Ponte; J. Bosch; M. Pertijs; N. de Jong; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2016. (abstract).

  566. Investigation of error- and drift sources in a capacitive sensor system for sub-nanometer displacement measurement
    R.S. Nojdelov; D. Voigt; A.S. van de Nes; S. Nihtianov;
    In Proc. of the IEEE 9th International Conference on Sensing Technology,
    IEEE, pp. -, 2016. Roumen S Nojdelova - EWI.

  567. An Oxide Electrothermal Filter in Standard CMOS
    L. Pedalà; U. Sönmez; F. Sebastiano; K.A.A. Makinwa; K. Nagaraj; J. Park;
    In 2016 IEEE Sensors,
    Orlando, FL, USA, pp. 343-345, November 2016. DOI: 10.1109/icsens.2016.7808512

  568. A Hybrid Multi-path CMOS Magnetic Sensor with 210µTrms Resolution and 3MHz Bandwidth for Contactless Current Sensing
    J. Jiang; K.A.A. Makinwa;
    In 2016 IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 204-205, Feb 2016. DOI: 10.1109/ISSCC.2016.7417978

  569. A Microcontroller with 96% Power-Conversion Efficiency using Stacked Voltage Domains
    B. Blutman; A. Kapoor; A. Majumdar; J.G. Martinez; J. Echeverri; L. Sevat; A. van der Wel; H. Fatemi; J.P. de Gyvez; K.A.A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1-2, June 2016. DOI: 10.1109/vlsic.2016.7573478

  570. 1650µm² Thermal-Diffusivity Sensors with Inaccuracies Down to ±0.75°C in 40nm CMOS
    U. Sonmez; F. Sebastiano; K.A.A. Makinwa;
    In 2016 IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 206-207, Feb 2016. DOI: 10.1109/ISSCC.2016.7417979

  571. Suppression Efficiency of the Correlated Noise and Drift of Self-oscillating Pseudo-differential Eddy Current Displacement Sensor
    V. Chaturvedi; J.G. Vogel; S. Nihtianov;
    In Proc. of the 30th EuroSensors conference,
    Sept. 2016.

  572. A ± 36A Integrated Current-Sensing System with 0.3% Gain Error and 400μA Offset from −55°C to +85°C
    S.H. Shalmany; D. Draxelmayr; K.A.A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1-2, June 2016. DOI: 10.1109/vlsic.2016.7573493

  573. A BJT-based Temperature-to-Digital Converter with ±60mK (3σ) Inaccuracy from -70°C to 125°C in 160nm CMOS
    B. Yousefzadeh; S.H. Shalmany; K.A.A. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1-2, June 2016. DOI: 10.1109/vlsic.2016.7573531

  574. Tilt sensitivity of an eddy-current position sensor for high-precision applications
    J.G. Vogel; S. Nihtianov;
    In Proc. of the 16th international conference of the EUSPEN,
    2016.

  575. Modelling the inductance of a novel eddy-current position sensor for high-precision applications
    J.G. Vogel; S. Nihtianov;
    In Proc. of the IEEE Sensors Applications Symposium,
    pp. 1 - 5, Apr. 2016.

  576. A hybrid multi-path CMOS magnetic sensor with 76 ppm/°C sensitivity drift
    J. Jiang; K.A.A. Makinwa;
    In European Solid-State Circuits Conference, ESSCIRC Conference 2016: 42nd,
    IEEE, pp. 397-400, Sep 2016. DOI: 10.1109/esscirc.2016.7598325

  577. Study of the Self-resonance Frequency of a Flat Coil for an Eddy-Current Position Sensor
    J.G. Vogel; S. Nihtianov;
    In Proc. of the IEEE Sensors conference,
    Oct. 2016.

  578. Flexible Microsystems
    P.J. French; P.M. Sarro;
    In Proceeding Smart Systems Integration,
    Munich, Germany, mesago, pp. 181-188, March 2016.

  579. CryoCMOS Hardware Technology a Classical Infrastructure for a Scalable Quantum Computer
    Harald Homulle; Stefan Visser; Bishnu Patra; Giorgio Ferrari; Enrico Prati; Carmen G. Almud{\'e}ver; Koen Bertels; Fabio Sebastiano; Edoardo Charbon;
    In Proceedings of the ACM International Conference on Computing Frontiers,
    New York, NY, USA, ACM, pp. 282--287, 2016. DOI: 10.1145/2903150.2906828
    Keywords: ... (de)coherence, CryoCMOS, cryogenics, error-correcting loop, fault-tolerant computing, quantum computation, quantum micro-architecture, qubit.

    Abstract: ... We propose a classical infrastructure for a quantum computer implemented in CMOS. The peculiarity of the approach is to operate the classical CMOS circuits and systems at deep cryogenic temperatures (cryoCMOS), so as to ensure physical proximity to the quantum bits, thus reducing thermal gradients and increasing compactness. CryoCMOS technology leverages the CMOS fabrication infrastructure and exploits the continuous effort of miniaturization that has sustained Moore?s Law for over 50 years. Such approach is believed to enable the growth of the number of qubits operating in a fault-tolerant fashion, paving the way to scalable quantum computing machines.

    document

  580. A Heterogeneous Quantum Computer Architecture
    X. Fu; L. Riesebos; L. Lao; C.G. Almudever; F. Sebastiano; R. Versluis; E. Charbon; K. Bertels;
    In Proceedings of the ACM International Conference on Computing Frontiers,
    New York, NY, USA, ACM, pp. 323--330, 2016. DOI: 10.1145/2903150.2906827
    Abstract: ... In this paper, we present a high level view of the heterogeneous quantum computer architecture as any future quantum computer will consist of both a classical and quantum computing part. The classical part is needed for error correction as well as for the execution of algorithms that contain both classical and quantum logic. We present a complete system stack describing the di?erent layers when building a quantum computer. We also present the control logic and corresponding data path that needs to be implemented when executing quantum instructions and conclude by discussing design choices in the quantum plane.} keywords = {quantum computer (micro-)architecture

    document

  581. Characterization of bipolar transistors for cryogenic temperature sensors in standard CMOS
    Lin Song; Harald Homulle; Edoardo Charbon; Fabio Sebastiano;
    In IEEE Sensors 2016,
    pp. 1-3, October 2016. DOI: 10.1109/ICSENS.2016.7808759
    Keywords: ... CMOS integrated circuits;bipolar transistors;cryogenics;temperature sensors;CMOS integrated temperature sensors;bipolar substrate PNP;bipolar transistors;carrier freeze-out;cryogenic temperature sensors;finite current gain;parasitic base resistance;size 160 nm;standard CMOS;temperature 7 K to 298 K;CMOS technology;Cryogenics;Standards;Substrates;Temperature distribution;Temperature sensors;CMOS;cryogenics;substrate bipolar transistors;temperature sensors.

    Abstract: ... This paper presents the cryogenic characterization of the bipolar substrate PNPs that are typically employed as sensing elements in CMOS integrated temperature sensors. PNPs realized in a standard 160-nm CMOS technology were characterized over the temperature range from 7 K to 294 K. Although PNP non-idealities, such as finite current gain and parasitic base resistance, deteriorate at lower temperature, device operation similar to room temperature is observed down to 70 K, while operation at lower temperatures is limited by carrier freeze-out in the base region and limited current gain. These results demonstrate the feasibility of temperature sensors in standard CMOS at cryogenic temperature.

  582. An Oxide Electrothermal Filter in Standard CMOS
    Lorenzo Pedal\'{a}; Ugur Sönmez; Fabio Sebastiano; K ofi A.A. Makinwa; K. Nagaraj; J. Park;
    In 2016 IEEE Sensors,
    IEEE} abstract={Due to their relatively stable phase shift over temperature, electrothermal filters (ETFs) with an oxide heat path have been used as on-chip phase references, e.g. for thermal diffusivity (TD) temperature sensors. However, previous oxide E, Oct 2016. DOI: 10.1109/ICSENS.2016.7808512
    Keywords: ... CMOS integrated circuits;elemental semiconductors;silicon;silicon-on-insulator;temperature measurement;temperature sensors;ETF;SOI processing;Si;TD temperature sensor;bulk standard CMOS process;deep-trench isolation;on-chip phase reference;oxide electrothermal filter;oxide-dominated heat path;temperature -40 degC to 125 degC;thermal diffusivity temperature sensor;Decision support systems;Electronic mail;Heating;Standards;System-on-chip;Temperature sensors;electrothermal filter;phase domain sigma delta ADC;self-referenced;temperature sensor;thermal diffusivity.

  583. Cryo-CMOS for quantum computing
    Edoardo Charbon; Fabio Sebastiano; Andrei Vladimirescu; Harald Homulle; Stefan Visser; Lin Song; Rosario M. Incandela;
    In Proc. 2016 IEEE International Electron Devices Meeting (IEDM),
    pp. 13.5.1-13.5.4, Dec 2016. DOI: 10.1109/IEDM.2016.7838410
    Keywords: ... CMOS integrated circuits;VLSI;cryogenic electronics;fault tolerance;integrated circuit design;integrated circuit reliability;quantum computing;VLSI design;cryoCMOS;cryogenic CMOS circuits;cryogenic CMOS systems;deep-cryogenic temperatures;fault-tolerant quantum bits;fault-tolerant qubit system;quantum computing;Computers;Fault tolerance;Fault tolerant systems;Field programmable gate arrays;Multiplexing;Quantum computing;Quantum dots.

    Abstract: ... Cryogenic CMOS, or cryo-CMOS circuits and systems, are emerging in VLSI design for many applications, in primis quantum computing. Fault-tolerant quantum bits (qubits) in surface code configurations, one of the most accepted implementations in quantum computing, operate in deep sub-Kelvin regime and require scalable classical control circuits. In this paper we advocate the need for a new generation of deep-submicron CMOS circuits operating at deep-cryogenic temperatures to achieve the performance required in a fault-tolerant qubit system. We outline the challenges and limitations of operating CMOS in near-zero Kelvin regimes and we propose solutions. The paper concludes with several examples showing the suitability of integrating fault-tolerant.qubits with CMOS.

  584. A front-end ASIC with receive sub-array beamforming integrated with a 32 × 32 PZT matrix transducer for 3-D transesophageal echocardiography
    C. Chen; Z. Chen; D. Bera; S. B. Raghunathan; M. Shabanimotlagh; E. Noothout; Z. Y. Chang; J. Ponte; C. Prins; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 1‒2, September 2016. DOI: 10.1109/vlsic.2016.7573470

  585. A 40-nm CMOS permittivity sensor for chemical/biological material characterization at RF/microwave frequencies
    G. Vlachogiannakis; M. Spirito; M. A. P. Pertijs; L. C. N. de Vreede;
    In Proc. IEEE MTT-S International Microwave Symposium (IMS),
    IEEE, pp. 1‒4, May 2016. DOI: 10.1109/mwsym.2016.7540260

  586. A broadband PVDF-based hydrophone with integrated readout circuit for intravascular photoacoustic imaging
    V. Daeichin; C. Chen; Q. Ding; M. Wu; R. Beurskens; G. Springeling; E. Noothout; M. D. Verweij; K. W.A. van Dongen; J. G. Bosch; A. F. W. van der Steen; N. de Jong; M. Pertijs; G. van Soest;
    In Proc. SPIE Photonics West,
    SPIE, February 2016. DOI: 10.1016/j.ultrasmedbio.2015.12.016
    Abstract: ... Intravascular photoacoustic (IVPA) imaging can visualize the coronary atherosclerotic plaque composition on the basis of the optical absorption contrast. Most of the photoacoustic (PA) energy of human coronary plaque lipids was found to lie in the frequency band between 2 and 15 MHz requiring a very broadband transducer, especially if a combination with intravascular ultrasound is desired. We have developed a broadband polyvinylidene difluoride (PVDF) transducer (0.6 × 0.6 mm, 52 μm thick) with integrated electronics to match the low capacitance of such a small polyvinylidene difluoride element (<5 pF/mm2) with the high capacitive load of the long cable (∼100 pF/m). The new readout circuit provides an output voltage with a sensitivity of about 3.8 μV/Pa at 2.25 MHz. Its response is flat within 10 dB in the range 2 to 15 MHz. The root mean square (rms) output noise level is 259 μV over the entire bandwidth (1–20 MHz), resulting in a minimum detectable pressure of 30 Pa at 2.25 MHz.

  587. The role of sub-dicing in the acoustical design of an ultrasound matrix transducer for carotid arteries imaging
    M. Shabanimotlagh; J. Janjic; S. Raghunathan; M. A. P. Pertijs; N. de Jong; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1‒4, September 2016. DOI: 10.1109/ultsym.2016.7728470
    Abstract: ... Accurate diagnostics of stenosis and blood flow distribution in carotid arteries requires transducers capable of producing 3D volume images with high frame rate for real time imaging. In the process of designing a matrix probe, an important goal is to realize the acoustic stack with high sensitivity and bandwidth. In this study, we employ a finite element analysis to evaluate the effect of sub-dicing on the performance of an acoustic stack in a piezoelectric matrix array. The array is integrated with an Application Specific Integrated Circuit (ASIC), which performs the task of signal amplification and efficient data reduction. The results show that two sub-dicing cuts can improve the sensitivity by 40%, bandwidth by 20%, and reduce the ringing time by 43%, which are all desired for improving the image quality.

  588. Three-dimensional beamforming combining micro-beamformed RF datasets
    D. Bera; H. J. Vos; S. B. Raghunathan; C. Chen; Z. Chen; M. D. Verweij; M. A. P. Pertijs; N. de Jong; J. G. Bosch;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1‒4, September 2016. DOI: 10.1109/ultsym.2016.7728449
    Abstract: ... A general challenge in 3D volumetric imaging is the large channel count. One solution uses integrated microbeamformers. The reconstruction of the entire volume from these micro-beamformed datasets can be performed in many ways. In this paper we propose two 3D multiline beamforming techniques, suitable for producing volumes at high frame rate and compare the image qualities to a fully-sampled matrix. The performance of the proposed beamforming techniques was evaluated with simulations in FieldII. Results show that the proposed simple volume reconstruction technique (using 25 transmissions) produces volumes at very high frame rate, but with sharp intensity changes within the volume. The proposed advanced technique (using 169 transmissions) produces volumes very similar to a fully-sampled matrix transducer despite the micro-beamforming.

  589. Detecting antibody-labeled BCG MNPs using a magnetoresistive biosensor and magnetic labeling technique
    Barroso, Teresa RG; Martins, Verónica C; Cardoso, Filipe Arroyo; Cardoso, Susana; Pedrosa, Jorge; Correia-Neves, Margarida; Rivas, Jos{\'e}; Freitas, Paulo P;
    In Journal of Nano Research,
    Trans Tech Publications Ltd, pp. 92-103, 2016.

  590. Design and optimization of a CMOS front-end for magnetoresistive sensor based biomolecular recognition detection
    Costa, Tiago; Germano, Jose; Piedade, Moises S; Cardoso, Filipe Arroyo; Freitas, Paulo P;
    In 2016 IEEE International Symposium on Circuits and Systems (ISCAS),
    IEEE, pp. 2859-2862, 2016.

  591. A Sampled Voltage Reference
    T. Rooijers;
    MSc thesis, Delft University of Technology, Jan 2016.

  592. A high-resolution resistor-based temperature sensor
    S. Pan;
    MSc thesis, Delft University of Technology, Aug 2016. cum laude.

  593. An On-chip noise thermometer
    J. van Dijk;
    MSc thesis, Delft University of Technology, Jan 2016. cum laude.

  594. Analysis and Design of a 2.5GS/s 6-bit SAR ADC with a 3-bit/cycle Resolving Scheme
    Magda Ursulean;
    MSc thesis, Delft University of Technology, August 2016.
    document

  595. A Front-end ASIC with High-Voltage Transmit Switching and Receive Digitization for Forward-Looking Intra-Vascular Ultrasound
    Mingliang Tan;
    MSc thesis, Delft University of Technology, November 2016.
    document

  596. Multi-sensor Read-out Circuit with Temperature, Capacitance and Voltage Sensing Functionalities
    Wei Wu;
    MSc thesis, Delft University of Technology, November 2016.
    document

  597. CMOS image sensor: Masterpieces of 3D integration
    A. Theuwissen;
    IEEE-DL invited talk at the University of Leuven, Belgium, November 2016.

  598. Noise: You love it or you hate it
    A. Theuwissen;
    Invited talk at the University of Varna, Bulgaria, October 2016.

  599. Phase-domain digitizer
    K.A.A. Makinwa; R. Quan;
    Patent, 9,276,792, March 1 2016.

  600. Efficient Analog to Digital Converter
    B. Gönen; F. Sebastiano; K.A.A. Makinwa; R.H.M. van Veldhoven;
    Patent, 9,325,340, April 26 2016.

  601. Frequency synthesiser
    Salvatore Drago; Fabio Sebastiano; Domine M.W. Leenaerts; Lucien J. Breems; Bram Nauta;
    Patent, United States 9240772 B2, January 2016.

  602. Efficient analog to digital converter
    Burak Gönen; Fabio Sebastiano; Kofi A. A. Makinwa; Robert H. M. van Veldhoven;
    Patent, 9325340, April 2016.

  603. A miniaturized optical gas sensor for natural gas analysis
    P. Ayerden;
    PhD thesis, Delft University of Technology, 7 2016.

  604. Airgap-based MEMS optical filters for the ultraviolet-visible spectrum
    M. Ghaderi;
    PhD thesis, Delft University of Technology, June 2016.

  605. Low-Power Active Electrodes for Wearable EEG Acquisition
    J. Xu;
    PhD thesis, Delft University of Technology, 6 2016.

  606. Energy-Efficient Smart Temperature Sensors in CMOS Technology
    K. Souri;
    PhD thesis, Delft University of Technology, 2016.

  607. Minimizing stress in large-area surface micromachined perforated membranes with slits
    M. Ghaderi; N.P. Ayerden; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 25, Issue 7, pp. 1-9, 2015.

  608. Water-enhanced guarding of polymer-coated IDE platforms as a key mechanism for achieving response immunity towards parasitic coupling events
    J. Staginus; Z.Y. Chang; E.J.R. Sudholter; LC.P.M. de Smet; G.C.M. Meijer;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 234, pp. 239-247, 2015. Available online 10-9-2015.

  609. Extracting large photovoltages from a-SiC photocathodes with an amorphous TiO2 front surface field layer for solar hydrogen evolution
    I.A. Digdaya; L. Han; T.W.F. Buijs; M. Zeman; B. Dam; A.H.M. Smets; W.A. Smith;
    Energy & Environmental Science,
    Volume 8, Issue 5, pp. 1585-1593, 2015. Harvest Published online 8-4-2015.

  610. A thermistor-based temperature sensor for a real-time clock with ±2 ppm frequency stability
    P. Park; D. Ruffieux; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 50, Issue 7, pp. 1571-1580, 2015. Available online 20-4-2015.

  611. A 15-Channel digital active electrode system for multi-parameter biopotential measurement
    J. Xu; B. Busze; C. van Hoof; K.A.A. Makinwa; R.F. Yazicioglu;
    IEEE Journal of Solid State Circuits,
    Volume 50, Issue 9, pp. 2090-2100, 2015. Available online 1-5-2015.

  612. Magnetic counter for Group B Streptococci detection in milk
    Duarte, Carla Margarida; Fernandes, Ana Carolina; Cardoso, Filipe Arroyo; Bexiga, Ricardo; Cardoso, Susana Freitas; Freitas, Paulo JP;
    IEEE Transactions on Magnetics,
    Volume 51, Issue 1, pp. 1-4, 2015.

  613. Real-time monitoring of magnetic nanoparticles diffusion in lateral flow microporous membrane using spin valve sensors
    Chicharo, Alexandre; Cardoso, Filipe Arroyo; Cardoso, Susana; Freitas, Paulo JP;
    IEEE Transactions on Magnetics,
    Volume 51, Issue 1, pp. 1-4, 2015.

  614. Magnetic-based biomolecule detection using giant magnetoresistance sensors
    Kokkinis, G; Jamalieh, M; Cardoso, Filipe Arroyo; Cardoso, S; Keplinger, F; Giouroudi, I;
    Journal of Applied Physics,
    Volume 117, Issue 17, pp. 17B731, 2015.

  615. A novel approach for detection and quantification of magnetic nanomarkers using a spin valve GMR-integrated microfluidic sensor
    Devkota, J; Kokkinis, G; Berris, T; Jamalieh, M; Cardoso, S; Cardoso, Filipe Arroyo; Srikanth, Hariharan; Phan, Manh-Huong; Giouroudi, I;
    RSC Advances,
    Volume 5, Issue 63, pp. 51169-51175, 2015.

  616. A 3 ppm 1.5 × 0.8 mm 2 1.0 µA 32.768 kHz MEMS-Based Oscillator
    Zaliasl, Samira; Salvia, Jim C.; Hill, Ginel C.; Chen, Lijun; Joo, Kimo; Palwai, Rajkumar; Arumugam, Niveditha; Phadke, Meghan; Mukherjee, Shouvik; Lee, Hae-Chang; Grosjean, Charles; Hagelin, Paul M.; Pamarti, Sudhakar; Fiez, Terri S.; Makinwa, Kofi A. A.; Partridge, Aaron; Menon, Vinod;
    IEEE Journal of Solid-State Circuits,
    Volume 50, Issue 1, pp. 291-302, 2015. DOI: 10.1109/JSSC.2014.2360377
    Keywords: ... Oscillators;Micromechanical devices;Clocks;Phase locked loops;Resonant frequency;Temperature sensors;Modulation;Low power design;MEMS oscillator;MEMS resonator;real time clock;sub-threshold;32 kHz oscillator;32 kHz XO and TCXO.

  617. Efficient sensor interfaces, advanced amplifiers and low power RF systems: Advances in analog circuit design 2015
    K.A.A. Makinwa;
    Springer, , 2015.

  618. High-performance AD and DA converters, IC design in scaled technologies, and time-domain signal processing: Advances in analog circuit design 2014
    K.A.A. Makinwa;
    Spriger, Volume Analog Circuit Design ser , 2015. 23rd workshop on Advances in Analog Circuit Design (AACD) Lisbon, Portugal, in April 8¿10, 2014.

  619. In-volume heating using high-power laser diodes
    V.S. Denisenkov; VV. Kiyko; G.V. Vdovin;
    MS Zediker (Ed.);
    SPIE, , pp. 934812-1-9348, 2015. Harvest.

  620. Active guarding of a four-point impedance probe with one common guard electrode for maximum readout bandwidth
    R.F. Wolffenbuttel; G. de Graaf;
    In P Daponte; S Shirmohammadi; {van Moer}, W (Ed.), IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings,
    IEEE, pp. 2101-2105, 2015.

  621. Dielectric spectroscopy for measuring the composition of gasoline/water/ethanol mixtures
    G. de Graaf; G. Lacerenza; R.F. Wolffenbuttel; J. Visser;
    In P Daponte; S Shirmohammadi; {van Moer}, W (Ed.), IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings,
    IEEE, pp. 154-158, 2015.

  622. Design and fabrication of an endomicroscopic imaging module for minimally invasive medical devices
    C.G. Costa; J.S. Gomes; R.F. Wolffenbuttel; J.H.G. Correia;
    In R Brama; JL Sánchez-Rojas (Ed.), Proceedings of SPIE Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, vol. 9517,
    SPIE, pp. 95170L-1-9517, 2015.

  623. A miniaturized optical sensor with integrated gas cell
    N.P. Ayerden; M. Ghaderi; G. de Graaf; R.F. Wolffenbuttel;
    In G Urban; J Wöllenstein; J Kieninger (Ed.), Procedia Engineering (Proceedings of the 29th Eurosensors Conference), vol. 120,
    Elsevier, pp. 392-395, 2015.

  624. The next generation of MEMS-based optical microspectrometers
    R.F. Wolffenbuttel;
    In R Brama; JL Sánchez-Rojas (Ed.), Proceedings of SPIE Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, vol. 9517,
    pp. 95170I-1-9517, 2015.

  625. Flow compensation in a MEMS dual-thermal conductivity detector for hydrogen sensing in natural gas
    G. de Graaf; A. Abarca Prouza; R.F. Wolffenbuttel;
    In TW Kenny; VM Bright (Ed.), Proceedings of the 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    IEEE, pp. 1203-1206, 2015.

  626. Imaging amplification for minimally invasive medical devices
    J.H. Correia; J.M. Gomes; G.C. Costa; R.F. Wolffenbuttel; J.P. Carmo;
    In M Paranjape; MA Pavanello (Ed.), Proceedings of the 30th Symposium on Microelectronics Technology and Devices (SBMicro),
    IEEE, pp. 1-4, 2015.

  627. Vapour HF release of airgap-based UV-visible optical filters
    M. Ghaderi; N.P. Ayerden; G. de Graaf; R.F. Wolffenbuttel;
    In G Urban; J Wöllenstein; J Kieninger (Ed.), Procedia Engineering (Proceedings of the 29th Eurosensors Conference), vol. 120,
    Elsevier, pp. 816-819, 2015.

  628. Optical characterization of MEMS-based multiple air-dielectric blue-spectrum distributed bragg reflectors
    M. Ghaderi; N.P. Ayerden; G. de Graaf; R.F. Wolffenbuttel;
    In R Brama; JL Sánchez-Rojas (Ed.), Proceedings of SPIE Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, vol. 9517,
    SPIE, pp. 95171M-1-9517, 2015.

  629. Optical design and characterization of a gas filled MEMS Fabry-Perot filter
    N.P. Ayerden; M. Ghaderi; G. de Graaf; R.F. Wolffenbuttel;
    In JL Sanchez-Rojas; R Brama (Ed.), Proceedings of SPIE Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, vol. 9517,
    SPIE, pp. 95171N-95171N-8, 2015.

  630. A MEMS flow compensated thermal conductivity detector for gas sensing
    G. de Graaf; A. Abarca; M. Ghaderi; R.F. Wolffenbuttel;
    In J Wollenstein (Ed.), Procedia Engineering (Proceedings of the 29th Eurosensors Conference), vol. 120,
    Elsevier, pp. 1265-1268, 2015.

  631. NIR micro beam-splitter by saw-dicing of glass substrate for optical coherence tomography
    M.J. Maciel; C.G. Costa; A.C. Peixoto; R.F. Wolffenbuttel;
    In G Urban; J Wöllenstein; J Kieninger (Ed.), Procedia Engineering (Proceedings of the 29th Eurosensors Conference), vol. 120,
    Elsevier, pp. 807-810, 2015.

  632. Optomechanical characterization of annealed thin PECVD oxide membranes
    M. Ghaderi; G. de Graaf; R.F. Wolffenbuttel;
    In RJ Wiegerink; D Tsoukalas; U. Staufer (Ed.), Proceedings of the 26th Micromechanics and Microsystems Europe workshop,
    2015.

  633. Design and wafer-level fabrication of a micro beam splitter for application in optical coherence tomography
    M.J. Maciel; M.F. Silva; A.C. Peixoto; G.C. Costa; R.F. Wolffenbuttel; J.H. Correia;
    In RJ Wiegerink; D Tsoukalas; U. Staufer (Ed.), Proceedings of the 26th Micromechanics and Microsystems Europe workshop,
    2015.

  634. Low temperature, 400 °C, pure boron deposition: A solution for integration of high-performance Si photodetectors and CMOS circuits
    V. Mohammadi; S. Nihtianov;
    In S Tadigadapa; J. Lee (Ed.), Proc. of the IEEE Sensors conference,
    IEEE, pp. 1-4, 2015. harvest.

  635. Wavefront coding with adaptive optics
    T.E. Agbana; O.A. Soloviev; V. Bezzubik; V. Patlan; M. Verhaegen; G.V. Vdovin;
    In TG Bifano; J Kubby; S Gigan (Ed.), Proceedings of Adaptive Optics and Wavefront Control for Biological Systems,
    SPIE, pp. 93350Q-1-9335, 2015.

  636. A ratiometric readout circuit for thermal-conductivity-based resistive gas sensors
    Z. Cai; R. H. M. van Veldhoven; A. Falepin; H. Suy; E. Sterckx; K. A. A. Makinwa; M. A. P. Pertijs;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 275‒278, September 2015. DOI: 10.1109/esscirc.2015.7313880

  637. Acoustic Characterisation of a PZT Matrix With Integrated Electronics for a 3D-TEE Probe
    S. Raghunathan; C. Chen; M. Shabanimotlagh; Z. Chen; S. Blaak; Z. Yu; C. Prins; M. Pertijs; J. Bosch; N. de Jong; M. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    October 2015. (abstract).

  638. A method for in-situ measurement of grid impedance and load impedance at 2 k¿150 kHz
    J. Tan; D. Zhao; J.A. Ferreira;
    In HG Kim; DF Tan (Ed.), Proceedings of the 9th International Conference on Power Electronics and ECCE Asia, ICPE-ECCE Asia 2015,
    IEEE, pp. 443-448, 2015. harvest J. Tan afgesloten in metis maar nog wel werkzaam.

  639. A 0.02mm2 Embedded Temperature Sensor with ±2°C Inaccuracy for Self-Refresh Control in 25nm Mobile DRAM
    Y.Y. Kim; W. Choi; J. Kim; S. Lee; S Lee; H. Kim; K.A.A. Makinwa; Y. Chae; TW Kim;
    In W Pribyl; F Dielacher; G Hueber (Ed.), Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 267-270, 2015.

  640. Investigation of long-term drift of NTC temperature sensors with less than 1 mK uncertainty
    A. Kulkarni; M. Patrascu; Y. van de Vijver; J. van Wensveen; R. Pijnenburg; S. Nihtianov;
    In W Suemitsu; C Couto (Ed.), Proc. of the IEEE 24th International Symposium on Industrial Electronics,
    IEEE, pp. 150-155, 2015. Harvest.

  641. A Two Conversions/Sample Differential Slope Multiple Sampling ADC With Accelerated Counter Architecture
    K. Kitamura; A.J.P. Theuwissen;
    In P Magnan (Ed.), Proceedings of the International Image Sensor Workshop,
    International Image Sensor Society, pp. 417-420, 2015.

  642. Architectural complexity analysis for large-scale emergency rescue management systems: A preliminary study
    L. Gao; M.E. Warnier; S. van Splunter; L. Chenggen; F.M. Brazier;
    In K Pattipati (Ed.), Proceedings of the international conference on complex systems engineering (ICCSE),
    IEEE, pp. 1-6, 11 2015. harvest.

  643. A 110dB SNR ADC with ±30V input common-mode range and 8μV Offset for current sensing applications
    L. Xu, B. Gonen, Q. Fan, J.H. Huijsing; K.A.A. Makinwa;
    In Digest of Technical Papers - 2015 IEEE International Solid-state Circuits Conference,
    San Francisco, CA, pp. 90 - 93, Feb 2015.

  644. A multi-path CMOS Hall sensor with integrated ripple reduction loops
    J. Jiang; K.A.A. Makinwa;
    In F Zhang (Ed.), Proceedings of the IEEE Asian Solid-State Circuits Conference,
    IEEE, pp. 1-4, 2015. harvest.

  645. Surface oxide content examination of capping boron layers in UV photodetectors
    V. Mohammadi; P. Ramachandra Rao; R.W.E. van de Kruijs; S. Nihtianov;
    In SR Bank; D Jena (Ed.), Proc. of the 73rd Annual Device Research Conference,
    IEEE, pp. 73-74, 2015. harvest.

  646. Stability characterization of high-performance PureB Si-photodiodes under aggressive cleaning treatments in industrial applications
    V. Mohammadi; L. Shi; U. Kroth; C. Laubis; S. Nihtianov;
    In LG Franquelo; BM Wilamowski (Ed.), Proc. of the IEEE International Conference on Industrial Technology,
    IEEE, pp. 3370-3376, 2015. Harvest.

  647. Low Power Receive Electronics for a Miniature Real-Time 3D Ultrasound Probe
    Z. Chen; C. Chen; S. B. Raghunathan; D. Bera; Z. Chang; S. Blaak; C. Prins; J. Ponte; J. G. Bosch; N. de Jong; M. D. Verweij; M. A. P. Pertijs;
    In Proc. Conference for ICT-Research in the Netherlands (ICT.OPEN),
    The Netherlands, March 2015.

  648. Investigating transfer gate potential barrier by feed-forward effect measurement
    Y. Xu; X. Ge; A.J.P. Theuwissen;
    In P. Magnan (Ed.), Proceedings of the International Image Sensor Workshop,
    International Image Sensor Society, pp. 116-120, 2015.

  649. A Self-referenced VCO-based Temperature Sensor with 0.034°C /mV Supply Sensitivity in 65nm CMOS
    T. Anand; K.A.A. Makinwa; P.K. Hanumolu;
    In M Motomura (Ed.), Proceedings of the Symposium on VLSI Circuits,
    IEEE, pp. C200-C201, 2015.

  650. A Fully Integrated ±5A Current-Sensing System with ±0.25% Gain Error and 12uA Offset from -40°C to +85°C
    S. Heidary Shalmany; G. Beer; D. Draxelmayr; K.A.A. Makinwa;
    In M Motomura (Ed.), Proceedings of the Symposium on VLSI Circuits,
    IEEE, pp. C298-C299, 2015.

  651. Wireless Temperature Sensor for Harsh Industrial Environments
    A. Kerezov; A. Kulkarni; S. Nihtianov;
    In Y Fujimoto; P Xu (Ed.), Proc. of the IEEE 41st Annual Industrial Electronics Society Conference,
    IEEE, pp. 3986-3991, 2015. Aditya Kulkarni - TNW.

  652. A 4600µm² 1.5°C (3σ) 0.9kS/s thermal-diffusivity temperature sensor with VCO-based readout
    Rui Quan; Ugur Sonmez; Fabio Sebastiano and, Kofi A.A. Makinwa;
    In International Solid-state Circuits Conference Digest of Technical Papers,
    San Francisco, CA, pp. 488 - 489, Feb 2015. DOI: 10.1109/ISSCC.2015.7063139
    Keywords: ... Accuracy;CMOS integrated circuits;Modulation;Radiation detectors;Temperature sensors.

    Abstract: ... This paper presents a highly digital thermal-diffusivity temperature sensor in 0.16µm CMOS for SoC thermal monitoring. The sensor occupies only 4600µm², which is the smallest for designs above 32nm and is one of the smallest ever reported. It also achieves ±1.5°C (3σ, single trim) inaccuracy and 0.6$^circ$C resolution at a 0.9kS/s sampling rate. This small area implementation is mainly enabled by the adoption of a VCO-based phase-domain ADC whose area is 70% digital.

  653. A compact 0.135-mW/channel LNA array for piezoelectric ultrasound transducers
    C. Chen; Z. Chen; Z. Y. Chang; M. A. P. Pertijs;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 404‒407, September 2015. DOI: 10.1109/esscirc.2015.7313913

  654. An integrated carbon dioxide sensor based on ratiometric thermal-conductivity measurement
    Z. Cai; van R. H. M. Veldhoven; A. Falepin; H. Suy; E. Sterckx; K. A. A. Makinwa; M. A. P. Pertijs;
    In Proc. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    IEEE, pp. 622‒625, June 2015. DOI: 10.1109/transducers.2015.7181000

  655. Low-power receive electronics for a miniature real-time 3D ultrasound probe
    M. Pertijs; C. Chen; S. Raghunathan; Z. Yu; M. ShabaniMotlagh; Z. Chen; Z. Y. Chang; E. Noothout; S. Blaak; J. Ponte; C. Prins; H. Bosch; M. Verweij; N. de Jong;
    In Proc. IEEE International Workshop on Advances in Sensors and Interfaces (IWASI),
    IEEE, pp. 235‒238, June 2015. invited paper. DOI: 10.1109/iwasi.2015.7184963

  656. A generic read-out circuit for resistive transducers
    B. Yousefzadeh; U. Sonmez; N. Mehta; J. Borremans; M. A. P. Pertijs; K. A. A. Makinwa;
    In Proc. IEEE International Workshop on Advances in Sensors and Interfaces (IWASI),
    IEEE, pp. 122‒125, June 2015. DOI: 10.1109/iwasi.2015.7184929

  657. A 30ppm <80nJ ring-down-based readout circuit for resonant sensors
    H. Jiang; Z. Y. Chang; M. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 482‒483, February 2015. DOI: 10.1109/ISSCC.2015.7063136
    Abstract: ... A readout circuit for MEMS resonant sensors, realized in 0.35μm CMOS, employs a dynamically-switching level-crossing detector to determine resonance frequency and quality factor from a single ring-down transient. Results obtained with three different resonators are in good agreement conventional impedance analysis. The circuit achieves a frequency resolution better than 30 ppm while consuming less than 80 nJ/meas from a 1.8V supply, 7.8x less than the state-of-the-art.

  658. A 0.05mm² 1V capacitance-to-digital converter based on period modulation
    Y. He; Z. Y. Chang; L. Pakula; S. H. Shalmany; M. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 486‒487, February 2015. DOI: 10.1109/ISSCC.2015.7063138
    Abstract: ... This paper presents a digitally assisted period modulation (PM)-based capacitance-to-digital converter (CDC) that is >9× smaller than prior CDCs with >10b resolution, and improves the energy efficiency by >10× compared to previous PM-based CDCs. This is achieved with the help of a piece-wise charge transfer technique that eliminates the need for a large on-chip integration capacitor, a dual-integration-capacitor scheme that reduces the front-end noise contribution, a sampled-biasing technique that reduces the noise of the integration current, and a current-efficient inverter-based design.

  659. A mixed-signal multiplexing system for cable-count reduction in ultrasound probes
    Q. Liu; C. Chen; Z. Y. Chang; C. Prins; M. A. P. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1‒4, October 2015. DOI: 10.1109/ultsym.2015.0141
    Abstract: ... This paper presents an approach to time-multiplexing multiple receive signals in a miniature ultrasound probe onto a single micro-coaxial cable. The resulting reduction in the number of receive cables alleviates the design of high-element-count endoscope- or catheter-based ultrasound probes. A prototype multiplexing system is presented that employs a custom multiplexing chip that uses current-mode drivers to combine four receive channels, sampled at 25 MHz each, on a single 3-m micro-coaxial cable. On the system-side of the cable, a transimpedance amplifier turns the multiplexed signal back into a voltage, after which it is digitized and equalized to correct for channel-to-channel crosstalk due to non-idealities of the cable. The chip has been implemented in a 0.18 μm CMOS process and consumes less than 1 mW per input channel. Experimental results show that the system can successfully convey 6 MHz Gaussian-shaped pulses applied to the four input channels of the multiplexing chip to the system with a channel-to-channel crosstalk below -31 dB.

  660. A single-cable PVDF transducer readout IC for intravascular photoacoustic imaging
    C. Chen; V. Daeichin; Q. Ding; G. van Soest; G. Springeling; T. van der Steen; M. Pertijs; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1‒4, October 2015. DOI: 10.1109/ultsym.2015.0142
    Abstract: ... This paper presents a custom-designed single-cable readout IC for the reception of the broadband photoacoustic (PA) signal in intravascular photoacoustic (IVPA) imaging. The readout IC is intended for direct integration behind a broadband polyvinylidene fluoride (PVDF) transducer in an IVPA catheter tip to match the impedance between the small PVDF element and the connecting cable. The capability of the readout IC to work with a single cable that combines the output signal and the power supply ensures the mechanical flexibility of the IVPA catheter. Electrical measurements show that the readout IC provides a flat frequency response from 1 MHz to 20 MHz with a 6 mA external current supply. The acoustical measurements involving the readout IC and the PVDF transducer demonstrate a 60 dB dynamic range, a sensitivity of 3.8 μV/Pa at 2.25 MHz, and a broad receiving bandwidth from 2 MHz to 15 MHz.

  661. A 66 dB SNDR pipelined split-ADC using class-AB residue amplifier with analog gain correction
    M. S. Akter; R. Sehgal; F. van der Goes; K. Bult;
    In proc. ESSCIRC,
    pp. 315-318, 2015. DOI: 10.1109/ESSCIRC.2015.7313890

  662. Magnetic microfluidic platform for biomedical applications using magnetic nanoparticles
    Stipsitz, Martin; Kokkinis, Georgios; Gooneratne, Chinthaka; Kosel, Jurgen; Cardoso, Susana; Cardoso, Filipe Arroyo; Giouroudi, Ioanna;
    In Key Engineering Materials,
    Trans Tech Publications Ltd, pp. 207-210, 2015.

  663. GMR microfluidic biosensor for low concentration detection of Nanomag-D beads
    Devkota, J; Kokkinis, G; Jamalieh, M; Phan, MH; Srikanth, H; Cardoso, S; Cardoso, Filipe Arroyo; Giouroudi, Ioanna;
    In Bio-MEMS and Medical Microdevices II,
    SPIE, pp. 167-173, 2015.

  664. Eddy current testing with high-spatial resolution probes using MR arrays as receiver
    Pelkner, Matthias; Pohl, Rainer; Erthner, Thomas; Stegemann, Robert; Kreutzbruck, Marc, Sergeeva-Chollet, Natalia, Cardoso, Filipe Arroyo et al;
    In 7th International symposium on NDT in aerospace (Proceedings),
    Deutsche Gesellschaft f{\"u}r Zerst{\"o}rungsfreie Pr{\"u}fung ev (DGZfP), pp. We-5, 2015.

  665. A 2800-µm² Thermal-Diffusivity Temperature Sensor with VCO-Based Readout in 160-nm CMOS
    Jan Angevare; Lorenzo Pedalà; Ugur Sonmez; Fabio Sebastiano; Kofi A.A. Makinwa;
    In Asian Solid-state Circuits Conference Digest of Technical Papers,
    Xiamen, China, pp. 1-4, Nov 2015. DOI: 10.1109/ASSCC.2015.7387444
    Keywords: ... CMOS digital integrated circuits;analogue-digital conversion;computerised monitoring;digital readout;temperature sensors;thermal diffusivity;voltage-controlled oscillators;VCO-based phase-domain ADC;VCO-based readout;bulk silicon;digital circuitry;highly digital temperature sensor;microprocessors;size 160 nm;standard CMOS process;systems-on-chip;temperature -35 degC to 125 degC;temperature-dependent thermal diffusivity;thermal monitoring;CMOS integrated circuits;CMOS process;Heating;Radiation detectors;Temperature measurement;Temperature sensors.

    Abstract: ... A highly digital temperature sensor based on the temperature-dependent thermal diffusivity of bulk silicon has been realized in a standard 160-nm CMOS process. The sensor achieves an inaccuracy of �2.9�C (3a) from -35�C to 125�C with no trimming and �1.2�C (3a) after a single-point trim, while achieving a resolution of 0.47�C (rms) at 1 kSa/s. Its compact area (2800 �m2) is enabled by the adoption of a VCO-based phase-domain ADC. Since 53% of the sensor area is occupied by digital circuitry, the sensor can be easily ported to more advanced CMOS technologies with further area reduction, which makes it well suited for thermal monitoring in microprocessors and other systems-on-chip.

  666. A 25mW Smart CMOS Wind Sensor with Corner Heaters
    Wouter Brevet; Fabio Sebastiano; Kofi A.A. Makinwa;
    In 41st Annual Conference of IEEE Industrial Electronics Society,
    Yokohama, Japan, pp. 001194-001199, Nov 2015. DOI: 10.1109/IECON.2015.7392262
    Keywords: ... CMOS integrated circuits;heating;intelligent sensors;wind power;wires (electric);corner heater;logic on-chip;power 25 mW;sensor bitstream output off-chip decimation;sensor chip thermal design;size 0.7 mum;smart CMOS thermal wind sensor;standard CMOS process;Clocks;Frequency modulation;Heating;Thermal sensors;Wind speed;Electrothermal filter (ETF);Smart wind sensor;Thermal sensors;thermal sigma-delta modulatiom.

    Abstract: ... A smart CMOS thermal wind sensor has been optimized for commercial use. Optimizing the sensor chip's thermal design resulted in better area efficiency and improved thermal dynamics with respect to prior work. The latter simplifies the off-chip decimation of the sensor's bitstream outputs. Moreover, by realizing more logic on-chip, the number of bond wires has been reduced by 33%, to 8, thus reducing manufacturing costs. Fabricated in a standard 0.7�m CMOS process, the sensor chip occupies 4�4mm2 and consumes 25mW of heating power, while achieving an inaccuracy of �6% (speed) and �2� (direction), for wind speeds between 4 and 25m/s.

  667. A Highly-Scalable Thermal-Diffusivity-Based Temperature Sensor
    J. Angevare;
    MSc thesis, Delft University of Technology, 12 2015.

  668. Area-Efficient Readout IC with High Panel Noise Rejection for Capacitive Touchscreens
    R. Bacchu Raghav;
    MSc thesis, Delft University of Technology, 12 2015. cum laude.

  669. A Low-Power CMOS Wind Sensor with Corner Heaters
    W. Brevet;
    MSc thesis, Delft University of Technology, 11 2015.

  670. A High Resolution Resistor-Based Temperature Sensor
    Y. Luo;
    MSc thesis, Delft University of Technology, 10 2015.

  671. A CMOS Bandgap Temperature sensor for Cryogenic Applications
    O. Eniola;
    MSc thesis, Delft University of Technology, 12 2015.

  672. A high-resolution self-timed zero-crossing-based Incremental Delta-Sigma ADC
    Giorgos Karykis;
    MSc thesis, Delft University of Technology, May 2015.
    document

  673. Combined Capacitance and Temperature to Digital Converter
    Revanth Bellamkonda;
    MSc thesis, Delft University of Technology, December 2015.
    document

  674. A 9-bit 33MHz Hybrid SAR Single-slope ADC
    Weihan Hu;
    MSc thesis, Delft University of Technology, December 2015.
    document

  675. Integrated Readout Circuit for Cross-Correlation Based Ultrasonic Ranging
    Nikola Radeljic-Jakic;
    MSc thesis, Delft University of Technology, December 2015.
    document

  676. A Mixed-Signal Multiplexing System for Cable-Count Reduction in Ultra-sound Probes
    Qilong Liu;
    MSc thesis, Delft University of Technology, March 2015.
    document

  677. Fully Capacitive Coupled Input Choppers
    J.H. Huijsing, Q. Fan; K.A.A. Makinwa;
    Patent, US 9,143,092, September 2015.

  678. Temperature sensor for a leadless cardiac pacemaker
    M. A. P. Pertijs; K. J. Carroll;
    Patent, United States 9,060,692, June 2015.

  679. Metal Shunt Resistor
    D. Draxelmayr; S. Shalmany; K. Makinwa;
    Patent, 20170074912, 9 2015.

  680. Automatic Common-mode Rejection Calibration
    Fabio Sebastiano; Lucien J. Breems; Raf Roovers;
    Patent, Europe 2195922 B1, March 2015.

  681. A/D converter input stage providing high linearity and gain matching between multiple channels
    Robert H.M. van Veldhoven; Fabio Sebastiano;
    Patent, United Sates 9154149 B2, October 2015.

  682. Design, fabrication and characterization of infrared LVOFs for measuring gas composition
    M. Ghaderi; N.P. Ayerden; A. Emadi; P. Enoksson; J.H. Correia; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 24, Issue 8, pp. 1-8, 2014.

  683. Gas viscosity sensing based on the electrostatic pull-in time of microactuators
    R.A. Dias; G. de Graaf; R.F. Wolffenbuttel; L.A. Machado da Rocha;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 216, pp. 376-385, 2014.

  684. A continuous-time ripple reduction technique for spinning-current Hall sensors
    J. Jiang; W.J. Kindt; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 49, Issue 7, pp. 1525-1534, 2014. Harvest.

  685. High-speed broadband FTIR system using MEMS
    N.P. Ayerden; U. Aygun; S.T.S. Holmstrom; S. Olcer; B. Can; J.L. Stehle; H. Urey;
    Applied Optics,
    Volume 53, Issue 31, pp. 7267-7272, 2014. Harvest.

  686. Plenoptic wavefront sensor with scattering pupil
    G.V. Vdovin; O.A. Soloviev; M. Loktev;
    Optics Express,
    Volume 22, Issue 8, pp. 9314-9323, 2014. NEO.

  687. Measuring in the subnanometer range: Capacitive and eddy current nanodisplacement sensors
    S. Nihtianov;
    IEEE Industrial Electronics Magazine,
    Volume 8, Issue 1, pp. 6-15, 2014. Harvest.

  688. Waveguide structures for efficient evanescent field coupling to zero mode waveguides
    M. Sarkar; A.J.H. Wachters; H.P. Urbach; JJ.H.B. Schleipen; P.J. van der Zaag; R. Wimberger-Friedl;
    Journal of the European Optical Society - Rapid Publications,
    Volume 9, pp. 1-10, 2014.

  689. A wearable 8-channel active-electrode EEG/ETI acquisition system for body area networks
    J. Xu; S. Mitra; A. Matsumoto; S. Patki; C. van Hoof; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 49, Issue 9, pp. 2005-2016, 2014. Harvest Available online 12-6-2014.

  690. Highly-stable electronic sensor interface for capacitive position measurement
    R. Nojdelov; S. Nihtianov;
    Key Engineering Materials,
    Volume 613, pp. 51-57, 2014. Harvest Chapter 2: Position & Displacement Metrology.

  691. Numerical gas flow and heat transfer simulation in the ASM Epsilon 2000 CVD reactor for Pure Boron deposition
    V. Mohammadi; S. Mohammadi; S. Ramesh; S. Nihtianov;
    Annual Journal of Electronics,
    Volume 8, pp. 28-31, 2014.

  692. High efficiency UV photodiodes fabricated on p-type substrate
    P. Ramachandra Rao; S. Milosavljevic; U. Kroth; C. Laubis; S. Nihtianov;
    Annual Journal of Electronics,
    Volume 8, pp. 24-27, 2014.

  693. Recoding of the stop codon UGA to glycine by a BD1-5/SN-2 bacterium and niche partitioning between Alpha- and Gammaproteobacteria in a tidal sediment microbial community naturally selected in a laboratory chemostat
    A. Hanke; E. Hamann; R. Sharma; J. Geelhoed; T. Hargesheimer; B. Kraft; V. Meyer; S. Lenk; H Osmers; R. Wu; K.A.A. Makinwa; RL Hettich; JF Banfield; HE Tegetmeyer; Marc Strous;
    Frontiers in Microbiology,
    Volume 5, Issue art. 231, pp. 1-17, 2014.

  694. A miniaturized micro-digital sun sensor by means of low-power low-noise CMOS imager
    N. Xie; A.J.P. Theuwissen;
    IEEE Sensors Journal,
    Volume 14, Issue 1, pp. 96-103, 2014.

  695. Highlights of the ISSCC 2013 Processors and High Performance Digital Sessions
    T. Fischer; B. G. Nam; L. Chang; T. Kuroda; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 49, Issue 1, pp. 4‒8, 2014. DOI: 10.1109/jssc.2013.2284658
    Abstract: ... This special issue covers the ISSCC conference held in San Francisco, CA, USA, on February 17-21, 2013. The issue includes the topics from the low power and high performance digital, memory, and technology directions as well as imagers, medical and sensors. There are 27 papers in the issue.

  696. Magnetic tunnel junction based eddy current testing probe for detection of surface defects
    Cardoso, Filipe Arroyo; Rosado, L; Ferreira, R; Paz, E; Cardoso, S; Ramos, PM; Piedade, M; Freitas, PP;
    Journal of Applied Physics,
    Volume 115, Issue 17, pp. 17E516, 2014.

  697. Microfluidics for the rapid detection of pathogens using giant magnetoresistance sensors
    Kokkinis, Georgios; Cardoso, Susana F; Cardoso, Filipe Arroyo; Giouroudi, Ioanna;
    IEEE Transactions on Magnetics,
    Volume 50, Issue 11, pp. 1-4, 2014.

  698. A bacteriophage detection tool for viability assessment of Salmonella cells
    Fernandes, E; Martins, VC; Nóbrega, Cláudia; Carvalho, CM; Cardoso, Filipe Arroyo; Cardoso, S; Dias, J; Deng, D; Kluskens, LD; Freitas, PP; others;
    Biosensors and Bioelectronics,
    Volume 52, pp. 239-246, 2014.

  699. MgO-based magnetic tunnel junction sensors array for non-destructive testing applications
    Guo, DW; Cardoso, Filipe Arroyo; Ferreira, R; Paz, E; Cardoso, S; Freitas, PP;
    Journal of Applied Physics,
    Volume 115, Issue 17, pp. 17E513, 2014.

  700. An in-depth noise model for giant magnetoresistance current sensors for circuit design and complementary metal-oxide-semiconductor integration
    Roldán, A; Roldán, JB; Reig, C; Cardoso, S; Cardoso, Filipe Arroyo; Ferreira, R; Freitas, PP;
    Journal of Applied Physics,
    Volume 115, Issue 17, pp. 17E514, 2014.

  701. Eddy currents testing probe with magneto-resistive sensors and differential measurement
    Rosado, Luis S; Cardoso, Filipe Arroyo; Cardoso, Susana; Ramos, Pedro M; Freitas, Paulo P; Piedade, Moisés;
    Sensors and Actuators A: Physical,
    Volume 212, pp. 58-67, 2014.

  702. Lab-on-chip cytometry based on magnetoresistive sensors for bacteria detection in milk
    Fernandes, Ana C; Duarte, Carla M; Cardoso, Filipe Arroyo; Bexiga, Ricardo; Cardoso, Susana; Freitas, Paulo P;
    Sensors,
    Volume 14, Issue 8, pp. 15496-15524, 2014.

  703. Improved magnetic tunnel junctions design for the detection of superficial defects by eddy currents testing
    Cardoso, Filipe Arroyo; Rosado, Luís S; Franco, Fernando; Ferreira, Ricardo; Paz, Elvira; Cardoso, Susana F; Ramos, Pedro M; Piedade, Moises; Freitas, Paulo JP;
    IEEE Transactions on Magnetics,
    Volume 50, Issue 11, pp. 1-4, 2014.

  704. Dynamical detection of magnetic nanoparticles in paper microfluidics with spin valve sensors for point-of-care applications
    Chicharo, Alexandre; Cardoso, Filipe Arroyo; Cardoso, Susana; Freitas, Paulo P;
    IEEE Transactions on Magnetics,
    Volume 50, Issue 11, pp. 1-4, 2014.

  705. Customized design of magnetic beads for dynamic magnetoresistive cytometry
    Vila, Ana; Martins, Veronica C; Chícharo, Alexandre; Rodriguez-Abreu, Carlos; Fernandes, Ana Carolina; Cardoso, Filipe Arroyo; Cardoso, Susana; Rivas, Jose; Freitas, Paulo;
    IEEE Transactions on Magnetics,
    Volume 50, Issue 11, pp. 1-4, 2014.

  706. Integrated polarization analyzing CMOS image sensors for detection and signal processing
    M. Sarkar; A.J.P. Theuwissen;
    S. Nihtianov; A Luque (Ed.);
    Woodhead Publishing Limited, , 2014. Book title : Integrated polarization analyzing CMOS image sensors for detection and signal processing.

  707. Smart sensor systems: Emerging technologies and applications
    G. Meijer; K. Makinwa; M. Pertijs;
    John Wiley \& Sons, , 2014.
    Abstract: ... With contributions from an internationally-renowned group of experts, this book uses a multidisciplinary approach to review recent developments in the field of smart sensor systems, covering important system and design aspects. It examines topics over the whole range of sensor technology from the theory and constraints of basic elements, physics and electronics, up to the level of application-orientated issues.

    document

  708. CMOS Image Sensors
    Albert Theuwissen;
    G. Meijer, M. Pertijs; K. Makinwa (Ed.);
    John Wiley \& Sons, , pp. 173-189, 2014. Book title : Smart Sensor Systems : Emerging Technologies and Applications.

  709. Optimal diffraction-limited focusing through static aberrations
    G.V. Vdovin; V. Patlan; O.A. Soloviev;
    TE Lizotte; A Forbes (Ed.);
    SPIE, , pp. 91940E-1-9194, 2014. NEO.

  710. Time-Domain Techniques for mm-Wave Frequency Generation
    K.A.A. Makinwa;
    P. Harpe; A Baschirotto; K.A.A. Makinwa (Ed.);
    Springer, , pp. 341-360, 2014.

  711. Time-Domain Signal Processing
    K.A.A. Makinwa;
    P. Harpe; A Baschirotto; K.A.A. Makinwa (Ed.);
    Springer, , pp. 297-298, 2014.

  712. Calibration and Self-Calibration of Smart Sensors
    M. Pertijs;
    In Smart Sensor Systems: Emerging Technologies and Applications,
    John Wiley \& Sons, May 2014.
    Abstract: ... Smart sensors acquire information about a non-electrical quantity of interest (the measurand) and convert this information to a useful electrical output signal. In order to do so, they combine a sensing element and the associated interface electronics on a single chip or in a single package. The sensing element performs the conversion from the non-electrical domain of the measurand to an electrical signal, while the interface electronics further process this signal to produce an output that can readily be used in a measurement or control system. Errors introduced in these steps affect the performance and reliability of the overall system. Therefore, it is very important to determine how large these errors are. The process of doing so is generally referred to as calibration, and is the topic of this chapter.

    document

  713. Dedicated Impedance-Sensor Systems
    G. Meijer; X. Li; B. Iliev; G. Pop; Z. Y. Chang; S. Nihtianov; Z. Tan; A. Heidari; M. Pertijs;
    In Smart Sensor Systems: Emerging Technologies and Applications,
    John Wiley \& Sons, May 2014.
    Abstract: ... Impedance sensors can be defined as being a set of electrodes which can be used to measure electrical properties of materials or structures. Once these properties are known, it appears that the features of measurements performed with such sensors depend for a large part on the properties of the material or structure to be characterized and only partly on the characteristics of the electrodes. The electrical properties of the sensor in its application can be modeled with passive elements in equivalent electrical circuits. The challenging task for the designer is to make such a sensor system sensitive for the measurands and to obtain immunity for other parameters. In this chapter, we consider impedance sensors to be sensors in a certain measurement environment, and that in the electric model presentation of this setup there is at least one resistive or one reactive component of interest which has to be measured.

    document

  714. Design, fabrication and characterization of LVOF-based IR microspectrometers
    N.P. Ayerden; M. Ghaderi; M.F. Silva; A. Emadi; P. Enoksson; J.H. Correia; G. de Graaf; R.F. Wolffenbuttel;
    In H Thienpont; J Mohr; H Zappe; H Nakajima (Ed.), Proceedings of SPIE Photonics Europe, vol. 9130,
    SPIE, pp. 91300T-91300T-1, 2014.

  715. Design and fabrication of multiple airgap-based visible filters
    M. Ghaderi; R.F. Wolffenbuttel;
    In H Thienpont; J Mohr; H Zappe; H Nakajima (Ed.), Proceedings of SPIE Photonics Europe, vol. 9130,
    SPIE, pp. 913005-913005-8, 2014.

  716. A blue optical filter for narrow-band imaging in endoscopic capsules
    M.F. Silva; M. Ghaderi; Luis Miguel Goncalves; G. de Graaf; R.F. Wolffenbuttel; J.H.G. Correia;
    In J Popp; VV Tuchin; DL. Matthews; FS Pavone (Ed.), Proceedings of SPIE Photonics Europe, vol. 9129,
    SPIE, pp. 912915-912915-8, 2014.

  717. Design of a Miniature Ultrasound Probe for 3D Transesophageal Echocardiography
    D. Bera; S. B. Raghunathan; C. Chen; S. Blaak; C. Prins; M. A. P. Pertijs; M. D. Verweij; J. G. Bosch; N. de Jong;
    In Annual Sensor Technology Workshop Sense of Contact,
    The Netherlands, April 2014.

  718. Capacitive sensor interface with improved dynamic range and stability
    R. Nojdelov; S. Nihtianov;
    In JC Miguez; D Slomovitz (Ed.), Proc. of the IEEE International Instrumentation and Measurement Technology Conference,
    IEEE, pp. 1373-1376, 2014. Harvest.

  719. Error analysis of a charge-balancing capacitive sensor interface with resistive reference
    R. Yang; S. Nihtianov;
    In O Kaynak (Ed.), Proc. of the 23rd IEEE International Symposium on Industrial Electronics,
    IEEE, pp. 274-280, 2014. Harvest.

  720. Capacitance-to-digital converter for accurate displacement measurement in the sub-nanometre range
    R. Nojdelov; S. Nihtianov; A. Yacoot; D. Voigt;
    In P Daponte (Ed.), Proc. of the 20th IMEKO TC4 Symposium on Measurements of Electrical Quantities: Research on Electrical and Electronic Measurement for the Economic Upturn,
    IMEKO, pp. 347-352, 2014. Harvest Together with 18th TC4 International Workshop on ADC and DCA Modeling and Testing, IWADC 2014.

  721. Noise analysis and characterization of a charge-balancing-based capacitive sensor interface with a resistive reference
    R. Yang; S. Nihtianov;
    In JC Miguez; D Slomovitz (Ed.), Proc. of the IEEE International Instrumentation and Measurement Technology Conference,
    IEEE, pp. 1182-1186, 2014. Harvest.

  722. Stability of the micromachined membrane deformable mirror as a freeform optical element
    G.V. Vdovin; O.A. Soloviev; S. Patlan;
    In {Groot Gregory}, G; AJ Davis (Ed.), Novel Optical Systems Design and Optimization XVII,
    SPIE, pp. 91930L-1-9193, 2014. NEO.

  723. An energy-efficient reconfigurable readout circuit for resonant sensors based on ring-down measurement
    Y. Yan; Z. Zeng; C. Chen; H. Jiang; Z. Y. Chang; D. M. Karabacak; M. A. P. Pertijs;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 221‒224, October 2014. DOI: 10.1109/icsens.2014.6984973

  724. A BJT-based CMOS temperature sensor with a 3.6pJ·K2-resolution FoM
    A. Heidary; Guijie Wang; K.A.A. Makinwa; G.C.M. Meijer;
    In LC Fujino; {Anderson et al}, J (Ed.), Digest of Technical Papers - 2014 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 224-225, 2014. Harvest Session 12. Sensors, Mems, and Displays 12.8.

  725. A CMOS Smart Temperature Sensor with duty-cycle-modulated output
    Guijie Wang; A. Heidari; G.C.M. Meijer;
    In s.n (Ed.), Proceedings of Sense of Contact 2014,
    s.n., pp. 1-2, 2014.

  726. Backside illuminated CMOS image sensors for extreme ultraviolet applications
    P. Ramachandra Rao; C. Laubis; S. Nihtianov;
    In FJ Arregui (Ed.), Proc. of the IEEE Sensors conference,
    IEEE, pp. 1660-1663, 2014.

  727. A resistor-based temperature sensor for a real time clock with ±2ppm frequency stability
    P. Park; K.A.A. Makinwa; D. Ruffieux;
    In P Andreani; A Bevilacqua; G Meneghesso (Ed.), Proceedings of the 40th European Solid-State Circuit Conference,
    IEEE, pp. 391-394, 2014. Harvest.

  728. A 60nV/Hz 15-channel digital active electrode system for portable biopotential signal acquisition
    J. Xu; B. Busze; H. Kim; K.A.A. Makinwa; C. van Hoof; R.F. Yazicioglu;
    In LC Fujino; J Anderson; D Dunwell; V Gaudet; G Gulak; J Haslett; S Mirabbasi; K Pagiamtzis; KC. Smith (Ed.), Digest of Technical papers - 2014 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 424-425, 2014. Harvest Session 24. Integrated Biomedical Systems 24.7.

  729. A 0.85V 600nW All-CMOS temperature sensor with an inaccuracy of ±0.4°C (3σ) from -40 to 125°C
    K. Souri; Y. Chae; F. Thus; K.A.A. Makinwa;
    In LC Fujino; J Anderson; D Dunwell; V Gaudet; G Gulak; J Haslett; S Mirabbasi; K Pagiamtzis; KC. Smith (Ed.), Digest of Technical papers - 2014 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 222-223, 2014. Harvest Session 12. Sensors, Mems, and Displays 12.7.

  730. A 1.55×0.85mm2 3ppm 1.0μA 32.768kHz MEMS-based oscillator
    S.Z. Asl; S. Mukherjee; W. Chen; Kimo Joo; R. Palwai; N. Arumugam; P. Galle; M. Phadke; C Grosjean; J.C. Salvia; H Lee; S Pamarti; TS Fiez; K.A.A. Makinwa; A. Partridge; V. Menon;
    In LC Fujino; J Anderson; {et al} (Ed.), Digest of Technical Papers - 2014 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 226-227, 2014. Harvest Session 12. Sensors, MEMS and Displays 12.9.

  731. RF self-interference cancellation for full-duplex
    B. van Liempd; B. Debaillie; J. Craninckx; C. Lavini; C. Palacios; S. Malotaux; J.R. Long; D.J. van den Broek; E.A.M. Klumperink;
    In S Glisic; M Latva-aho; L DaSilva (Ed.), Proceedings 2014 9th International Conference on Cognitive Radio Oriented Wireless Networks and Communications,
    IEEE, pp. 526-531, 2014. Harvest.

  732. A dual-notch +27dBm Tx-power electrical-balance duplexer
    B. van Liempd; J. Craninckx; R. Singh; P. Reynaert; S. Malotaux; J.R. Long;
    In P Andreani; A Bevilacqua; G Meneghesso (Ed.), Proceedings of the 40th European Solid-State Circuit Conference,
    IEEE, pp. 463-466, 2014. Harvest.

  733. A Lossy Fabry-perot Based Optical Filter for Natural Gas Analysis
    Ayerden, NP; Ghaderi, M; De Graaf, G; Wolffenbuttel, RF;
    In Procedia Engineering (Proceedings of the 28th Eurosensors Conference), vol. 87,
    Elsevier, pp. 1410-1413, 2014.

  734. Optical filter for providing the required illumination to enable narrow band imaging
    Silva, MF; Rodrigues, JA; Oliveira, MJ; Fernandes, AR; Pereira, S; Costa, CG; Ghaderi, M; Ayerden, P; Goncalves, LM; De Graaf, G; others;
    In Procedia Engineering (Proceedings of the 28th Eurosensors Conference), vol. 87,
    Elsevier, pp. 1414-1417, 2014.

  735. Surface-micromachined bragg reflectors based on multiple airgap/sio2 layers for cmos-compatible fabry-perot filters in the uv-visible spectral range
    Ghaderi, M; Ayerden, NP; De Graaf, G; Wolffenbuttel, RF;
    In Procedia Engineering (Proceedings of the 28th Eurosensors Conference), vol. 87,
    Elsevier, pp. 1533-1536, 2014.

  736. Optical filter for providing the required illumination to enable narrow band imaging
    M.F. Silva; J.A. Rodrigues; M.J. Oliveira; A.R. Fernandes; S. Pereira; C.G. Costa; M. Ghaderi; P. Ayerden; L.M. Goncalves; G. de Graaf; R.F. Wolffenbuttel; J.H. Correia;
    In Procedia Engineering (Proceedings of the 28th Eurosensors Conference), vol. 87,
    Elsevier, pp. 1414-1417, 2014.

  737. A 0.07mm² 2-Channel Instrumentation Amplifier with 0.1% Gain Matching in 0.16µm CMOS
    Fabio Sebastiano; Federico Butti; Robert H.M. van Veldhoven; Paolo Bruschi;
    In International Solid-state Circuits Conference Digest of Technical Papers,
    San Francisco, CA, pp. 294 - 295, February9--13 2014. DOI: 10.1109/ISSCC.2014.6757440
    Keywords: ... CMOS integrated circuits;instrumentation amplifiers;2-channel instrumentation amplifier;CMOS;DEM scheme;IA;angular sensors;cosine outputs;cost-constrained automotive applications;dynamic element matching scheme;gain matching;high chopping frequency;multichannel sensor outputs;resistive magnetic sensor;sensor front-ends;sensor operation;size 0.16 mum;voltage 17 muV;Accuracy;CMOS integrated circuits;Gain measurement;Instruments;Noise measurement;Solid state circuits;Switches.

    Abstract: ... Extremely small-area sensor front-ends are required for cost-constrained automotive applications. Instrumentation amplifiers (IA) for such front-ends must process multi-channel sensor outputs and provide gain matching over the channels for proper sensor operation. Angular sensors are a typical example, in which the sine and cosine outputs of a resistive magnetic sensor must be processed with adequate gain matching to avoid unacceptable angular errors. This paper presents a 2-channel instrumentation amplifier in 0.16µm CMOS with 0.1% gain matching and occupying 0.035mm2 per channel. This represents a 13.3x area improvement with respect to state-of-the-art designs with similar gain accuracy [1]-[4], while maintaining low noise (18.7nV/√Hz), low offset (17µV) and high power efficiency (NEF=12.9). The accurate gain matching in a limited area is enabled by the adoption of a dynamic element matching (DEM) scheme and by the use of a high chopping frequency.

  738. A 0.008-mm² area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring
    Ugur Sonmez; Rui Quan; Fabio Sebastiano; Kofi. A. A. Makinwa;
    In Proc. European Solid-State Circuits Conference,
    Venice, Italy, pp. 395-398, September22--26 2014. DOI: 10.1109/ESSCIRC.2014.6942105
    Keywords: ... CMOS integrated circuits;system-on-chip;temperature measurement;temperature sensors;thermal diffusivity;SoC thermal monitoring;area-optimized thermal-diffusivity-based temperature sensor;bulk silicon;microprocessors;size 160 nm;standard CMOS process;systems-on-chip;temperature-dependent thermal diffusivity;thermal monitoring;Accuracy;Heating;System-on-chip;Temperature measurement;Temperature sensors.

    Abstract: ... An array of temperature sensors based on the temperature-dependent thermal diffusivity of bulk silicon has been realized in a standard 160-nm CMOS process. The sensors achieve an inaccuracy of ±2.4 °C (3σ) from -40 to 125 °C with no trimming and ±0.65 °C (3σ) with a one temperature trim. Each sensor occupies 0.008 mm², and achieves a resolution of 0.21 °C (rms) at 1 kSa/s. This combination of accuracy, speed, and small size makes such sensors well suited for thermal monitoring in microprocessors and other systems-on-chip.

  739. In-air ultrasonic gesture sensing with MEMS microphones
    D. M. van Willigen; E. Mostert; M. A. P. Pertijs;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 90‒93, October 2014. DOI: 10.1109/icsens.2014.6984940

  740. An eddy-current displacement-to-digital converter based on a ratio-metric delta-sigma ADC
    A. Fekri; M. Nabavi; N. Radeljic-Jakic; Z. Y. Chang; M. Pertijs; S. Nihtianov;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 403‒406, September 2014. DOI: 10.1109/esscirc.2014.6942107

  741. Capacitive sensor interface with precision references
    R. Yang; M. A. P. Pertijs; S. Nihtianov; P. Haak;
    In Proc. IEEE International Conference on Industrial Technology (ICIT),
    IEEE, pp. 358‒390, March 2014. DOI: 10.1109/icit.2014.6894896

  742. Design of a miniature ultrasound probe for 3D transesophageal echocardiography
    S. B. Raghunathan; D. Bera; C. Chen; S. Blaak; C. Prins; M. A. P. Pertijs; J. G. Bosch; N. de Jong; M. D. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 2091‒2094, September 2014. DOI: 10.1109/ultsym.2014.0521
    Abstract: ... The relatively large size of most of the current 3D Transesophageal Echocardiography probes (TEE) enables their usage in adults for short procedures only. In this paper, we propose a new miniature 3D TEE probe with a head volume of 1 cm3, that would be suitable for use in neonates or for prolonged transnasal use in adults. We focus on partitioned designs, in which a minority of transmit elements is directly wired out and the majority of receive elements connect to a limited number of receive cables via an ASIC that performs a nine-fold data reduction in receive mode. The designs are motivated based on the pressure and beam width of the transmitted field, and the resolution, grating lobes and side lobes in the received field.

  743. Detection of micrometric surface defects in titanium using magnetic tunnel junction sensors
    Rosado, LS; Cardoso, Filipe Arroyo; Franco, F; Ferreira, R; Paz, E; Cardoso, S; Ramos, PM; Freitas, PP; Piedade, M;
    In Proceedings of the 11th European Conference on Non-Destructive Testing (ECNDT’14),
    2014.

  744. Results of MR based ET probes for buried flaw detection over different metallic materials
    Ribes, Belén; SERGEEVA-CHOLLET, Natalia; CARDOSO, Filipe Arroyo; BRAGADO, Leticia; FERMON, Claude; CARDOSO, Susana; FREITAS, Paulo P; PIEDADE, Moisés S; ROSADO, Luis;
    In 11th European Conference on Non-Destructive Testing (ECNDT 2014),
    pp. 6-10, 2014.

  745. Giant Magnetoresistance (GMR) sensors for 0.35 $\mu$m CMOS technology sub-mA current sensing
    de Marcellis, Andrea; Reig, C; Cubells, MD; Madrenas, J; Cardoso, Filipe Arroyo; Cardoso, S; Freitas, PP;
    In SENSORS, 2014 IEEE,
    IEEE, pp. 444-447, 2014.

  746. Microfluidic Diagnostic System for the Rapid Detection of Pathogens using Giant Magnetoresistance Sensors
    Kokkinis, G; Cardoso, Susana F; Cardoso, Filipe Arroyo; Giouroudi, Ioanna;
    In Book of Abstracts,
    pp. 3388-3389, 2014.

  747. Magnetic-Based Biomolucule Detection using GMR Sensors
    Kokkinis, G; Jamalieh, Murad Aziz; Cardoso, Filipe Arroyo; Cardoso, Susana F; Keplinger, Franz; Giouroudi, Ioanna;
    In Abstracts,
    pp. 422, 2014.

  748. Characterization of the Piezojunction Effect in an Industrial 130nm Process
    P. ‘t Hart;
    MSc thesis, Delft University of Technology, 12 2014.

  749. A Highly-Digital Smart Thermal-Diffusivity-Based Temperature Sensor
    R. Quan;
    MSc thesis, Delft University of Technology, 10 2014. cum laude.

  750. A Zoom ADC for dynamic signals
    B. Gonen;
    MSc thesis, Delft University of Technology, 10 2014. cum laude.

  751. A Low Power System-on-Chip with Memory Stacked on Top of Logic
    K. Blutman;
    MSc thesis, Delft University of Technology, 10 2014. cum laude.

  752. Development and optimization of an ultra low power excitation research algorithm for gas sensor
    Marco {De Stefano};
    MSc thesis, Delft University of Technology, March 2014.
    document

  753. Capacitive Sensor Interface Using an Inverter-Based Period Modulator
    Yuming He;
    MSc thesis, Delft University of Technology, October 2014.

  754. An Algorithmic Readout Approach for Thermal Conductivity Based CO2 Sensors
    Luis Eduardo {Rueda Guerrero};
    MSc thesis, Delft University of Technology, November 2014.
    document

  755. ADC, a temperature sensor, a non-contact transponder, and a method of converting analog signals to digital signals
    K.A.A. Makinwa; K. Souri;
    Patent, US 8,665,130, March 2014.

  756. Multiple electrothermal-filter device
    K.A.A. Makinwa; C.P.L Van Vroonhoven;
    Patent, US 8,870,454, October 2014.

  757. Magnetic sensor arrangement
    Fabio Sebastiano; Robert H.M. van Veldhoven;
    Patent, Europe 2672285, May 2014.

  758. Modulator with high signal to noise ratio
    Fabio Sebastiano; Robert H.M. van Veldhoven; Selcuk Ersoy;
    Patent, Europe 14160161, March 2014.

  759. Driver for switched-capacitor circuits
    Fabio Sebastiano;
    Patent, Europe 14175054.7, June 2014.

  760. Adaptive optics based on liquid total internal reflection mirrors
    E.S. ten Have;
    PhD thesis, Delft University of Technology, 2014.

  761. Evanescent waveguides sensors for biomedical applications
    A. Purniawan;
    PhD thesis, Delft University of Technology, 2014. Nog aanvullen, niet in Repository, geen fulltext.

  762. Biologically inspired CMOS image sensor for fast motion and polarization detection
    M. Sarkar; D.S.S. Bello; C. van Hoof; A.J.P. Theuwissen;
    IEEE Sensors Journal,
    Volume 13, Issue 3, pp. 1065-1073, 2013. Harvest Article number: 6381431.

  763. A 256 pixel magnetoresistive biosensor microarray in 0.18 μm CMOS
    D.A. Hall; R.S. Gaster; K.A.A. Makinwa; S.X. Wang; B. Murmann;
    IEEE Journal of Solid State Circuits,
    Volume 48, Issue 5, pp. 1290-1301, 2013. Harvest.

  764. A 6.3 μW 20 bit incremental zoom-ADC with 6 ppm INL and 1 μV offset
    Y. Chae; K. Souri; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 48, Issue 12, pp. 3019-3027, 2013. Harvest.

  765. Capacitive response of PDMS-coated IDE platforms directly exposed to aqueous solutions containing volatile organic compounds
    J. Staginus; I.M. Aerts; Z.Y. Chang; G.C.M. Meijer; LC.P.M. de Smet; E.J.R. Sudholter;
    Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers,
    Volume 184, pp. 130-142, 2013.

  766. Low-power high-accuracy micro-digital sun sensor by means of a CMOS image sensor
    N. Xie; A.J.P. Theuwissen;
    Journal of Electronic Imaging,
    Volume 22, Issue 3, pp. 1-11, 2013.

  767. A CMOS temperature sensor with a voltage-calibrated inaccuracy of ±0.15°C (3σ) from -55 to 125°C
    K. Souri; Y. Chae; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 48, Issue 1, pp. 292-301, 2013. Published online Oktober 2012; printed version January 2013.

  768. Stability characterization of high-sensitivity silicon-based EUV photodiodes in a detrimental environment
    L. Shi; S. Nihtianov; L.K. Nanver; F. Scholze;
    IEEE Sensors Journal,
    Volume 13, Issue 5, pp. 1699-1707, 2013. Online publicatie dd 20 december 2012.

  769. Fabrication, characterization, and simulation of a cantilever-based airflow sensor integrated with optical fiber
    M. Sadegh Cheri; H. Latifi; F. Beygi Azar Aghbolagh; R. Ranjbar Naeini; M. Taghavi; M. Ghaderi;
    Applied Optics,
    Volume 52, Issue 14, pp. 3420-3427, 2013. Harvest.

  770. Feedforward effect in standard CMOS pinned photodiodes
    M. Sarkar; B. Buttgen; A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 60, Issue 3, pp. 1154-1161, 2013. Harvest Article number: 6420923.

  771. An interface for eddy-current displacement sensors with 15-bit resolution and 20 MHz excitation
    M. R. Nabavi; M. A. P. Pertijs; S. Nihtianov;
    IEEE Journal of Solid-State Circuits,
    Volume 48, Issue 11, pp. 2868‒2881, November 2013. DOI: 10.1109/jssc.2013.2281692
    Abstract: ... This paper presents an integrated interface for eddy-current sensors (ECSs) for displacement measurement. The employed architecture helps bridging the performance gap between the requirements of demanding and precision industrial applications and the performance of existing ECS interfaces. The interface operates with a sensor excitation frequency of 20 MHz, which is more than one order of magnitude higher than typical values. This high excitation frequency limits the eddy-current penetration depth in the target down to a few tens of micrometers, thus enabling the use of thin targets required in precision applications. The proposed interface consists of a low-power front-end oscillator that incorporates the sensor, and a two-channel offset-compensated synchronous demodulator. A ratio-metric measurement approach along with offset and 1/f noise reduction techniques is applied to improve the system stability. The interface has been realized in a 0.35-μm 3.3 V BiCMOS technology and consumes 18 mW. Measurement results obtained using two flat sensing coils show a full-range non-linearity of the sensor interface of only 0.4\%, and a resolution of 15.5 bits (65 nm on a 3 mm measurement range), with 1 kHz signal bandwidth. This translates into 1.5 pico-Henry inductance-measurement resolution, which is comparable with the performance of the most advanced LCR meters. Using the proposed solution, a long-term instability below 20 ppm (for 17 hours) and a thermal drift of 30 ppm/°C are obtained without any temperature compensation. Compared to the state-of-the-art, the proposed interface achieves a considerably better trade-off between power consumption, resolution, bandwidth, and excitation frequency.

  772. A 1.2-V 8.3-nJ CMOS humidity sensor for RFID applications
    Z. Tan; R. Daamen; A. Humbert; Y. V. Ponomarev; Y. Chae; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 48, Issue 10, pp. 2469‒2477, October 2013. DOI: 10.1109/jssc.2013.2275661
    Abstract: ... This paper presents a fully integrated CMOS humidity sensor for a smart RFID sensor platform. The sensing element is a CMOS-compatible capacitive humidity sensor, which consists of top-metal finger-structure electrodes covered by a humidity-sensitive polyimide layer. Its humidity-sensitive capacitance is digitized by an energy-efficient capacitance-to-digital converter (CDC) based on a third-order delta-sigma modulator. This CDC employs current-efficient operational transconductance amplifiers based on current-starved cascoded inverters, whose limited output swing is accommodated by employing a feedforward loop-filter topology. A programmable offset capacitor is included to remove the sensor's baseline capacitance and thus reduce the required dynamic range. To reduce offset errors due to charge injection of the switches, the entire system is auto-zeroed. The proposed humidity sensor has been realized in a 0.16- μm CMOS technology. Measurement results show that the CDC performs a 12.5-bit capacitance-to-digital conversion in a measurement time of 0.8 ms, while consuming only 8.6 μA from a 1.2-V supply. This corresponds to a state-of-the-art figure-of-merit of 1.4 pJ/conversion-step. Combined with the co-integrated humidity sensing element, it provides a resolution of 0.05\% RH in the range from 30\% RH to 100\% RH while consuming only 8.3 nJ per measurement, which is an order-of-magnitude less energy than the state-of-the-art.

  773. A Low-Power CMOS Smart Temperature Sensor with a Batch-Calibrated Inaccuracy of ±0.25°C (±3σ) from -70°C to 130°C
    A. Aita; M. Pertijs; K. Makinwa; J. Huijsing; G. Meijer;
    IEEE Sensors Journal,
    Volume 13, Issue 5, pp. 1840‒1848, May 2013. DOI: 10.1109/JSEN.2013.2244033
    Abstract: ... In this paper, a low-power CMOS smart temperature sensor is presented. The temperature information extracted using substrate PNP transistors is digitized with a resolution of 0.03°C using a precision switched-capacitor (SC) incremental ΔΣ A/D converter. After batch calibration, an inaccuracy of ±0.25°C (±3) from -70°C to 130°C is obtained. This represents a two-fold improvement compared to the state-of-the-art. After individual calibration at room temperature, an inaccuracy better than ±0.1°C over the military temperature range is obtained, which is in-line with the state-of-the-art. This performance is achieved at a power consumption of 65 μW during a measurement time of 100 ms, by optimizing the power/inaccuracy tradeoffs, and by employing a clock frequency proportional to absolute temperature. The latter ensures accurate settling of the SC input stage at low temperatures, and reduces the effects of leakage currents at high temperatures.

  774. An energy-efficient readout circuit for resonant sensors based on ring-down measurement
    Z. Zeng; M. A. P. Pertijs; D. M. Karabacak;
    Review of Scientific Instruments,
    Volume 84, Issue 2, pp. 025005, February 2013. DOI: 10.1063/1.4792396
    Abstract: ... This paper presents an energy-efficient readout circuit for resonant sensors that operates based on a transient measurement method. The resonant sensor is driven at a frequency close to its resonance frequency by an excitation source that can be intermittently disconnected, causing the sensor to oscillate at its resonance frequency with exponentially decaying amplitude. By counting the zero crossings of this ring-down response, the interface circuit can detect the resonance frequency. In contrast with oscillator-based readout, the presented readout circuit is readily able to detect quality factor (Q) of the resonator from the envelope of the ring-down response, and can be used even in the presence of large parasitic capacitors. A prototype of the readout circuit has been integrated in 0.35 μm CMOS technology, and consumes only 36 μA from a 3.3 V supply during a measurement time of 2 ms. The resonance frequency and quality factor of a micro-machined SiN resonator obtained using this prototype are in good agreement with results obtained using impedance analysis. Furthermore, a clear transient response is observed to ethanol flow using the presented readout, demonstrating the use of this technique in sensing applications.

  775. Challenges in spintronic platforms for biomedical applications
    Freitas, PP; Cardoso, FA; Martins, VC; Fernandes, Elisabete Ramos; Martins, SAM; Dias, T; Amaral, JP; Cardoso, S; Germano, J; Costa, T; others;
    2013.

  776. Spintronic devices for biomedical applications
    Freitas, PP; Cardoso, S; Cardoso, FA; Dias, T; Martins, VC; Fernandes, Elisabete Ramos; Carvalho, Carla AOCM; Azeredo, Joana; Amaral, JP; Pinto, V{\'\i}tor; others;
    2013.

  777. Magnetic tunnel junction sensors with pTesla sensitivity
    Freitas, S Cardoso; Leitao, DC; Gameiro, L; Cardoso, F; Ferreira, R; Paz, E; Freitas, PP;
    2013.

  778. Electrothermal Frequency References in Standard CMOS
    S.M. Kashmiri; K.A.A. Makinwa;
    Springer Verlag, in Analog Circuits and Sinal Processing, 2013.

  779. Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
    R. Wu; J.H. Huijsing; K.A.A. Makinwa;
    Springer New York, in Analog Circuits and Sinal Processing, 2013. Published as e-book in 2012; printed version 2013.

  780. Mobility-based Time References for Wireless Sensor Networks
    Fabio Sebastiano; Lucien J. Breems; Kofi A.A. Makinwa;
    Springer, , 2013.
    Abstract: ... This book describes the use of low-power low-cost and extremely small radios to provide essential time reference for wireless sensor networks. The authors explain how to integrate such radios in a standard CMOS process to reduce both cost and size, while focusing on the challenge of designing a fully integrated time reference for such radios. To enable the integration of the time reference, system techniques are proposed and analyzed, several kinds of integrated time references are reviewed, and mobility-based references are identified as viable candidates to provide the required accuracy at low-power consumption. Practical implementations of a mobility-based oscillator and a temperature sensor are also presented, which demonstrate the required accuracy over a wide temperature range, while drawing 51-µW from a 1.2-V supply in a 65-nm CMOS process.

  781. Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications
    M.R. Nabavi; S. Nihtianov;
    S. Nihtianov; A. Luque (Ed.);
    Woodhead Publishing, Chapter Integrated indu, , pp. 76-101, 2013.

  782. Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications
    S. Xia; S. Nihtianov;
    S. Nihtianov; A. Luque (Ed.);
    Woodhead Publishing, Chapter Capacitive sens, , pp. 63-75, 2013.

  783. Gas viscosity MEMS sensor based on pull-in
    R.A. Dias; G. de Graaf; R.F. Wolffenbuttel; L.A. Machado da Rocha;
    In JR Morante (Ed.), Proceedings of Transducers Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS EUROSENSORS XXVII),
    IEEE, pp. 980-983, 2013.

  784. A 0.25mm2 AC-biased MEMS microphone interface with 58dBA SNRt
    S. Ersoy, R. van Veldhoven, F. Sebastiano, K. Reimann; K.A.A. Makinwa;
    In A Chandrakasan; B. Nauta (Ed.), Digest of Technical Papers - 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013),
    IEEE, pp. 382-383, 2013. Harvest Session 15.

  785. Noise analysis of a capacitor-to-voltage converter with a zoom-in technique
    A. Heidary; R. Taherkhani; S. Nihtianov;
    In S Mukhopadhyay; {Mason et al}, A (Ed.), Proc. of the 7th International Conference on Sensing Technology,
    IEEE, pp. 252-255, 2013.

  786. A ±5A battery current sensor with ±0.04% gain error from -55°C to +125°C
    S. Heidary Shalmany; K.A.A. Makinwa; D. Draxelmayr;
    In {De Venuto et al}, D (Ed.), Proceedings 2013 5th IEEE International Workshop on Advances in Sensors and Interfaces,
    IEEE, pp. 117-120, 2013.

  787. A time/resistor-referenced capacitive sensor interface for displacement measurement in the sub-nanometer range
    R. Yang; S. Nihtianov;
    In RC Luo (Ed.), Proc. of the 22nd IEEE International Symposium on Industrial Electronics,
    IEEE, pp. 1-5, 2013. Harvest.

  788. Integrated capacitive-sensor interface based on a multi-slope modulator
    S. Nihtianov; Y. Cheng;
    In GP Hancke; N Beute; Y Ibrahim (Ed.), Proc. of the IEEE International Conference on Industrial Technology,
    IEEE, pp. 966-971, 2013. Harvest.

  789. A micropower battery current sensor with ±0.03% (3σ) Inaccuracy from -40 to +85°C
    S. Heidary Shalmany; D. Draxelmayr; K.A.A. Makinwa;
    In A Chandrakasan; B. Nauta (Ed.), Digest of Technical Papers - 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013),
    IEEE, pp. 386-387, 2013. Harvest Session 22.

  790. A 6.3μW 20b incremental zoom-ADC with 6ppm INL and 1μV offset
    Y. Chae; K. Souri; K.A.A. Makinwa;
    In A Chandrakasan; B. Nauta (Ed.), Digest of Technical Papers - 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013),
    IEEE, pp. 276-277, 2013. Harvest Session 15.

  791. A resistor-based temperature sensor for MEMS frequency references
    M. Shahmohammadi; K. Souri; K.A.A. Makinwa;
    In S. Rusu; Y. Deval (Ed.), Proceedings 39th European Solid-State Circuits Conference,
    IEEE, pp. 225-228, 2013. Harvest.

  792. A continuous-time ripple reduction technique for spinning-current Hall sensors
    J. Jiang; K.A.A. Makinwa; W.J. Kindt;
    In S. Rusu; Y. Deval (Ed.), Proceedings 39th European Solid-State Circuits Conference,
    IEEE, pp. 217-220, 2013. Harvest.

  793. Minimum energy point tracking for sub-threshold digital CMOS circuits using an in-situ energy sensor
    N. Mehta; K.A.A. Makinwa;
    In CW. Chen; W Gao; J Vandewalle (Ed.), Proceedings - IEEE International Symposium on Circuits and Systems (ISCAS 2013),
    IEEE, pp. 570-573, 2013. Harvest Article number: 6571906.

  794. Reactive sub-nanometer displacement sensors: advantages and limitations
    S. Nihtianov;
    In S Soyjaudah; {Armoogum et al}, V (Ed.), Proc. of the IEEE Africon,
    IEEE, pp. 1-6, 2013.

  795. A 40µW CMOS temperature sensor with an inaccuracy of ±0.4°C (3σ) from -55°C to 200°C
    K. Souri; K Souri; K.A.A. Makinwa;
    In S. Rusu; Y. Deval (Ed.), Proceedings 39th European Solid-State Circuits Conference,
    IEEE, pp. 221-224, 2013. Harvest.

  796. A 0.25mm² AC-Biased MEMS Microphone Interface with 58dBA SNR
    Sel\c{c}uk Ersoy; Robert H.M. van Veldhoven; Fabio Sebastiano; Klaus Reimann;
    In International Solid-state Circuits Conference Digest of Technical Papers,
    San Francisco, CA, pp. 382-383, February17--21 2013. DOI: 10.1109/ISSCC.2013.6487779
    Keywords: ... AC machines;DC machines;capacitance;electronics packaging;micromechanical devices;microphones;AC-biased MEMS microphone interface;AC-biasing scheme;ASIC size reduction;DC-biased microphone;SNR;capacitive MEMS microphone roadmap;module packaging cost;noise.

    Abstract: ... Capacitive MEMS microphone roadmaps are mainly driven by increasing SNR and reducing size/cost. This requires smaller microphones, ASICs with lower noise and smaller area, and cheaper packaging. Because of fundamental limitations, traditional DC-biased microphones will have difficulty following these trends. This paper proposes an AC-biasing scheme, which leads to a significant reduction in ASIC size and module packaging cost.

  797. A 0.1-mm² 3-Channel Area-Optimized ΣΔ ADC in 0.16-µm CMOS with 20-kHz BW and 86-dB DR
    Fabio Sebastiano; Robert H.M. van Veldhoven;
    In Proc. European Solid-State Circuits Conference,
    Bucharest, Romania, pp. 375 - 378, September16--20 2013. DOI: 10.1109/ESSCIRC.2013.6649151
    Keywords: ... CMOS integrated circuits;analogue-digital conversion;automotive electronics;delta-sigma modulation;3-channel area-optimized S? ADC;CMOS;automotive sensors;capacitors;channel latency;channel multiplexing;frequency 20 kHz;frequency 75 MHz;front-ends;inter-channel gain mismatch;oversampling ratio;size 0.16 mum;Capacitors;Crosstalk;Gain;Modulation;Multiplexing;Noise;Sensors.

    Abstract: ... Front-ends for automotive sensors must digitize multiple channels with high resolution while minimizing their silicon area to save costs. Both channel latency and inter-channel gain mismatch must be minimized to be able to serve multiple sensor applications, ranging from ABS to power steering, with the same front-end. The proposed S? ADC simultaneously digitizes 3 channels, each with a DR of 86 dB over a 20-kHz BW using a 75-MHz clock. Channel latency is <40 ns and inter-channel gain mismatch is <0.2%. The ADC occupies only 0.1 mm² in a 0.16-µm CMOS process. The small area is enabled by channel multiplexing, allowing component sharing among the channels, and by the large oversampling ratio (OSR), allowing for smaller capacitors.

  798. A 7μW pH-to-digital converter for quality monitoring of perishable products
    S. H. Shalmany; M. Merz; A. Fekri; Z. Chang; R. Hoofman; M. A. P. Pertijs;
    In Proc. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    IEEE, pp. 1747‒1750, June 2013. DOI: 10.1109/Transducers.2013.6627125
    Abstract: ... This paper describes an energy-efficient smart pH sensor intended for use in RFID tags to monitor the quality of perishable products. The sensor is based on an Extended Gate Field-Effect Transistor (EGFET). In a measurement time of 20 ms, it achieves a pH resolution of 0.05 and an accuracy of 0.1 in a pH range from 3 to 10, while consuming only 7 μW. This level of power consumption, which is orders of magnitude lower than the prior art, is achieved by incorporating the EGFET in an ultra-low-power frontend based on a differential source-follower, and digitizing the resulting pH-dependent voltage using an incremental first-order ΔΣ ADC.

  799. A low-power CMOS integrated sensor for CO2 detection in the percentage range
    A. Humbert; B. J. Tuerlings; R. J. O. M. Hoofman; Z. Tan; D. Gravesteijn; M. A. P. Pertijs; C. W. M. Bastiaansen; D. Soccol;
    In Proc. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    IEEE, pp. 1649‒1652, June 2013. DOI: 10.1109/Transducers.2013.6627101
    Abstract: ... Within the Catrene project “PASTEUR”, a low-cost, low-power capacitive carbon dioxide sensor has been developed for tracking CO2 concentration in the percentage range. This paper describes this sensor, which operates at room temperature where it exhibits short response times as well as reversible behavior. It can be easily integrated using CMOS compatible processing, and has been combined with a Relative Humidity (RH) sensor, using the same capacitive transduction method, and with a low-power capacitance-to-digital converter, hence enabling correction of cross sensitivity to RH.

  800. A 1V 14b self-timed zero-crossing-based incremental ΔΣ ADC
    C. Chen; Z. Tan; M. A. P. Pertijs;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 274‒275, February 2013. DOI: 10.1109/ISSCC.2013.6487732
    Abstract: ... This paper introduces a clock-free self-timed incremental ΔΣ ADC. Unlike conventional ΔΣ ADCs, it does not require a dedicated clock signal, thus saving energy and reducing system complexity. As such, it has similar advantages as self-timed (or asynchronous) SAR ADCs. It is particularly suited for use in energy-constrained sensor applications, in which conversions of a quasistatic input signal are triggered by infrequent and possibly irregular external events. As it autonomously powers down upon completion of a conversion, it can adapt to a wide range of conversion rates in an energy-efficient way.

  801. Ultra-low Energy CMOS Humidity Sensors for RFID Applications
    Z. Tan; R. Daamen; A. Humbert; Y. V. Ponomarev; Y. Chae; G. C. M. Meijer; M. A. P. Pertijs;
    In Annual Sensor Technology Workshop Sense of Contact,
    The Netherlands, April 2013. (Best Poster Award).

  802. Magnetic tunnel junction sensors with pTesla sensitivity for biomedical imaging
    Cardoso, S; Gameiro, L; Leitao, DC; Cardoso, Filipe Arroyo; Ferreira, R; Paz, E; Freitas, PP;
    In Smart Sensors, Actuators, and MEMS VI,
    SPIE, pp. 315-322, 2013.

  803. CMOS instrumentation system for matrix-based magnetoresistive biosensors
    Costa, Tiago; Piedade, Moises S; Cardoso, Filipe Arroyo; Freitas, Paulo P;
    In 2013 IEEE International Instrumentation and Measurement Technology Conference (I2MTC),
    IEEE, pp. 1315-1318, 2013.

  804. Eddy current probes based on magnetoresistive array sensors as receivers
    Sergeeva-Chollet, Natalia; Pelkner, Matthias M; Erthner, Thomas M; Kreutzbruck, Marc M; Fermon, Claude M; Decitre, Jean-Marc M; Paul, Johannes; Cardoso, Filipe Arroyo; Cardoso, Susana; Freitas, Paulo M; others;
    In 19 th World Conference on Non-Destructive Testing 2016,
    2013.

  805. Design of Front-End Receiver Electronics for 3D Trans-Esophageal Echocardiography
    Anirban Saha;
    MSc thesis, Delft University of Technology, January 2013.
    document

  806. An Energy-Efficient Reconfigurable Interface for Resonant Sensors Based On Ring-Down Measurement
    Yuxin Yan;
    MSc thesis, Delft University of Technology, August 2013.
    document

  807. Design of an Energy-Efficient Interface Circuit for a MEMS-based Capacitive Pressure Sensor
    Lokesh Rajendran;
    MSc thesis, Delft University of Technology, September 2013.
    document

  808. Method and system for impulse radio wakeup
    Fabio Sebastiano; Salvatore Drago; Lucien J. Breems; Domine M.W. Leenaerts;
    Patent, United States 8620394 B2, December 2013.

  809. Magnetic sensor with low electric offset
    Fabio Sebastiano; Robert H.M. van Veldhoven;
    Patent, Europe 2562556 A2, February 2013.

  810. Magnetic sensor with low electric offset
    Fabio Sebastiano; Robert H.M. van Veldhoven;
    Patent, United States 8664941 B2, March 2013.

  811. Magnetic sensor with low electric offset
    Fabio Sebastiano; Robert H.M. van Veldhoven;
    Patent, China 102954808 A, March 2013.

  812. Magnetic sensor arrangement
    Fabio Sebastiano; Robert H.M. van Veldhoven;
    Patent, United States 0328550 A1, December 2013.

  813. Offset compensation for zero-crossing detection
    Robert H.M. van Veldhoven; Fabio Sebastiano;
    Patent, Europe 14160161, October 2013.

  814. Performance analysis of Si-based ultra-shallow junction photodiodes for UV radiation detection
    L. Shi;
    PhD thesis, Delft University of Technology, 2013. Harvest.

  815. Energy-efficient capacitive-sensor interfaces
    Z. Tan;
    PhD thesis, Delft University of Technology, 2013. Harvest.

  816. Low-Cost and Low-Temperature Integration Methods for System-in-Package
    N.B. Palacios Aguilera;
    PhD thesis, Delft University of Technology, 2013.

  817. 4T CMOS active pixel sensors under ionizing radiation
    J. Tan;
    PhD thesis, Delft University of Technology, 2013. Harvest.

  818. Energy-Efficient Capacitive Sensor Interfaces
    Zhichao Tan;
    PhD thesis, Delft University of Technology, June 2013.
    document

  819. A review of visible-range Fabry-Perot microspectrometers in silicon for the industry
    Carmo Paulo Joao; R.P. Rocha; M. Bartek; G. de Graaf; R.F. Wolffenbuttel; J.H. Correia;
    Optics & Laser Technology,
    Volume 44, Issue 7, pp. 2312-2320, 2012.

  820. Surface-charge-collection-enhanced high-sensitivity high-stability silicon photodiodes for DUV and VUV spectral ranges
    L. Shi; S. Nihtianov; L. Haspeslagh; F. Scholze; A. Gottwald; L.K. Nanver;
    IEEE Transactions on Electron Devices,
    Volume 59, Issue 11, pp. 2888-2894, 2012. Harvest.

  821. A 20-b ± 40-mV range read-out IC with 50-nV offset and 0.04% gain error for bridge transducers
    R. Wu; Y. Chae; J.H. Huijsing; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 47, Issue 9, pp. 2152-2163, September 2012. Harvest.

  822. Abstracting synchronization process in workflow involving partial synchronization pattern
    F. Hu; J. Jiang; L. Ma; L. Liu;
    Applied Mechanics and Materials,
    Volume 182-183, pp. 1781-1785, 2012. Harvest Betreft: 2012 International Applied Mechanics, Mechatronics Automation Symposium (IAMMAS 2012); Shenyang, Liaoning.

  823. Generating document tree of workflow with synchronization process
    F. Hu; J. Jiang; W. Qin; Y. Li;
    Applied Mechanics and Materials,
    Volume 182-183, pp. 1766-1770, 2012. Harvest Betreft: 2012 International Applied Mechanics, Mechatronics Automation Symposium (IAMMAS 2012); Shenyang, Liaoning.

  824. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian Marnani; S.W. Koh; G.Q. Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 7, pp. 1279-1284, 2012. harvest Betreft: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011), Linz, Austria.

  825. An SOI thermal-diffusivity-based temperature sensor with ±0.6 °C (3σ) untrimmed inaccuracy from -70 °C to 225 °C
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 188, pp. 66-74, 2012. harvest.

  826. Characterization and closed-loop performance of a liquid mirror adaptive optical system
    E.S. ten Have; G.V. Vdovin;
    Applied Optics,
    Volume 51, Issue 12, pp. 2155-2163, 2012.

  827. A scaled thermal-diffusivity-based 16 MHz frequency reference in 0.16 μm CMOS
    S.M. Kashmiri; K. Souri; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 47, Issue 7, pp. 1535-1545, July 2012. Harvest Article number: 6216450.

  828. Column-parallel digital correlated multiple sampling for low-noise CMOS image sensors
    Y. Chen; Y. Xu; A.J. Mierop; A.J.P. Theuwissen;
    IEEE Sensors Journal,
    Volume 12, Issue 4, pp. 793-799, 2012.

  829. An autonomous microdigital sun sensor by a CMOS imager in space application
    N. Xie; A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 59, Issue 12, pp. 3405-3410, 2012. Harvest.

  830. Power-efficient high-speed and high-resolution capacitive-sensor interface for subnanometer displacement measurements
    S. Xia; S. Nihtianov;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 61, Issue 5, pp. 1315-1322, 2012. Harvest Article number: 6151147.

  831. Novel method for measuring surface tension
    E.S. ten Have; G.V. Vdovin;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 173, Issue 1, pp. 90-96, 2012.

  832. Design strategies for eddy-current displacement sensor systems: Review and recommendations
    M.R. Nabavi; S. Nihtianov;
    IEEE Sensors Journal,
    Volume 12, Issue 12, pp. 3346-3355, 2012. Harvest.

  833. Comparative study of silicon-based ultraviolet photodetectors
    L. Shi; S. Nihtianov;
    IEEE Sensors Journal,
    Volume 12, Issue 7, pp. 2453-2459, 2012. Harvest Article number: 6175098.

  834. Analyzing the radiation degradation of 4-transistor deep submicron technology CMOS image sensors
    J. Tan; B. Buttgen; A.J.P. Theuwissen;
    IEEE Sensors Journal,
    Volume 12, Issue 6, pp. 2278-2286, 2012. Harvest Article number: 6143978.

  835. Electrical and optical performance investigation of si-based ultrashallow-junction p+-n VUV/EUV photodiodes
    L. Shi; S. Nihtianov; S. Xia; L.K. Nanver; A. Gottwald; F. Scholze;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 61, Issue 5, pp. 1268-1277, 2012. Harvest Article number: 6163408.

  836. Low-cost technology for the integration of micro-and nanochips into fluidic systems on printed circuit board: Fabrication challenges
    N.B. Palacios-Aguilera; J. Bastemeijer; J.R. Mollinger; A. Bossche; V.R.S.S. Mokkapati RSS; H.A. Visser; R. Akkerman;
    International Journal on Advances in Systems and Measurements,
    Volume 5, Issue 1 & 2, pp. 11-21, 2012.

  837. HermesE: A 96-channel full data rate direct neural interface in 0.13 μm CMOS
    H. Gao; R.M. Walker; P. Nuyujukian; K.A.A. Makinwa; K.V. Shenoy; B. Murmann; T.H.Y. Meng;
    IEEE Journal of Solid State Circuits,
    Volume 47, Issue 4, pp. 1043-1055, April 2012. Harvest Article number: 6158616.

  838. Linear variable optical filter-based ultraviolet microspectrometer
    Emadi, Arvin; Wu, Huaiwen; de Graaf, Ger; Enoksson, Peter; Correia, Jose Higino; Wolffenbuttel, Reinoud;
    Applied optics,
    Volume 51, Issue 19, pp. 4308-4315, 2012.

  839. Design and implementation of a sub-nm resolution microspectrometer based on a Linear-Variable Optical Filter
    Emadi, Arvin; Wu, Huaiwen; de Graaf, Ger; Wolffenbuttel, Reinoud;
    Optics Express,
    Volume 20, Issue 1, pp. 489-507, 2012.

  840. An energy-efficient 15-bit capacitive-sensor interface based on period modulation
    Z. Tan; S. H. Shalmany; G. C. M. Meijer; M. A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 47, Issue 7, pp. 1703‒1711, July 2012. DOI: 10.1109/jssc.2012.2191212
    Abstract: ... This paper presents an energy-efficient capacitive-sensor interface with a period-modulated output signal. This interface converts the sensor capacitance to a time interval, which can be easily digitized by a simple digital counter. It is based on a relaxation oscillator consisting of an integrator and a comparator. To enable the use of a current-efficient telescopic OTA in the integrator, negative feedback loops are applied to limit the integrator's output swing. To obtain an accurate ratiometric output signal, auto-calibration is applied. This eliminates errors due to comparator delay, thus enabling the use of a low-power comparator. Based on an analysis of the stability of the negative feedback loops, it is shown how the current consumption of the interface can be traded for its ability to handle parasitic capacitors. A prototype fabricated in 0.35 μm standard CMOS technology can handle parasitic capacitors up to five times larger than the sensor capacitance. Experimental results show that it achieves 15-bit resolution and 12-bit linearity within a measurement time of 7.6 ms for sensor capacitances up to 6.8 pF, while consuming only 64 μA from a 3.3 V power supply. Compared to prior work with similar performance, this represents a significant improvement in energy efficiency.

  841. Front-end receiver electronics for a matrix transducer for 3-D transesophageal echocardiography
    Z. Yu; S. Blaak; Z. Y. Chang; J. Yao; J. G. Bosch; C. Prins; C. T. Lancee; N. de Jong; M. A. P. Pertijs; G. C. M. Meijer;
    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 59, Issue 7, pp. 1500‒1512, July 2012. DOI: 10.1109/tuffc.2012.2350
    Abstract: ... There is a clear clinical need for creating 3-D images of the heart. One promising technique is the use of transesophageal echocardiography (TEE). To enable 3-D TEE, we are developing a miniature ultrasound probe containing a matrix piezoelectric transducer with more than 2000 elements. Because a gastroscopic tube cannot accommodate the cables needed to connect all transducer elements directly to an imaging system, a major challenge is to locally reduce the number of channels, while maintaining a sufficient signal-to-noise ratio. This can be achieved by using front-end receiver electronics bonded to the transducers to provide appropriate signal conditioning in the tip of the probe. This paper presents the design of such electronics, realizing time-gain compensation (TGC) and micro-beamforming using simple, low-power circuits. Prototypes of TGC amplifiers and micro-beamforming cells have been fabricated in 0.35-μm CMOS technology. These prototype chips have been combined on a printed circuit board (PCB) to form an ultrasound-receiver system capable of reading and combining the signals of three transducer elements. Experimental results show that this design is a suitable candidate for 3-D TEE.

  842. A randomized trial of tigecycline versus ampicillin-sulbactam or amoxicillin-clavulanate for the treatment of complicated skin and skin structure infections
    Alpert, M; Rahav, G; Rill, D; Zito, E; Gardiner, D; Pedersen, R; Babinchak, T; McGovern, PC; Armstrong, P; Berbel, G; others;
    2012.

  843. Spintronic platforms for biomedical applications
    Freitas, PP; Cardoso, Filipe Arroyo; Martins, VC; Martins, SAM; Loureiro, J; Amaral, J; Chaves, RC; Cardoso, S; Fonseca, LP; Sebastião, AM; others;
    Lab on a Chip,
    Volume 12, Issue 3, pp. 546-557, 2012.

  844. Quantitative biomolecular sensing station based on magnetoresistive patterned arrays
    Serrate, David; De Teresa, JM; Marquina, Clara; Marzo, J; Saurel, D; Cardoso, Filipe Arroyo; Cardoso, S; Freitas, PP; Ibarra, MR;
    Biosensors and Bioelectronics,
    Volume 35, Issue 1, pp. 206-212, 2012.

  845. GMR sensors and magnetic nanoparticles for immuno-chromatographic assays
    Marquina, C; De Teresa, JM; Serrate, D; Marzo, J; Cardoso, Filipe Arroyo; Saurel, D; Cardoso, S; Freitas, PP; Ibarra, MR;
    Journal of Magnetism and Magnetic Materials,
    Volume 324, Issue 21, pp. 3495-3498, 2012.

  846. Integration of magnetoresistive biochips on a CMOS circuit
    Cardoso, Filipe Arroyo; Costa, T; Germano, J; Cardoso, S; Borme, J; Gaspar, J; Fernandes, JR; Piedade, MS; Freitas, PP;
    IEEE transactions on magnetics,
    Volume 48, Issue 11, pp. 3784-3787, 2012.

  847. Waterborne pathogen detection using a magnetoresistive immuno-chip
    Martins, Sofia SA; Martins, Verónica C; Cardoso, Filipe Arroyo; Freitas, Paulo P; Fonseca, Luís P;
    Molecular biological technologies for ocean sensing,
    pp. 263-288, 2012.

  848. Surface-engineered sensors: polymer-based sensors for the capacitive detection of organic water pollutants
    J. Staginus; I.M. Aerts; Z.Y. Chang; G.C.M. Meijer; LC.P.M. de Smet;
    conference, 2012. TU Delft.

  849. Dedicated impedance sensors in their applications
    G.C.M. Meijer; A. Heidary; B. Iliev; G. Pop;
    SUSU Publication Center, , pp. 14-16, 2012.

  850. Energy-Efficient Capacitive Sensor Interfaces
    M. A. P. Pertijs; Z. Tan;
    In Nyquist AD Converters, Sensor Interfaces, and Robustness,
    Springer Science \& Business Media, October 2012.
    Abstract: ... Capacitive sensor systems are potentially highly energy efficient. In practice, however, their energy consumption is typically dominated by that of the interface circuit that digitizes the sensor capacitance. Energy-efficient capacitive sensor interfaces are therefore a prerequisite for the successful application of capacitive sensors in energy-constrained applications, such as battery-powered devices and wireless sensor nodes. This paper derives lower bounds on the energy consumption of capacitive sensor interfaces. A comparison of these bounds with the state-of-the-art suggests that there is significant room for improvement. Several approaches to improving energy efficiency are discussed and illustrated by two design examples.

    document

  851. A capacitance-to-digital converter for displacement sensing with 17b resolution and 20μs conversion time
    S. Xia; K.A.A. Makinwa; S. Nihtianov;
    In L Fujino (Ed.), Proc. of the IEEE international solid-state circuits conference digest of technical papers,
    IEEE, pp. 198-199, 2012. Harvest Article number: 6176973.

  852. Lock-in amplifier techniques for low-frequency modulated sensor applications
    G. de Graaf; R.F. Wolffenbuttel;
    In G Brasseur (Ed.), IEEE International Instrumentation and Measurement Technology Conference Proceedings,
    IEEE, pp. 1745-1749, 2012.

  853. Closed-loop operated time-based accelerometer
    R.A. Dias; P.J. Macedo; H.D. Silva; R.F. Wolffenbuttel; E. Cretu; L.A. Machado da Rocha;
    In R Walczak; J Dzuiban (Ed.), 26th European Conference on Solid-State Transducers, EUROSENSORS 2012,
    Elsevier, pp. 398-401, 2012.

  854. Surface-micromachined thermal conductivity detectors for gas sensing
    G. de Graaf; R.F. Wolffenbuttel;
    In G Brasseur (Ed.), IEEE International Instrumentation and Measurement Technology Conference Proceedings,
    IEEE, pp. 1861-1864, 2012.

  855. Performance of inkjet-printed structures on different substrate materials under high humidity and elevated temperature conditions
    N.B. Palacios-Aguilera; H.A. Visser; L.D. Vargas-Llona; U. Balda Irurzun; A. Sridhar; R. Akkerman; A. Bossche;
    In 4th Electronic System-Integration Technology Conference (ESTC),
    pp. 5, 2012.

  856. Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects
    V. Rajaraman; J.J. Koning; E. Ooms; G. Pandraud; K.A.A. Makinwa; H. Boezen;
    In L Buchaillot; H Zappe (Ed.), Proceedings 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems,
    IEEE, pp. 220-223, 2012. harvest Article number: 6170130.

  857. Bandwidth requirements for Op-amp in temperature sensors with duty-cycle modulated output.
    S. Foruhi; M. Shahmohammadi; A. Heidary; G.C.M. Meijer; Guijie Wang;
    In {Ivanov et al}, R (Ed.), Proceedings XXI International Scientific Conference Electronics 2012,
    Technical University of Sofia, pp. 61-64, 2012.

  858. Physical and mechanical properties of a TIR-based liquid micro deformable mirror
    E.S. ten Have; G.V. Vdovin;
    In H Thienpont; J Mohr; H Zappe; H Nakajima (Ed.), Proceedings SPIE - Micro-Optics 2012,
    SPIE, pp. 84281W-1-8428, 2012.

  859. Autonomous self-aligning and self-calibrating capacitive sensor system
    O.S. van de Ven; D. Yang; S. Xia; J.P. van Schieveen; J.W. Spronck; R.H. Munnig Schmidt; S. Nihtianov;
    In M Kamel; F Karray; H Hagras (Ed.), Proc. of the 3rd International Conference on Autonomous and Intelligent Systems,
    Springer Verlag, pp. 10-17, 2012.

  860. Evaluation of Antibody Surface Functionalisation of TiO2-ALD Waveguide Using Escherichia coli type K12
    A. Purniawan; M. Almering; G. Pandraud; K.A. Vakalopoulos; P.J. French,; P.M. Sarro;
    In Proc. Conference for ICT-Research in the Netherlands,
    Rotterdam, the Netherlands, Oct 2012.

  861. Electrical performance stability characterization of high-sensitivity Si-based EUV photodiodes in a harsh industrial application
    L. Shi; S. Nihtianov; F. Scholze; L.K. Nanver;
    In L Gomes; LG Chakraborty; D Irwin (Ed.), Proc. of the 38th Annual Conference on IEEE Industrial Electronics Society,
    IEEE, pp. 3952-3957, 2012.

  862. A ±0.4°C (3σ) -70 to 200°C time-domain temperature sensor based on heat diffusion in Si and SiO2
    C.P.L. van Vroonhoven; D. d'Aquino; K.A.A. Makinwa;
    In L Fujino (Ed.), Digest of Technical Papers - 2012 IEEE International Solid-state Circuits Conference,
    IEEE, pp. 204-206, February 2012. Harvest Article number: 6176976.

  863. A 0.7 e- rms temporal-readout-noise CMOS image sensor for low-light-level imaging
    Y. Chen; Y. Xu; Y. Chae; A. Mierop; X. Wang; A.J.P. Theuwissen;
    In H Hidaka; {Nauta et al}, B (Ed.), Digest of Technical Papers - 2012 IEEE International Solid-State Circuits Conference.,
    IEEE, pp. 384-386, 2012.

  864. A 20bit continuous-time ΣΔ modulator with a Gm-C integrator, 120dB CMRR and 15 ppm INL
    G. Singh; R. Wu; Y. Chae; K.A.A. Makinwa;
    In Y. Deval; J-B Begueret; D Belot (Ed.), Proceedings 2012 38th European Solid-State Circuit Conference,
    IEEE, pp. 385-388, 2012.

  865. A capacitance measurement system with milliwatt power and attofarad resolution
    A. Heidary; R. Taherkhani; G.C.M. Meijer;
    In M Kamarei; P Jabehdar-Maralani (Ed.), Proceedings 2012 20th Iranian Conference on Electrical Engineering,
    IEEE, pp. 263-266, 2012. Harvest Article number: 6292365.

  866. Comparison of different methods to cancel offset capacitance in capacitive displacement sensors
    S. Xia; S. Nihtianov;
    In G Brasseur (Ed.), Proc. of the IEEE international instrumentation and measurement technology conference,
    IEEE, pp. 1838-1841, 2012. Harvest Article number: 6229448.

  867. Encapsulated aluminum nitride SAW devices for liquid sensing applications
    A.T. Tran; G. Pandraud; M. Nie; H. Schellevis; A. Akhnoukh; A. Purniawan; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    IEEE, pp. 604-607, 2012.

  868. A 700μW 8-channel EEG/contact-impedance acquisition system for dry-electrodes
    S. Mitra; J. Xu; A. Matsumoto; K.A.A. Makinwa; A. van Hoof; R.F. Yazicioglu;
    In A Amerasekera; M Nagata (Ed.), Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 68-69, 2012. Harvest.

  869. A CMOS temperature sensor with a voltage-calibrated inaccuracy of ±0.15°C (3σ) from -55 to 125°C
    K. Souri; Y. Chae; K.A.A. Makinwa;
    In L Fujino (Ed.), Digest of Technical Papers - 2012 IEEE International Solid-state Circuits Conference,
    IEEE, pp. 208-210, February 2012. Harvest Article number: 6176978.

  870. A comparison between PECVD and ALD for the fabrication of slot waveguide based sensors
    G. Pandraud; A. Purniawan; E. Margallo-Balbás; P.M. Sarro;
    In DL Andrews; J-M Nunzi; A Ostendorf (Ed.), Proceeings of SPIE - Nanophotonics IV,
    SPIE, pp. 1-7, 2012. harvest.

  871. Microfluidic cell trapping device based on standard PCB technology
    N.B. Palacios Aguilera; T. Zhou; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In V Ovchinnikov; P Dini (Ed.), Proceedngs Sixth International Conference on Quantum, Nano and Micro Technologies,
    IARIA / Curran Associates INc., pp. 1-6, 2012.

  872. Contact creep in a thermal actuation mechanism
    O.S. van de Ven; J.W. Spronck; S. Nihtianov; R.H. Munnig Schmidt;
    In P. Shore; H. Spaan; T. Burke (Ed.), Proc. of the 12th International Conference of the European Society for Precision Engineering and Nanotechnology,
    EUSPEN, pp. 478-481, 2012.

  873. Performance of inkjet-printed structures on different substrate materials under high humidity and elevated temperature conditions
    N.B. Palacios Aguilera; H.A. Visser; L.D. Vargas Llona; U. Balda Irurzun; A. Sridhar; R. Akkerman; A. Bossche;
    In {Paulasto-Krockel et al}, M (Ed.), Proceedings 4th Electronics System Integration Technologies Conference 2012,
    pp. -, 2012.

  874. An energy-efficient capacitive-sensor interface based on a multi-slope modulatior
    Y. Cheng; S. Nihtianov;
    In {Ivanov et al}, R (Ed.), Proc. of the International Scientific Conference Electronics,
    Technical University of Sofia, pp. 65-68, 2012.

  875. A temperature sensor with duty-cycle-modulated output implemented CMOS technology
    Guijie Wang; A. Heidary; G.C.M. Meijer;
    In {Ivanov et al}, R (Ed.), Proceedings XXI International Scientific Conference Electronics 2012,
    Technical University of Sofia, pp. 59-60, 2012.

  876. Surface-engineered sensors: polymer-based sensors for the capacitive detection of organic pollutants in water
    J. Staginus; I.M. Aerts; Z.Y. Chang; G.C.M. Meijer; LC.P.M. de Smet; E.J.R. Sudholter;
    In s.n. (Ed.), Water, IMCS 2012 - The 14th International Meeting on Chemical Sensors,
    AMA Association, pp. 1141-1144, 2012.

  877. Design, fabrication and measurements with a UV linear-variable optical filter microspectrometer
    Emadi, Arvin; Wu, Huaiwen; de Graaf, Ger; Enoksson, Peter; Correia, Jos{\'e} Higino; Wolffenbuttel, Reinoud;
    In Proceedings of SPIE Photonics Europe, vol. 8439,
    SPIE, pp. 84390V-84390V, 2012.

  878. Closed loop operation of time-based accelerometers
    Dias, Rosana A; Wolffenbuttel, RF; Cretu, E; Rocha, Lu{\'\i}s A;
    In Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop,
    2012.

  879. Comparing silicon deposition techniques for visible-blind detector fabrication
    Emadi, A; Enoksson, Peter; Correia, JH; Wolffenbuttel, RF;
    In Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop,
    2012.

  880. Design and implementation of IR microspectrometers based on linear-variable optical filters
    Emadi, Arvin; Wu, Huaiwen; de Graaf, Ger; Wolffenbuttel, Reinoud;
    In Proceedings of SPIE Photonics Europe, vol. 8439,
    SPIE, pp. 84391O-84391O, 2012.

  881. Design, fabrication and measurements with a UV linear-variable optical filter microspectrometer
    Emadi, Arvin; Wu, Huaiwen; de Graaf, Ger; Enoksson, Peter; Correia, Jos{\'e} Higino; Wolffenbuttel, Reinoud;
    In Proceedings of SPIE Photonics Europe, vol. 8439,
    SPIE, pp. 84390V-84390V, 2012.

  882. A 1.2 V 8.3 nJ energy-efficient CMOS humidity sensor for RFID applications
    Z. Tan; Y. Chae; R. Daamen; A. Humbert; Y. V. Ponomarev; M. A. P. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 24‒25, June 2012. DOI: 10.1109/vlsic.2012.6243771

  883. An energy-efficient interface for resonant sensors based on ring-down measurement
    M. A. P. Pertijs; Z. Zeng; D. M. Karabacak; M. Crego-Calama; S. H. Brongersma;
    In Proc. IEEE International Symposium on Circuits and Systems (ISCAS),
    IEEE, pp. 990‒993, May 2012. invited paper. DOI: 10.1109/iscas.2012.6272213

  884. Energy-Efficient Capacitive Sensor Interfaces
    M. Pertijs; Z. Tan;
    In Proc. Workshop on Advances in Analog Circuit Design (AACD),
    March 2012. invited paper. DOI: 10.1007/978-1-4614-4587-6_8

  885. A 9-channel low-power receiver ASIC for 3D transesophageal echocardiography
    Z. Yu; S. Blaak; C. Prins; Z. Y. Chang; C. T. Lancée; J. G. Bosch; N. de Jong; G. C. M. Meijer; M. A. P. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 2063‒2066, October 2012. DOI: 10.1109/ultsym.2012.0516
    Abstract: ... This paper presents a 9-channel low-power receiver ASIC dedicated to a matrix piezoelectric ultrasound transducer for 3D Trans-Esophageal Echocardiography (TEE). It consists of 9 low-noise amplifiers (LNAs), 9 time-gain-compensation (TGC) amplifiers and a 9:1 micro-beamformer. A prototype ASIC has been implemented in 0.35 μm CMOS technology, with a core area of 0.98 mm × 1.7 mm. It is operated at a 3.3 V supply and consumes only 0.5 mW per channel. The measured channel-to-channel mismatch is within ±1 dB. Acoustic measurements proved the micro-beamforming function of the ASIC when processing real ultrasound signals from a 3 × 3 transducer array. These promising results show that this design, after layout optimization, is suitable to be scaled up to accommodate a full matrix transducer.

  886. Energy-Efficient Self-Timed Zero-Crossing-Based Incremental Delta-Sigma ADC
    Chao Chen;
    MSc thesis, Delft University of Technology, November 2012.
    document

  887. Design of High-Resolution Photodiode Readout Circuitry for a Bio-Implantable Continuous Glucose Sensing Chip
    Umanath Kamath;
    MSc thesis, Delft University of Technology, November 2012.
    document

  888. Electrothermal frequency referrence
    S.M.Kashmiri,K.A.A.Makinwa;
    Patent, US 8,222,940, July 2012.

  889. Ripple reduction loop for chopper amplifiers and chopper-stabilized amplifiers
    J.H. Huijsing, K.A.A. Makinwa; R. Wu;
    Patent, US 8,120,422, February 2012.

  890. Current-feedback instrumentation amplifiers
    J.H. Huijsing, R. Wu; K.A.A. Makinwa;
    Patent, US 8,179,195, May 2012.

  891. Oven Controlled MEMS Oscillator Device
    S. Donnay; X. Rottenberg; J. Borremans; H. Tilmans; G. van der Plas; M. Pertijs;
    Patent, United States 13/150,499, December 2012.

  892. Oven controlled MEMS oscillator
    S. Donnay; X. Rottenberg; J. Borremans; H. Tilmans; G. van der Plas; M. Pertijs;
    Patent, European 2,530,836, December 2012.

  893. Automatic Common-mode Rejection Calibration
    Fabio Sebastiano; Lucien J. Breems; Raf Roovers;
    Patent, United States 8174416, May 2012.

  894. Frequency synthesiser
    Salvatore Drago; Fabio Sebastiano; Domine M.W. Leenaerts; Lucien J. Breems; Bram Nauta;
    Patent, China 102369665 A, March 2012.

  895. Low-Noise CMOS Image Sensors for Radio-Molecular Imaging
    Y. Chen;
    PhD thesis, Delft University of Technology, 2012.

  896. In vivo blood analysis system
    B.P. Iliev;
    PhD thesis, Delft University of Technology, 2012.

  897. Low-power receive-electronics for a miniature 3D ultrasound probe.
    Z. Yu;
    PhD thesis, Delft University of Technology, 2012.

  898. MEMS integration techniques on silicon-on-insulator for inertial devices
    V. Rajaraman;
    PhD thesis, Delft University of Technology, 2012.

  899. Thermal-diffusivity-based frequency references in standard CMOS
    S.M. Kashmiri;
    PhD thesis, Delft University of Technology, 2012.

  900. From MEMS to NEMS: Scaling Cantilever Sensors
    C.K. Yang;
    PhD thesis, Delft University of Technology, 2012.

  901. Low-power low-noise CMOS imager design: in Micro-Digital Sun Sensor application
    N. Xie;
    PhD thesis, Delft University of Technology, 2012.

  902. Low-Power Receive-Electronics for a Miniature 3D Ultrasound Probe
    Zili Yu;
    PhD thesis, Delft University of Technology, April 2012.
    document

  903. Charge Domain Interlace Scan Implementation in a CMOS Image Sensor
    Y. Xu; A.J. Mierop; A.J.P. Theuwissen;
    IEEE Journal on Sensors,
    pp. 2621-2627, 2011.

  904. Auto-calibration of capacitive MEMS accelerometers based on pull-in voltage
    L.A. Machado da Rocha; R.A. Dias; E. Cretu; L. Mol; R.F. Wolffenbuttel;
    Microsystem Technologies: micro and nanosystems - information storage and processing systems,
    Volume 17, Issue 3, pp. 429-436, 2011.

  905. Narrow-band pass filter array for integrated opto-electronic spectroscopy detectors to assess esophageal tissue
    D. Ferreira; J. Mirkovic; R.F. Wolffenbuttel; J. Correia; M. Feld; G. Minas;
    Biomedical Optics Express,
    Volume 2, Issue 6, pp. 1703-1716, 2011.

  906. A surface micromachined thermopile detector array with an interference-based absorber
    H.W. Wu; A. Emadi; P.M. Sarro; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 7, pp. 1-8, 2011.

  907. Design of a time-based micro-g accelerometer
    R.A. Dias; L. Mol; R.F. Wolffenbuttel; E. Cretu; L.A. Machado da Rocha;
    IEEE Sensors Journal,
    Volume 11, Issue 8, pp. 1677-1683, 2011.

  908. Controller design for a high-sampling-rate closed-loop adaptive optics system with piezo-driven deformable mirror
    H. Song; R. Fraanje; G. Schitter; G.V. Vdovin; M. Verhaegen;
    European Journal of Control,
    Volume 17, Issue 3, pp. 290-301, 2011.

  909. A single-trim CMOS bandgap reference with a 3σ inaccuracy of ±0.15% from -40°C to 125°C
    G. Ge; C. Zhang; G. Hoogzaad; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 11, pp. 2693-2701, November 2011.

  910. A 240-frames/s 2.1-Mpixel CMOS image sensor with columnshared cyclic adc's
    S. Lim; J. Cheon; Y. Chae; W. Jung; D.H. Lee; M. Kwon; S. Yoo; S. Ham; G. Han;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 9, pp. 2073-2083, 2011.

  911. Integrated Polarization-Analyzing CMOS Image Sensor for Detecting Incoming Light Ray Direction
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 60, Issue 8, pp. 2759-2767, 2011.

  912. A 0.12 mm2 7.4 μ W micropower temperature sensor with an inaccuracy of ±0.2°C (3σ) from -30°C to 125°C
    K. Souri; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 7, pp. 1693-1700, July 2011.

  913. A 4 GHz continuous-time ΔΣ ADC with 70 dB DR and -74 dBFS THD in 125 MHz BW
    M. Bolatkale; L.J. Breems; R. Rutten; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 12, pp. 2857-2868, December 2011.

  914. A 2.1 M pixels, 120 frame/s CMOS image sensor with column-parallel ¿¿ ADC Architecture
    Y. Chae; J. Cheon; S. Lim; M. Kwon; K. Yoo; W. Jung; D.H. Lee; S. Ham; G. Han;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 1, pp. 236-247, 2011.

  915. Design aspects of advanced eddy current sensor interface for industrial applications
    M.R. Nabavi; S. Nihtianov;
    IEEE Transactions on Industrial Electronics,
    Volume 58, Issue 9, pp. 4414-4423, 2011.

  916. Charge Domain Interlace Scan Implementation in a CMOS Image Sensor
    Y. Xu; A. Mierop; A.J.P. Theuwissen;
    IEE Conference Publication Series,
    Volume 11, Issue 11, pp. 2621-2627, 2011.

  917. Integrated Polarization Analyzing CMOS Image Sensor for Real Time Material Classification
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    IEEE Sensors Journal,
    Volume 11, Issue 8, pp. 1692-1703, 2011.

  918. A current-feedback instrumentation amplifier with a gain error reduction loop and 0.06% untrimmed gain error
    R. Wu; J.H. Huijsing; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 12, pp. 2794-2806, December 2011. NEO.

  919. DNA tracking within a nanochannel: device fabrication and experiments
    V.R.S.S. Mokkapati; V. di Virgilio; C. Shen; J. Mollinger; J. Bastemeijer; A. Bossche;
    Lab on a Chip,
    Volume 11, Issue 16, pp. 2711-2719, 2011.

  920. Effects of size and surface on the elasticity of silicon nanoplates: molecular dynamics and semi-continuum approaches
    H. Sadeghian; J.F.L Goosen; A. Bossche; B.J. Thijsse; F. van Keulen;
    Thin Solid Films,
    Volume 520, Issue 1, pp. 391-399, 2011.

  921. On the size-dependent elasticity of silicon nanocantilevers: impact of defects
    H. Sadeghian; J.F.L Goosen; A. Bossche; B.J. Thijsse; F. van Keulen;
    Journal of Physics D: Applied Physics,
    Volume 44, Issue 7, pp. 072001, 2011.

  922. A 160 μw 8-channel active electrode system for EEG monitoring
    J. Xu; R.F. Yazicioglu; B. Grundlehner; P. Harpe; K.A.A. Makinwa; C. van Hoof;
    IEEE Transactions on Biomedical Circuits and Systems,
    Volume 5, Issue 6, pp. 555-567, December 2011.

  923. Pull-in-based $\mu$g-resolution accelerometer: Characterization and noise analysis
    Dias, Rosana A; Cretu, Edmond; Wolffenbuttel, Reinoud; Rocha, Luis A;
    Sensors and Actuators A: Physical,
    Volume 172, Issue 1, pp. 47-53, 2011.

  924. Digitally-controlled array of solid-state microcoolers for use in surgery
    Carmo, JP; Silva, MF; Ribeiro, JF; Wolffenbuttel, RF; Alpuim, P; Rocha, JG; Goncalves, LM; Correia, JH;
    Microsystem Technologies,
    Volume 17, Issue 8, pp. 1283-1291, 2011.

  925. A 65-nm CMOS temperature-compensated mobility-based frequency reference for Wireless Sensor Networks
    Fabio Sebastiano; Lucien J. Breems; Kofi Makinwa; Salvatore Drago; Domine M. W. Leenaerts; Bram Nauta;
    {IEEE} J. Solid-State Circuits,
    Volume 46, Issue 7, pp. 1544 - 1552, July 2011. DOI: 10.1109/JSSC.2011.2143630
    Keywords: ... CMOS integrated circuits;compensation;electron mobility;wireless sensor networks;MOS transistor;current 42.6 muA;electron mobility;mobility-based frequency reference;size 65 nm;temperature -55 degC to 125 degC;temperature-compensated CMOS frequency reference;two-point trim;voltage 1.2 V;wireless sensor networks;Accuracy;Frequency conversion;Oscillators;Temperature;Temperature measurement;Temperature sensors;Wireless sensor networks;CMOS integrated circuits;Charge carrier mobility;MOSFET;crystal-less clock;frequency reference;low voltage;sigma-delta modulation;smart sensors;temperature compensation;temperature sensors;ultra-low power;wireless sensor networks.

    Abstract: ... A temperature-compensated CMOS frequency reference based on the electron mobility in a MOS transistor is presented. Over the temperature range from -55 °C to 125 °C, the frequency spread of the complete reference is less than ±0.5% after a two-point trim and less than ±2.7% after a one-point trim. These results make it suitable for use in Wireless Sensor Network nodes. Fabricated in a baseline 65-nm CMOS process, the 150 kHz frequency reference occupies 0.2 mm² and draws 42.6 µA from a 1.2-V supply at room temperature.

  926. Ultrasound beamformer using pipeline-operated S/H delay stages and charge-mode summation
    Z. Yu; M. A. P. Pertijs; G. C. M. Meijer;
    Electronics Letters,
    Volume 47, Issue 18, pp. 1011‒1012, September 2011. DOI: 10.1049/el.2011.1786
    Abstract: ... The proposed ultrasound beamformer is based on the delay-and-sum beamforming principle. The circuit consists of several programmable delay lines. Each delay line is constructed by pipeline-operated sample-and-hold (S/H) stages with digitally-assisted delay control, which ensure delay-independent gain and good timing accuracy. The summation is realised in the charge domain using the charge-averaging method, which consumes virtually no extra die area or power. A prototype beamformer has been fabricated in a 0.35 m CMOS process to interface nine transducer elements. Measurement results show that this circuit consumes much less power and chip area than the prior art, while maintaining good accuracy and flexibility.

  927. A Single-Temperature Trimming Technique for MOS-Input Operational Amplifiers Achieving 0.33μV/°C Offset Drift
    M. Bolatkale; M. A. P. Pertijs; W. J. Kindt; J. H. Huijsing; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 46, Issue 9, pp. 2099‒2107, September 2011. DOI: 10.1109/JSSC.2011.2139530
    Abstract: ... A MOS-input operational amplifier has a reconfigurable input stage that enables trimming of both offset and offset drift based only on single-temperature measurements. The input stage consists of a MOS differential pair, whose offset drift is predicted from offset voltage measurements made at well-defined bias currents. A theoretical motivation for this approach is presented and validated experimentally by characterizing the offset of pairs of discrete MOS transistors as a function of bias current and temperature. An opamp using the proposed single-temperature trimming technique has been designed and fabricated in a 0.5 μm BiCMOS process. After single-temperature trimming, it achieves a maximum offset of ± 30 μV and an offset drift of 0.33 μV/°C (3σ) over the temperature range of -40°C to +125°C.

  928. Self-powered, hybrid antenna-magnetoresistive sensor for magnetic field detection
    Macedo, R; Cardoso, Filipe Arroyo; Cardoso, S; Freitas, PP; Germano, J; Piedade, MS;
    Applied Physics Letters,
    Volume 98, Issue 10, pp. 103503, 2011.

  929. On-chip measurement of the Brownian relaxation frequency of magnetic beads using magnetic tunneling junctions
    Donolato, Marco; Sogne, E; Dalslet, Bjarke Thomas; Cantoni, Matteo; Petti, Daniela; Cao, J; Cardoso, Filipe Arroyo; Cardoso, S; Freitas, PP; Hansen, Mikkel Fougt; others;
    Applied Physics Letters,
    Volume 98, Issue 7, pp. 073702, 2011.

  930. Operational Amplifiers: Theory and Design
    J.H. Huijsing;
    Kluwer Academic Publishers, Volume Kluwer International Seri , 2011.

  931. Characterization and closed-loop AO performance of a liquid deformable mirror
    E.S. ten Have; G.V. Vdovin;
    JJ Dolne; TJ Karr; VL Gamiz; S Rogers; DP Casasent (Ed.);
    SPIE, , pp. 816504-1-8165, 2011. NEO.

  932. Column-Parallel Single Slope ADC with Digital Correlated Multiple Sampling for Low Noise CMOS Image Sensors
    Y. Chen; A.J.P. Theuwissen; Y. Chae;
    In Procedia Engineering (Proceedings of the 25th Eurosensors Conference,
    pp. 1265-1268, 2011.

  933. Ageing effects on image sensors due to terrestrial cosmic radiation
    G.G. Nampoothiri; A.J.P. Theuwissen; M. Horemans;
    In S Süsstrunk; M Rabbani (Ed.), Electonic Imaging,
    SPIE, pp. 1-5, 2011.

  934. Series resistance optimization of high-sensitivity Si-based VUV photodiodes
    L. Shi; L.K. Nanver; A. Sakic; S. Nihtianov; T. Knezevic; A. Gottwald; U. Kroth;
    In H Zhang; K. Lee; Y Yan; R Dyer (Ed.), Proc. of the IEEE International Instrumentation and Measurement Technology Conference,
    IEEE, pp. 1-4, 2011.

  935. Noise analysis of a micro-G pull-in time accelerometer
    R.A. Dias; R.F. Wolffenbuttel; E. Cretu; L.A. Rocha;
    In A Johanessen; P Ohlckers; E Johanessen; M Azadmehr (Ed.), Vestfold University College, pp. 258-261, 2011.

  936. Squeeze-film damper design with air channels: experimental verification
    R.A. Dias; R.F. Wolffenbuttel; E. Cretu; L. Rocha;
    In G Kaltsas; C Tsamis (Ed.), 25th Eurosensors Conference,
    Elsevier, pp. 47-50, 2011.

  937. Sensor platform for natural gas composition measurement
    G. de Graaf; F. Bakker; R.F. Wolffenbuttel;
    In G Kaltsas; C Tsamis (Ed.), 25th Eurosensors Conference,
    Elsevier, pp. 1157-1160, 2011.

  938. Use of multi-wall carbon nanotubes as an absorber in a thermal detector
    H. Wu; S. Vollebregt; A. Emadi; G. de Graaf; R. Ishihara; R.F. Wolffenbuttel;
    In C Tsamis; G Kaltas (Ed.), 25th Eurosensors Conference,
    Elsevier, pp. 523-526, 2011.

  939. A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas
    G. de Graaf; H.W. Wu; R.F. Wolffenbuttel;
    In {De Saint Leger et al}, O (Ed.), 12th Intl. Conf. on Thermal, Mechanical Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    IEEE, pp. 1/5-5/5, 2011.

  940. IR microspectrometers based on linear-variable optical filters
    A. Emadi; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    In G Kaltsas; C Tsamis (Ed.), 25th Eurosensors Conference,
    Elsevier, pp. 1401-1404, 2011.

  941. Design and fabrication of an Albedo insensitive analog sun sensor
    H.W. Wu; A. Emadi; G. de Graaf; J. Leijtens; R.F. Wolffenbuttel;
    In G Kaltsas; C Tsamis (Ed.), 25th Eurosensors Conference,
    Elsevier, pp. 527-530, 2011.

  942. A 21-bit Read-Out IC Employing Dynamic Element Matching with 0.037% Gain Error
    R. Wu; J.H. Huijsing; K.A.A. Makinwa;
    In K-N Kim; S-I Liu (Ed.), 2011 IEEE Asian Solid-State Circuits Conference,
    IEEE, pp. 241-244, 2011.

  943. A Continuous-Time Sigma-Delta Modulator with a Gm-C Input Stage,120-dB CMRR and -87 dB THD
    Navid Sarhangnejad; R. Wu; Y. Chae; K.A.A. Makinwa;
    In K-N Kim; S-I Liu (Ed.), 2011 IEEE Asian Solid-State Circuits Conference (A-SSCC),
    IEEE, pp. 245-248, 2011.

  944. Ramp Calibration of Temperature Sensors
    K. Souri; K.A.A. Makinwa;
    In {De Venuto}, D; {L. Benini} (Ed.), 2011 IEEE 4th International Workshop on Advances in Sensors and Interfaces (IWASI),
    IEEE, pp. 67-70, 2011.

  945. A 36V Voltage-to-Current Converter with Dynamic Element Matching and Auto-Calibration for AC Ripple Reduction
    S. Bajoria; M.F. Snoeij; V. Schaffer; M.V. Ivanov; S. Wang; K.A.A. Makinwa;
    In H Tenhunen; M Aberg (Ed.), 2011 IEEE 37th European Solid-State Circuits Conference,
    IEEE, pp. 319-322, 2011.

  946. Low temperature encapsulation of nanochannels with water inside
    C. Shen; VRSS. Mokkapati; F. Santagata; A. Bossche; P.M. Sarro;
    In {Fan et al}, L-S (Ed.), 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    IEEE, pp. 854-857, 2011.

  947. Imaging the Heart with Ultrasound: Interface Electronics Design for 3D Transesophageal Echocardiography
    Z. Yu;
    In The Sense of Contact 13,
    Sense of Contact 2009, pp. -, 2011.

  948. Introduction to the Special Issue on the 2010 IEEE International Solid-State Circuits Conference
    K. Arimoto; K. Takeuchi; T. Karnik; K.A.A. Makinwa; A. Burdett;
    In {Makinwa et al}, KAA (Ed.), Special Issue on the 2010 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 3-7, 2011. Inleiding ter introductie special issue.

  949. Performance optimization of self-alignment system for capacitive sensors
    J. van Schieveen; R. Yang; S. Nihtianov; J. Spronck;
    In S Bogosyan; K Ohnishi (Ed.), Proc. of the IEEE International Conference on Mechatronics,
    IEEE, pp. 648-653, 2011.

  950. A GMR Spin-Valve Integrated into a Continuous Time Sigma-Delta Modulator for Quantitative, Real-Time Biosensing
    D.A. Hall; C. Chu; A. Dotey; R.S. Gaster; K.A.A. Makinwa; B. Murmann; S.X. Wang;
    In B Terris; C-R Chang; M-J Tung; B Liu; K Liu (Ed.), IEEE International Magnetics Conference (INTERMAG),
    IEEE, pp. -, 2011.

  951. Application challenges of capacitive sensors with floating targets
    S. Nihtianov; G.C.M. Meijer;
    In s.n. (Ed.), Proc. of the IEEE Africon,
    IEEE, pp. 1249-1254, 2011.

  952. Capacitive sensor system for sub-nanometer displacement measurement
    S. Xia; S. Nihtianov;
    In E Lewis; T Kenny (Ed.), Proc. of the IEEE Sensors conference,
    IEEE, pp. 1173-1176, 2011.

  953. A 2.1 Mpixel 120 frames/s CMOS image sensor with column parallel ¿¿ ADC architecture
    Y. Chae; J. Cheon; S. Lim; D. Lee; M. Kwon; K. Yoo; W. Jung; D.H. Lee; S. Ham; G. Han;
    In U Moon (Ed.), IEEE International Solid State Circuits Conference,
    IEEE, pp. 394-395, 2011.

  954. A Ratio-metric Analog to Digital Converter for an Eddy Current Displacement Sensor
    A. Fekri; M. R. Nabavi; M. Pertijs; S. Nihtianov;
    In Proc. International Scientific Conference on Electronics,
    Sozopol, Bulgaria, September 2011.

  955. Thermal Diffusivity Sensing: A New Temperature Sensing Paradigm
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    In R Patel; T Andre; A Khan (Ed.), 2011 IEEE Custom Integrated Circuits Conference,
    IEEE, pp. 1-6, 2011.

  956. A novel soi-mems "micro-swing" time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range
    V. Rajaraman; B.S. Hau; L.A. Rocha; R.A. Dias; K.A.A. Makinwa; R. Dekker;
    In M. Bao; L-S Fan (Ed.), 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    IEEE, pp. 2066-2069, 2011.

  957. A 96-channel full data rate direct neural interface in 0.13um CMOS
    R.M. Walker; H. Gao; P. Nuyujukian; K.A.A. Makinwa; K.V. Shenoy; T. Meng; B. Murmann;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 144‒145, June 2011.

  958. A 160μW 8-channel active electrode system for EEG monitoring
    J. Xu; R.F. Yazicioglu; P. Harpe; K.A.A. Makinwa; C. van Hoof;
    In A Chandrakasan; {Gass et al}, W (Ed.), Digest of Technical Papers - 2011 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 300-302, February 2011. NEO.

  959. Closed-loop AO performance of a liquid mirror
    E.S. ten Have; G.V. Vdovine;
    In Abstracts of the 8th International Workshop on Adaptive Optics for Industry and Medicine,
    Universidad de Murcia, pp. 78-79, 2011. NEO.

  960. Dry Film Resist Microfluidic Channels on Printed Circuit Board and its Application as Fluidic Interconnection for Nanofluidic Chips: Fabrication Challenges
    N.B. Palacios-Aguilera; S. Mokkapati; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In V Privman; V Ovchinnikov (Ed.), 5th International Conference on Quantum, Nano and Micro Technologies 2011 (ICQNM),
    IARIA, pp. 71-76, 2011.

  961. A precision DTMOST-based temperature sensor
    K. Souri; Y. Chae; Y. Ponomarev; K.A.A. Makinwa;
    In H Schmidt; C Papavassiliou (Ed.), Proceedings 2011 European Solid-State Circuits Conference,
    IEEE, pp. 279-282, 2011.

  962. Electrical performance optimization of a silicon-based EUV photodiode with hear-theoretical quantum efficiency
    L. Shi; L.K. Nanver; C. Laubis; F. Scholze; S. Nihtianov;
    In {Esashi et al.}, M; Z Zhou (Ed.), Proc. of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems,
    IEEE, pp. 48-51, 2011.

  963. Near- and mid-IR microspectrometers based on linear variable optical filters
    A. Emadi;
    In E Lewis; Th Kenny (Ed.), Proceedings 10th IEEE Sensors Conference 2011,
    IEEE, pp. 424-427, 2011.

  964. Zoom-in front-end circuit for high-performance capacitive displacement sensors
    S. Xia; S. Nihtianov;
    In X Yu; T Dillon (Ed.), Proc. of the 37th IEEE Industrial Electronics Society,
    IEEE, pp. 2657-2662, 2011.

  965. A 256 Channel Magnetoresistive Biosensor Microarray for Quantitative Proteomics
    D.A. Hall; R.S. Gaster; S.J. Osterfeld; K.A.A. Makinwa; S.X. Wang; B. Murmann;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 174‒175, June 2011.

  966. Ageing Effects on Image Sensors: Neutron Irradation Studies on Wafer and Packages CCD and CMOS devices
    G.G. Nampoothiri; A.J.P. Theuwissen;
    In K Chesnut; R Reed (Ed.), Proceedings of Nuclear and Space Radiation Effects Conference 2011,
    IEEE, pp. -, 2011.

  967. High-performance eddy current sensor interface for small displacement measurement
    M.R. Nabavi; R. Yang; S. Nihtianov;
    In {Dyer et al.}, C (Ed.), Proc. of the International Instrumentation and Measurement Technology Conference,
    IEEE, pp. 58-62, 2011.

  968. A 25mW Smart CMOS Sensor for Wind and Temperature Measurement
    J. Wu; C.P.L. van Vroonhoven; Y. Chae; K.A.A. Makinwa;
    In E Lewis; T Kenny (Ed.), Proceedings IEEE Sensors 2011,
    IEEE, pp. 1261-1264, 2011.

  969. Series Resistance Optimization of High-Sensitivity Si-based VUV Photodiodes
    L. Shi; L.K. Nanver; A. Sakic; S. Nihtianov; T. Knezevic; A. Gottwald; U. Kroth;
    In H Zhang; K. Lee; Y Yan; R Dyer (Ed.), IEEE International Instrumentation and Measurement Technology Conference,
    IEEE, pp. 1-4, 2011.

  970. Zoom-in front-end for power-efficient high-speed and high-resolution capacitive sensor measurement system
    S. Xia; S. Nihtianov;
    In H Zhang; K. Lee; Y Yan; R Dyer (Ed.), Proc. of the IEEE International Instrumentation and Measurement Technology Conference,
    IEEE, pp. 159-163, 2011.

  971. Highly stable capacitance-to-digital converter with improved dynamic range
    R. Nojdelov; R. Yang; X. Guo; S. Nihtianov;
    In S Mukhopadhyay; A Fuchs; KP Jayasundera (Ed.), Proc. of the IEEE Fifth International Conference on Sensing Technology,
    IEEE, pp. 140-144, 2011.

  972. An autonomous low power high resolution micro-digital sun sensor
    N. Xie; A.J.P. Theuwissen;
    In L Zhou; G Jin (Ed.), 2011 International Symposium on Photoelectric Detection and Imaging (ISPDI2011),
    SPIE, pp. 1-8, 2011.

  973. Column-Parallel Circuits with Digital Correlated Multiple Sampling for Low Noise CMOS Imagers
    Y. Chen; Y. Xu; A. Mierop; A.J.P. Theuwissen;
    In N Terashini; J Nakamura (Ed.), 2011 International Image Sensor Workshop (IISW),
    Image Sensors, pp. 78-81, 2011.

  974. Ageing Effects on Image Sensors: Neutron Irradiation Studies on Wafer and Packaged devices
    G.G. Nampoothiri; A.J.P. Theuwissen;
    In N Teranishi; J Nakamura; S Kawahito (Ed.), 2011 International Image Sensor Workshop (IISW),
    IISW, pp. 66-69, 2011.

  975. 4T CMOS Image Sensor Pixel Degradation due to X-ray Radiation
    J. Tan; B. Buettgen; A.J.P. Theuwissen;
    In N Terashini; J Nakamura (Ed.), 2011 International Image Sensor Workshop - IISW,
    Image Sensors, pp. 228-231, 2011.

  976. A current-feedback instrumentation amplifier with a gain error reduction loop and 0.06% untrimmed gain error
    R. Wu; J.H. Huijsing; K.A.A. Makinwa;
    In A Chandrakasan; {Gass et al}, W (Ed.), Digest of Technical Papers - 2011 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 244-246, February 2011.

  977. A 4GHz CT Delta-Sigma ADC with 70dB DR and -74dBFS THD in 125MHz BW
    M. Bolatkale; L.J. Breems; R. Rutten; K.A.A. Makinwa;
    In A Chandrakasana; W Gass (Ed.), 2011 IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 470-472, 2011.

  978. A 21b ±40mV range read-out IC for bridge transducers
    R. Wu; J.H. Huijsing; K.A.A. Makinwa;
    In A Chandrakasan; {Gass et al}, W (Ed.), Digest of Technical Papers - 2011 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 110-111, February 2011. NEO.

  979. Spectral measurement with a UV linear-variable optical filter microspectrometer
    A. Emadi;
    In E Lewis; Th Kenny (Ed.), Proceedings 10th IEEE Sensors Conference 2011,
    IEEE, pp. 420-423, 2011.

  980. An Autonomous micro-Digital Sun Sensor Implemented with a CMOS Image Sensor Achieving 0.004o Resolution @ 21 mW
    N. Xie; A.J.P. Theuwissen; B. Buttgen;
    In N Teranishi; J Nakamura; S Kawahito (Ed.), International Image Sensor Workshop (IISW 2011),
    IISW, pp. 208-211, 2011.

  981. An SOI thermal-diffusivity-based temperature sensor with ±0.6°C (3σ) untrimmed inaccuracy from -70°C to 170°C
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    In S. Xia; M. Bao; L-S Fan (Ed.), 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    IEEE, pp. 2887-2890, 2011.

  982. Qualification of a stable capacitive sensor interface, based on capacitance-resistance comparison
    R. Yang; A. Fekri; R. Nojdelov; S. Nihtianov;
    In E Lewis; T Kenny (Ed.), Proc. of the IEEE Sensors conference,
    IEEE, pp. 1181-1184, 2011.

  983. High-sensitivity high-stability silicon photodiodes for DUV, VUV and EUV spectral ranges
    L. Shi; S. Nihtianov; L.K. Nanver; F. Scholze; A. Gottwald;
    In OH Siegmund (Ed.), Proc. of the SPIE 8145, 81450N,
    SPIE, pp. 1-9, 2011.

  984. A 50mW CMOS wind sensor with ±4% speed and ±2° direction error
    J. Wu; Y. Chae; C.P.L. van Vroonhoven; K.A.A. Makinwa;
    In A Chandrakasan; {Gass et al}, W (Ed.), Digest of Technical Papers - 2011 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 106-108, February 2011.

  985. Stability characterization of high-sensitivity silicon-based EUV photodiodes in a detrimental industrial environment
    L. Shi; L.K. Nanver; S. Nihtianov;
    In X Yu; T Dillon; Y Ibrahim; E Chang (Ed.), Proc. of the 37th Annual Conference of the IEEE Industrial Electronics Society,
    IEEE, pp. 2651-2656, 2011.

  986. A scaled thermal-diffusivity-based frequency reference in 0.16 um CMOS
    S.M. Kashmiri; K. Souri; K.A.A. Makinwa;
    In H Tenhunen; M Aberg (Ed.), 37th European Soldi-State Circuits Conference 2011, (ESSCIRC),
    IEEE, pp. 503-506, 2011.

  987. X-ray radiation effect on CMOS imagers with in-pixel buried-channel source follower
    Y. Chen; J. Tan; X. Wang; A.J. Mierop; A.J.P. Theuwissen;
    In H Tenhunen; M Aberg (Ed.), 41st IEEE European Solid-State Device Research Conference (ESSDERC) 2011,
    IEEE, pp. 155-158, 2011.

  988. Phase readout of thermal conductivity-based gas sensors
    C.P.L. van Vroonhoven; G. de Graaf; K.A.A. Makinwa;
    In {De Venuto}, D; L Benini (Ed.), 4th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI),
    IEEE, pp. 199-202, 2011.

  989. Low temperature encapsulation of nanochannels with water inside
    C. Shen; V.R.S.S Mokkapati; F. Santagata; A. Bossche; P.M. Sarro;
    In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference,
    IEEE, pp. 854-857, 2011.

  990. Effects of Packaging and Process Spread on a Mobility-Based Frequency Reference in 0.16-µm CMOS
    Fabio Sebastiano; Lucien J. Breems; Kofi Makinwa; Salvatore Drago; Domine M. W. Leenaerts; Bram Nauta;
    In Proc. European Solid-State Circuits Conference,
    Helsinki, Finland, pp. 511 - 514, September12-16 2011. DOI: 10.1109/ESSCIRC.2011.6044934
    Keywords: ... CMOS integrated circuits;MOSFET;ceramic packaging;electron mobility;low-power electronics;plastic packaging;reference circuits;wireless sensor networks;CMOS process;ceramic packages;electron mobility;frequency 50 kHz;low-voltage low-power circuit;mobility-based frequency reference;off-chip components;packaging;plastic packages;process spread;size 0.16 mum;temperature -55 degC to 125 degC;temperature 293 K to 298 K;thick-oxide MOS transistors;thin-oxide MOS transistors;voltage 1.2 V;wireless sensor networks;Accuracy;Ceramics;Oscillators;Plastics;Temperature distribution;Temperature measurement;Transistors.

    Abstract: ... In this paper, we explore the robustness of frequency references based on the electron mobility in a MOS transistor by implementing them with both thin-oxide and thick-oxide MOS transistors in a 0.16-µm CMOS process, and by testing samples packaged in both ceramic and plastic packages. The proposed low-voltage low-power circuit requires no off-chip components, making it suitable for applications requiring fully integrated solutions, such as Wireless Sensor Networks. Over the temperature range from -55 °C to 125 °C, its frequency spread is less than ±1% (3σ) after a one-point trim. Fabricated in a baseline 0.16-µm CMOS process, the 50 kHz frequency reference occupies 0.06 mm² and, at room temperature, its consumption with a 1.2-V supply is less than 17 µW.

  991. A 1.8V 11μW CMOS smart humidity sensor for RFID sensing applications
    Z. Tan; R. Daamen; A. Humbert; K. Souri; Y. Chae; Y. V. Ponomarev; M. A. P. Pertijs;
    In Proc. IEEE Asian Solid State Circuits Conference (A-SSCC),
    IEEE, pp. 105‒108, November 2011. DOI: 10.1109/ASSCC.2011.6123615
    Abstract: ... A fully-integrated humidity sensor for a smart RFID sensor platform has been realized in 0.16μm standard CMOS technology. It consists of a top-metal finger-structure capacitor covered with a humidity-sensitive layer, combined with a micro-power flexible sensor interface based on a second-order incremental delta-sigma converter. The interface can be easily reconfigured to compensate for process variation of the sensing element. In a measurement time of 10.2 ms, the interface performs a 13-bits capacitance-to-digital conversion while consuming only 5.85 μA from 1.8 V supply. In combination with the co-integrated sensor capacitor, it thus provides a humidity-to-digital conversion with a resolution of 0.1\% RH in the range of 20\% to 90\% RH at only 107 nJ per measurement. This represents a significant improvement in energy efficiency compared to existing capacitive-sensor interfaces with comparable performance.

  992. Light-emitting diode junction-temperature sensing using differential voltage/current measurements
    F. D. Roscam-Abbing; M. A. P. Pertijs;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 861‒864, October 2011. DOI: 10.1109/icsens.2011.6127191

  993. An energy-efficient 15-bit capacitive sensor interface
    Z. Tan; M. A. P. Pertijs; G. Meijer;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 283‒286, September 2011. DOI: 10.1109/esscirc.2011.6044962

  994. A ping-pong-pang current-feedback instrumentation amplifier with 0.04\% gain error
    S. Sakunia; F. Witte; M. Pertijs; K. Makinwa;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    IEEE, pp. 60‒61, June 2011.
    Abstract: ... A ping-pong-pang auto-zeroed and chopped current-feedback instrumentation amplifier (CFIA) uses three dynamically-matched input stages to achieve 0.04\% gain error, a 2.5× improvement over prior art. Its 4 μV offset and 28 nV/√Hz noise are achieved at 3.5× less supply current than a comparable ping-pong auto-zeroed CFIA.

    document

  995. Optimization and integration of magnetoresistive sensors
    Freitas, Paulo P; Cardoso, Susana; Ferreira, Ricardo; Martins, Verónica C; Guedes, André; Cardoso, Filipe Arroyo; Loureiro, Joana; Macedo, Rita; Chaves, Rui C; Amaral, José;
    In Spin,
    World Scientific Publishing Company, pp. 71-91, 2011.

  996. Light-Emitting Diode Junction-Temperature Sensing using Various Voltage/Current Measurement Techniques
    Folkert Roscam Abbing;
    MSc thesis, Delft University of Technology, August 2011.
    document

  997. Energy-Efficient Readout of Resonant Sensors
    Zeng Zeng;
    MSc thesis, Delft University of Technology, October 2011.
    document

  998. Energy-Efficient Capacitive-Sensor Interface Based on an Incremental Delta-Sigma Modulator Employing Current-Starved Inverter-Based OTAs
    Fan Guo;
    MSc thesis, Delft University of Technology, November 2011.
    document

  999. Single slope analog-to-digital converter
    M.F. Snoeij; A.J.P. Theuwissen; J.H. Huijsing;
    2011.

  1000. Apparatus and method for sigma-delta analog to digital conversion
    Y. Chae; I. Lee; J. Cheon; S. Ham; G. Han;
    2011.

  1001. Method of monolithically integrating MEMS/NEMS sensors/actuators with MEMS/NEMS sensors/actuators and example semiconductor process for making the same
    V. Rajaraman;
    2011.

  1002. Synchronous phase detection circuit
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    Patent, US 8,013,636, September 2011.

  1003. Ovenized System Containing Micro-Electromechanical Resonator
    J. Borremans; M. A. P. Pertijs;
    Patent, United States 20130127552A1, November 2011.

  1004. Oscillator based on thermal diffusion
    J.F. Witte; K.A.A. Makinwa;
    Patent, US 7,920,032, May 2011.

  1005. Apparatus and method for sigma-delta analog to digital conversion
    Y. Chae; I. Lee; J. Cheon; S. Ham; G. Han;
    Patent, US 7,916,061, 2011.

  1006. Low-power high-performance integrated interface for eddy-current displacement sensors
    M.R. Nabavi;
    PhD thesis, Delft University of Technology, 2011.

  1007. MEMS-based lineair thermopile detector arrays for ir microspectrometers
    H.W. Wu;
    PhD thesis, Delft University of Technology, 2011.

  1008. Low-power high-accuracy smart temperature sensors in CMOS technology
    A.L. Aita;
    PhD thesis, Delft University of Technology, 2011.

  1009. A biologically inspired CMOS image sensor
    M. Sarkar;
    PhD thesis, Delft University of Technology, 2011.

  1010. Precision instrumentation amplifiers and a read-out for sensor interfacing
    R. Wu;
    PhD thesis, Delft University of Technology, 2011.

  1011. Micro and Nanofluidic devices: For Single cell and DNA analysis
    V.R.S.S. Mokkapati;
    PhD thesis, Delft University of Technology, 2011.

  1012. Design and empirical investigation of capacitive human detectors with opened electrodes
    R.A. Cardenas; H.M.M. Kerkvliet; G.C.M. Meijer;
    Measurement Science and Technology,
    Volume 21, Issue 1, pp. 1-8, 2010.

  1013. Fabrication and characterization of IC compatible linear variable optical filters with application in a micro spectrometer
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; K. Hedsten; P. Enoksson; J.H.G. Correia; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 162, Issue 2, pp. 400-405, 2010.

  1014. Model-based aberration correction in a wavefront-sensor-less adaptive optics system
    H. Song; R. Fraanje; G. Schitter; H. Kroese; G.V. Vdovine; M. Verhaegen;
    Optics Express,
    Volume 18, Issue 23, pp. 24070-24084, 2010. NEO.

  1015. Model-based aberration correction in a closed-loop wavefront-sensor-less adaprive optics system
    H. Song; P.R. Fraanje; G. Schitter; H. Kroese; G.V. Vdovin; M. Verhaegen;
    Optics Express,
    Volume 18, Issue 23, 2010.

  1016. Estimation of three- and four-element windkessel parameters using subspace model identification
    T. Kind; T.J.C. Faes; J.W. Lankhaar; A. Vonk-Noordegraaf; M. Verhaegen;
    IEEE Transactions on Biomedical Engineering,
    Volume 57, Issue 7, pp. 1531-1538, 2010.

  1017. Error source identification and stability test of a precision capacitance measurement system
    S. Nihtianov; X. Guo;
    SAIEE Africa Research Journal,
    Volume 101, Issue 3, pp. 106-111, 2010. NEO.

  1018. Application of electrostatic pull-in instability on sensing adsorbate stiffness in nanomechanical resonators
    H. Sadeghian Marnani; J.F.L. Goosen; A. Bossche; F. van Keulen;
    Thin Solid Films,
    Volume 518, Issue 17, pp. 5018-5021, 2010.

  1019. Introduction to the Special Issue on the 2010 International Solid-State Circuits Conference
    K. Arimoto; K. Takeuchi; K.A.A. Makinwa; A. Burdett,;
    IEEE Journal of Solid State Circuits,
    Volume 46, Issue 1, pp. 3-7, 2010.

  1020. Surface reconstruction and elastic behavior of silicon nanobeams: The impact of applied deformation
    H. Sadeghian Marnani; J.F.L. Goosen; A. Bossche; B.J. Thijsse; F. van Keulen;
    Thin Solid Films,
    Volume 518, pp. 3273-3275, 2010.

  1021. Design, fabrication and characterization of a femto-farad capacitive sensor for pico-liter liquid monitoring
    J. Wei; C. Yue; M. van der Velden; T. Chen; Z.W. Liu; K.A.A. Makinwa; P.M. Sarro;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 162, Issue 2, pp. 406-417, 2010.

  1022. MCM based microlaboratory for simultaneous measurement of several biochemical parameters by spectrophotometry
    G. Minas; R.F. Wolffenbuttel; J.H.G. Correia;
    Biomedical Microdevices,
    Volume 12, Issue 4, pp. 727-736, 2010.

  1023. A high PSRR bandgap voltage reference with virtually diode-connected MOS transistors.
    K. Souri; H. Shamsi; M. Kazemi; Kamran Souri;
    IEICE Transactions on Electronics,
    Volume E93-C, Issue 12, pp. 1708-1712, 2010.

  1024. A planar thermoelectric power generator for integration in wearable microsystems
    Carmo Paulo Joao; Luis Miguel Goncalves; R.F. Wolffenbuttel; J.H.G. Correia;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 161, Issue 1-2, pp. 199-204, 2010.

  1025. Demonstration of PECVD SiC-SiO2-SiC horizontal slot waveguides
    G. Pandraud; A.B. Neira; E. Margallo Balbas; C.K. Yang; P.M. Sarro;
    IEEE Photonics Technology Letters,
    Volume 22, Issue 6, pp. 398-400, 2010.

  1026. Model-based aberration correction in a closed-loop wavefront-sensor-less adaptive optics system
    H. Song; P.R. Fraanje; G. Schitter; H. Kroese; G.V. Vdovin; M. Verhaegen;
    Optics Express,
    Volume 18, Issue 23, pp. 24070-24084, 2010.

  1027. Introduction to the special issue on the 35th ESSCIRC
    Y. Deval; K.A.A. Makinwa; S. Rusu;
    IEEE Journal of Solid State Circuits,
    Volume 45, Issue 7, pp. 1270-1272, 2010.

  1028. Demonstration of PECVD SiC thermal delay lines for optical coherence tomography in the visible
    G. Pandraud; E. Margallo Balbas; P.M. Sarro;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 7715, pp. 1-10, 2010.

  1029. A 200 µA Duty-Cycled PLL for Wireless Sensor Nodes in 65 nm CMOS
    Salvatore Drago; Domine M.W. Leenaerts; Bram Nauta; Fabio Sebastiano; Kofi A.A. Makinwa; Lucien J. Breems;
    {IEEE} J. Solid-State Circuits,
    Volume 45, Issue 7, pp. 1305 - 1315, July 2010. DOI: 10.1109/JSSC.2010.2049458
    Keywords: ... CMOS integrated circuits;UHF integrated circuits;frequency synthesizers;low-power electronics;phase locked loops;wireless sensor networks;CMOS technology;DCPLL circuit;current 200 muA;duty-cycled PLL;frequency 300 MHz to 1.2 GHz;frequency error;low-power high-frequency synthesizer;size 65 nm;voltage 1.3 V;wireless sensor networks;wireless sensor nodes;Batteries;CMOS technology;Energy consumption;Frequency synthesizers;Integrated circuit technology;Jitter;Oscillators;Phase locked loops;Phase noise;Wireless sensor networks;CMOS;PLL;WSN;duty-cycle;frequency stability;frequency synthesizer;fully integrated;ultra-low-power;wireless sensor networks.

    Abstract: ... The design of a duty-cycled PLL (DCPLL) capable of burst mode operation is presented. The proposed DCPLL is a moderately accurate low-power high-frequency synthesizer suitable for use in nodes for wireless sensor networks (WSN). Thanks to a dual loop configuration, the PLL's total frequency error, once in lock, is less than 0.25% from 300 MHz to 1.2 GHz. It employs a fast start-up DCO which enables its operation at duty-cycles as low as 10%. Fabricated in a baseline 65 nm CMOS technology, the DCPLL circuit occupies 0.19 x 0.15 mm² and draws 200 µA from a 1.3 V supply when generating bursts of 1 GHz signal with a 10% duty-cycle.

  1030. A 1.2-V 10-µW NPN-Based Temperature Sensor in 65-nm CMOS With an Inaccuracy of 0.2 °C (3σ) From -70 °C to 125 °C
    Fabio Sebastiano; Lucien J. Breems; Kofi Makinwa; Salvatore Drago; Domine M. W. Leenaerts; Bram Nauta;
    {IEEE} J. Solid-State Circuits,
    Volume 45, Issue 12, pp. 2591 - 2601, December 2010. DOI: 10.1109/JSSC.2010.2076610
    Keywords: ... CMOS integrated circuits;correlation methods;signal sampling;temperature sensors;CMOS;correlated double sampling;dynamic element matching;npn transistor;power 10 muW;size 65 nm;temperature -70 C to 125 C;temperature sensor;voltage 1.2 V;CMOS analog integrated circuits;CMOS process;Intelligent sensors;Sigma delta modulation;Temperature sensors;CMOS analog integrated circuits;sigma-delta modulation;smart sensors;temperature sensors.

    Abstract: ... An NPN-based temperature sensor with digital output has been realized in a 65-nm CMOS process. It achieves a batch-calibrated inaccuracy of (3σ) and a trimmed inaccuracy of (3σ) over the temperature range from -70 °C to 125 °C. This performance is obtained by the use of NPN transistors as sensing elements, the use of dynamic techniques, i.e., correlated double sampling and dynamic element matching, and a single room-temperature trim. The sensor draws 8.3 µA from a 1.2-V supply and occupies an area of 0.1 mm².

  1031. A Thermal-Diffusivity-Based Frequency Reference in Standard CMOS With an Absolute Inaccuracy of ±0.1\% From -55°C to 125°C
    S. M. Kashmiri; M. A. P. Pertijs; K. A. A. Makinwa;
    IEEE Journal of Solid-State Circuits,
    Volume 45, Issue 12, pp. 2510‒2520, December 2010. DOI: 10.1109/JSSC.2010.2076343
    Abstract: ... An on-chip frequency reference exploiting the well-defined thermal-diffusivity (TD) of IC-grade silicon has been realized in a standard 0.7 μm CMOS process. A frequency-locked loop (FLL) locks the frequency of a digitally controlled oscillator (DCO) to the process-insensitive phase shift of an electrothermal filter (ETF). The ETF's phase shift is determined by its geometry and by the thermal diffusivity of bulk silicon (D). The temperature dependence of is compensated for with the help of die-temperature information obtained by an on-chip band-gap temperature sensor. The resulting TD frequency reference has a nominal output frequency of 1.6 MHz and dissipates 7.8 mW from a 5 V supply. Measurements on 16 devices show that it has an absolute inaccuracy of ±0.1\% (σ = ±0.05\%) over the military temperature range (-55°C to 125°C ), with a worst case temperature coefficient of ± 11.2 ppm/°C.

  1032. A 140 dB-CMRR current-feedback instrumentation amplifier employing ping-pong auto-zeroing and chopping
    M. A. P. Pertijs; W. J. Kindt;
    IEEE Journal of Solid-State Circuits,
    Volume 45, Issue 10, pp. 2044‒2056, October 2010. DOI: 10.1109/jssc.2010.2060253
    Abstract: ... This paper presents a precision general-purpose current-feedback instrumentation amplifier (CFIA) that employs a combination of ping-pong auto-zeroing and chopping to cancel its offset and 1/f noise. A comparison of offset-cancellation techniques shows that neither chopping nor auto-zeroing is an ideal solution for general-purpose CFIAs, since chopping results in output ripple, and auto-zeroing is associated with increased low-frequency noise. The presented CFIA mitigates these unintended side effects through a combination of these techniques. A ping-pong auto-zeroed input stage with slow-settling offset-nulling loops is applied to limit the bandwidth of the increased noise to less than half of the auto-zeroing frequency. This noise is then modulated away from DC by chopping the input stage at half the auto-zeroing frequency, reducing the low-frequency noise to the 27 nV/ white-noise level, without introducing extra output ripple. The auto-zeroing is augmented with settling phases to further reduce output transients. The CFIA was realized in a 0.5 μm analog CMOS process and achieves a typical offset of 2.8 μV and a CMRR of 140 dB in a common-mode voltage range that includes the negative supply.

  1033. Low-cost calibration techniques for smart temperature sensors
    M. A. P. Pertijs; A. L. Aita; K. A. A. Makinwa; J. H. Huijsing;
    IEEE Sensors Journal,
    Volume 10, Issue 6, pp. 1098‒1105, June 2010. DOI: 10.1109/jsen.2010.2040730
    Abstract: ... Smart temperature sensors generally need to be trimmed to obtain measurement errors below ±2°C. The associated temperature calibration procedure is time consuming and therefore costly. This paper presents two, much faster, voltage calibration techniques. Both make use of the fact that a voltage proportional to absolute temperature (PTAT) can be accurately generated on chip. By measuring this voltage, the sensor's actual temperature can be determined, whereupon the sensor can be trimmed to correct for its dominant source of error: spread in the on-chip voltage reference. The first calibration technique consists of measuring the (small) PTAT voltage directly, while the second, more robust alternative does so indirectly, by using an external reference voltage and the on-chip ADC. Experimental results from a prototype fabricated in 0.7 μm CMOS technology show that after calibration and trimming, these two techniques result in measurement errors (±3σ) of ±0.15°C and ±0.25°C, respectively, in a range from -55°C to 125°C.

  1034. 12-bit accurate voltage-sensing ADC with curvature-corrected dynamic reference
    N. Saputra; M. A. P. Pertijs; K. A. A. Makinwa; J. H. Huijsing;
    Electronics Letters,
    Volume 46, Issue 6, pp. 397‒398, March 2010. DOI: 10.1049/el.2010.3337
    Abstract: ... A sigma-delta analogue-to-digital converter (ADC) with a dynamic voltage reference is presented that achieves 12-bit absolute accuracy over the extended industrial temperature range (-40 to 105°C). Temperature-dependent gain errors due to the reference's curvature are digitally corrected by adjusting the gain of the ADC's decimation filter. The required correction factor is obtained by first using the reference to make a temperature measurement, and then translating the result into a correction factor by means of a lookup table and a linear interpolator. Thus, a dynamic voltage reference is realised with a measured temperature drift of less than 1.7 ppm/°C. The ADC was fabricated in 0.7 μm CMOS technology and consumes 85 μA from a 2.5-5.5 V supply.

  1035. Challenges and trends in the development of a magnetoresistive biochip portable platform
    Martins, Verónica C; Germano, José; Cardoso, Filipe Arroyo; Loureiro, Joana; Cardoso, Susana; Sousa, Leonel; Piedade, Moisés; Fonseca, Luís P; Freitas, PP;
    Journal of Magnetism and Magnetic Materials,
    Volume 322, Issue 9-12, pp. 1655-1663, 2010.

  1036. Picomolar detection limit on a magnetoresistive biochip after optimization of a thiol-gold based surface chemistry
    Martins, VC; Cardoso, Filipe Arroyo; Freitas, PP; Fonseca, LP;
    Journal of nanoscience and nanotechnology,
    Volume 10, Issue 9, pp. 5994-6002, 2010.

  1037. Qualification of MEMS gyroscope architectures for high performance and tunability
    I. Sabageh; V. Rajaraman; E. Cretu;
    conference, 2010. Delft University of Technology.

  1038. Design and modelling of a three mass, decoupled, tunable SOI MEMS gyroscope with sense frame architecture
    I. Sabageh; V. Rajaraman; E. Cretu;
    conference, 2010.

  1039. A piezoresistive detector design for a high sensitivity pull in time digital accelerometer
    Hau Bou sing; V. Rajaraman; L.A. Rocha;
    conference, 2010.

  1040. A piezoresistive detector design for a high sensitivity time based digital accelerometer
    Hau Bou sing; V. Rajaraman; L.A. Rocha;
    conference, 2010.

  1041. Preliminary design and modeling of high performance tunable, decoupled MEMS gyroscope
    I. Sabageh; V. Rajaraman; E. Cretu;
    conference, 2010.

  1042. Surface micromached gas sensor using thermopiles for carbon dioxide detection
    S. Chen; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    {van Honschoten}, J; H Verputten; H Groenland (Ed.);
    MME, , pp. 216-219, 2010.

  1043. Spectral measurement using IC compatible linear variable optical filter
    A. Emadi; H. Wu; S. Grabarnik; G. de Graaf; K. Hedsten; P. Enoksson; J.H.G. Correia; R.F. Wolffenbuttel;
    H Thienpont; {van Daele}, P; J Mohr; H Zappe (Ed.);
    SPIE, , pp. 1-6, 2010.

  1044. Thermal analysis, fabrication and signal processing of surface microma-chined thermal conductivity based gas sensors
    G. de Graaf; H. Wu; R.F. Wolffenbuttel;
    L Abelmann; H Groenland; {van Honschoten}, J; H Verputten (Ed.);
    MME, , pp. 173-176, 2010.

  1045. An UV linear variable optical filter based micro spectrometer
    A. Emadi; H. Wu; S. Grabarnik; G. de Graaf; K. Hedsten; P. Enoksson; J.H.G. Correia; R.F. Wolffenbuttel;
    M.J. Vellekoop (Ed.);
    Eurosensor 24, , pp. 416-419, 2010.

  1046. A CMOS 128 APS linear array integrated with a LVOF for high sensitivity and high resolution micro spectrophotometry
    C. Liu; A. Emadi; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    F Berghmans; AG Mignani; C. van HoofA (Ed.);
    SPIE, , pp. 1-10, 2010.

  1047. Encapsulated thermopile detector array for IR microspectrometer
    H. Wu; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    MA Druy; CD Brown; RA Crocombe (Ed.);
    SPIE, , pp. 1-9, 2010.

  1048. CMOS compatible LVOF based visible microspectrometer
    A. Emadi; H. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    MA Druy; CD Brown; RA Crocombe (Ed.);
    SPIE, , pp. 1-8, 2010.

  1049. Spectral measurement with a linear variable filter using a LMS algorithm
    A. Emadi; S. Grabarnik; H. Wu; G. de Graaf; R.F. Wolffenbuttel;
    MJ vellekoop (Ed.);
    Eurosensor 24, , pp. 504-507, 2010.

  1050. Post processing of linear variable optical filter on CMOS chip at die-level
    A. Emadi; H. Wu; G. de Graaf; R.F. Wolffenbuttel;
    {van Honschoten}, J; H Verputten; H Groenland (Ed.);
    MME, , pp. 185-188, 2010.

  1051. Thin film encapsulated 1D thermoelectric detector in an IR microspectrometer
    H. Wu; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    F Berghmans; AG Mignani; C. van HoofA (Ed.);
    SPIE, , pp. 1-8, 2010.

  1052. Time based micro-g accelerometer with improved damper geometry
    R.A. Dias; L.A. Rocha; L. Mol; R.F. Wolffenbuttel; E. Cretu;
    V Piuri (Ed.);
    IEEE, , pp. 672-675, 2010.

  1053. Interference filter based absorber for thermopile detector array by surface micromachining
    H. Wu; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    L Abelmann; H Groenland; {van Honschoten}, J; H Verputten (Ed.);
    MME, , pp. 169-172, 2010.

  1054. Linear variable optical filter with silver metallic layers
    A. Emadi; S. Mokkapati; H. Wu; G. de Graaf; R.F. Wolffenbuttel;
    {van Honschoten}, J; H Verputten; H Groenland (Ed.);
    MME, , pp. 104-107, 2010.

  1055. Smart temperature sensors in standard CMOS
    K.A.A. Makinwa;
    In s.n (Ed.), Proceedings of Eurosensors XXIV,
    Elsevier, pp. 930-939, 2010.

  1056. The APS+ and why we dare going without DARE
    J. Leijtens; N. Xie; A.J.P. Theuwissen;
    In {Bedi et al}, R (Ed.), Proceedings of 3rd International workshop on Analog and Mixed signal Integrated Circuits for Space Applications (AMICSA 2010),
    ESA, pp. 1-18, 2010.

  1057. Modeling and control of nonlinear dynamic adaptive optics system
    H. Song; R. Fraanje; G. Schitter; G.V. Vdovin; M. Verhaegen;
    In IFAC 2010 symposium on mechatronic systems,
    IFAC, pp. -, 2010.

  1058. X-ray radiation effects on CMOS image sensor in-pixel devices
    J. Tan; B. Buttgen; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings of International conference on solid-state devices and materials 2010,
    pp. 299-300, 2010.

  1059. In-pixel buried-channel source follower in CMOS image sensors exposed to X-ray radiation
    C. Yue; J. Tan; X. Wang; A. Mierop; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings of IEEE sensors 2010,
    IEEE, pp. 1649-1652, 2010.

  1060. Pure boron chemical vapor deposited layers; A new material for silicon device processing
    L.K. Nanver; T.L.M. Scholtes; F. Sarubbi; W.B. De Boer; G. Lorito; A. Sakic; S. Milosavljevic; C. Mok Kai Rine; L. Shi; S. Nihtianov; K Buisman;
    In {Lojek et al}, B (Ed.), Proceedings 18th IEEE Conference on Advanced Thermal Processing of Semiconductors - RTP 2010,
    IEEE, pp. 136-139, 2010.

  1061. Biologically inspired autonomous agent navigation using an integrated polarization analyzing CMOS image sensor
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    In B Jakoby; M.J. Vellekoop (Ed.), Proceedings EUROSENSOR XXIV Conference 2010,
    Elsevier, pp. 673-676, 2010.

  1062. Optical performance of B-layer ultra shallow junction silicon photodiodes in the VUV spectral range
    L. Shi; F. Sarubbi; L.K. Nanver; U. Krothc A; A. Gottwald; S. Nihtianov;
    In B Jakoby; M.J. Vellekoop (Ed.), Proceedings EuroSensors XXIV,
    Elsevier, pp. 633-636, 2010.

  1063. Performance improvement of advanced capacitive displacement sensors in industrial applications
    S. Nihtianov;
    In s.n. (Ed.), Proceedings of the 7th International Conference on Condition Monitoring and Machinery Failure Prevention Technologies 2010,
    Coxmoor Publishing Company, pp. 875-884, 2010.

  1064. Optical stability investigation of high performance silicon based VUV photodiodes
    L. Shi; L.K. Nanver; A. Sakic; S. Nihtianov; A. Gottwald; U. Krothc A;
    In T Kenny; G Fedder (Ed.), Proceedings IEEE Sensors Conference 2010,
    IEEE, pp. 132-135, 2010.

  1065. Integrated polarization-analyzing CMOS image sensor for detecting incoming light ray direction
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    In S Mandayam; K Arshak (Ed.), Proceedings of 2010 IEEE Sensors Applications Symposium,
    IEEE, pp. 194-199, 2010.

  1066. Total ionizing effects on 4-transistor CMOS image sensor pixels
    J. Tan; A.J.P. Theuwissen;
    In JB Xu; PKT Mok (Ed.), Proceedings of IEEE International conference on Electron Devices and Solid-State Circuits (EDSSC'10),
    IEEE, pp. 1-4, 2010.

  1067. A biologically inspired collision detection algorithm using differential optic flow imaging
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    In TG Constandinou (Ed.), Proceedings of IEEE BIOCAS 2010,
    IEEE, pp. 250-253, 2010.

  1068. A CMOS image sensor with charge domain interlace scan
    Y. Xu; A. Mierop; A.J.P. Theuwissen;
    In T Kenny; G Fedder (Ed.), Proceedings of IEEE Sensors 2010,
    IEEE, pp. 123-127, 2010.

  1069. A flexible low power high resolution integrated interface for capacitive sensors
    A. Heidary; S. Shalmany; G.C.M. Meijer;
    In s.n (Ed.), Proceedings of IEEE ISIE 2010,
    IEEE ISIE, pp. 3347-3350, 2010.

  1070. The APS+ : an intelligent active pixel sensor centered on low power
    N. Xie; A.J.P. Theuwissen; B. Buettgen; H. Hakkesteegt; H. Jansen; J. Leijtens;
    In {Armandillo et al}, E (Ed.), Proceedings of International Conference on Space Optics (ICSO 2010),
    ESA, pp. 1-4, 2010.

  1071. Now is the time for the sunsensor of the future
    J. Leijtens; K. de Boom; M. Durkut; H. Hakkesteegt; A.J.P. Theuwissen; N. Xie;
    In {Armandillo et al.}, E (Ed.), Proceedings of the 2010 International Conference on Space Optics,
    ESA/ESTEC, pp. 1-6, 2010. CD-ROM.

  1072. Integrated polarization analyzing CMOS image sensor for autonomous navigation using polarized light
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    In P Chountas; J Kacprzyk (Ed.), Proceedings of the 2010 5th IEEE Conference on Intelligent Systems,
    IEEE, pp. 224-229, 2010.

  1073. Radiation effects on CMOS image sensors due to X-rays
    J. Tan; B. Buttgen; A.J.P. Theuwissen;
    In J Breza; D Donoval; E Vavrinsky (Ed.), Proceedings 8th International conference on Advanced Semiconductor Devices and Microsystems (ASDAM),
    IEEE, pp. 279-283, 2010.

  1074. Nanochannels fabrication, filling and DNA manipulation
    VRSS. Mokkapati; V. di Virgilio; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In P Decuzzi; {Cao et al}, J (Ed.), Proceedings ASME 2010 First Global Congress on NanoEngineering for Medicine and Biology,
    ASME, pp. 135-138, 2010. NEO.

  1075. An analog and digital representation of polarization using CMOS image sensors
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings 5th EOS Topical Meeting on Advanced Imaging Techniques,
    s.n., pp. 1-2, 2010.

  1076. Modeling and control of a nonlinear dynamic adaptive optics system
    H. Song; P.R. Fraanje; G. Schitter; G.V. Vdovin; M. Verhaegen;
    In K.Y. Toumi (Ed.), Proceedings 2010 IFAC Symposium on Mechatronic Systems,
    UFAC mech 2010, pp. 299-305, 2010.

  1077. Optimized low-power thermal stepper system for harsh and inaccessible environments
    R. Yang; J.P. van Schieveen; S. Nihtianov; J.W. Spronck;
    In s.n. (Ed.), Proceedings IECON 2010,
    IEEE, pp. 1779-1784, 2010.

  1078. Electronic system for control of a thermally actuated alignment device
    R. Yang; J.P. van Schieveen; S. Nihtianov; J.W. Spronck;
    In {Rodríguez et al}, J (Ed.), Proceedings ICIT 2010,
    IEEE, pp. 1581-1586, 2010.

  1079. Concept evaluation of a high performance self aligning capacitive displacement sensor
    S. Xia; J.P. van Schieveen; S. Nihtianov; J.W. Spronck;
    In {Rodríguez et al}, J (Ed.), Proceedings ICIT 2010,
    IEEE, pp. 1575-1580, 2010.

  1080. Zoom in techniques in capacitance measurement
    S. Xia; S. Nihtianov;
    In SJ Ovcharov; KK Asparuhova (Ed.), Proceedings Electronics ET2010,
    s.n., pp. 12-15, 2010.

  1081. Micro-digital sun sensor: an imagining sensor for space applications
    N. Xie; A.J.P. Theuwissen; B. Buettgen; H. Hakkesteegt; H. Jansen; J. Leijtens;
    In s.n. (Ed.), Proceedings of IEEE International symposium on industrial electronics,
    IEEE, pp. 3362-3365, 2010.

  1082. Design of a Beamformer for an Ultrasonic Matrix Transducer for 3D Transesophageal Echocardiography
    Z. Yu; S. Blaak; G. C. M. Meijer; M. A. P. Pertijs; C. T. Lancée; J. G. Bosch; C. Prins; N. de Jong;
    In Annual Sensor Technology Workshop Sense of Contact,
    The Netherlands, April 2010. (Best Poster Award).

  1083. Energy-efficient capacitive sensor interface with high dynamic range
    Z. Tan; M. A. P. Pertijs; G. C. M. Meijer;
    In Annual Sensor Technology Workshop Sense of Contact,
    The Netherlands, April 2010.

  1084. A thermal-diffusivity-based temperature sensor with an untrimmed inaccuracy of 0.2degess C (3 sigma) from -55 to 125 degrees C.
    C.P.L. van Vroonhoven; D. d'Aquino; K.A.A. Makinwa;
    In s.n. (Ed.), Digest of ISSCC,
    ISSCC, pp. 314-315, 2010.

  1085. A single-trim CMOS bandgap reference with a 3-sigma inaccuracy of ±0.15% from ¿40°C to 125°C
    G. Ge; Ch Zhang; G. Hoogzaad; K.A.A. Makinwa;
    In LC Fujino (Ed.), 2010 IEEE International Solid-State Circuits Conference; Digest of technical papers (ISSCC) 2010,
    IEEE, pp. 78-79, 2010.

  1086. A 0.12mm² 7.4µW micropower temperature sensor with an inaccuracy of 0.2°C(3-sigma) from -30°C to 125°C
    K. Souri; K.A.A. Makinwa;
    In {Guerra-Vinuesa et al}, O (Ed.), Unknown,
    ESSCIRC/ESSDERC, pp. 282-285, 2010.

  1087. A high PSRR bandgap voltage reference with virtually diode-connected MOS transistors
    K. Souri; H. Shamsi; M. Kazemi; Kianoush Souri;
    In s.n. (Ed.), Proceedings of NEWCAS,
    NEWCAS, pp. 301-304, 2010.

  1088. VUV performance characterization of a silicon based ultrashallow junction photodiode
    L. Shi; S. Nihtianov; L.K. Nanver; U. Krothc A;
    In {French et al}, P (Ed.), Proceedings 13th SAFE Workshop of the STW.ICT Conference 2010,
    STW, pp. 158-161, 2010.

  1089. A CMOS temperature sensor with an energy-efficient zoom ADC and an inaccuracy of ±0.25°C (3¿) from -40°C to 125°C
    K. Souri; S.M. Kashmiri; K.A.A. Makinwa;
    In 2010 IEEE International solid-state circuits conference; Digest of technical papers (ISSCC) 2010,
    IEEE, pp. 310-311, 2010.

  1090. An interface circuit for grounded and leaky capacitive sensors
    X. Li; G.C.M. Meijer;
    In s.n (Ed.), Proceedings of ICIT 2010,
    IEEE ICIT 2010, pp. 1571-1574, 2010.

  1091. A temperature sensor in 0.18 micrometer CMOS with 62 microwatt power consumption and a range of -120..120 degree C.
    J.H.R. Schrader; A. Stellinga; K.A.A. Makinwa;
    In {Bedi et al}, R (Ed.), Proceedings International workshop on Analog and Mixed signal Integrated Circuits for Space Applications (AMICSA 2010),
    ESA, pp. 1-20, 2010.

  1092. Integrated polarization analyzing CMOS image sensor
    M. Sarkar; D. San Segundo Bello; C. van Hoof; A.J.P. Theuwissen;
    In {Amara et al.}, A (Ed.), Proceedings of 2010 IEEE International Symposium on Circuits and Systems,
    IEEE, pp. 621-624, 2010.

  1093. PECVD SIC- SiO2-SIC Horizontal Slot Waveguides for Sensing Photonics devices
    G. Pandraud; A. Barbosa Neira; E. Margallo Balbas; P.M. Sarro;
    In G. Fedder; T. Kenney (Ed.), Proceedings IEEE SENSORS 2010,
    IEEE, pp. 975-978, 2010.

  1094. Integrated auto alighment and calibration for high resolution capacitive sensor system
    J.P. van Schieveen; J.W. Spronck; S. Nihtianov; R.H. Munnig Schmidt;
    In H Spaan; P Shore (Ed.), Proceedings of the 10th international conference of the european spciety for precision engineering and nanotechnology,
    EUSPEN, pp. 188-191, 2010.

  1095. A capacitive sensing technique for measuring displacement with floating target
    X. Guo; S. Nihtianov;
    In {Chakraborty et al}, C (Ed.), Proceedings 2010 IEEE International Conference on Industrial Technology,
    IEEE, pp. 1565-1570, 2010.

  1096. A high resolution universal integrated interface for capacitive sensors
    A. Heidary; Z.Y. Chang; G.C.M. Meijer;
    In P.J. French (Ed.), Proceedings of STW-ICT conference 2010,
    STW, pp. 4-7, 2010.

  1097. A 2.4GHz 830pJ/bit duty-cycled wake-up receiver with -82dBm sensitivity for crystal-less wireless sensor nodes
    Salvatore Drago; Domine M.W. Leenaerts; Fabio Sebastiano; and Lucien J. Breems; Kofi A.A. Makinwa; Bram Nauta;
    In International Solid-state Circuits Conference Digest of Technical Papers,
    San Francisco, CA, pp. 224 - 225, February7--11 2010. DOI: 10.1109/ISSCC.2010.5433955
    Keywords: ... CMOS integrated circuits;UHF integrated circuits;field effect MMIC;radio receivers;ultra wideband communication;wireless sensor networks;CMOS wake up receiver;bit rate 500 kbit/s;broadband IF heterodyne architecture;crystal less wireless sensor nodes;frequency 2.4 GHz;impulse radio modulation;non coherent energy detection;power 415 muW;size 65 nm;Baseband;Bit error rate;Clocks;Filters;Gain measurement;Pulse amplifiers;Radio frequency;Radiofrequency amplifiers;Voltage;Wireless sensor networks.

    Abstract: ... A 65 nm CMOS 2.4 GHz wake-up receiver operating with low-accuracy frequency references has been realized. Robustness to frequency inaccuracy is achieved by employing non-coherent energy detection, broadband-IF heterodyne architecture and impulse-radio modulation. The radio dissipates 415 µW at 500 kb/s and achieves a sensitivity of -82 dBm with an energy efficiency of 830 pJ/bit.

  1098. A 65-nm CMOS temperature-compensated mobility-based frequency reference for Wireless Sensor Networks
    Fabio Sebastiano; Lucien J. Breems; Kofi Makinwa; Salvatore Drago; Domine M. W. Leenaerts; Bram Nauta;
    In Proc. European Solid-State Circuits Conference,
    Sevilla, Spain, pp. 102 - 105, September14--16 2010. DOI: 10.1109/ESSCIRC.2010.5619792
    Keywords: ... CMOS integrated circuits;MOSFET;electron mobility;wireless sensor networks;CMOS temperature-compensated mobility;MOS transistor;current 42.6 muA;electron mobility;frequency 150 kHz;frequency reference;size 65 nm;temperature -55 C to 125 C;voltage 1.2 V;wireless sensor network;Accuracy;CMOS integrated circuits;Calibration;Oscillators;Temperature measurement;Temperature sensors;Wireless sensor networks.

    Abstract: ... For the first time, a temperature-compensated CMOS frequency reference based on the electron mobility in a MOS transistor is presented. Over the temperature range from -55 °C to 125 °C, its frequency spread is less than ±0.5% after a two-point trim and less than ±2.7% after a one-point trim. These results make it suitable for use in Wireless Sensor Network nodes. Fabricated in a baseline 65-nm CMOS process, the 150 kHz frequency reference occupies 0.2 mm² and draws 42.6 µA from a 1.2-V supply at room temperature.

  1099. A programmable analog delay line for Micro-beamforming in a transesophageal ultrasound probe
    Z. Yu; M. A. P. Pertijs; G. C. M. Meijer;
    In Proc. IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT),
    IEEE, pp. 299‒301, November 2010. DOI: 10.1109/icsict.2010.5667749

  1100. An interface for eddy current displacement sensors with 15-bit resolution and 20 MHz excitation
    M. R. Nabavi; M. A. P. Pertijs; S. Nihtianov;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 290‒293, September 2010. DOI: 10.1109/esscirc.2010.5619835

  1101. A Thermal-diffusivity-based Frequency Reference in Standard CMOS with an Absolute Inaccuracy of ±0.1\% from -55°C to 125°C
    M. Kashmiri; M. Pertijs; K. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 74‒75, February 2010. DOI: 10.1109/ISSCC.2010.5434042
    Abstract: ... Most electronic systems require a frequency reference, and so, much research has been devoted to the realization of on-chip frequency references in standard CMOS. However, the accuracy of such references is limited by the process spread and temperature drift of on-chip components. By means of trimming and temperature compensation, RC and ring oscillators have achieved inaccuracies in the order of 1\%. LC oscillators achieve inaccuracies below 0.1\%, but dissipate much more power. This paper describes a new approach, which exploits the well-defined thermal diffusivity of IC-grade silicon in order to generate frequencies stable to 0.1\% over process and temperature variations. Such thermal diffusivity (TD) frequency references dissipate less power than LC oscillators, are more accurate than RC and ring oscillators and, uniquely, scale well with process.

  1102. Design of a low power time-gain-compensation amplifier for a 2D piezoelectric ultrasound transducer
    J. Yao; Z. Yu; M. A. P. Pertijs; G. C. M. Meijer; C. T. Lancee; J. G. Bosch; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 841‒844, October 2010. DOI: 10.1109/ultsym.2010.5935775
    Abstract: ... In this paper, a programmable time-gain compensation amplifier dedicated to a 2D piezoelectric ultrasound transducer is presented. It uses an open-loop amplifier structure consisting of a voltage-to-current converter and a current-to-voltage converter. The circuit has been designed in a standard 0.35-μm CMOS process. Simulation and measurement results show that gains of 0dB, 12dB, 26dB and 40dB can be achieved for input signals centered at 6MHz with 80dB dynamic range (100μV to 1V). The measured gain errors at 6MHz are below 1dB for all gain settings. The amplifier consumes only 130μW when driving a 250fF load.

  1103. L. Sousa, M. Piedade, J. Germano," T. Almeida,'P. Lopes"
    Cardoso, F; Freitas, P;
    In Embedded System Design: Topics, Techniques and Trends: IFIP TC10 Working Conference: International Embedded Systems Symposium (IESS), May 30-June 1, 2007, Irvine (CA), USA,
    Springer, pp. 353, 2010.

  1104. Spintronic microfluidic platform for biomedical and environmental applications
    Cardoso, Filipe Arroyo; Martins, VC; Fonseca, LP; Germano, J; Sousa, LA; Piedade, MS; Freitas, PP;
    In Fourth European Workshop on Optical Fibre Sensors,
    SPIE, pp. 55-57, 2010.

  1105. A 1.2V 10µW NPN-based temperature sensor in 65nm CMOS with an inaccuracy of ±0.2°C (3σ) from -70°C to 125°C
    Fabio Sebastiano; Lucien J. Breems; Kofi Makinwa; Salvatore Drago; Domine M. W. Leenaerts; Bram Nauta;
    In International Solid-state Circuits Conference Digest of Technical Papers,
    San Francisco, CA, pp. 312 - 313, February7--11 2010. DOI: 10.1109/ISSCC.2010.5433895
    Keywords: ... CMOS integrated circuits;signal processing equipment;temperature sensors;CMOS technology;batch calibrated inaccuracy;current 8.3 �A;power 10 �W;size 65 nm;temperature -70 C to 125 C;temperature sensor;voltage 1.2 V;CMOS technology;Pipelines;Robustness;Sampling methods;Switches;Tail;Temperature sensors;Testing;Timing;Voltage.

    Abstract: ... A temperature sensor utilizing NPN transistors has been realized in a 65 nm CMOS process. It achieves a batch-calibrated inaccuracy of ±0.5°C (3σ) and a trimmed inaccuracy of ±0.2°C (3σ) from -70°C to 125°C The sensor draws 8.3 µA from a 1.2 V supply and occupies an area of 0.1 mm².

  1106. Ping-Pong-Pang Instrumentation Amplifier
    Saket Sakunia;
    MSc thesis, Delft University of Technology, September 2010.
    document

  1107. Auto-gain correction and common-mode voltage cancellation in a precision amplifier.
    R.E. Boucher; J.H. Huijsing;
    2010.

  1108. Method for determining a spring constant for a deformable scanning probe microscope element, and scanning probe microscope and calibration device arranged for determing a spring constant for a probe element
    H. Sadeghian Marnani; C. Yang; F. van Keulen; J.F.L. Goosen; A. Bossche;
    2010.

  1109. Better pictures through physics: the state of art of CMOS image sensors
    A.J.P. Theuwissen;
    2010.

  1110. Sensors getting worse, images getting better
    A.J.P. Theuwissen;
    2010.

  1111. Chopped auto-zeroed ping-pong amplifier and related apparatus, system, and method
    M. A. P. Pertijs;
    Patent, United States 7,834,685, November 2010.

  1112. Current sense amplifier with extended common mode voltage range
    W. J. Kindt; M. A. P. Pertijs;
    Patent, United States 7,671,677, March 2010.

  1113. Digital temperature sensors and calibration thereof
    M. Pertijs; J. Huijsing;
    Patent, United States 7,674,035, March 2010.

  1114. Digitale temperatursensoren und kalibrierung dafür
    M. A. P. Pertijs; J. H. Huijsing;
    Patent, German 602,005,020,159, May 2010.

  1115. Autozeroing current feedback instrumentation amplifier
    M. Pertijs; G. Reitsma;
    Patent, United States 7,719,351, May 2010.

  1116. Integrated circuit with pin-selectable mode of operation and level-shift functionality and related apparatus, system, and method
    M. A. P. Pertijs;
    Patent, United States 7,714,612, May 2010.

  1117. Bias-steuerung
    M. A. P. Pertijs; J. H. Huijsing;
    Patent, German 602,005,018,235, January 2010.

  1118. Automatic Common-mode Rejection Calibration
    Fabio Sebastiano; Lucien J. Breems; Raf Roovers;
    Patent, China 101809863 A, August 2010.

  1119. Method and system for impulse radio wakeup
    Fabio Sebastiano; Salvatore Drago; Lucien J. Breems; Domine M.W. Leenaerts;
    Patent, Europe 2206240 A2, July 2010.

  1120. Method and system for impulse radio wakeup
    Fabio Sebastiano; Salvatore Drago; Lucien J. Breems; Domine M.W. Leenaerts;
    Patent, China 101816130 A, August 2010.

  1121. Frequency synthesiser
    Salvatore Drago; Fabio Sebastiano; Domine M.W. Leenaerts; Lucien J. Breems; Bram Nauta;
    Patent, World 113108 A1, October 2010.

  1122. Frequency synthesiser
    Salvatore Drago; Fabio Sebastiano; Domine M.W. Leenaerts; Lucien J. Breems; Bram Nauta;
    Patent, Europe 2237418 A2, October 2010.

  1123. A low cost universal integrated interface for capacitive sensors
    A. Heidary;
    PhD thesis, Delft University of Technology, 2010.

  1124. Optical techniques for the study of living tissue
    E. Margallo Balbas;
    PhD thesis, Delft University of Technology, 2010.

  1125. Linear variable optical filters for microspectrometer applications
    A. Emadi;
    PhD thesis, Delft University of Technology, 2010.

  1126. Optical microspectrometers using imaging diffraction gratings
    S. Grabarnik;
    PhD thesis, Delft University of Technology, 2010.

  1127. Fast step-response settling of micro electrostatic actuators operated at low air pressure using input shaping
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 19, pp. 074020(1)-0740, 2009.

  1128. Surface stress-induced change in overall elastic behavior and self-bending of ultrathin cantilever plates
    H. Sadeghian Marnani; J.F.L. Goosen; A. Bossche; F. van Keulen;
    Applied Physics Letters,
    Volume 94, Issue 231908, pp. 1-3, 2009.

  1129. A CMOS image sensor with in pixel buried channel source follower and optimized row selector
    C. Yue; X. Wang; A. Mierop; A.J.P. Theuwissen;
    pp. 2390-2397, 2009.

  1130. A novel i nterface for eddy current displacement sensors
    M.R. Nabavi; S. Nihtianov;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 58, Issue 5, pp. 1623-1632, 2009.

  1131. A temperature-to-digital converter based on an optimized electrothermal filter
    S.M. Kashmiri; S. Xia; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 44, Issue 7, pp. 2026-2035, 2009.

  1132. Low voltage, low power inverter-based switched-capacitor delta-sigma modulator
    Y. Chae; G. Han;
    IEEE Journal of Solid State Circuits,
    Volume 44, Issue 2, pp. 458-472, 2009.

  1133. Characterization of thermal cross-talk in a MEMS-based thermopile detector array
    H.W. Wu; S. Grabarnik; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 19, pp. 74022(1)-74022, 2009.

  1134. A single-chip CMOS smoke and temperature sensor for an intelligent fire detector
    J. Cheon; J. Lee; I. Lee; Y. Chae; Y. yoo; G. Han;
    IEEE Sensors Journal,
    Volume 9, Issue 8, pp. 914-921, 2009.

  1135. A chopper current-feedback instrumentation amplifier with a 1mHz 1/f noise corner and an AC-coupled ripple reduction loop
    R. Wu; K.A.A. Makinwa; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 44, pp. 3232-3243, 2009.

  1136. Smart CMOS image sensor with high SBR and subpixel resolution for light-selection-based range finding
    J. Cheon; Y. Chae; D. Kim; S. Lim; I. Lee; K. Lee; D.J. Kim; G. Han;
    IEEE Electron Device Letters,
    Volume 56, Issue 11, pp. 2546-2555, 2009.

  1137. On-Chip Pixel Binning in Photon-Counting EMCCD-Based Gamma Camera: A Powerful Tool for Noise Reduction
    A.H. Westra; J.W.T. Heemskerk; M.A.N. Korevaar; A.J.P. Theuwissen; R. Kreuger; K.M. Ligtvoet; F.J. Beekman;
    IEEE Transactions on Nuclear Science,
    Volume 56, pp. 2559-2565, 2009.

  1138. Vertically tapered layers for optical applications fabricated using resist reflow
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 19, pp. 074014(1)-0740, 2009.

  1139. Squeezed film damping measurements on a parallel-plate MEMS in the free molecule regime
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 19, pp. 074021(1)-0740, 2009.

  1140. Dynamic offset canceling technique applied in the universal transducer interface
    J. ye; G.C.M. Meijer;
    Annual Journal of Electronics,
    pp. 105-108, 2009.

  1141. Impulse-Based Scheme for Crystal-Less ULP Radios
    Salvatore Drago; Fabio Sebastiano; Lucien J. Breems; Domine M.W. Leenaerts; Kofi A.A. Makinwa; Bram Nauta;
    {IEEE} Trans. Circuits Syst. {I},
    Volume 56, Issue 5, pp. 1041 - 1052, May 2009. DOI: 10.1109/TCSI.2009.2015208
    Keywords: ... access protocols;ad hoc networks;clocks;low-power electronics;modulation;ultra wideband communication;wireless sensor networks;ad hoc modulation;crystal-less ULP radio;crystal-less clock generator;duty-cycled wake-up radio;frequency 17.7 MHz;frequency 2.4 GHz;impulse radio;medium access control protocol;power 100 muW;ultra-low-power radio;wireless sensor network;Crystal-less clock;EDICS Category: COMM110A5, COMM200, COMM250A5;impulse radio;ultra-low power (ULP);wake-up radio;wireless sensor network (WSN).

    Abstract: ... This study describes a method of implementing a fully integrated ultra-low-power (ULP) radio for wireless sensor networks (WSNs). This is achieved using an ad hoc modulation scheme (impulse radio), with a bandwidth of 17.7 MHz in the 2.4 GHz-ISM band and a specific medium access control (MAC) protocol, based on a duty-cycled wake-up radio and a crystal-less clock generator. It is shown that the total average power consumption is expected to be less than 100 µW with a clock generator inaccuracy of only 1%.

  1142. A Low-Voltage Mobility-Based Frequency Reference for Crystal-Less ULP Radios
    Fabio Sebastiano; Lucien J. Breems; Kofi A.A. Makinwa; Salvatore Drago; Domine M.W. Leenaerts; Bram Nauta;
    {IEEE} J. Solid-State Circuits,
    Volume 44, Issue 7, pp. 2002 -2009, July 2009. DOI: 10.1109/JSSC.2009.2020247
    Keywords: ... CMOS integrated circuits;MOSFET;wireless sensor networks;CMOS technology;MOS transistor;crystal-less ULP radios;current 34 muA;electron mobility;frequency 100 kHz;low-voltage low-power circuit;low-voltage mobility-based frequency reference;size 65 nm;temperature -22 degC to 85 degC;temperature 293 K to 298 K;voltage 1.2 V;wireless sensor networks;CMOS technology;Circuits;Electron mobility;Energy consumption;Frequency synchronization;MOSFETs;Oscillators;Silicon;Temperature sensors;Wireless sensor networks;CMOS analog integrated circuits;Charge carrier mobility;crystal-less clock;low voltage;relaxation oscillators;ultra-low power;wireless sensor networks.

    Abstract: ... The design of a 100 kHz frequency reference based on the electron mobility in a MOS transistor is presented. The proposed low-voltage low-power circuit requires no off-chip components, making it suitable for application in wireless sensor networks (WSN). After a single-point calibration, the spread of its output frequency is less than 1.1% (3σ) over the temperature range from -22 °C to 85 °C . Fabricated in a baseline 65 nm CMOS technology, the frequency reference circuit occupies 0.11 mm² and draws 34 µA from a 1.2 V supply at room temperature.

  1143. A portable and autonomous magnetic detection platform for biosensing
    Germano, José; Martins, Verónica C; Cardoso, Filipe Arroyo; Almeida, Teresa M; Sousa, Leonel; Freitas, Paulo P; Piedade, Moisés S;
    Sensors,
    Volume 9, Issue 6, pp. 4119-4137, 2009.

  1144. On the modeling of new tunnel junction magnetoresistive biosensors
    de Almeida, Teresa Mendes; Piedade, Moisés S; Sousa, Leonel Augusto; Germano, José; Lopes, Paulo AC; Cardoso, Filipe Arroyo; Freitas, Paulo Peixeiro;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 59, Issue 1, pp. 92-100, 2009.

  1145. Femtomolar limit of detection with a magnetoresistive biochip
    Martins, VC; Cardoso, Filipe Arroyo; Germano, J; Cardoso, S; Sousa, L; Piedade, M; Freitas, PP; Fonseca, LP;
    Biosensors and Bioelectronics,
    Volume 24, Issue 8, pp. 2690-2695, 2009.

  1146. Magnetoresistive biochip-based portable platforms for biomolecular recognition detection
    Martins, V; Cardoso, Filipe Arroyo; Freitas, P; Germano, J; Cardoso, S; Sousa, L; Piedade, M; Fonseca, L;
    New Biotechnology,
    Issue 25, pp. S358-S359, 2009.

  1147. Sensory feedback for surgical drilling:intermediate report on project status, 24 november 2009
    E. Margallo; D.H.B. Wicaksono;
    Delft University of Technology, , 2009.

  1148. A smart universal sensor-interface chip, progress report VI, STW internal progress report
    Q. Jia;
    EWI Ch. Electronic Instrumentation, , 2009.

  1149. A smart universal sensor-interface chip, progress report VII, STW internal progress report
    Q. Jia;
    EWI Ch. Electronic Instrumentation, , 2009.

  1150. Sensory feedback for surgical drilling:intermediate report on project status, 21 april 2009
    E. Margallo; D.H.B. Wicaksono;
    Delft University of Technology, , 2009.

  1151. Dynamic offset compensated CMOS amplifiers
    J.F. Witte; K.A.A. Makinwa; J.H. Huijsing;
    Springer, , 2009.

  1152. A low power universal capacitive sensor interface for autonomous sensor applications
    Z. Tan; G.C.M. Meijer;
    s.n. (Ed.);
    Sense of Contact 2009, , pp. 1-4, 2009.

  1153. A new approach to high speed high resolution capacitive ratio measurement
    S. Xia; S. Nihtianov;
    s.n. (Ed.);
    Electronics 2008, , pp. 121-124, 2009.

  1154. A low noise current feedback instrumentation amplifier for high precision thermistor bridge
    Wu Rong; K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    Sense of Contact 2009, , pp. 01-04, 2009.

  1155. Low voltage plug dispersion compensation for moving field capillary electrophoresis with flow loss via the side channels
    L. Zhang; A. Bossche;
    s.n. (Ed.);
    IEEE, , pp. 581-584, 2009.

  1156. Fabrication of a microfluidic device with insulated electrodes on top and bottom sides of the channel
    L. Zhang; A. Bossche;
    S Teo; AQ Liu; H Li; B Tarik (Ed.);
    Trans Tech Publications, , pp. 183-186, 2009.

  1157. A time based capacitance to digital converter with fast data acquisitions and high resolution
    A. Heidary; G.C.M. Meijer;
    s.n. (Ed.);
    Sensor and test, , pp. 297-330, 2009.

  1158. CMOS temperature sensors based on thermal diffusion
    C.P.L. van Vroonhoven; S.M. Kashmiri; K.A.A. Makinwa;
    s.n. (Ed.);
    Sense of Contact 2009, , pp. 1-4, 2009.

  1159. Characterization of in pixel buried channel source follower with optimized row selector in CMOS image sensors
    Y. Chen; X. Wang; A. Mierop; A.J.P. Theuwissen;
    s.n. (Ed.);
    International Image Sensor Workshop, , pp. 0-4, 2009.

  1160. High performance capacitive sensor electronic interfaces for industrial applications
    S. Nihtianov;
    s.n. (Ed.);
    sensor test 2009, , pp. 281-286, 2009.

  1161. high performance silicon based extreme ultraviolet radiation detector for industrial application
    L. Shi; F. Sarubbi; S. Nihtianov; L.K. Nanver; T.L.M. Scholtes; F. Scholze;
    s.n. (Ed.);
    IEEE, , pp. 1891-1896, 2009.

  1162. Control system for high precision thermal actuation
    yang ruimin; van schieveen jeroen; S. Nihtianov; spronck jo;
    s.n. (Ed.);
    Electronics 2008, , pp. 113-116, 2009.

  1163. High resolution low latency capacitive displacement sensor
    S. Xia; J.P. van Schieveen; S. Nihtianov; J.W. Spronck;
    s.n. (Ed.);
    Electronics 2008, , pp. 117-120, 2009.

  1164. Linearization of a thermal diffusivity based temperature sensor
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    s.n. (Ed.);
    IEEE Sensors, , pp. 1697-1700, 2009.

  1165. Investigating the ageing effects on image sensors due to terrestrial cosmic radiation
    G. Nampoothiri; A.J.P. Theuwissen;
    s.n. (Ed.);
    International Image Sensor Workshop, , pp. 01-04, 2009.

  1166. Self-powered sun sensor microsystems
    H.W. Wu; A. Emadi; G. de Graaf; J. Leijtens; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2009.

  1167. Microspectrometer with a concave grating fabricated in a MEMS technology
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2009.

  1168. IC-compatible fabrication of linear variable optical filters for micro-spectrometer
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2009.

  1169. Study of thermal cross-talk in micromachined thermopile based infrared detector arrays
    H.W. Wu; S. Grabarnik; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    STW, , pp. 1-4, 2009.

  1170. Squeezed film damping measurements on a parallel-plate MEMS in the free molecule regime
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Transducers, , pp. 1425-1428, 2009.

  1171. Self-powered optical sensor systems
    H.W. Wu; A. Emadi; G. de Graaf; J. Leijtens; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Transducers, , pp. 1373-1376, 2009.

  1172. Improved damper geometry for parallel-plate MEMS
    R. dias; L. Mol; E. Cretu; R.F. Wolffenbuttel; L.A. Rocha;
    s.n. (Ed.);
    MME, , pp. 1-4, 2009.

  1173. Interference filter based IR absorber for MEMS thermopile array
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 1-4, 2009.

  1174. Thermal cross-talk in IC-compatible micromachined infrared thermopile detector arrays
    H.W. Wu; S. Grabarnik; G. de Graaf; A. Emadi; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IRS, , pp. 319-323, 2009.

  1175. Fabrication and characterization of IC-compatible multilayer interference filters
    G. de Graaf; A. Emadi; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IRS, , pp. 313-317, 2009.

  1176. Stability Investigation of High Performance Silicon-Based DUV/EUV Photodiodes
    L. Shi; F. Sarubbi; S. Nihtianov; L.K. Nanver; F. Scholze;
    In P.J. French (Ed.), Proc. of SAFE 2009,
    STW, pp. 530-533, 2009.

  1177. An accurate readout circuit for sensors based on thermopiles/thermocouples
    Q. Jia; X. Li; G.C.M. Meijer;
    In s.n. (Ed.), IRS2 Proceedings of SENSOR+TEST 2009 Conference,
    AMA Service, pp. 295-300, 2009.

  1178. Thermal characterization of microliter amounts of liquids by a micromachined calorimetric transducer
    G. Parr; E. Iervolino; A.W. van Herwaarden; W.H.A. Wien; M.J. Vellekoop;
    In P.M. Sarro; C Hierold (Ed.), Proc. IEEE MEMS 2009,
    IEEE, pp. 535-538, 2009.

  1179. Fabrication and experimental verification of a dielectrophoretic separation device
    L. Zhang; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Proceedings of 8th annual IEEE sonference on sensors,
    IEEE, pp. 1168-1171, 2009.

  1180. Thermal stepper: a high stability postioning system for micro adjustment
    J.P. van Schieveen; J.W. Spronck; S. Nihtianov; R.H. Munnig Schmidt;
    In {Spaan H. Brussel H van}, {Brinkmeijer E.} (Ed.), 9th international conference of the european society for precision engineering and nanatechnology: san sebastian, spain,
    EUSPEN, pp. 110-114, 2009.

  1181. Fabrication and testing of a TMMF S2030 based microfluidic device for single cell analysis
    S. Mokkapati; L. Zhang; R. hanfoug; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Fabrication and testing of a TMMF S2030 based microfluidic device for single cell analysis,
    International conference on quantum, nano and microtechnologies (ICQNM), pp. 86-89, 2009.

  1182. Trade-offs in the design of a universal sensor interface chip
    Q. Jia; X. Li; G.C.M. Meijer;
    In TA Tang; X Zeng; Y. Chen; H Yu (Ed.), Proceedings of 2009 IEEE 8th international conference on ASIC,
    IEEE, pp. 871-874, 2009.

  1183. CMOS temperature sensors based on thermal diffusion
    C.P.L. van Vroonhoven; S.M. Kashmiri; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings of the international workshop on thermal investigations of ICs and systems,
    Therminic 2009, pp. 140-143, 2009.

  1184. MHz-range interface for inductive displacement sensors
    M.R. Nabavi; S. Nihtianov;
    In s.n. (Ed.), Proceedings SENSOR 2009 Conference, Volume I,
    AMA Service, pp. 269-274, 2009.

  1185. Measuring the thermal diffusivity of CMOS chips
    S.M. Kashmiri; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings of IEEE Sensors 2009,
    IEEE, pp. 45-48, 2009.

  1186. Low-power front-end of eddy current sensor interfaces for industrial applications
    M.R. Nabavi; S. Nihtianov;
    In s.n. (Ed.), Proceedings of IECON 2009,
    IEEE, pp. 3417-3422, 2009.

  1187. Fabrication of a lab-on-a-chip device for single cell analysis using TMMF S2030
    S. Mokkapati; L. Zhang; F. postma; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Proceedings of ICMEMS 2009,
    ICMEMS, pp. 1-4, 2009.

  1188. Stability considerations in a new interface circuit for inductive position sensors
    M.R. Nabavi; S. Nihtianov;
    In s.n. (Ed.), Proceedings of ICECS 2009,
    IEEE, pp. 932-935, 2009.

  1189. A multi-bit cascade sigma-delta modulator with an oversampled single-bit DAC
    S.M. Kashmiri; K.A.A. Makinwa; L.J. Breems;
    In s.n. (Ed.), Proceedings of ICECS 2009,
    ICECS, pp. 49-52, 2009.

  1190. Precision measurement of the low-frequency noise of highly-stable capacitance-to-digital converter
    X. Guo; S. Nihtianov;
    In s.n. (Ed.), Proceedings of ISMTII 2009,
    D. S. Rozhdestvensky Optical Society, pp. 167-171, 2009.

  1191. Dedicated impedance sensors with reduced influence of undesired physical effects
    G.C.M. Meijer; X. Li; Z.Y. Chang; B.P. Iliev;
    In s.n. (Ed.), Proceedings of ISMTII 2009,
    D. S. Rozhdestvensky Optical Society, pp. 297-301, 2009.

  1192. A multi bit cascaded sigma delta modulator with an oversampled single bit DAC
    S.M. Kashmiri; K.A.A. Makinwa; L.J. Breems;
    In s.n. (Ed.), Proceedings of International Conference on Electronics Circuits and Systems,
    ICECS, pp. 49-52, 2009.

  1193. Analysis and design of an integrated universal capacitive sensor interface
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of ISMTII 2009,
    ISMTII, pp. 268-272, 2009.

  1194. A balanced design of a universal sensor interface chip
    Q. Jia; X. Li; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of ISMTII 2009,
    D. S. Rozhdestvensky Optical Society, pp. 177-182, 2009.

  1195. Nanochannels fabrication with nearly-flat walls and embedded electrodes for nano-bio sensing
    S. Mokkapati; V. di Virgilio; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Proceedings of SAFE 2009,
    STW, pp. 40-43, 2009.

  1196. Size dependent elastic behavior of silicon nanofilms molecular dynamics study
    H. Sadeghian Marnani; J.F.L. Goosen; A. Bossche; B.J. Thijsse; F. van Keulen;
    In s.n. (Ed.), Proceedings of the ASME 2009 International Mechanical Engineering Congress d344c05bce504fc6a756492d950402b8 Exposition IMECE2009, November 13-19, 2009, Lake Buena Vista, Florida, USA,
    ASME, pp. 1-6, 2009.

  1197. A novel device for particle batch separation based on dielectrophoresis
    L. Zhang; A. Bossche;
    In s.n. (Ed.), Proceedings of Transducers 2009,
    Transducers, pp. 2151-2154, 2009.

  1198. MHz-range interface for inductive displacement sensors
    M.R. Nabavi; S. Nihtianov;
    In s.n. (Ed.), Proceedings of sensor+test conference,
    pp. 269-274, 2009.

  1199. A digitally assisted electrothermal frequency locked loop
    S.M. Kashmiri; K.A.A. Makinwa;
    In D Tsoukalas; Y Papananos (Ed.), Proceedings of ESSCIRC 2009,
    ESSCIRC, pp. 296-299, 2009.

  1200. Fabrication of nanochannels with nearly flat walls and embedded titanium nitride electrodes for nano bio sensing
    S. Mokkapati; L. Zhang; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Fabrication of nanochannels with nearly flat walls and embedded titanium nitride electrodes for nano bio sensing,
    MME, pp. 01-04, 2009.

  1201. A 140dB-CMRR current-feedback instrumentation amplifier employing ping-pong auto-zeroing and chopping
    M. A. P. Pertijs; W. J. Kindt;
    In Highlights of ISSCC 2009,
    Eindhoven, The Netherlands, March 2009.

  1202. A chopper and auto-zero offset-stabilized CMOS instrumentation amplifier
    J.F. Witte; J.H. Huijsing; K.A.A. Makinwa;
    In K Yano (Ed.), IEEE Digest of VLSI Circuits 2009,
    IEEE, pp. 210-211, 2009.

  1203. Design of a micro beamformer for a 2D piezoelectric ultrasound transducer
    S. Blaak; Z. Yu; G.C.M. Meijer; C.T. Lancee; J.G. Bosch; N. de Jong;
    In M Pappalardo (Ed.), Proceedings 2009 IEEE International Ultrasonics Symposium,
    IEEE, pp. 1338-1341, 2009. NEO.

  1204. ¿/6 Suspended Patch Antenna
    L. Giangrande; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), STW, pp. 143-146, 2009.

  1205. A 200 µA duty-cycled PLL for wireless sensor nodes
    Salvatore Drago; Domine M.W. Leenaerts; Bram Nauta; Fabio Sebastiano; Kofi A.A. Makinwa; Lucien J. Breems;
    In Proc. European Solid-State Circuits Conference,
    Athens, Greece, pp. 132 - 135, September14--18 2009. DOI: 10.1109/ESSCIRC.2009.5325979
    Keywords: ... CMOS integrated circuits;UHF detectors;detector circuits;frequency synthesizers;low-power electronics;phase locked loops;wireless sensor networks;CMOS process;burst mode;current 200 muA;duty cycled PLL;frequency 1 GHz;low power frequency synthesizer;size 0.15 mm;size 0.19 mm;size 65 nm;voltage 1.3 V;wireless sensor nodes;Phase locked loops;Wireless sensor networks.

    Abstract: ... A duty-cycled PLL operating in burst mode is presented. It is an essential building block of a moderately accurate low-power frequency synthesizer suitable for use in nodes for wireless sensor networks. Once in lock, the PLL's frequency error is less than 0.1% (rms). Fabricated in a baseline 65 nm CMOS process, the PLL occupies 0.19 times 0.15 mm² and draws 200 µA from a 1.3-V supply when generating a 1 GHz signal with a duty cycle of 10%.

  1206. A 140dB-CMRR current-feedback instrumentation amplifier employing ping-pong auto-zeroing and chopping
    M. A. P. Pertijs; W. J. Kindt;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 324‒325, February 2009. DOI: 10.1109/isscc.2009.4977439

  1207. A CMOS smart temperature sensor with a batch-calibrated inaccuracy of ±0.25°C (3σ) from -70°C to 130°C
    A. L. Aita; M. Pertijs; K. Makinwa; J. H. Huijsing;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 342‒343, February 2009. DOI: 10.1109/ISSCC.2009.4977448
    Abstract: ... A major contributor to the total cost of precision CMOS temperature sensors is the cost of trimming and calibration. Significant cost savings can be obtained by batch calibration, but this is usually at the expense of an equally significant loss of accuracy. This paper presents a CMOS temperature sensor with a batch-calibrated inaccuracy of ±0.25°C (3σ) from -70°C to 130°C, which represents a 2x improvement over the state of the art. Individual trimming reduces the sensor's inaccuracy to ±0.1°C (3σ) over the military range: -55°C to 125°C. The sensor draws 25μA from a 2.5V to 5.5V supply, which is significantly less than commercial products with comparable accuracy.

  1208. Implementation and Characterization of a femto-Farad Capacitive Sensor for pico-Liter Liquid Monitoring
    J. Wei; C. Yue; ZL. Chen; Z.W. Liu; K.A.A. Makinwa; P.M. Sarro;
    In J Brugger; D Briand (Ed.), Proceeding of EUROSENSORS XXIII,
    Elsevier, pp. 120-123, 2009.

  1209. Oscillator based on thermal diffusion
    K.A.A. Makinwa; J.F. Witte;
    2009.

  1210. Forewarned is four-armed;classic analog misteakes to avoid
    K.A.A. Makinwa;
    2009.

  1211. Method for measuring a temperature, electromechanical device for measuring a temperature
    H. Sadeghian Marnani; F. van Keulen; C.K. Yang; J.F.L. Goosen; A. Bossche;
    2009. Op naam van TU Delft; 2003431; Op naam van TU Delft.

  1212. Chopper stabilized amplifiers combining low chopper noise and linear frequency characteristics
    J.H. Huijsing; K.A.A. Makinwa; J.F. Witte;
    2009.

  1213. Radiation detector, method of manufacturing a radiation detector and lithographic apparatus comprising a radiation detector
    S. Nihtianov; L.K. Nanver; F. Sarubbi; T.L.M. Scholtes;
    2009.

  1214. System for Diagnosing Impedances having accurate current source and accurate voltage level shift
    K.J. de Langen; J.F. Witte;
    2009.

  1215. RAdiation detector, method of manufacturing a radiation detector and lithographic apparatus comprising a radiation detector
    S. Nihtianov; L.K. Nanver; F. Sarubbi; T.L.M. Scholtes;
    2009.

  1216. Autozeroing current feedback instrumentation amplifier
    M. Pertijs; G. Reitsma;
    Patent, United States 7,573,327, August 2009.

  1217. Strom-Rückkopplungs-Instrumentenverstärker mit selbsttätiger Nullpunkt-Einstellung
    M. Pertijs; G. Reitsma;
    Patent, German 102,008,023,384, January 2009.

  1218. Automatic Common-mode Rejection Calibration
    Fabio Sebastiano; Lucien J. Breems; Raf Roovers;
    Patent, World 040697 A3, August 2009.

  1219. Power saving method and system for wireless communications device
    Salvatore Drago; Fabio Sebastiano; Domine M.W. Leenaerts; Lucien J. Breems;
    Patent, World 044368 A2, April 2009.

  1220. Method and system for impulse radio wakeup
    Fabio Sebastiano; Salvatore Drago; Lucien J. Breems; Domine M.W. Leenaerts;
    Patent, World 044365 A3, June 2009.

  1221. Bioparticle separation in microfluidic devices for in-line application
    L. Zhang;
    PhD thesis, Delft University of Technology, 2009.

  1222. An energy efficient smart temperature sensor for RFID
    K. Souri;
    PhD thesis, Delft University of Technology, 2009.

  1223. Periodical nanocavities in thin films for optical bio-molecular detection
    O.M. Piciu;
    PhD thesis, Delft University of Technology, 2009.

  1224. Electronic control of a thermal actuator for a fully autonomous self-alignment and self-caliration functionality
    C.K. Yang;
    PhD thesis, Delft University of Technology, 2009.

  1225. Charge domain interlacing CMOS image sensor design
    Y. Xu;
    PhD thesis, Delft University of Technology, 2009.

  1226. A novel interface circuit for grounded capacitive sensors with feedfrward-based active shielding
    F. Reverter; X. Li; G.C.M. Meijer;
    Measurement Science and Technology,
    Volume 19, Issue 2, pp. 1-5, 2008.

  1227. Degradation of CMOS image sensors in deep-submicron technology due to gamma-radiation
    Rao padmakumar; X. Wang; A.J.P. Theuwissen;
    Solid-State Electronics,
    Volume 52, pp. 1407-1413, 2008.

  1228. Features and design constraints for an optimized SC front-end circuit for capacitive sensors with a wide dynamic range
    A. Heidary; G.C.M. Meijer;
    IEEE Journal of Solid State Circuits,
    pp. 1609-1616, 2008.

  1229. Tribler: a social-based peer-to-peer system
    J.A. Pouwelse; P.J. Garbacki; J. Wang; A. Bakker; J. Yang; A. Iosup; D.H.J. Epema; M.J.T. Reinders; {van Steen}, MR; HJ Sips;
    Concurrency and Computation: Practice & Experience,
    Volume 20, Issue 2, pp. 127-138, 2008.

  1230. An integrated interface circuit with a capacitance-to-voltage converter as front-end for grounded capacitive sensors
    A. Heidary; G.C.M. Meijer;
    Measurement Science and Technology,
    Volume 20, pp. 1-7, 2008.

  1231. Interface electronics for a CMOS electrothermal frequency-locked-loop
    C. Zhang; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 43, Issue 7, pp. 1603-1608, 2008.

  1232. Correction of low order aberrations using continuous deformable mirrors
    G.V. Vdovin; O.A. Soloviev; A.A. Samokhin; M. Loktev;
    Optics Express,
    Volume 16, Issue 5, pp. 2859-2866, 2008.

  1233. Influence of terrestrial cosmic rays on the reliability of CCD image sensors-pat 2:experiments at elevated temperature
    A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 55, Issue 9, pp. 2324-2328, 2008.

  1234. CMOS image sensors:state-of-the-art
    A.J.P. Theuwissen;
    Solid-State Electronics,
    Volume 52, pp. 1401-1406, 2008.

  1235. CCD structures implemented in standard 0.18 micrometer CMOS technology
    Rao padmakumar; X. Wang; A.J.P. Theuwissen;
    Electronics Letters,
    Volume 44, Issue 8, pp. 548-549, 2008.

  1236. Optimal implementation of a microspectrometer based on a single flat diffraction grating
    S. Grabarnik; A. Emadi; E.A. Sokolova; G.V. Vdovin; R.F. Wolffenbuttel;
    Applied Optics,
    Volume 47, pp. 2082-2090, 2008.

  1237. A high-performance interface for grounded conductivity sensors
    X. Li; G.C.M. Meijer;
    Measurement Science and Technology,
    Volume 19, Issue 11, pp. 1-7, 2008.

  1238. Read-out calibration of a SOI capacitive transducer using the pull-in voltage
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 18, Issue 6, 2008.

  1239. Negative offset operation of four-transistor CMOS image pixels for increased well capacity and suppressed dark current
    B. Mheen; Y. Joo-song; A.J.P. Theuwissen;
    IEEE Electron Device Letters,
    Volume 29, Issue 4, pp. 347-349, 2008.

  1240. Fabrication of an imaging diffraction grating for use in a MEMS-based optical microspectrograph
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; G.V. Vdovin; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 18, Issue 6, 2008.

  1241. High-resolution microspectrometer with an aberration-correcting planar grating
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    Applied Optics,
    Volume 47, pp. 6442-6447, 2008.

  1242. Fabrication and optical characterization of nano-hole arrays in gold and gold/palladium films on glass
    O.M. Piciu; M.W. Docter; M. van der KrogtC; Y. Garini; I.T. Young; P.M. Sarro; A. Bossche;
    Institution of Mechanical Engineers. Proceedings. Part N: Journal of Nanoengineering and Nanosystems,
    Volume 221, Issue 3, pp. 107-114, 2008.

  1243. Size-dependent trajectories of DNA macromolecules due to insulative dielectrophoresis in submicrometer-deep fluidic channels
    G.O.F. Parikesit; A.P. Markesteijn; O.M. Piciu; A. Bossche; J. Westerweel; I.T. Young; Y. Garini;
    Biomicrofluidics,
    Volume 2, Issue 024103, pp. 1-14, 2008.

  1244. A comparison of two-and four-electrode techniques to characterize blood impedance for the frequency range of 100 Hz to 100 MHz
    Z.Y. Chang; G.A.M. Pop; G.C.M. Meijer;
    IEEE Transactions on Biomedical Engineering,
    Volume 55, Issue 3, pp. 1247-1249, 2008.

  1245. A current-feedback instrumentation amplifier with 5 microvolts offset for bidirectional high-side current-sensing
    J.F. Witte; J.H. Huijsing; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 43, Issue 12, pp. 2769-2775, 2008.

  1246. Design and performance of a room-temperature TeraHertz detection array for real-time imaging
    I. Kasalynas; A.J.L. Adam; T.O. Klaassen; J.N. Hovenier; G. Pandraud; V.P. Iordanov; P.M. Sarro;
    IEEE Journal of Selected Topics in Quantum Electronics,
    Volume 14, Issue 2, pp. 363-369, 2008.

  1247. A thermopile detector array with scaled TE elements for use in an integrated IR microspectrometer
    H.W. Wu; S. Grabarnik; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 18, Issue 6, 2008.

  1248. Comparison of generalized differential quadrature and galerkin methods for the analysis of micro-electro-mechanical coupled systems
    H. Sadeghian Marnani; G. Rezazadeh;
    Communications in Nonlinear Science and Numerical Simulation,
    pp. 68850E-68850E8, 2008.

  1249. Measuring and extraction of biological information on new handheld biochip-based microsystem
    Lopes, Paulo AC; Germano, José; de Almeida, Teresa Mendes; Sousa, Leonel Augusto; Piedade, Moisés S; Cardoso, Filipe Arroyo; Ferreira, Hugo Alexandre; Freitas, Paulo P;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 59, Issue 1, pp. 56-62, 2008.

  1250. Detection of 130 nm magnetic particles by a portable electronic platform using spin valve and magnetic tunnel junction sensors
    Cardoso, Filipe Arroyo; Germano, J; Ferreira, R; Cardoso, S; Martins, VC; Freitas, PP; Piedade, MS; Sousa, L;
    Journal of Applied Physics,
    Volume 103, Issue 7, pp. 07A310, 2008.

  1251. A smart integrated sensor-interface chip.DET6437,progress report IV
    Q. Jia; X. Li; G.C.M. Meijer;
    STW, , 2008.

  1252. Project pieken in de delta, heart in three dimensions interface electronics, design progress report V
    Z. Yu;
    Delft University of Technology, , 2008.

  1253. Technical report on the VIDI project "Adaptive optics for the human vision"
    M. Loktev; G.V. Vdovin;
    STW, , 2008.

  1254. High resolution IF-to-baseband ADC for AM/FM car radios
    P.G.R. Silva; J.H. Huijsing;
    Springer Science + Business Media B.V., , 2008.

  1255. Sensory feedback for surgical drilling:intermediate report on project status
    E. Margallo Balbas; D.H.B. Wicaksono;
    STW, , 2008.

  1256. Project pieken in de delta, heart in three dimensions interface electronics, design progress report III
    Z. Yu;
    Delft University of Technology, , 2008.

  1257. Project pieken in de delta, heart in three dimensions interface electronics, design progress report IV
    Z. Yu;
    Delft University of Technology, , 2008.

  1258. A smart integrated sensor-interface chip,DET6437,progress report V
    Q. Jia; X. Li; G.C.M. Meijer;
    STW, , 2008.

  1259. Project pieken in de delta, Heart in three dimensions interface electronics, design progress report 1
    Z. Yu;
    Delft University of Technology, , 2008.

  1260. Project pieken in de delta, heart in three dimensions interface electronics, design progress report III
    Z. Yu;
    Delft University of Technology, , 2008.

  1261. Silicon-on-Glass & Silicon-on-Insulator MEMS Acceleration (Inertial) Sensors - Design & Process Development
    V. Rajaraman;
    NXP, , 2008.

  1262. Smart Sensor Systems
    Gerard C.M. Meijer;
    Gerard Meijer (Ed.);
    Wiley-Interscience, , 2008. ISBN: 978-0-470-86691-7.

  1263. Characterization of new EUV stable silicon photodiodes
    F. Scholze; C. Laubis; F. Sarubbi; L.K. Nanver; S. Nihtianov;
    conference, 2008. s.n..

  1264. Planar MEMS-compatible microspectrograph
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; G.V. Vdovin; R.F. Wolffenbuttel;
    s.n. (Ed.);
    apcot, , pp. 53-56, 2008.

  1265. Design and fabrication of a thermopile detector array with scaled elements for an integrated IR microspectrometer
    H.W. Wu; A. Emadi; W. van der Vlist; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    apcot, , pp. 213-216, 2008.

  1266. A mechanistic model for adsorption-induced change in resonance response of submicron cantilevers
    H. Sadeghian Marnani; J.F.L. Goosen; A. Bossche; F. van Keulen;
    SA Tadigadapa; BA Parviz; AK Henning (Ed.);
    SPIE, , pp. 1-8, 2008.

  1267. Dynamic Offset Cancellation in Operational Amplifiers and Instrumentation Amplifiers
    J.H. Huijsing;
    M. Steyaert; A.H.M. van Roermund; H Casier (Ed.);
    Springer, , pp. 99-123, 2008.

  1268. An adaptive front-end for grounded conductivity sensors in liquid-monitoring applications
    Q. Jia; X. Li; G.C.M. Meijer;
    s.n. (Ed.);
    Sense of Contact 2009, , pp. 1-6, 2008.

  1269. An interfacing for eddy current displacement sensors with power considerations
    M.R. Nabavi; S. Nihtianov;
    s.n. (Ed.);
    Sense of Contact 2009, , pp. 1-6, 2008.

  1270. Optical microspectrometer with planar grating and external spherical
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 350-353, 2008.

  1271. Instrumentation amplifier developments
    J.H. Huijsing;
    {Andrea Baschirotto,Piero Malcovati} (Ed.);
    University of pavia, , pp. 105-136, 2008.

  1272. High-speed sigma-delta converters
    M. Bolatkale; L.J. Breems; K.A.A. Makinwa;
    s.n. (Ed.);
    ProRISC, , pp. 143-148, 2008.

  1273. Continuous dielectrophoretic separation in the iterative curves using DC biased AC electric fields
    L. Zhang; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    s.n. (Ed.);
    IEEE, , pp. 864-868, 2008.

  1274. Fabrication of trapped optical structures using resist reflow
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 113-116, 2008.

  1275. Squeezed film damping measurements on a parallel-plate MEMS in the free molecule regime
    L. Mol; L.A. Rocha; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 355-358, 2008.

  1276. Optical sensors based on photon detection
    R.F. Wolffenbuttel;
    {G.C.M. Meijer} (Ed.);
    Wiley, , pp. 4-79-121, 2008.

  1277. IC-compatible microspectrometer using a planar imaging diffraction grating
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; G.V. Vdovin; R.F. Wolffenbuttel;
    s.n. (Ed.);
    SPIE, , pp. 1-10, 2008.

  1278. Characterization of thermal cross-talk in a thermopile detector
    H.W. Wu; S. Grabarnik; G. de Graaf; A. Emadi; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 415-418, 2008.

  1279. Simulation and analytical calculation of reflowed resist structures
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 347-350, 2008.

  1280. Optimized settling of under-damped electrostatic actuators based on input shaping
    L. Mol; L.A. Rocha; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 1337-1340, 2008.

  1281. Damping of electrostatic actuators operated at low air pressure using input shaping
    L. Mol; L.A. Rocha; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 13-16, 2008.

  1282. Cross-talk characterization of thermal detector array
    H.W. Wu; S. Grabarnik; A. Emadi; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 366-369, 2008.

  1283. Concave diffraction gratings fabricated with planar lithography
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    SPIE, , pp. 1-8, 2008.

  1284. A fast interface for low-value capacitive sensors with improved accuracy
    R. Nojdelov; S. Nihtianov;
    In s.n. (Ed.), Proceedings of I2MTC 2008,
    I2MTC2012, pp. 1576-1580, 2008.

  1285. The design of a chopped current-feedback instrumentation amplifier
    R. Wu; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), ISCAS 2008, IEEE International Symposium,
    ISCAS, pp. 2466-2469, 2008.

  1286. Reliability analysis of single grain Si TFT using 2D simulation
    A. Baiano; J. Tan; R. Ishihara; C.I.M. Beenakker;
    In Y Kuo (Ed.), Thin film transistors 9 (TFT 9),
    s.n., pp. 109-114, 2008.

  1287. A current-feedback instrumentation amplifier with 5 microvolts offset for bidirectional high-side current-sensing
    J.F. Witte; J.H. Huijsing; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings of ISSCC 2008,
    ISSCC, pp. 74-76, 2008.

  1288. Design of reliable interface system for eddy current displacement sensors in vacuum environments
    M.R. Nabavi; S. Nihtianov;
    In J Popp; s.n. (Ed.), ISCAS 2008, IEEE International Symposium,
    IEEE, pp. 2090-2093, 2008.

  1289. A precision integrated interface circuit for thermopile based sensors
    Q. Jia; X. Li; G.C.M. Meijer;
    In s.n. (Ed.), The IMTC IEEE 2008 proceedings,
    IEEE, pp. 1-4, 2008.

  1290. A low-power interface for eddy current displacement sensors in sub-micron applications
    M.R. Nabavi; S. Nihtianov;
    In s.n. (Ed.), The IMTC IEEE 2008 proceedings,
    I2MTC2012, pp. 17-20, 2008.

  1291. An integrated interface for leaky capacitive sensor with emphasize on humidity sensor
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), The IMTC IEEE 2008 proceedings,
    I2MTC2012, pp. 1-4, 2008.

  1292. Response time of silicon photodiodes for DUV/EUV radiation
    S. Xia; F. Sarubbi; R. Naulaerts; S. Nihtianov; L.K. Nanver;
    In B Rassa (Ed.), The IMTC IEEE 2008 proceedings,
    I2MTC2012, pp. 1956-1959, 2008.

  1293. 2D simulation of hot-carrier-induced degradation and reliability analysis for single grain Si TFTs
    J. Tan; A. Baiano; R. Ishihara; C.I.M. Beenakker;
    In s.n. (Ed.), The annual workshop on semiconductor advances for future electronics and sensors,
    STW, pp. 600-603, 2008.

  1294. Universal asynchronous sensor systems
    X. Li; G.C.M. Meijer;
    In {G.C.M. Meijer} (Ed.), Smart sensor systems,
    Wiley, pp. 10-279-311, 2008.

  1295. Smart temperature sensor and temperature-sensor systems
    G.C.M. Meijer;
    In G.C.M. Meijer (Ed.), Smart sensor systems,
    Wiley, pp. 7-185-223, 2008.

  1296. Silicon sensors, an introduction
    J.H. Huijsing;
    In {G.C.M. Meijer} (Ed.), Smart sensor systems,
    Wiley, pp. 1-55-77, 2008.

  1297. Interface electronics for smart sensor systems
    G.C.M. Meijer;
    In G.C.M. Meijer (Ed.), Smart sensor systems,
    Wiley, pp. 2-23-54, 2008.

  1298. High-performance DUV/EUV photodiodes in a pure boron doping technology
    F. Sarubbi; L.K. Nanver; T.L.M. Scholtes; S. Nihtianov; F. Scholze;
    In s.n. (Ed.), The annual workshop on semiconductor advances for future electronics and sensors,
    STW, pp. 588-591, 2008.

  1299. Capacitive sensors
    X. Li; G.C.M. Meijer;
    In {G.C.M. Meijer} (Ed.), Smart sensor systems,
    Wiley, pp. 8-225-248, 2008.

  1300. Smart sensor systems: why where how?
    J.H. Huijsing;
    In G.C.M. Meijer (Ed.), Smart sensor systems,
    Wiley, pp. 1-1-21, 2008.

  1301. The dependence of shallow-junction DUV/EUV photodiodes response time on illuminated area
    S. Xia; S. Nihtianov;
    In s.n. (Ed.), Proceedings of sense of contact X,
    Sense of Contact 2009, pp. 1-1, 2008.

  1302. A temperature to digital converter based on an optimized electrothermal filter
    S.M. Kashmiri; S. Xia; K.A.A. Makinwa;
    In W Redman-White; A Walton (Ed.), Proceedings of the 34th European Solid-State Circuits Conference, 2008. ESSCIRC 2008,
    IEEE, pp. 74-77, 2008.

  1303. Lab-on-a-chip device:testing,alignment,bonding and trapping of polystyrene beads
    S. Mokkapati; O.M. Piciu; L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Proceedings of MME 2008,
    MME, pp. 213-216, 2008.

  1304. Design constraints of the interface electronics for an ultrasonic matrix transducer for 3D transesophageal echocardiography
    Z. Yu; G.C.M. Meijer; C.A. Prins; N. de Jong; H. van den Bosch;
    In s.n. (Ed.), Proceedings of sense of contact X,
    Sense of Contact 2009, pp. 1-4, 2008.

  1305. PDMS-glass bonded microfluidic device for single cell analysis:testing, alignment,bonding and trapping of polystyrene beads
    S. Mokkapati; O.M. Piciu; L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Proceedings of SAFE 2008,
    SAFE, pp. 415-419, 2008.

  1306. Very thin SiC membranes for micromachines vacuum sensors
    H.T.M. Pham; C. Fan; G. Pandraud; J.F. Creemer; N.M. van der Pers; P. Visser; K. Kwakernaak; P.M. Sarro;
    In s.n. (Ed.), Proceedings of IEEE sensors 2008,
    IEEE Sensors, pp. 1143-1146, 2008.

  1307. A CMOS image sensor with a buried-channel source follower
    X. Wang; M.F. Snoeij; R. Padma kumar rao; A. Mierop; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings of ISSCC 2008,
    IEEE, pp. 62-63, 2008.

  1308. A CMOS temperature-to-digital converter with an inaccuracy of +_ 0.5degree celsius (3 ) from -55 to 125 degree celsius
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    In {K.Pagiamztis L.C. Fujino, M.Amiri, G.Gulak}, S.Mirabbasi; R.Specner (Ed.), Proceedings of ISSCC 2008,
    ISSCC, pp. 576,577-637, 2008.

  1309. An adaptive front-end fo grounded conductivity sensors in liquid-monitoring applications
    Q. Jia; X. Li; G.C.M. Meijer;
    In Ru Huang; Min Yu; Xia An (Ed.), Proceedings of ICSICT,
    ICSICT, pp. 1-4, 2008.

  1310. Thermal diffusivity sensors for wide-range temperature sensing
    C.P.L. van Vroonhoven; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings of IEEE Sensors 2008,
    IEEE Sensors, pp. 764-767, 2008.

  1311. A high-performance interface for platinum temperature sensors with long-cable
    X. Li; G.C.M. Meijer;
    In {Ru Huang, Min Yu, Xia An} (Ed.), Proceedings of ICSICT,
    IEEE, pp. 1-4, 2008.

  1312. Plug dispersion compensation for moving field capillary electrophoresis by low voltage electroosmotic pump
    L. Zhang; R. Lindken; A. Bossche;
    In s.n. (Ed.), Proceedings of IEEE Sensors 2008,
    IEEE, pp. 1175-1178, 2008.

  1313. A CMOS image sensor with row and column profiling means
    N. Xie; A.J.P. Theuwissen; X. Wang; J. Leijtens; H. Hakkesteegt; H. Jansen;
    In s.n. (Ed.), Proceedings of IEEE Sensors 2008,
    IEEE Sensors, pp. 1356-1359, 2008.

  1314. New chances for asynchronous sensor interfaces
    G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of ICCDCS 2008,
    IEEE Xplore, pp. 1-6, 2008.

  1315. Smart optics: the next step in presicision system design
    R.H. Munnig Schmidt; M. Verhaegen; G. Schitter; N.J. Doelman; G.V. Vdovin; K.J. Boller; F. Bijkerk; M. Steinbuch; N Rosielle; {De Smet}, MD; C Keller; R Stuik;
    In Barten,E (Ed.), Proceedings of Pact 2008,
    PACT, pp. 1-4, 2008. NEO.

  1316. A programmable time-gain-compensation (TGC) amplifier for medical ultrasonic echo signal processing
    Z. Yu; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of ICSICT,
    ICSIST, pp. 1-4, 2008.

  1317. PDMS-glass bonded lab-on-a-chip device for single cell analysis
    S. Mokkapati; O.M. Piciu; L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In {S.Hascik, J.Osvald} (Ed.), Proceedings of ASDAM 2008,
    ASDAM, pp. 211-214, 2008.

  1318. The high-tech world of lithography
    S. Nihtianov;
    In s.n. (Ed.), Proceedings of Electronics-ET 2008,
    Electronics 2008, pp. 15-24, 2008.

  1319. Response time of shallow junction silicon photodiodes
    L. Shi; S. Xia; F. Sarubbi; R. Naulaerts; S. Nihtianov; L.K. Nanver;
    In s.n. (Ed.), Proceedings of Electronics 2008,
    Electronics 2008, pp. 21-26, 2008.

  1320. The interface electronics for an ultrasonic matrix transducer for 3D transephageal echocardiography
    Z. Yu; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of Electronics-ET 2008,
    Electronics 2008, pp. 19-22, 2008.

  1321. Wavefront sensing using a random phase screen
    M. Loktev; G.V. Vdovin; O.A. Soloviev;
    In {Christopher ainty} (Ed.), Proceedings of 6th International workshop on Adaptive optics for industry and medicine,
    Imperial college press, pp. 182-187, 2008.

  1322. Lab-on-a-chip device for single cell analysis:trapping polystyrene beads
    S. Mokkapati; O.M. Piciu; L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Proceedings of APCTP-ASEAN workshop on Advanced Material Science and Nanotechnology,
    Academic press of vietnam academy of science and technology, pp. 1093-1097, 2008.

  1323. Particle deflection in the electrode arrays by dielectrophoresis and AC electroosmosis
    L. Zhang; A. Bossche;
    In s.n. (Ed.), Proceedings Eurosensors XXII,
    Eurosensors, pp. 321-324, 2008.

  1324. Optimizing the noise performance of an integrated interface for capacitive sensors for a wide range
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings Electronics ET 2008,
    Electronics ET, pp. 9-14, 2008.

  1325. Thin-film encapsulation of a silicon field emission electron source
    F. Santagata; C.K. Yang; J.F. Creemer; P.M. Sarro;
    In s.n. (Ed.), Proceedings Eurosensors XXII,
    Eurosensors XXII, pp. 625-628, 2008.

  1326. Pure boron-doped photodiodes: a solution for radiation detection in EUV lithography
    F. Sarubbi; L.K. Nanver; T.L.M. Scholtes; S. Nihtianov; F. Scholze;
    In S Hall (Ed.), IEEE 38th european solid-state device research conference,
    IEEE, pp. 278-281, 2008.

  1327. A DFA framework for hybrid microsystems
    M. Tichem; D. Tanase;
    In {S.M. Ratchev, S. Koelemeijer} (Ed.), IPAS 2008; Micro-Assembly Technologies and Applications,
    Springer, pp. 13-22, 2008.

  1328. Extremely ultra-shallow p+-n boron-deposited silicon diodes applied to DUV photodiodes
    F. Sarubbi; L.K. Nanver; T.L.M. Scholtes; S. Nihtianov;
    In J Appenzeller (Ed.), 66th annual device research conference,
    IEEE, pp. 143-144, 2008.

  1329. Integrated adaptive optics systme for small telescopes
    M. Loktev; G.V. Vdovin; O.A. Soloviev;
    In {Norbert Hubin, Claire E.Max, Peter L. Wizinowich} (Ed.), Astronomical telescopes and instrumentation 2008, proceedings of SPIE,
    SPIE, pp. 1-7, 2008.

  1330. An investigation on the particle movement in the slanted planar electrode arrays
    L. Zhang; A. Bossche;
    In s.n. (Ed.), apcot, pp. 1-4, 2008.

  1331. Impulse Based Scheme for Crystal-less ULP Radios
    Fabio Sebastiano; Salvatore Drago; Lucien J. Breems; Domine M.W. Leenaerts; Kofi A.A. Makinwa; Bram Nauta;
    In Proc. IEEE International Symposium on Circuits and Systems,
    pp. 1508 - 1511, May18--21 2008. DOI: 10.1109/TCSI.2009.2015208
    Keywords: ... access protocols;ad hoc networks;clocks;low-power electronics;modulation;ultra wideband communication;wireless sensor networks;ad hoc modulation;crystal-less ULP radio;crystal-less clock generator;duty-cycled wake-up radio;frequency 17.7 MHz;frequency 2.4 GHz;impulse radio;medium access control protocol;power 100 muW;ultra-low-power radio;wireless sensor network;Crystal-less clock;EDICS Category: COMM110A5, COMM200, COMM250A5;impulse radio;ultra-low power (ULP);wake-up radio;wireless sensor network (WSN).

    Abstract: ... This study describes a method of implementing a fully integrated ultra-low-power (ULP) radio for wireless sensor networks (WSNs). This is achieved using an ad hoc modulation scheme (impulse radio), with a bandwidth of 17.7 MHz in the 2.4 GHz-ISM band and a specific medium access control (MAC) protocol, based on a duty-cycled wake-up radio and a crystal-less clock generator. It is shown that the total average power consumption is expected to be less than 100 µW with a clock generator inaccuracy of only 1%.

  1332. A Low-Voltage Mobility-Based Frequency Reference for Crystal-Less ULP Radios
    Fabio Sebastiano; Lucien J. Breems; Kofi A.A. Makinwa; Salvatore Drago; Domine M.W. Leenaerts; Bram Nauta;
    In Proc. European Solid-State Circuits Conference,
    Edinburgh, UK, pp. 306 - 309, September15--19 2008. DOI: 10.1109/ESSCIRC.2008.4681853
    Keywords: ... CMOS integrated circuits;MOSFET circuits;electron mobility;integrated circuit design;low-power electronics;mobile radio;wireless sensor networks;MOS transistor;crystal less ULP radios;electron mobility;frequency 100 kHz;low voltage mobility based frequency reference;off-chip components;one point calibration;size 65 nm;temperature -22 degC to 85 degC;voltage 1.2 V;wireless sensor networks;CMOS technology;Calibration;Circuits;Energy consumption;Frequency;Oscillators;Silicon;Temperature distribution;Temperature sensors;Wireless sensor networks.

    Abstract: ... The design of a 100 kHz frequency reference based on the electron mobility in a MOS transistor is presented. The proposed low-voltage low-power circuit requires no off-chip components, making it suitable for Wireless Sensor Networks (WSN) applications. After one-point calibration the spread of its output frequency is less than 1.1% (3σ) over the temperature range from -22 °C to 85 °C. Fabricated in a baseline 65-nm CMOS technology, the frequency reference occupies 0.11 mm² and draws 34 µA from a 1.2-V supply at room temperature.

  1333. On the Temperature Compensation of a Frequency Reference for Crystal-Less ULP Wireless Sensor Networks
    Fabio Sebastiano; Lucien J. Breems; Kofi A.A. Makinwa; Salvatore Drago; Domine M.W. Leenaerts; Bram Nauta;
    In Proc. ProRISC,
    Veldhoven, The Netherlands, pp. 306 - 309, September27--18 2008.
    Abstract: ... Each node in a Wireless Sensor Network (WSN) must be provided with a frequency reference to enable network synchronization and RF communication. As the nodes need to be small, cheap and energy efcient, a frequency reference suitable for WSN must show low power consumption and require no off-chip components. A reference based on electron mobility in a MOS transistor demonstrates such features. Its output frequency follows the temperature dependence of mobility, which, although large, is well dened and can be compensated for. It is shown that a temperature sensor with accuracy of only 0.6 °C can be employed for the temperature compensation and that the inaccuracy of a compensated mobility-based frequency reference due to temperature, process spread, voltage supply variations and noise can be as low as 1% on a wide temperature range, fitting radio architectures for WSN applications.

  1334. Voltage calibration of smart temperature sensors
    M. A. P. Pertijs; A. L. Aita; K. A. A. Makinwa; J. H. Huijsing;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 756‒759, October 2008. DOI: 10.1109/icsens.2008.4716551

  1335. Sigma delta ADC with a dynamic reference for accurate temperature and voltage sensing
    N. Saputra; M. A. P. Pertijs; K. A. A. Makinwa; J. H. Huijsing;
    In Proc. IEEE International Symposium on Circuits and Systems (ISCAS),
    IEEE, pp. 1208‒1211, May 2008. DOI: 10.1109/iscas.2008.4541641

  1336. A BiCMOS Operational Amplifier Achieving 0.33μV/°C Offset Drift using Room-Temperature Trimming
    M. Bolatkale; M. A. P. Pertijs; W. J. Kindt; J. H. Huijsing; K. A. A. Makinwa;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 76‒77, February 2008. DOI: 10.1109/isscc.2008.4523064

  1337. Integrated spintronic platforms for biomolecular recognition detection
    Martins, VC; Cardoso, Filipe Arroyo; Loureiro, J; Mercier, M; Germano, J; Cardoso, S; Ferreira, R; Fonseca, LP; Sousa, L; Piedade, MS; others;
    In AIP Conference Proceedings,
    American Institute of Physics, pp. 150-175, 2008.

  1338. A low power chopper current-feedback instrumentation amplifier with noise PSD of 17nV/Hz
    R. Wu; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), Proceedings / SAFE 2008, ProRISC 2008,
    ProRISC, pp. 279-282, 2008.

  1339. Elektrische meetinrichting werkwijze en computer programmaproduct
    G.C.M. Meijer; M.A. Hilhorst;
    2008.

  1340. Elektrische meetinrichting, werkwijze en computer programma product
    G.C.M. Meijer; M.A. Hilhorst;
    2008. TU Delft; 1033148; TU Delft.

  1341. Bias circuits
    M. Pertijs; J. Huijsing;
    Patent, United States 7,446,598, November 2008.

  1342. Bitstream controlled reference signal generation for a sigma-delta modulator
    M. A. P. Pertijs; K. A. A. Makinwa; J. H. Huijsing;
    Patent, United States 7,391,351, June 2008.

  1343. Learning from nature:biologically-inspired biosensors
    D.H.B. Wicaksono;
    PhD thesis, Delft University of Technology, 2008.

  1344. Dynamic offset compensated CMOS amplifiers
    J.F. Witte;
    PhD thesis, Delft University of Technology, 2008.

  1345. Mid infrared microspectrometer systems
    G. de Graaf;
    PhD thesis, Delft University of Technology, 2008.

  1346. Planar double-grating micro spectrometer
    S. Grabarnik; R.F. Wolffenbuttel; A. Emadi; M. Loktev; E.A. Sokolova; G.V. Vdovin;
    Optics Express,
    Volume 15, Issue 6, pp. 3581-3588, 2007.

  1347. Extending the limits of a capacitive soil-water-content measument (U_SP_2_I_IC_T)
    Z.Y. Chang; B.P. Iliev; G.C.M. Meijer; J.F. de Groot;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 56, Issue 6, pp. 2240-2244, 2007.

  1348. Liquid-level measurement system based on a remote grounded capacitive sensor (U_SP_2_I_IC_T)
    F. Reverter; X. Li; G.C.M. Meijer;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    pp. 1-8, 2007.

  1349. Liquid-crystal intra ocular adaptive lens with wireless control
    A.N. Simonov; G.V. Vdovin; M. Loktev;
    Optics Express,
    pp. 7468-7478, 2007.

  1350. Multiple-ramp column-parallel ADC architectures for CMOS image sensors
    M.F. Snoeij; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 42, Issue 12, pp. 2968-2977, 2007.

  1351. A CMOS chopper offset-stabilized opamp
    J.F. Witte; K.A.A. Makinwa; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 42, Issue 7, pp. 1529-1535, 2007.

  1352. Low-frequency noise phenomena in switched MOSFETs
    M.F. Snoeij; A.P. van der wel; E.A.M. Klumperink; J.S. Kolhatkar; E. Hoekstra; C. Salm; H. Wallinga; B. Nauta;
    IEEE Journal of Solid State Circuits,
    Volume 42, Issue 3, pp. 540-550, 2007.

  1353. Liquid crystal wavefront corrector with model response based on spreading of the electric field in a dielectric material
    M. Loktev; G.V. Vdovin; N.A. Klimov;
    Optics Express,
    pp. 2770-2778, 2007.

  1354. Stretchable diffraction gratings for spectrometry (U_SP_2_I_IC_T)
    A.N. Simonov; S. Grabarnik; G.V. Vdovin;
    Optics Express,
    pp. 9784-9792, 2007.

  1355. Technical Challenges and Recent progress in CCD Imagers
    J.T. Bosiers; C. Draijer; A.J.P. Theuwissen;
    Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment,
    pp. 148-156, 2007.

  1356. Structured illumination microscopy using extraordinary transmission through sub-wavelength hole-arrays
    M.W. Docter; P.M. van den Berg; P.F.A. Alkemade; V.G. Kutchoukov; O.M. Piciu; A. Bossche; I.T. Young; Y. Garini;
    Journal of Nanophotonics,
    Volume 1, Issue 011665, pp. 1-10, 2007.

  1357. An IF-to-baseband sigma delta modulator for AM/FM/IBOC radio receivers with a 118 dB dynamic range
    P.G.R. Silva; K.A.A. Makinwa; J.H. Huijsing; L.J. Breems; R. Roovers;
    IEEE Journal of Solid State Circuits,
    Volume 42, Issue 5, pp. 1076-1089, 2007.

  1358. Magnetoresistive sensors
    Freitas, PP; Ferreira, R; Cardoso, S; Cardoso, Filipe Arroyo;
    Journal of Physics: Condensed Matter,
    Volume 19, Issue 16, pp. 165221, 2007.

  1359. Noise characteristics and particle detection limits in diode + MTJ matrix elements for biochip applications
    Cardoso, Filipe Arroyo; Ferreira, R; Cardoso, S; Conde, JP; Chu, V; Freitas, PP; Germano, J; Almeida, T; Sousa, L; Piedade, MS;
    IEEE transactions on magnetics,
    Volume 43, Issue 6, pp. 2403-2405, 2007.

  1360. Nanoned report (1-01-2007 to 01-07-2007)
    O.M. Piciu; A. Bossche;
    Nanoned, , 2007.

  1361. Tissue viability
    D. Tanase; N. komen;
    STW, , 2007.

  1362. Poly-elektronics zakboek
    P.P.L. Regtien; R.F. Wolffenbuttel;
    Reed Business, , 2007.

  1363. Tissue viability
    D. Tanase; N. komen;
    STW, , 2007.

  1364. A smart universal sensor-interface chip, progress report 3
    Q. Jia;
    STW, , 2007.

  1365. On integrated process development for SOI-MEMS inertial devices
    V. Rajaraman;
    NXP Semiconductors, , 2007.

  1366. Accurate read-out calibration of an SOI capacitive transducer using the pull-in voltage
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 355-358, 2007.

  1367. A test mechanism for device diagnostics and process characterization
    L.A. Rocha; L. Mol; E. Cretu; R.F. Wolffenbuttel; J. Machado da silva; J.S. matos;
    s.n. (Ed.);
    s.n., , pp. 597-602, 2007.

  1368. Infrared thermopile detector array for the integrated micro spectrometer
    A. Emadi; H.W. Wu; S. Grabarnik; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IEEE, , pp. 435-438, 2007.

  1369. Full-gap positioning of parallel-plate electrostatic MEMS using on-off control
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IEEE, , pp. 1464-1468, 2007.

  1370. Hoofdstuk E: Meten
    P.P.L. Regtien; R.F. Wolffenbuttel;
    {H.S. van Leerdam, R.P. Mertens}; {A.J.M. Montagne en G.A. Schwippert} (Ed.);
    Reed Business, , pp. E/1-E/66, 2007.

  1371. Hoofdstuk B4: Sensoren en Actuatoren (U_SP_2_I_IC_T)
    P.P.L. Regtien; R.F. Wolffenbuttel;
    {H.S. van leerdam, R.P. Mertens}; {A.J.M. Montagne en G.A. Schwippert} (Ed.);
    Reed Business, , pp. B4/1-B4/72, 2007.

  1372. Gamma-ray effects on CMOS image sensors in deep sub-micron technology
    Rao padmakumar; X. Wang; A. Mierop; A.J.P. Theuwissen;
    s.n. (Ed.);
    International Image sensor, , pp. 70-73, 2007.

  1373. Low-cost interface for leaky capacitive sensor with emphasize on humidity sensor
    A. Heidary; G.C.M. Meijer;
    s.n. (Ed.);
    Sense of Contact 2009, , pp. 1-6, 2007.

  1374. Design and fabrication of an infrared microspectrometer using attenuated total reflection
    G. de Graaf; W. van der Vlist; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IEEE, , pp. 1395-1399, 2007.

  1375. Capacitive MEMS accelerometers testing mechanism for auto-calibration and long-term diagnostics
    L.A. Rocha; L. Mol; E. Cretu; R.F. Wolffenbuttel; J. Machado da silva;
    s.n. (Ed.);
    s.n., , pp. 171-175, 2007.

  1376. Spectral sensor basedon an imaging diffraction grating and fabricated with MEMS technologies
    S. Grabarnik; A. Emadi; H.W. Wu; G. de Graaf; G.V. Vdovin; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 175-178, 2007.

  1377. Design and fabrication of thermopile detector array for microspectrometer application
    H.W. Wu; A. Emadi; G. de Graaf; S. Grabarnik; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 103-106, 2007.

  1378. Fabrication and characterization of infra-red multi-layered interference filter
    A. Emadi; S. Grabarnik; H.W. Wu; G. de Graaf; R.F. Wolffenbuttel;
    MME, , pp. 249-252, 2007.

  1379. A feedback operated tunable accelerometer: Analysis and design
    L.A. Rocha; L. Mol; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    MME, , pp. 405-408, 2007.

  1380. High-Precision Read-Out Circuit for Thermistor Temperature Sensor
    R. Wu; K.A.A. Makinwa; J.H. Huijsing; S. Nihtianov;
    Springer, , pp. -, 2007.

  1381. Capacitance to digital converter
    S. Nihtianov; R. Nojdelov; E. Van Doren;
    In s.n. (Ed.), Proceedings of the 2007 IEEE Sensors Applications Symposium,
    IEEE, pp. 1-4, 2007.

  1382. A fifth-order continuous-time sigma-delta modulator with 62-dB dynamic range and 2 MHz bandwidth
    R. Wu; J.R. Long; M. van de Gevel; Gerard Lassche;
    In s.n. (Ed.), A fifth-order continuous-time sigma-delta modulator with 62-dB dynamic range and 2 MHz bandwidth,
    ProRISC, pp. 100-103, 2007.

  1383. Standard CMOS Hall-Sensor with Integrated Interface Electronics for a 3D Compass Sensor
    J. van der MeerC; K.A.A. Makinwa; J.H. Huijsing; F.R. Riedijk;
    In s.n. (Ed.), Standard CMOS Hall-Sensor with Integrated Interface Electronics for a 3D Compass Sensor,
    IEEE, pp. 1-4, 2007.

  1384. A CMOS image sensor with a column-level multiple-ramp single-slope ADC
    M.F. Snoeij; P. Donegan; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), Solid-State Circuits Conference, 2007. ISSCC 2007. Digest of Technical Papers. IEEE International,
    IEEE, pp. 1-4, 2007.

  1385. Universal asynchronous sensor interfaces
    G.C.M. Meijer;
    In J Gajza (Ed.), Proceedings of Kongres Metrologii 2007,
    Kongres Metrologii, pp. 1-8, 2007.

  1386. The effect of substrate doping on the behaviour of a CMOS electrothermal frequency-locked-loop
    C. Zhang; K.A.A. Makinwa;
    In s.n. (Ed.), Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International,
    IEEE, pp. 2283-2286, 2007.

  1387. A sensor interface system for measuring the impedance (Cx Rx) of soil at a signal frequency of 20 MHz
    Z.Y. Chang; B.P. Iliev; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sixth IEEE Sensors Conference 2007,
    IEEE, pp. 1-4, 2007.

  1388. A low-noise switched-capacitor front end for capacitive sensor
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sixth IEEE Conference on SENSORS 2007,
    IEEE, pp. 40-43, 2007.

  1389. Interface electronics for a CMOS electrothermal frequency-locked-loop
    C. Zhang; K.A.A. Makinwa;
    In D Schmitt-Landsiedel; T Noll (Ed.), Proceedings of the 33rd European Solid State Circuits Conference, 2007. ESSCIRC 2007,
    IEEE, pp. 292-295, 2007.

  1390. Position-sensitive detector designed with unusual CMOS layout strategies for a Hartmann-shack wavefront sensor
    W. Davies Dalema Monteiro; P. Luciana Salles; P. Ret; O. Andreas Furtado; G.V. Vdovin;
    In {Dainty Christopher} (Ed.), Proceedings of the 6th International workshop on adaptive optics for industry and medicine,
    Imperial college press, pp. 200-205, 2007. NEO.

  1391. Characterization of a buried-channel n-MOST source followers in CMOS image sensors
    X. Wang; Rao padmakumar; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings of the 2007 International Image Sensor Workshop,
    ImageSensors Inc., pp. 223-245, 2007.

  1392. An integrated switched-capacitor front-end for capacitive sensors with a wide dynamic range
    A. Heidary; G.C.M. Meijer;
    In D Schmitt-Landsiedel; T Noll (Ed.), Proceedings of the 33rd European Solid State Circuits Conference, 2007. ESSCIRC 2007,
    IEEE, pp. 404-407, 2007.

  1393. A Fifth-order Continuous-time Sigma-delta Modulator with 62-dB Dynamic Range and 2 MHz Bandwidth
    R. Wu; J.R. Long; M. van de Gevel; Gerard Lassche;
    In s.n. (Ed.), Proceedings of the 2007 PH.D Research in Microelectronics and Electronics Conference, Prime 2007,
    IEEE, pp. 1-4, 2007.

  1394. Analysis and design of CMOS smart temperature sensor (SMT) with duty-cycle modulated output
    K. kohbod; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of Electronics ET 2007,
    s.n., pp. 53-58, 2007.

  1395. Capacitance meter
    S. Nihtianov; R. Nojdelov;
    In s.n. (Ed.), Proceedings of Electronics ET 2007,
    s.n., pp. 123-128, 2007.

  1396. The noise performance of evaluation boards for a universal transducer interface with USB connecction
    Z.Y. Chang; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of Electronics ET 2007,
    s.n., pp. 47-52, 2007.

  1397. Analysis and design of an integrated interface fo leaky capacitive sensors with emphasis on humidity sensors
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of Electronics ET 2007,
    s.n., pp. 41-46, 2007.

  1398. A survey of Eddy current displacement sensors: Imperfections and signal conditioning methods
    M.R. Nabavi; S. Nihtianov;
    In s.n. (Ed.), Proceedings of Electronics ET 2007,
    s.n., pp. 116-122, 2007.

  1399. Nano-hole Arrays in Thin Au/Pd Film on Glass, for High Speed Molecular Analysis
    O.M. Piciu; M. van der KrogtC; F. Tatar; P.M. Sarro; A. Bossche; M.W. Docter; Y. Garini; I.T. Young;
    In s.n. (Ed.), Proceedings of 5th IEEE Conference on Sensors,
    IEEE, pp. 608-611, 2007.

  1400. A fast charge-meter for interfacing capacitive sensors
    S. Nihtianov; R. Nojdelov; E. Van Doren;
    In s.n. (Ed.), Proceedings of Africon 2007,
    IEEE, pp. 317-322, 2007.

  1401. Low-power and accurate operation of a CMOS smart temperature sensor based on bipolar devices and Delta-Sigma A/D converter
    A.L. Aita; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings Microelectronics and Electronics Conference, 2007,
    IEEE, pp. 133-136, 2007.

  1402. Minimizing power in very-low-voltage switched-opamp pipelined ADCs
    M.R. Nabavi; R. Lotfi;
    In s.n. (Ed.), Proceedings of the 2007 IEEE International Conference on Signal Processing and Communications,
    IEEE, pp. 289-292, 2007.

  1403. Microfluidic prototype fabrication in dry film resist
    L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In {A. Liu, J. Wu, C.Lu}; {C.D. Reddy} (Ed.), MEMS technology and devices,
    pan Stanford, pp. 414-417, 2007. Voor de telling krijft deze ND ipv ID.

  1404. A self-adaptive front-end for grounded conductivity sensors in liquid-monitoring applications
    Q. Jia; X. Li; G.C.M. Meijer;
    In s.n. (Ed.), PRO Risc2007,
    ProRISC, pp. 42-45, 2007.

  1405. Electronics for Physicists: does the studio classroom solve the problem?
    K.A.A. Makinwa; E. Lagendijk; D.R. Schaart; E.H. van Veen;
    In {Gómez Chova}, L; {Marti Belenguer}, D; {Candel Torres}, I (Ed.), INTED2007 Proceedings,
    INTED, pp. 1-6, 2007.

  1406. Degradation of spectral response and dark current of CMOS image sensor in deep-submicron technology due to gamma-irradiation
    Rao padmakumar; X. Wang; A.J.P. Theuwissen;
    In s.n. (Ed.), ESSDERC 2007 Proceedings of the 37th European Solid-State Device Research Conference,
    IEEE, pp. 370-373, 2007.

  1407. Plug dispersion compensation in moving field capillary electrophoresis applications
    F. Tatar; L. Zhang; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.,
    IEEE, pp. 779-782, 2007.

  1408. A three stage amplifier with quenched multipath frequency compensation for all capacitive loads
    J. Hu; J.H. Huijsing; K.A.A. Makinwa;
    In s.n. (Ed.), Circuits and Systems, 2007. ISCAS 2007. IEEE International Symposium on,
    IEEE, pp. 225-228, 2007.

  1409. A universal transducerconnection interfaces with USB
    Z.Y. Chang; G.C.M. Meijer;
    In s.n. (Ed.), A universal transducerconnection interfaces with USB,
    Sense of Contact 2009, pp. 1-4, 2007.

  1410. Power and Area Efficient Column-Parallel ADC Architectures for CMOS Image Sensors
    M.F. Snoeij; A.J.P. Theuwissen; J.H. Huijsing; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings IEEE Sensors 2007,
    IEEE, pp. 523-526, 2007.

  1411. Low-power operation of a precision CMOS temperature sensor based on substrate PNPs
    A.L. Aita; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings IEEE Sensors 2007,
    IEEE, pp. 856-859, 2007.

  1412. Smart capacitive-resistive sensors
    G.C.M. Meijer; X. Li; Z. Chang; B.P. Iliev;
    In s.n. (Ed.), Proceeding of: XLII International Scientific Conference on Information, Communication and Energy Systems and Technologies - ICEST2007,
    ICEST, pp. 3-12, 2007.

  1413. Sub-wavelength apertures in Au/Pd film for fluorescence measurements
    O.M. Piciu; M. van der KrogtC; M.W. Docter; Y. Garini; I.T. Young; P.M. Sarro; A. Bossche;
    In s.n. (Ed.), Sense of Contact 2009, pp. 1-4, 2007.

  1414. Acoustic emission based online valve leak detection and testing
    V. Rajaraman; A. Puettmer;
    In s.n. (Ed.), IEEE, pp. 1854-1857, 2007.

  1415. Adsorption-induced Resonance Frequency Change in Submicron Structures
    H. Sadeghian Marnani; J.F.L. Goosen; A. Bossche; F. van Keulen;
    In P.J. French; K DeMeyer; W Krautschneider; L.K. Nanver; {van de Sanden}, MCM; J Schmitz (Ed.), Proceedings SAFE 2007, 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors,
    Technology Foundation STW, pp. 621-624, 2007.

  1416. Lab-on-a-chip device for single cell analysis
    S. Mokkapati; O.M. Piciu; A. Bossche;
    In s.n. (Ed.), SAFE,
    SAFE, pp. 612-616, 2007.

  1417. Design of an optimized electrothermal filter for a temperature-to-frequency converter
    S. Xia; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings Sensors, 2007 IEEE,
    IEEE, pp. 1255-1258, 2007.

  1418. Smart sensor design: the art of compensation and cancellation
    K. A. A. Makinwa; M. A. P. Pertijs; J. C. van der Meer; J. H. Huijsing;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 76‒82, September 2007. DOI: 10.1109/esscirc.2007.4430251

  1419. Nanotechnology and the Detection of Biomolecular Recognition Using Magnetoresistive Transducers
    Freitas, Paulo P; Ferreira, Hugo A; Cardoso, Filipe Arroyo; Cardoso, Susana; Ferreira, Ricardo; Almeida, José; Guedes, Andre; Chu, Virginia; Conde, João P; Martins, Verónica; others;
    In A Portrait of State-of-the-Art Research at the Technical University of Lisbon,
    Springer Netherlands, pp. 3-22, 2007.

  1420. A new handheld biochip-based microsystem
    Lopes, Paulo Alexandre Crisóstomo; Germano, J; Almeida, TM; Sousa, Leonel; Piedade, Moisés Simões; Cardoso, Filipe Arroyo; Ferreira, Hugo Alexandre; Freitas, Paulo P;
    In 2007 IEEE International Symposium on Circuits and Systems,
    IEEE, pp. 2379-2382, 2007.

  1421. Generic architecture designed for biomedical embedded systems
    Sousa, Leonel; Piedade, M; Germano, J; Almeida, T; Lopes, P; Cardoso, Filipe Arroyo; Freitas, P;
    In Embedded System Design: Topics, Techniques and Trends,
    Springer US, pp. 353-362, 2007.

  1422. Electronic biosensor arrangement
    C. Nohammer; C.P.L. van Vroonhoven; D. Rocha Wiese Meneses; M.J. Vellekoop;
    2007. NEO, aanvrager: Austrian Research Centers GMBH, Wien; WO/2007/131255 A1; NEO, aanvrager: Austrian Research Centers GMBH, Wien.

  1423. Photoelectric device using PN diode and silicon integrated circuits (IC) comprising the smae photoelectric device
    B. Mheen; J. U-park; G. Ok Kim; Y. An im; H. Su kim;
    2007.

  1424. System for Diagnosing Impedances having accurate current source and accurate voltage level-shift
    J.F. Witte;
    2007.

  1425. Optical device including gate insulator with modulated thickness
    H. Su kim; B. Mheen; G. Ok Kim;
    2007.

  1426. Accurate voltage to current converters for rail-sensing current-faadback instrumentation amplifiers
    J.H. Huijsing; B. Shahi;
    2007.

  1427. Accurate voltage to current converters for rail-sensing current feedback instrumentation amplifiers
    J.H. Huijsing; Shahi Behzad;
    2007.

  1428. Electronische Biosensoranordnung
    C. Nohammer; C.P.L. van Vroonhoven; D. Rocha Wiese Meneses; M.J. Vellekoop;
    2007. NEO, aanvrager: Austrian Research Centers GMBH, Wien; A 830/2006; NEO, aanvrager: Austrian Research Centers GMBH, Wien.

  1429. Frequency stabilization of chopper-stabilized amplifiers
    J.H. Huijsing; M.J. Fonderie; B. Shahi;
    2007.

  1430. Spiral inductor having parallel-branch structure
    D. Suh; B. Mheen; J. Young-kang;
    2007.

  1431. Apparatus for determining the shape and/or size of little particles
    J.H. Nieuwenhuis; G.W. Lubking; G. yki; M.J. Vellekoop;
    2007.

  1432. A novel SiC/polymer based bio-inspired surface-micromachining MEMS vibratory gyroscope
    Y. Chen;
    PhD thesis, Delft University of Technology, 2007.

  1433. A precision band-gap reference in CMOS technology
    Z. Yu;
    PhD thesis, Delft University of Technology, 2007.

  1434. High-Resolution IF-to-Baseband Sigma Delta ADC for AM/FM car Radios
    P.G.R. Silva;
    PhD thesis, Delft University of Technology, 2007.

  1435. High resolution IF-to-baseband ADC for AM/FM car radios
    P.G.R. Silva;
    PhD thesis, Delft University of Technology, 2007.

  1436. Sigma-delta read-out architectures for electrothermal filters
    C.P.L. van Vroonhoven;
    PhD thesis, Delft University of Technology, 2007.

  1437. band-gap reference (NP60751) measurement report
    Z. Yu;
    PhD thesis, Delft University of Technology, 2007.

  1438. CMOS Image sensor in 0.18 um technology for a micro-digital sun sensor
    N. Xie;
    PhD thesis, Delft University of Technology, 2007.

  1439. Design of a thermal frequency-lock-loop for temperature sensing
    C. Zhang;
    PhD thesis, Delft University of Technology, 2007.

  1440. High-Resolution IF-to-Baseband Sigma Delta ADC for AM/FM car Radios
    P.G.R. Silva;
    PhD thesis, Delft University of Technology, 2007.

  1441. Analog Signal Processing for CMOS Image Sensors
    M.F. Snoeij;
    PhD thesis, Delft University of Technology, 2007.

  1442. Modelling and optimization of an electrothermal filter
    S. Xia;
    PhD thesis, Delft University of Technology, 2007.

  1443. lab-on-a-chip for biological fluid analysis by spectrophotometry (U-SP-2-I-ICT)
    R.F. Wolffenbuttel; G. Minas; J.H.G. Correia;
    Arab Health World,
    Volume XX, Issue 3, pp. 17-18, 2006.

  1444. The Hole Role in Solid-State Imagers
    A.J.P. Theuwissen;
    pp. 2972-2980, 2006.

  1445. Piezoelectric deformable mirror with adaptive multiplexing control (U-SP-2-I-ICT)
    A.N. Simonov; G.V. Vdovin; S. Hong;
    Optical Engineering,
    Volume 45, Issue 7, pp. 1-3, 2006.

  1446. UV bandpass optical filters for microspectrometers (U-SP-2-I-ICT)
    A. Emadi; R.F. Wolffenbuttel; J.H.G. Correia;
    ECS Transactions,
    Volume 4, Issue 1, pp. 141-147, 2006.

  1447. Stability and accuracy of active shielding for grounded capacitive sensors (U-SP-2-I-ICT)
    F. Reverter; X. Li; G.C.M. Meijer;
    Measurement Science and Technology,
    Volume 17, pp. 2884-2890, 2006.

  1448. Predicting urban arterial travel time with state-space neural networks and Kalman filters
    H. Liu; H.J. van Zuylen; J.W.C. van Lint; R.J. Maria;
    Transportation Research Record,
    Volume 1968, pp. 99-108, 2006.

  1449. Measuring the Wavelength-dependent divergence of transmission through sub-wavelength hole-arrays by spectral imaging
    M.W. Docter; I.T. Young; O.M. Piciu; A. Bossche; P.F.A. Alkemade; P.M. van den Berg; Y. Garini;
    Optics Express,
    Volume 14, Issue 20, pp. 9477-9482, 2006.

  1450. Using dynamic voltage drive in a parallel-plate electrostatic actuator for full-gap travel range and positioning (U-SP-2-I-ICT)
    R.F. Wolffenbuttel; L.A. Rocha; E. Cretu;
    IEEE Journal of Microelectromechanical Systems,
    Volume 15, Issue 1, pp. 69-83, 2006.

  1451. A CMOS Imager With Column-Level ADC Using Dynamic column Fixed-pattern Noise Reduction (U-SP-2-I-ICT)
    M.F. Snoeij; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 41, Issue 12, pp. 3007-3015, 2006.

  1452. An array of highly selective Fabry-perot optical channels for biological fluid analysis by optical absorption using a white light source for illumination (U-SP-2-I-ICT)
    R.F. Wolffenbuttel; G. Minas; J.H.G. Correia;
    Journal of Optics,
    Volume 8, pp. 272-278, 2006.

  1453. An MCM based microsystem for calorimetric detection of niomolecules in biological fluids (U-SP-2-I-ICT)
    G. de Graaf; R.F. Wolffenbuttel; G. Minas; J.H.G. Correia;
    IEEE Sensors Journal,
    Volume 6, Issue 4, pp. 1003-1009, 2006.

  1454. A CMOS Temperature-to-Frequency Converter with an Inaccuracy of 0.5 degrees C from -40 to 105 degrees C (U-SP-2-I-ICT)
    K.A.A. Makinwa; M.F. Snoeij;
    IEEE Journal of Solid State Circuits,
    Volume 41, Issue 12, pp. 1-6, 2006.

  1455. Systematic approach for the linearization and readout of non-symmetric impedance bridges (U-SP-2-I-ICT)
    R.F. Wolffenbuttel; G. de Graaf;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 55, Issue 5, pp. 1566-1572, 2006.

  1456. Measuring the near-field of extra-ordinary transmission through a periodic hole-array
    M.W. Docter; I.T. Young; O.M. Piciu; A. Bossche; P.F.A. Alkemade; P.M. van den Berg; Y. Garini;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 6195, 2006.

  1457. A Solid-state 2-D Wind Sensor (U-SP-2-I-ICT)
    K.A.A. Makinwa; J.H. Huijsing; A. Hagedoorn;
    Lecture Notes in Computer Science,
    Issue 4017, pp. 1-8, 2006.

  1458. CMOS Transconductors With Nearly Constant Input Ranges Over Wide Tuning Intervals
    Paolo Bruschi; Fabio Sebastiano; Nicol? Nizza;
    {IEEE} Trans. Circuits Syst. {II},
    Volume 53, Issue 10, pp. 1002 - 1006, October 2006. DOI: 10.1109/TCSII.2006.882126
    Keywords: ... CMOS integrated circuits;bipolar integrated circuits;circuit tuning;0.35 micron;CMOS transconductors;bipolar-CMOS-DMOS process;common-mode range;differential input range;low-frequency filters;prototype circuit;tuning intervals;Chemical sensors;Circuit optimization;Circuit simulation;Low pass filters;MOSFETs;Mirrors;Optimization methods;Stability;Transconductors;Voltage;CMOS transconductor;constant input range;low-frequency filters.

    Abstract: ... Three different bias strategies aimed to reduce the effect of tuning on either the differential input range or the common-mode range of triode-region CMOS transconductors are presented. The method is applied to an original transconductor topology that is optimized to produce ultralow Gm values. A prototype circuit, which was designed with the 0.35-µm bipolar-CMOS-DMOS (BCD6) process of STMicroelectronics, is presented. The effectiveness and limitations of the method are characterized by means of electrical simulations

  1459. A new hand-held microsystem architecture for biological analysis
    Piedade, Moisés; Sousa, Leonel Augusto; de Almeida, Teresa Mendes; Germano, José; da Costa, Bertinho d'Andrade; Lemos, João Miranda; Freitas, Paulo Peixeiro; Ferreira, Hugo A; Cardoso, Filipe Arroyo;
    IEEE Transactions on Circuits and Systems I: Regular Papers,
    Volume 53, Issue 11, pp. 2384-2395, 2006.

  1460. CONTROLO 2006
    Costa, BA; Lemos, JM; Piedade, MS; Sousa, L; Almeida, T; Germano, J; Freitas, P; Ferreira, H; Cardoso, F;
    2006.

  1461. Magnetoresistive DNA chips based on ac field focusing of magnetic labels
    Ferreira, HA; Cardoso, Filipe Arroyo; Ferreira, R; Cardoso, S; Freitas, PP;
    Journal of applied physics,
    Volume 99, Issue 8, pp. 08P105, 2006.

  1462. Diode/magnetic tunnel junction cell for fully scalable matrix-based biochip
    Cardoso, Filipe Arroyo; Ferreira, HA; Conde, JP; Chu, V; Freitas, PP; Vidal, D; Germano, J; Sousa, L; Piedade, MS; Costa, BA; others;
    Journal of Applied Physics,
    Volume 99, Issue 8, pp. 08B307, 2006.

  1463. CE-MICROMODULE (STW project) Progress report (November 2005-April 2006) (U-SP-2-I-ICT)
    A. Bossche;
    STW, Volume STW , 2006.

  1464. NanoNed/Nanoimpuls (Periodic proggress report) (U-SP-2-I-ICT)
    O.M. Piciu;
    Nanoned, Volume Nanoned , 2006.

  1465. NANONED-Periodic progress report (U-SP-2-I-ICT)
    A. Bossche;
    Nanoned/Nanoimpuls, Volume Nanoned , 2006.

  1466. Water-content meter (U-SP-2-I-ICT)
    Z.Y. Chang;
    STW, , 2006.

  1467. MAX9922/9923T/H/F document control preliminary datasheet,topology review, schematics, plots and action item updates (U-SP-2-I-ICT)
    J.F. Witte;
    MAXIM, Volume MAXIM , 2006.

  1468. Shape Vision (STW project) Final report (U-SP-2-I-ICT)
    A. Bossche;
    STW, Volume STW , 2006.

  1469. A Smart Universal Sensor-Interface Chip, Progress report 1 (U-SP-2-I-ICT)
    Q. Jia; X. Li; G.C.M. Meijer;
    STW, Volume STW report , 2006.

  1470. CE-MICROMODULE (STW project) progress report (may 2006-November 2006) (U-SP-2-I-ICT)
    A. Bossche;
    STW, Volume STW , 2006.

  1471. A Smart Universal Sensor-Interface Chip,Progress report 2 (U-SP-2-I-ICT)
    Q. Jia; X. Li; G.C.M. Meijer;
    STW, Volume STW report 2 , 2006.

  1472. Dedicated smart admittance-sensor systems-progress report 9/17-01-2006 (U-SP-2-I-ICT)
    B.P. Iliev; G.C.M. Meijer;
    STW, Volume STW report , 2006.

  1473. Shape Vision (STW project) progress report (November 2005-April 2006) (U-SP-2-I-ICT)
    A. Bossche;
    STW, Volume STW , 2006.

  1474. Dedicated smart admittance-sensor systems-progress report-part 3 9/17-01-2006 (U-SP-2-I-ICT)
    Z.Y. Chang; B.P. Iliev; G.C.M. Meijer;
    STW, Volume STW report , 2006.

  1475. Dedicated smart admittance-sensor systems-progress report-part 2 9/17-01-2006 (U-SP-2-I-ICT)
    Z.Y. Chang; B.P. Iliev; G.C.M. Meijer;
    STW, Volume STW report , 2006.

  1476. Precision temperature sensors in CMOS technology
    M. A. P. Pertijs; J. H. Huijsing;
    Springer Science \& Business Media, , 2006.
    Abstract: ... The low cost and direct digital output of CMOS smart temperature sensors are important advantages compared to conventional temperature sensors. This book addresses the main problem that nevertheless prevents widespread application of CMOS smart temperature sensors: their relatively poor absolute accuracy. Several new techniques are introduced to improve this accuracy. The effectiveness of these techniques is demonstrated using three prototypes. The final prototype achieves an inaccuracy of ±0.1 °C over the military temperature range, which is a significant improvement in the state of the art. Since smart temperature sensors have been the subject of academic and industrial research for more than two decades, an overview of existing knowledge and techniques is also provided throughout the book.

    document

  1477. Silicon compatible Fabry-perot optical filters for mid-IR microspectrometer applications (U-SP-2-I-ICT)
    A. Emadi; G. de Graaf; R.F. Wolffenbuttel; J.H.G. Correia;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2006.

  1478. In-vivo Blood Characterization system (U-SP-2-I-ICT)
    B.P. Iliev; G.C.M. Meijer; A.M. pop Gheorghe;
    G Milton; KR Fowler (Ed.);
    IEEE, , pp. 1781-1785, 2006.

  1479. An 118dB CT IF-to-Baseband/spl sigma//spl Delta/Modulator for AM/FM/IBOC Radio Receivers (U-SP-2-I-ICT)
    P.G.R. Silva; K.A.A. Makinwa; J.H. Huijsing; L.J. Breems; R. Roovers;
    s.n. (Ed.);
    IEEE, , pp. 1-10, 2006.

  1480. Experimental verification of Rarefied Gas Squeezed-Film Damping Models used in MEMS (U-SP-2-I-ICT)
    L. Mol; R.F. Wolffenbuttel; L.A. Rocha; E. Cretu;
    s.n. (Ed.);
    s.l., , pp. 1-4, 2006.

  1481. A CMOS temperature-to-frequency converter with an inaccuracy of 0.5 degrees C from -40 to 105 degrees C (U-SP-2-I-ICT)
    K.A.A. Makinwa; M.F. Snoeij;
    s.n. (Ed.);
    IEEE, , pp. 1141-1150, 2006.

  1482. A CMOS Imager with Column-Level ADC Using Dynamic Column FPN Reduction (U-SP-2-I-ICT)
    M.F. Snoeij; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    s.l., , pp. 498-499, 2006.

  1483. "Smart FPA's : Are They Worth the Effort?" (U-SP-2-I-ICT)
    J. Leijtens; A.J.P. Theuwissen; J.P. Magnan;
    s.n. (Ed.);
    SPIE, , pp. 1-5, 2006.

  1484. A CMOS Imager with column-level ADC using dynamic column FPN reduction (U-SP-2-I-ICT)
    M.F. Snoeij; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    s.l., , pp. 2014-2023, 2006.

  1485. Column-parallel single-slope ADCS for CMOS image sensors (U-SP-2-I-ICT)
    M.F. Snoeij; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2006.

  1486. Continuous Electrodeless Dielectrophoretic Separation in a Circular Channel (U-SP-2-I-ICT)
    L. Zhang; F. Tatar; P. Turmezei; J. Bastemeijer; J.R. Mollinger; O.M. Piciu; A. Bossche;
    {Francis E.H. tay, Miao Jianmin}; {John Bergstrom, Ciprian Iliesc} (Ed.);
    s.l., , pp. 527-532, 2006.

  1487. Continuous Electrokinetic Separation by Electrodeless Dielectrophoresis (U-SP-2-I-ICT)
    L. Zhang; F. Tatar; J.R. Mollinger; A. Bossche;
    {Peter Enoksson} (Ed.);
    Eurosensors, , pp. 1-4, 2006.

  1488. Design, simulation and fabrication of a dielectrophoretic separation device using topographic channel structure (U_SP_2_I_IC_T)
    L. Zhang; F. Tatar; J.R. Mollinger; A. Bossche;
    IEEE, , pp. 435-438, 2006.

  1489. CMOS Image Sensors for Ambient Intelligence (U-SP-2-I-ICT)
    A.J.P. Theuwissen; M.F. Snoeij; X. Wang; R. Padma kumar rao; E. Bodegom;
    {S. Mukherjee} (Ed.);
    Springer, , pp. 125-150, 2006.

  1490. Fabrication of an in Infrared microspectrometer using evanescent wave sensing (U-SP-2-I-ICT)
    G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2006.

  1491. Rarefied gas squeezed-film damping measurements at constant knudsen numbers (U-SP-2-I-ICT)
    L. Mol; R.F. Wolffenbuttel; L.A. Rocha; E. Cretu;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2006.

  1492. Squeezed-film damping measurements at constant knudsen numbers (U-SP-2-I-ICT)
    L. Mol; R.F. Wolffenbuttel; L.A. Rocha; E. Cretu;
    R.F. Wolffenbuttel (Ed.);
    s.l., , pp. 121-124, 2006.

  1493. On-off control for full-gap positioning of parallel-plate electrostatic MEMS (U-SP-2-I-ICT)
    L. Mol; R.F. Wolffenbuttel; L.A. Rocha; E. Cretu;
    s.n. (Ed.);
    s.l., , pp. 1-4, 2006.

  1494. Pull-In Time Based High Sensitivity Accelermeter With Adjustable Rane and Resolution (U-SP-2-I-ICT)
    L. Mol; R.F. Wolffenbuttel; L.A. Rocha; E. Cretu;
    R.F. Wolffenbuttel (Ed.);
    MME, , pp. 129-132, 2006.

  1495. "Influence of Terrestrial Cosmic rays on Solid-state Image Sensors" (U-SP-2-I-ICT)
    A.J.P. Theuwissen;
    In Spektrum Forum,
    Fachhochschule, pp. -, 2006.

  1496. Some properties of a room temperature THz detection array
    G. Pandraud; V.P. Iordanov; I. Kasalynas; A.J.L. Adam; T.O. Klaassen; J.N. Hovenier; P.M. Sarro;
    In s.n. (Ed.), Some properties of a room temperature THz detection array,
    SPIE, pp. 1-7, 2006.

  1497. Sigma Delta ADC with accurate dynamic reference for temperature sensing and voltage monitoring (U-SP-2-I-ICT)
    N. Saputra; J.H. Huijsing; K.A.A. Makinwa;
    In s.n. (Ed.), Sigma Delta ADC with accurate dynamic reference for temperature sensing and voltage monitoring,
    ProRISC, pp. 1-5, 2006.

  1498. Catheter-based measurement system for blood analysis in vivo (U-SP-2-I-ICT)
    B.P. Iliev; A.M. pop Gheorghe; G.C.M. Meijer;
    In s.l. (Ed.), Proceedings of the The Sense of Contact VIII,
    STW, pp. 1-6, 2006.

  1499. Investigations in the noise performance of the DEM SC Instrumentation Amplifier (U-SP-2-I-ICT)
    Guijie Wang; A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sense of Contact VIII,
    STW, pp. 1-6, 2006.

  1500. On the performance of an active shielding for grounded capacitive sensors (U-SP-2-I-ICT)
    F. Reverter; X. Li; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sense of Contact VIII,
    STW, pp. 1-6, 2006.

  1501. Particle sorter in Microchannels (U-SP-2-I-ICT)
    A. Meilan-Garcia; O.M. Piciu; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Proceedings of the Sense of Contact VIII,
    STW, pp. 1-5, 2006.

  1502. Fabrication Technology of Periodical Nano-cavities for Bio-analytical Applications (U-SP-2-I-ICT)
    O.M. Piciu; M. van der KrogtC; P.M. Sarro; A. Bossche; M.W. Docter;
    In s.n. (Ed.), Proceedings of the Sense of Contact VIII,
    STW, pp. 1-6, 2006.

  1503. Design and measurement of a switched -capacitor dynamic-element-matching amplifier (U-SP-2-I-ICT)
    A. Heidary; G.C.M. Meijer;
    In s.n (Ed.), Proceedings of the Sense of Contact,
    Sense of Contact 2009, pp. 1-6, 2006.

  1504. Technique for plug dispersion compensation in moving field capillary electrophoresis application (U_SP_2_I_IC_T)
    F. Tatar; L. Zhang; J. Bastemeijer; P. Turmezei; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Proceedings of the 5th IEEE Conference on Sensors 2006,
    IEEE, pp. 109-112, 2006.

  1505. A CMOS chopper offset-stabilized opamp (U-SP-2-I-ICT)
    J.F. Witte; K.A.A. Makinwa; J.H. Huijsing;
    In Ch Enz; M Declercq; Y Leblebici (Ed.), Proceedings of the 32nd European Solid-State Circuits Conference, 2006. ESSCIRC 2006,
    IEEE, pp. 360-363, 2006.

  1506. "Fixed-pattern Noise induced by Transmission Gate in Pinned 4T CMOS Image Sensor Pixels" (U-SP-2-I-ICT)
    X. Wang; Rao padmakumar; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings of the 38th European solid-state device research conference (ESSDERC),
    ESSDERC, pp. 331-334, 2006.

  1507. A new methodology in power estimation in CMOS combinational circuits at logic level (U-SP-2-I-ICT)
    A.L. Aita; L.L. De Oliveira; J.P. Dos Santos Martins;
    In s.n. (Ed.), Proceedings of the 48th IEEE International Midwest Symposium On Circuits And Systems (MWSCAS2005),
    IEEE, pp. 1127-1130, 2006.

  1508. A readout circuit foir capacitive biosensors with integrated SAR A/D conversion
    C.P.L. van Vroonhoven; D. Rocha; M.J. Vellekoop; C. Nohammer;
    In s.n. (Ed.), Proceedings of the 2006 ISCAS Conference,
    IEEE, pp. 1-4, 2006. geen affiliatie TUD.

  1509. Noise analysis of continuous-time /spl sigma// spl delta/modulators with switched-capacitor feedback DAC (U-SP-2-I-ICT)
    P.G.R. Silva; K.A.A. Makinwa; J.H. Huijsing; L.J. Breems;
    In s.n. (Ed.), Proceedings of the 2006 ISCAS Conference,
    IEEE, pp. 1-4, 2006.

  1510. An 8-bit, 4-Gsample/s Track-and-Hold in a 67GHz fT SiGe BiCMOS technology (U-SP-2-I-ICT)
    D. Smola; J.H. Huijsing; K.A.A. Makinwa; H. van der Ploeg; M. Vertregt; L.J. Breems;
    In Ch Enz; M Declercq; Y Leblebici (Ed.), Proceedings of the 32nd European Solid-State Circuits Conference, 2006. ESSCIRC 2006,
    IEEE, pp. 1-4, 2006.

  1511. A 110dB dynamic range continuous-time IF-to-baseband sigma-delta modulator for AM/FM/IBOC receivers (U-SP-2-I-ICT)
    P.G.R. Silva; L.J. Breems; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), Proceedings of the 2006 ISCAS Conference,
    IEEE, pp. 1-4, 2006.

  1512. Integrated interface for high-ohmic voltage generating sensors (U-SP-2-I-ICT)
    Q. Jia; X. Li; G.C.M. Meijer;
    In DE Dimitrov (Ed.), Proceedings Electronics ET2006,
    Electronics ET, pp. 1-6, 2006.

  1513. Fabrication and Optical Characterization of Nano-hole Arrays for Molecular Detections (U-SP-2-I-ICT)
    O.M. Piciu; M. van der KrogtC; P.M. Sarro; A. Bossche; M.W. Docter;
    In s.n. (Ed.), Proceedings of the 10th MicroTAS Conference 2006,
    MicroTAS, pp. 666-669, 2006.

  1514. Characterisation of a liquid-level measurement system based on a grounded capacitive sensor (U-SP-2-I-ICT)
    F. Reverter; X. Li; G.C.M. Meijer;
    In DE Dimitrov (Ed.), Proceedings Electronics ET 2006,
    Electronics ET, pp. 1-5, 2006.

  1515. Optical Nano-hole Arrays for Molecular Recognition and Detection (U-SP-2-I-ICT)
    O.M. Piciu; M. van der KrogtC; P.M. Sarro; A. Bossche; M.W. Docter;
    In s.n. (Ed.), Proceedings of the Asia-Pacific Conference of Transducers and Micro-Nano Technology¿APCOT 2006,
    apcot, pp. 1-4, 2006.

  1516. Nano-hole arrays in thin Au/Pd film on glass for high speed molecular analysis
    O. Piciu; M. van der Krogt; M. Docter; P.M. Sarro; A. Bossche;
    In S. Lee; M Esashi (Ed.), Proc. IEEE Sensors 2006 Conference,
    IEEE, pp. 608-611, 2006.

  1517. Plug dispersion compensation technique in moving field capillary electrophoresis applications (U-SP-2-I-ICT)
    F. Tatar; P. Turmezei; L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Plug dispersion compensation technique in moving field capillary electrophoresis applications,
    Eurosensors, pp. 1-4, 2006.

  1518. Noise Optimization of Integrated Switched-Capacitor Front-Ends with wide Dynamic Range (U-SP-2-I-ICT)
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Noise Optimization of Integrated Switched-Capacitor Front-Ends with Wide Dynamic Range,
    ProRISC, pp. 1-4, 2006.

  1519. High Throughput Continuous Separation by Electrodeless Dielectrophoresis (U-SP-2-I-ICT)
    L. Zhang; F. Tatar; A. Bossche;
    In T Kitamori; S Hasabe; F Hiroyuki (Ed.), 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, (MicroTas, 2006),
    CBMS, pp. 909-911, 2006.

  1520. High-performance analog delays: Surpassing Bessel-Thomson by Pade-approximated Gaussians
    S.M. Kashmiri; S.A.P. Haddad; W.A. Serdijn;
    In s.n. (Ed.), Circuits and Systems, 2006. ISCAS 2006. IEEE International symposium on,
    IEEE, pp. 2349-2353, 2006.

  1521. "Column-parallel Single Slope ADCs for CMOS Image Sensors" (U-SP-2-I-ICT)
    M.F. Snoeij; A.J.P. Theuwissen; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), Eurosensors XX 2006,
    Eurosensors, pp. 284-287, 2006.

  1522. Sigma Delta ADC with Accurate Dynamic Reference for Temperature Sensing and Voltage Monitoring
    N. Saputra; M. A. P. Pertijs; K. A. A. Makinwa; J. H. Huijsing;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    The Netherlands, pp. 80‒84, November 2006.

  1523. Aberrations of a stretchable diffraction grating (U-SP-2-I-ICT)
    S. Grabarnik; A.N. Simonov; G.V. Vdovin;
    In s.n. (Ed.), Proceedings of the EOS Topical Meeting on Micro-Optics, Diffractive Optics and Optical MEMS (TOM 4) Part of the EOS Annual Meeting 2006,
    s.l., pp. 144-145, 2006.

  1524. "Random Telegraph Signal in CMOS Image Sensor Pixels" (U-SP-2-I-ICT)
    X. Wang; Rao padmakumar; A. Mierop; A.J.P. Theuwissen;
    In s.n. (Ed.), Proceedings of the Electron Devices Meeting, 2006. IEDM '06. International,
    IEEE, pp. 115-118, 2006.

  1525. Moving Field Capillary Electrophoresis With Plug Dispersion Compensation (U-SP-2-I-ICT)
    F. Tatar; P. Turmezei; L. Zhang; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Proceedings of the Asia-Pacific Conference of Transducers and Micro-Nano Technology¿APCOT 2006,
    apcot, pp. 1-4, 2006.

  1526. Development and Investigation of a Switched-Capacitor Dynamic-Element-Matching Amplifier (U-SP-2-I-ICT)
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings Electronics ET2006,
    Electronics ET, pp. 183-188, 2006.

  1527. Selection of Capacitive Sensor interface for high-precision application
    S.V. Ulyashyn; S. Nihtianov;
    In s.n. (Ed.), Proceedings Electronics ET2006,
    Electronics ET, pp. 204-209, 2006.

  1528. A fully integrated very low frequency single-ended Gm-C filter based on a novel transconductor
    Monica Schipani; Fabio Sebastiano; Nicol? Nizza; Paolo Bruschi;
    In Proc. IEEE Ph.D. Research in Microelectronics and Electronics,
    Otranto, Italy, pp. 25 - 28, June12--15 2006. DOI: 10.1109/RME.2006.1689887
    Keywords: ... CMOS integrated circuits;low-pass filters;network topology;0.35 micron;1.5 to 15 Hz;60 muW;CMOS transconductor topology;low pass filter;second order fully integrated filter;single-ended Gm-C filter;single-ended filter architectures;Capacitance;Capacitors;Frequency;Low pass filters;MOSFETs;Mechanical sensors;Noise reduction;Temperature sensors;Topology;Transconductors.

    Abstract: ... A second order fully integrated low pass filter with cut-off frequency variable in the range 1.5-15 Hz is presented. The filter is based on a recently proposed CMOS transconductor topology combining G m values of the order of a few nS with large input ranges and suitability to single-ended filter architectures. The performances are validated by simulations performed on a prototype designed with the 0.35 µm BCD6 process of STMicroelectronics. In particular, a dynamic range of 70 dB and power dissipation of 60 µW have been obtained with a corner frequency of 1.5 Hz

  1529. Characterisation and modelling of a magnetic biosensor
    Almeida, TM; Piedade, MS; Cardoso, Filipe Arroyo; Ferreira, HA; Freitas, PP;
    In 2006 IEEE Instrumentation and Measurement Technology Conference Proceedings,
    IEEE, pp. 2007-2012, 2006.

  1530. Microsystem for biological analysis based on magnetoresistive sensing
    Germano, J; Piedade, MS; Sousa, L; Almeida, TM; Lopes, P; Cardoso, Filipe Arroyo; Ferreira, HA; Freitas, PP;
    In XVIII International Measurement Confederation (IMEKO) World Congress,
    2006.

  1531. Magnetoresistive biosensor modelling for biomolecular recognition,”
    Almeida, TM; Piedade, MS; Lopes, PC; Sousa, L; Germano, J; Cardoso, Filipe Arroyo; Ferreira, HA; Freitas, PP;
    In XVIII International Measurement Confederation World Congress,
    2006.

  1532. Measurements and modelling of a magnetoresistive biosensor
    Almeida, TM; Piedade, MS; Germano, J; Lopes, PC; Sousa, L; Cardoso, Filipe Arroyo; Ferreira, H; Freitas, P;
    In 2006 IEEE Biomedical Circuits and Systems Conference,
    IEEE, pp. 41-44, 2006.

  1533. Temperature modelling of a biochip for DNA analysis
    Costa, BA; Lemos, JM; Piedade, MS; Sousa, L; Almeida, T; Germano, J; Freitas, P; Ferreira, H; Cardoso, Filipe Arroyo;
    In 2006 14th Mediterranean Conference on Control and Automation,
    IEEE, pp. 1-5, 2006.

  1534. Determination of biological expression signals on a new handheld biochip-based microsystem
    Lopes, P AC; Germano, J; Almeida, TM; Sousa, L; Piedade, MS; Cardoso, Filipe Arroyo; Ferreira, HA; Freitas, PP;
    In 2006 IEEE Biomedical Circuits and Systems Conference,
    IEEE, pp. 57-60, 2006.

  1535. Scalable Magnetoresistive Biochips For Biomolecular recognition
    Cardoso, Filipe Arroyo; Ferreira, H; Freitas, P; Conde, J; Chu, V; Germano, J; Sousa, L; Piedade, M; Martins, V; Fonseca, L; others;
    In 2006 IEEE International Magnetics Conference (INTERMAG),
    IEEE, pp. 249-249, 2006.

  1536. Chopper chopper-stabilized instrumentation and operational amplifiers (U_SP_2_I_IC_T)
    J.H. Huijsing; B. Shahi;
    2006.

  1537. A Servo Format for Disks, Preferably Hard Disks (U-SP-2-I-ICT)
    K.A.A. Makinwa; W. Bergmans;
    2006.

  1538. Chopper chopper-stabilized instrumentation and operational amplifiers
    J.H. Huijsing; B. Shahi;
    2006.

  1539. Oscillator based on thermal diffusion (U_SP_2_I_IC_T)
    K.A.A. Makinwa; J.F. Witte;
    2006.

  1540. Device for determining the direction and speed of an air flow
    J.H. Huijsing; Jan Verhoeven;
    2006.

  1541. Ultrasound 3D Positioning System for Surgical Instruments (U-SP-2-I-ICT)
    F. Tatar;
    PhD thesis, Delft University of Technology, 2006.

  1542. Methods and Sensors for accurate Wavefront Measurements
    O.A. Soloviev;
    PhD thesis, Delft University of Technology, 2006.

  1543. Integrated Particle ShapeSensor
    P. Turmezei;
    PhD thesis, Delft University of Technology, 2006.

  1544. "Over-sampled single-bit DAC in a wide band, cascaded continuous-time sigma-delta ADC (U-SP-2-I-ICT)
    S.M. Kashmiri;
    PhD thesis, Delft University of Technology, 2006.

  1545. A novel concept for a mid-field microscope
    M.W. Docter; I.T. Young; V.G. Kutchoukov; A. Bossche; P.F.A. Alkemade; Y. Garini;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 5703, pp. 118-126, 2005.

  1546. Pre-distorted sinewave-driven parallel-plate electrostatic actuator for harmonic displacement
    G. de Graaf; L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 15, pp. 103-108, 2005.

  1547. Thermo-electric characterization of APCVD PolySi/sub 0.7/Ge/sub 0.3/ for IC-compatible fabrication of integrated lateral Peltier elements
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    IEEE Transactions on Electron Devices,
    Volume 52, Issue 5, pp. 1014-1025, 2005.

  1548. Multiplexing control of a multichannel piezoelectric deformable mirror
    H. Song; A.N. Simonov; G.V. Vdovin;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 6018, pp. F-1-F-12, 2005.

  1549. Phase extraction from three and more interferograms registered with different unknown wavefront tilts
    O.A. Soloviev; G.V. Vdovin;
    Optics Express,
    Volume 13, Issue 10, pp. 3743-3753, 2005.

  1550. Fabrication of nanofluidic devices in glass with polysilicon electrodes
    V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; Y. Garini; L.K. Nanver; A. Bossche;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 123-124, pp. 602-607, 2005. 100% EI.

  1551. Measuring and interpreting the mechanical-thermal noise spectrum in a MEMS
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 15, pp. 30-38, 2005.

  1552. A lab-on-a-chip for spectrophotometric analysis of biological fluids
    G. Minas; R.F. Wolffenbuttel; J.H. Correia;
    Lab On a Chip: microfluidic and nanotechnologies for chemistry, biology, and bioengineering,
    Volume 5, Issue 11, pp. 1303-1309, 2005.

  1553. Subjective adaptive correction of the abberations of the human eye
    G.V. Vdovin; M. Loktev; A.N. Simonov; V. Kijko; S. Volkov;
    Journal of Optical Technology,
    Volume 72, Issue 3, pp. 284-286, 2005.

  1554. MEMS-based mechanical spectrum analyzer
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 54, Issue 3, pp. 1260-1265, 2005.

  1555. Hartmann-Shack test with random masks for modal wavefront reconstruction
    O.A. Soloviev; G.V. Vdovin;
    Optics Express,
    Volume 13, Issue 23, pp. 9570-9584, 2005.

  1556. MEMS-based optical mini- and microspectrometers for the visible and infrared spectral range
    R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 15, pp. 145-152, 2005.

  1557. C- and L-band planar delay interferometer for DPSK decoders
    J. Gamet; G. Pandraud;
    IEEE Photonics Technology Letters,
    Volume 17, Issue 6, pp. 1217-1219, 2005.

  1558. A SU-8 fluidic microsystem for biological fluids analysis
    D.J. Ribeiro; G. Minas; P.B. Turmezei; R.F. Wolffenbuttel; J.H. Correia;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 123-124, pp. 77-81, 2005.

  1559. Spectral performance of a micromachined infrared spectrum analyzer in silicon
    S.H. Kong; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 54, Issue 1, pp. 264-267, 2005.

  1560. Field matching Y-branch for low loss power splitter
    J. Gamet; G. Pandraud;
    Optics Communications,
    Volume 248, Issue 4-6, pp. 423-429, 2005.

  1561. Electroosmotic flow analysis of a branched U-turn nanofluidic device
    G.O.F. Parikesit; A.P. Markesteijn; V.G. Kutchoukov; O.M. Piciu; A. Bossche; J. Westerweel; Y. Garini; I.T. Young;
    Lab On a Chip: microfluidic and nanotechnologies for chemistry, biology, and bioengineering,
    Issue 5, pp. 1067-1074, 2005.

  1562. Adaptive correction of human-eye aberrations in a subjective feedback loop
    G.V. Vdovin; M. Loktev; A.N. Simonov; V. Kijko; S. Volkov;
    Optics Letters,
    Volume 30, Issue 7, pp. 795-797, 2005.

  1563. A low-cost and accurate interface for four-electrode conductivity sensors
    X. Li; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 54, Issue 6, pp. 2433-2437, 2005.

  1564. Light scanner based on a viscoelastic stretchable grating
    A.N. Simonov; G.V. Vdovin; O. Akhazar-Mehr;
    Optics Letters,
    Volume 30, Issue 9, pp. 949-951, 2005.

  1565. The noise performance of a high-speed capacitive-sensor interface based on a relaxation oscillator and a fast counter
    M. Gasulla; X. Li; G.C.M. Meijer;
    IEEE Instrumentation and Measurement Magazine,
    Volume 54, Issue 5, pp. 1934-1940, 2005.

  1566. Nanoliter array advances: miniaturized, high-speed PCR sensing & control
    I.T. Young; V.P. Iordanov; H.R.C. Dietrich; A. Bossche;
    IEEE Sensors Journal,
    pp. 2919-2922, 2005.

  1567. Study of ic compatible on-chip thermoelectric coolers
    S.H. Kong; D.D.L. Wijngaards; R.F. Wolffenbuttel;
    Japanese Journal of Applied Physics. Part 2, Letters & Express Lettres,
    Volume 44, Issue 7B, pp. 5736-5739, 2005.

  1568. Optical detection of electrokinetically manipulated single molecules in a nanofluidic chip
    G.O.F. Parikesit; V.G. Kutchoukov; A. Bossche; I.T. Young; Y. Garini;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 5718, pp. 133-141, 2005.

  1569. Optical detection of single molecules in nanofluidic chips
    G.O.F. Parikesit; V.G. Kutchoukov; W. van Oel; G.F. Liqui Lung; A. Bossche; I.T. Young; Y. Garini;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 5718, pp. 133-141, 2005. phpub 39.

  1570. A CMOS smart temperature sensor with a 3σ inaccuracy of ±0.1°C from -55°C to 125°C
    M. A. P. Pertijs; K. A. A. Makinwa; J. H. Huijsing;
    IEEE Journal of Solid-State Circuits,
    Volume 40, Issue 12, pp. 2805‒2815, December 2005. (JSSC Best Paper Award). DOI: 10.1109/JSSC.2005.858476
    Abstract: ... A smart temperature sensor in 0.7 μm CMOS is accurate to within ±0.1°C (3σ) over the full military temperature range of -55°C to 125°C. The sensor uses substrate PNP transistors to measure temperature. Errors resulting from nonidealities in the readout circuitry are reduced to the 0.01°C level. This is achieved by using dynamic element matching, a chopped current-gain independent PTAT bias circuit, and a low-offset second-order sigma-delta ADC that combines chopping and correlated double sampling. Spread of the base-emitter voltage characteristics of the substrate PNP transistors is compensated by trimming, based on a calibration at one temperature. A high trimming resolution is obtained by using a sigma-delta current DAC to fine-tune the bias current of the bipolar transistors.

  1571. A CMOS smart temperature sensor with a 3σ inaccuracy of ±0.5°C from -50°C to 120°C
    M. A. P. Pertijs; A. Niederkorn; X. Ma; B. McKillop; A. Bakker; J. H. Huijsing;
    IEEE Journal of Solid-State Circuits,
    Volume 40, Issue 2, pp. 454‒461, February 2005. DOI: 10.1109/JSSC.2004.841013
    Abstract: ... A low-cost temperature sensor with on-chip sigma-delta ADC and digital bus interface was realized in a 0.5 μm CMOS process. Substrate PNP transistors are used for temperature sensing and for generating the ADC's reference voltage. To obtain a high initial accuracy in the readout circuitry, chopper amplifiers and dynamic element matching are used. High linearity is obtained by using second-order curvature correction. With these measures, the sensor's temperature error is dominated by spread on the base-emitter voltage of the PNP transistors. This is trimmed after packaging by comparing the sensor's output with the die temperature measured using an extra on-chip calibration transistor. Compared to traditional calibration techniques, this procedure is much faster and therefore reduces production costs. The sensor is accurate to within ±0.5°C (3σ) from -50°C to 120°C.

  1572. Shape vision - progress report (October 2004-March 2005)
    A. Bossche;
    STW, , 2005.

  1573. Tracking system for art applications, fifth report, project DET 5100
    R.N. Aguilar Cardenas;
    STW, Volume STW Report , 2005.

  1574. CE-micromodule - progress report (December 2004-May 2005)
    A. Bossche;
    STW, , 2005.

  1575. Tracking system for art applications, sixth report, project DET 5100
    R.N. Aguilar Cardenas;
    STW, Volume STW Report , 2005.

  1576. Dedicated smart admittance-sensor systems - Progress report 8/30.06.2005
    B.P. Iliev; G.C.M. Meijer;
    Technologiestichting STW, Volume STW Project, DMR.5294 , 2005. nog niet eeder opgevoerd JH.

  1577. Shape vision - progress report (June 2005-November 2005)
    A. Bossche;
    STW, , 2005.

  1578. A smart universal sensor interface chip
    C. Guan; X. Li; G.C.M. Meijer;
    STW, , 2005.

  1579. Single molecule detection in nanochannels
    O.M. Piciu; A. Bossche;
    STW, , 2005.

  1580. CE-micromodule - progress report (May 2005-October 2005)
    A. Bossche;
    STW, , 2005.

  1581. Single molecule detection
    O.M. Piciu; A. Bossche;
    STW, , 2005.

  1582. Experimental verification of squeezed-film damping models for MEMS
    L.A. Rocha; L. Mol; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    s.n., , pp. 244-247, 2005. Editor onbekend JH.

  1583. Low-Cost Epoxy Packaging of CMOS Hall-effect Compasses (U-SP-2-I-ICT)
    J. van der Meer; F.R. Riedijk; E.J. van Kampen; K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    IEEE, , pp. 65-68, 2005.

  1584. Low-cost epoxy packaging of CMOS Hall-effect compasses (U-SP-2-I-ICT)
    J. van der Meer; K.A.A. Makinwa; J.H. Huijsing; F.R. Riedijk; E.J. van Kampen;
    s.n. (Ed.);
    IEEE, , pp. 65-68, 2005.

  1585. Design of an infrared microspectrometer using total internal reflection
    G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    s.n., , pp. 1-4, 2005. Editor onbekend JH.

  1586. Algorithmic foundation of the Clockwork Orange Robot Soccer Team
    P.P. Jonker; B. van Driel; V.G. Kutchoukov; B. Terwijn;
    M. Erdmann; D. Hsu; M. Overmars; {van der Stappen}, A.F. (Ed.);
    Springer Verlag, , pp. 17-26, 2005.

  1587. Full-range dynamic positioning of parallel-plate electrostatic actuators
    L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    s.n., , pp. 280-283, 2005. Editor onbekend JH.

  1588. Full-range stable operation of parallel-plate electrostatic actuators
    L.A. Rocha; L. Mol; E. Cretu; R.F. Wolffenbuttel;
    {R Reus}, de; {S Bouwstra} (Ed.);
    IEEE, , pp. 1-4, 2005. Editor onbekend.

  1589. High-resolution capacitive measurement of microstructure displacement using coherent detection
    L. Mol; G. de Graaf; L.A. Rocha; R.F. Wolffenbuttel;
    {R Reus}, de; {S Bouwstra} (Ed.);
    IEEE, , pp. 1-4, 2005. Editor onbekend.

  1590. 3-D modeling and simulation of fluidic microsystems for biological fluids analysis
    G. Minas; MH.J.M. Barros; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    s.n., , pp. 342-345, 2005. Editor onbekend JH.

  1591. On-chip integrated CMOS optical detection microsystem for spectrophotometric analyses in biological microfluidic systems
    G. Minas; D.J. Ribeiro; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    IEEE, , pp. 1133-1138, 2005. Editor onbekend JH.

  1592. A temperature sensor based on a thermal oscillator (U-SP-2-I-ICT)
    K.A.A. Makinwa; J.F. Witte;
    s.n. (Ed.);
    IEEE, , pp. 1149-1152, 2005.

  1593. High-resolution low-cost ultrasonic tracking system for human-interface systems
    R.N. Aguilar Cardenas; H.M.M. Kerkvliet; G.C.M. Meijer;
    s.n. (Ed.);
    IEEE, , pp. 878-882, 2005. Editor onbekend JH.

  1594. A 2nd order thermal sigma-delta modulator for flow sensing (U-SP-2-I-ICT)
    K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    IEEE, , pp. 549-552, 2005.

  1595. A fully-integrated CMOS Hall sensor with a 4.5uT, 3s offset spread for compass applications (U-SP-2-I-ICT)
    J. van der Meer; K.A.A. Makinwa; J.H. Huijsing;
    s.n. (Ed.);
    s.l., , pp. 246-247-195,6, 2005.

  1596. Technology and operation of a liquid crystal modal wavefront corrector
    M. Loktev; G.V. Vdovin;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine, Proceedings of the 4th international workshop,
    Springer, pp. 25-34, 2005.

  1597. A quantized analog delay for an ir-UWB quadrature downconversion autocorrelation receiver
    S. Bagga; L. Zhang; W.A. Serdijn; J.R. Long; E. Busking;
    In s.n. (Ed.), ICU 2005 - IEEE International Conference on Ultra-Wideband,
    IEEE, pp. 328-332, 2005. Editor onbekend, WPM.

  1598. A 1.8 V 3.2 /spl mu/W comparator for use in a CMOS imager column-level single-slope ADC
    M.F. Snoeij; A.J.P. Theuwissen; J.H. Huijsing;
    In s.n. (Ed.), ISCAS 2005, IEEE International Symposium on Circuits and Systems, 2005,
    IEEE, pp. 6162-6165, 2005. Editor onbekend, WPM.

  1599. A fully integrated CMOS hall sensor with a 3.65/spl mu/T 3/spl sigma/ offset for compass applications
    J. van der MeerC; F.R. Riedijk; E.A. van Kampen; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), ISSCC 2005 conference digest,
    IEEE, pp. 246-247, 2005. geen editors-sb.

  1600. Multiplexing Control of a Multichannel Piezoelectric Deformable Mirror (U-SP-2-I-ICT)
    H. Song; A.N. Simonov; G.V. Vdovin;
    In {Wenhan Jiang} (Ed.), Multiplexing Control of a Multichannel Piezoelectric Deformable Mirror,
    SPIE, pp. 1-10, 2005.

  1601. Y-nano X-micro Technologies: nanometric optical control
    D.W. de Lima Monteiro; F.P. Honorato; J.A. Ferreira; O.A. Soloviev; G.V. Vdovin; M. Loktev;
    In s.n. (Ed.), Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show,
    s.n., pp. 475-478, 2005.

  1602. CMOS integrator based lock-in pixel for heterodyne interferometry
    O.A. Soloviev; G.V. Vdovin;
    In JF Lopez; FV Fernandez; JM Lopez-Villegas; {de la Rosa}, JM (Ed.), VLSI Circuits and Systems II,
    The International Society for Optical Engineering, pp. 945-952, 2005.

  1603. Systematic performance comparision of Bessel Thomson vs Pade approximated delay filters (U-SP-2-I-ICT)
    S.M. Kashmiri; S.A.P. Haddad; W.A. Serdijn;
    In s.n. (Ed.), Systematic performance comparision of Bessel Thomson vs Pade approximated delay filters,
    ProRISC, pp. 1-5, 2005.

  1604. Particle separation by dielectrophoresis
    L. Zhang; F. Tatar; P. Turmezei; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), SAFE f4b9ffddfab04085879c224259517fcb ProRISC,
    Dutch Technology Foundation, pp. 186-191, 2005. Editor onbekend JH/STW.

  1605. High- and low-frequency model of blood impedance
    Z.Y. Chang; B.P. Iliev; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sense of Contact 7 workshop,
    Sense of Contact 2009, pp. 1-6, 2005. Editor onbekend JH.

  1606. Ultra high-speed sampling track-and-hold amplifier in SiGe Bi-CMOS technology
    D. Smola; H. van der Ploeg; M. Vertregt; L. Breems; J.H. Huijsing; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005),
    Technologiestichting STW, pp. 295-298, 2005. Editor onbekend, WPM/STW.

  1607. SU-8 in microfluidic platform design
    P. Turmezei; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Proceedings of the Sense of Contact 7 workshop,
    Sense of Contact 2009, pp. 1-6, 2005. Editor onbekend JH.

  1608. Numerical simulation of electrokinetic force fields for particle manipulation and sorting in branched-u-turn 2D-like nanofluidic device
    G.O.F. Parikesit; A.P. Markesteijn; O.M. Piciu; V.G. Kutchoukov; J. Westerweel; A. Bossche; Y. Garini; I.T. Young;
    In s.n. (Ed.), Proceedings of the 9th International Conference on Miniaturized Systems for Chemistry and Life Sciences,
    TRF, pp. 841-843, 2005. Editor onbekend JH.

  1609. In-vitro and in-vivo plasma resistance measurement system
    B.P. Iliev; Z.Y. Chang; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sense of Contact 7 workshop,
    Sence of Contact, pp. 1-5, 2005. Editor onbekend JH.

  1610. 3D particle shape sensor utilizing electro-orientation
    P. Turmezei; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Proceedings of the 9th International conference on miniaturized systems for chemistry and life sciences,
    MicroTAS, pp. 1111-1114, 2005. editors onbekend -sb.

  1611. Systematic power reduction and performance analysis of mismatch limited ADC design
    P.C.S. Scholtens; D. Smola; M. Vertregt;
    In s.n. (Ed.), Proceedings of the 2005 International Symposium on Low Power Electronics and Design (ISPLED),
    ACM, pp. 78-83, 2005. Editor onbekend, WPM.

  1612. The effect of switched biasing on 1/f noise in CMOS imager front-ends
    M.F. Snoeij; A.J.P. Theuwissen; J.H. Huijsing;
    In s.n. (Ed.), Proceedings of the 2005 IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors,
    s.n., pp. 68-71, 2005. Editor onbekend, WPM.

  1613. A low-power column-parallel 12-bit ADC for CMOS imagers
    M.F. Snoeij; A.J.P. Theuwissen; J.H. Huijsing;
    In s.n. (Ed.), Proceedings of the 2005 IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors,
    s.n., pp. 169-172, 2005. Editor onbekend, WPM.

  1614. A Two-dimensional Capacitive Human-detection system (U-SP-2-I-ICT)
    G.C.M. Meijer; R.N. Aguilar Cardenas; H.M.M. Kerkvliet;
    In s.n. (Ed.), Proceedings of the 14th International Scientific and Applied Science Conference ELECTRONICS - ET2005,
    s.n., pp. 1-6, 2005.

  1615. An improved electrode structure for capacitive single-axis tilt sensors (U-SP-2-I-ICT)
    G.C.M. Meijer; H.M.M. Kerkvliet;
    In s.n. (Ed.), Proceedings of the 14th International Scientific and Applied Science Conference ELECTRONICS - ET2005,
    s.n., pp. 1-4, 2005.

  1616. Liquid crystal wavefront corrector on silicon
    M. Loktev; G.V. Vdovin; L.K. Nanver;
    In JG McInerney; G Farrell; DM Denieffe; LP Barry; HS Gamble; PJ. Hughes; A Moore (Ed.), Proceedings of SPIE, Opto-Ireland 2005: optoelectronics, photonic devices, and optical networks,
    SPIE - The International Society for Optical Engineering, pp. 195-202, 2005. 50/50 EI/ECTM-sb.

  1617. Modal wavefront correction with liquid crystals: different options
    M. Loktev; G.V. Vdovin; N.A. Klimov; S.P. Kotova; A. Naumov;
    In LC Chien (Ed.), Proceedings of SPIE, Emerging Liquid Crystal Technologies,
    SPIE - The International Society for Optical Engineering, pp. 163-170, 2005.

  1618. A high resolution IF-to-baseband continious-time ¿¿ modulator for AM/FM/IBOC radio receiver
    P.G.R. Silva; L.J. Breems; K.A.A. Makinwa; J.H. Huijsing;
    In s.n. (Ed.), Proceedings of ProRISC 2005, 16th Annual Workshop on Circuits, Systems and Signal Processing,
    Dutch Technology Foundation, pp. 289-294, 2005. editors onbekend, sb.

  1619. A 2nd order sigma-delta ADC as an interface circuit for SOI accelerometers
    Y. Yu; S. Butselaar; K.A.A. Makinwa;
    In s.n. (Ed.), Proceedings of ProRISC 2005, 16th Annual Workshop on Circuits, Systems and Signal Processing,
    Dutch Technology Foundation, pp. 316-319, 2005. Editor onbekend, JH/STW.

  1620. Estimation of the total error of modal wavefront reconstruction with Zernike polynomials and Hartmann-Shack test
    O.A. Soloviev; G.V. Vdovin;
    In W Jiang (Ed.), Proceedings of SPIE,
    SPIE, pp. D-1-D-12, 2005.

  1621. Subjective adaptive correction of the abberations of the human eye
    G.V. Vdovin; M. Loktev; A.N. Simonov; S.P. Hong; V. Kiyko; S. Volkov;
    In FD Murtagh (Ed.), Proceedings of SPIE,
    SPIE, pp. 154-163, 2005.

  1622. ATTO-Liter Periodical Cavities for Optical BIO-Molecular Detection
    O.M. Piciu; M. van der KrogtC; M.W. Docter; P.M. Sarro; A. Bossche;
    In s.n. (Ed.), Proceedings of IEEE Sensors, 2005,
    s.l., pp. 452-456, 2005. NEO.

  1623. An interference rejection filter for an ultra-wideband quadrature downconversion autocorrelation receiver
    S. Bagga; S.A.P. Haddad; K. van Hartingsveldt; SS. Lee; W.A. Serdijn; J.R. Long;
    In s.n. (Ed.), Proceedings of IEEE international symposium on circuits and systems (ISCAS 2005),
    IEEE, pp. 5357-5360, 2005. Editor onbekend JH.

  1624. Electro-orientation of micro-particles in an on-chip flow cytometer
    P. Turmezei; J.R. Mollinger; A. Bossche;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIX, Proceedings,
    IEEE, pp. 1-4, 2005.

  1625. The fabrication of optical hole-arrays for use in the atto-liter titer plate device for single molecule detection
    O.M. Piciu; M. van der KrogtC; M.W. Docter; P.M. Sarro; A. Bossche;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIX,
    IEEE, pp. 1-4, 2005.

  1626. Single-axis tilt sensor systems
    H.M.M. Kerkvliet; G.C.M. Meijer;
    In S Tabakov (Ed.), Electronics, ET'2004 Proceedings of the conference,
    Technical University of Sofia, pp. 9-14, 2005.

  1627. Two-frequency method for measuring the position of surgical tools with ¿m precision
    F. Tatar; J. Bastemeijer; J.R. Mollinger; A. Bossche;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIX, proceedings,
    IEEE, pp. -, 2005. Editor onbekend.

  1628. Extending the limits of a capacitive soil-water-content measurement
    Z.Y. Chang; B.P. Iliev; F. de Groot; G.C.M. Meijer;
    In s.n. (Ed.), IEEE, pp. 376-379, 2005. Editor onbekend JH.

  1629. Fabrication of biochemical nanodevices with self aligned electrodes
    V.G. Kutchoukov; G.O.F. Parikesit; Y. Garini; J. Slabbekoorn; L.K. Nanver;
    In s.n. (Ed.), Proceedings of APCOT MNT,
    apcot, pp. -, 2005. phpub 38 / 50/50 EI/ECTM-sb.

  1630. Capactive human-detection systems with auto-calibration
    R.N. Aguilar Cardenas; M.C. Roelofsz; H.M.M. Kerkvliet; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the 9th World Multi-Conference on Systemics, Cybernetics and Informatic, WMSCI 2005,
    ISSS, pp. 1-7, 2005. Editor onbekend JH.

  1631. CMOS technology in Hartmann-Shack wavefront sensing
    D.W. de Lima Monteiro; T. Nirmaier;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine: Proceedings of the 4th international workshop,
    Springer, pp. 163-176, 2005.

  1632. Interferometer-based adaptive optical system: performance simulations
    O.A. Soloviev; G.V. Vdovin;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine: Proceedings of the 4th international workshop,
    Springer, pp. 91-99, 2005.

  1633. Prime microlens arrays for Hartmann-Shack sensors: an economical fabrication technology
    D.W. de Lima Monteiro; O. Akhzar Mehr; G.V. Vdovin;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine: Proceedings of the 4th international workshop,
    Springer, pp. 197-206, 2005.

  1634. Control of a thermal deformable mirror: Correction of a static disturbance with limited sensor information
    M. de Boer; K.J.G. Hinnen; M.H.G. Verhaegen; P.R. Fraanje; G.V. Vdovin; N. Doelman;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine - Proceedings of the 4th International Workshop,
    Springer, pp. 61-71, 2005.

  1635. Wireless control of an LC adaptive lens
    G.V. Vdovin; M. Loktev; X. Zhang;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine, Proceedings of the 4th international workshop,
    Springer, pp. 45-51, 2005.

  1636. Deformable mirrors with thermal actuators
    G.V. Vdovin; M. Loktev;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine, Proceedings of the 4th international workshop,
    Springer, pp. 17-24, 2005.

  1637. Resistive and capacitive single-axis tilt-sensor system
    H.M.M. Kerkvliet; G.C.M. Meijer;
    In s.n. (Ed.), 2005 sensors proceedings vol.II,
    AMA Service GmbH, pp. 243-247, 2005. Editor onbekend JH.

  1638. Electronics and signal-processing techniques for smart sensor systems
    G.C.M. Meijer;
    In s.n. (Ed.), 2005 sensors proceedings vol.II,
    AMA Service GmbH, pp. 79-84, 2005. Editor onbekend JH.

  1639. Measurements techniques for smart sensor interfaces implemented in CMOS technology
    G.C.M. Meijer; X. Li;
    In s.n. (Ed.), 2005 6th International Conference on ASIC Proceedings,
    IEEE, pp. 1-4, 2005. Editor onbekend JH.

  1640. Trade-off in the design of speed measurements based on ultrasonic doppler effect
    R.N. Aguilar Cardenas; H.M.M. Kerkvliet; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the Sense of Contact 7 workshop,
    Sense of Contact 2009, pp. 1-7, 2005. Editor onbekend JH.

  1641. Micromachined membrane deformable mirrors
    G.V. Vdovin;
    In U Wittrock (Ed.), Adaptive optics for industry and medicine, Proceedings of the 4th international workshop,
    Springer, pp. 3-8, 2005.

  1642. Phase extraction from three and more interferograms registered with different unknown tilts
    O.A. Soloviev; G.V. Vdovin;
    In FD Murtagh (Ed.), Proceedings of SPIE,
    SPIE, pp. 269-275, 2005.

  1643. Optimizing the Design of a Switched-Capacitor Dynamic-Element-Matching Amplifier
    A. Heidary; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of the annual Scientific and Applied Science conference Electronics 2005,
    Electronics ET, pp. 9-14, 2005.

  1644. A tunable CMOS transconductor for ultra-low Gm with wide differential input voltage range
    Paolo Bruschi; Fabio Sebastiano; Nicol? Nizza; Massimo Piotto;
    In Proc. European Conference on Circuit Theory and Design,
    Cork, Ireland, pp. III/337 - III/3, August28--September2 2005. DOI: 10.1109/ECCTD.2005.1523129
    Abstract: ... A differential input, single ended output transconductor with gm in the range 0.5-5 nS is presented. The circuit uses a source coupled pair operated in triode region. The need of providing a fixed common mode input voltage, which afflicts circuits based on the same principle, is removed by adopting an original topology. The results of simulations based on the 0.35 µm BCD6 process of STMicroelectronics are presented.

  1645. Precision interface electronics for a CMOS smart temperature sensor
    M. A. P. Pertijs; J. H. Huijsing;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 4‒pp, October 2005. invited paper. DOI: 10.1109/ICSENS.2005.1597856
    Abstract: ... This paper describes the interface electronics of a CMOS smart temperature sensor that is accurate to plusmn0.1degC over the full military temperature range. The sensor is fabricated in a standard CMOS process. Substrate bipolar transistors are used as temperature-sensitive devices. Precision interface electronics are used to make the most of their temperature characteristics. While the sensor is trimmed at one temperature, its accuracy over the full temperature range depends on the initial accuracy of the electronics. Dynamic offset cancellation and dynamic element matching are used to eliminate offset and gain errors. These techniques are combined with a sigma-delta ADC to obtain a readily usable digital temperature reading

  1646. A CMOS temperature sensor with a 3σ inaccuracy of ±0.1°C from -55°C to 125°C
    M. Pertijs; K. Makinwa; J. Huijsing;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 238‒596, February 2005. ({ISSCC} 2005 {Jack} {Kilby} Award for Outstanding Student Paper). DOI: 10.1109/ISSCC.2005.1493957
    Abstract: ... A smart temperature sensor is accurate to within ±0.1°C (3σ) over the full military temperature range of -55°C to 125°C. This 5x improvement is achieved using DEM, a current-gain independent PTAT bias circuit, and a low-offset ΔΣ ADC combining chopping and CDS. The sensor is fabricated in 0.7μm 2M1P CMOS with 4.5mm² area and draws 75μA.

  1647. Architecture of a portable system based on a biochip for DNA recognition
    Piedade, M; Sousa, L; Germano, J; Lemos, J; Costa, B; Freitas, P; Ferreira, H; Cardoso, Filipe Arroyo; Vidal, D;
    In Proc. of the XX conference on Design of Circuits and Integrated Systems,
    2005.

  1648. Werkwijze voor het vervaardigen van nanokanalen en nanokanalen daarmee vervaardigd
    V.G. Kutchoukov; A. Bossche; F.P.J. Laugere; W. van der Vlist;
    2005. TUD / 25%/75% ECTM/EI, sb; 1024033; TUD / 25%/75% ECTM/EI, sb.

  1649. Magneetveldsensor, drager van een dergelijke magneetveldsensor en een kompas, voorzien van een dergelijke magneetveldsensor.
    J. van der MeerC; F.R. Riedijk; P.C. de Jong; A.W. van Herwaarden;
    2005. Xensor Integration B.V. te Delfgauw; 1025089; Xensor Integration B.V. te Delfgauw.

  1650. Oscillator based on thermal diffusion (U-SP-2-I-ICT)
    K.A.A. Makinwa; J.F. Witte;
    2005.

  1651. Method of manufacturing nanochannels and nanochannels thus fabricated
    V.G. Kutchoukov; A. Bossche; F.P.J. Laugere; W. van der Vlist;
    2005. TUD - 25%/75% ECTM/EI, sb; WO 2005/012159 A1; TUD - 25%/75% ECTM/EI, sb.

  1652. Method of performing an assay, apparatus therefor, and a method of manufacturing and apparatus
    V.P. Iordanov; P.M. Sarro; R.F. Wolffenbuttel; M.J. Vellekoop;
    2005. Technische Universiteit Delft - 25/75 ECTM/EI, sb; US2005059158; Technische Universiteit Delft - 25/75 ECTM/EI, sb.

  1653. Device for determining the direction and speed of an air flow
    H.J.B. Verhoeven; J.H. Huijsing; A. Hagedoorn; B.W. van Oudheusden;
    2005. Mierij Meteo b.v.; ES2225885T; Mierij Meteo b.v..

  1654. Inrichting voor het uitvoeren van een reactie
    V.P. Iordanov; J. Bastemeijer; A. Bossche; P.M. Sarro;
    2005. TUD 25/75 ECTM/EI-sb; 1024578; TUD 25/75 ECTM/EI-sb.

  1655. Circuit, including feedback, for reducing DC-offset and noise produced by an amplifier
    A. Bakker; J.H. Huijsing;
    2005. Koninklijke Philips Electronics N.V.; US6911864; Koninklijke Philips Electronics N.V..

  1656. Microfluidic device for carrying out a reaction
    V.P. Iordanov; J. Bastemeijer; A. Bossche; P.M. Sarro;
    2005. TUD - 25/75 ECTM/EI, sb; WO2005037433; TUD - 25/75 ECTM/EI, sb.

  1657. Dynamics and Nonlinearities of the Electro-mechanical coupling in Inertial MEMS
    L.A. Rocha;
    PhD thesis, Delft University of Technology, 2005.

  1658. Modal wavefront correctors based on nematic liquid crystals
    M. Loktev;
    PhD thesis, Delft University of Technology, 2005.

  1659. Modal Wavefront Correctors Based on Nematic Liquid Crystals
    M. Loktev;
    PhD thesis, Delft University of Technology, 2005.

  1660. Dynamics and nonlinearities of the electro-mechanical coupling in inertial mems
    L.A. Machado da Rocha;
    PhD thesis, Delft University of Technology, 2005.

  1661. Investigation in DEM SC-instrumentation amplifier
    Guijie Wang; A. Heidary;
    Technical report, 2005.

  1662. Illumination source identification using a CMOS optical microsystem
    G. de Graaf; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 53, Issue 2, pp. 238-242, 2004. ed.is niet bekend.

  1663. Systematic design exploration of Delta-Sigma ADCs
    O. Bajdechi; G.G.E. Gielen; J.H. Huijsing;
    IEEE Transactions on Circuits and Systems Part 1: Fundamental Theory and Applications,
    Volume 51, Issue 1, pp. 86-95, 2004.

  1664. Fabrication of nanofluidic devices using glass-to-glass anodic bonding
    V.G. Kutchoukov; F. Laugere; W. van der Vlist; L. Pakula; Y. Garini; A. Bossche;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 114, Issue 2-3, pp. 521-527, 2004. phpub 18.

  1665. Analysis and analitycal modeling of static pull-in with application to MEMS-based voltage reference and process monitoring
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    IEEE Journal of Microelectromechanical Systems,
    Volume 13, Issue 2, pp. 342-354, 2004.

  1666. The Meyer-Neldel rule for diodes in forward bias
    R. Widenhorn; M. Fitzgibbons; E. Bodegom;
    Journal of Applied Physics,
    Volume 96, Issue 12, pp. 7379-7382, 2004. ed.is niet bekend.

  1667. Interlocking mechanical and fluidic interconnections for microfluidic circuits boards
    B.L. Gray; S.D. Collins; R.L. Smith;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 112, pp. 18-24, 2004.

  1668. Dispersion resulting from wide passband shape in 50-GHz-spaced wavelength router
    J. Gamet; G. Pandraud; A.P. Vonsovici;
    Optical Engineering,
    Volume 43, Issue 7, pp. 1474-1475, 2004.

  1669. Compensation of temperature effects on the pull-in voltage of microstructures
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 115, pp. 351-356, 2004.

  1670. An array of Fabry-Perot optical-channels for biological fluids analysis
    G. Minas; J.C. Ribeiro; J.S. Martins; R.F. Wolffenbuttel; J.H. Correia;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 115, pp. 362-367, 2004. ed. is niet bekend.

  1671. Electrical and magnetic properties of NdTiO3+delta
    E. Connolly; R.J.D. Tilley; A. Arulraj; R. Gundakaram; C.N.R. Rao;
    Journal of Alloys and Compounds,
    Volume 388, Issue 1, pp. 153-157, 2004. ed. is niet bekend.

  1672. State-of-the-art in integrated optical microspectrometers
    R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 53, Issue 1, pp. 197-202, 2004. ed. is niet bekend.

  1673. High resolution microscopy implemented by photon-plasmon interaction
    Y. Garini; V.G. Kutchoukov; P.F.A. Alkemade; I.T. Young;
    Cytometry,
    Volume 59A, Issue 1, pp. 101-101, 2004. phpub 42(?).

  1674. Integrated Coulter counter based on 2-dimensional liquid aperture control
    J.H. Nieuwenhuis; F. Kohl; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers,
    Volume 102, Issue 1, pp. 44-50, 2004. ed. is niet bekend.

  1675. Electro-deposition for high-quality conformal resist layers for MEMS
    C.M.A. Ashruf; L.D.M. van den Brekel; G.J. Bertens; E. Boellaard; P.N. Pham; M. Heschel;
    Advances in electronics manufacturing technology,
    Volume 1, Issue 19, pp. 1-4, 2004. ed. is niet bekend.

  1676. On-line electrical impedance measurement for monitoring blood viscosity during on-pump heart surgery
    G.A.M. Pop; T.L.M. de Backer; M. de Jong; P.C. Struijk; L. Moraru; Z.Y. Chang; H.G. Goovaerts; C.J. Slager; AJJC bogers;
    European Surgical Research: clinical and experimental surgery,
    Volume 36, Issue 5, pp. 259-265, 2004.

  1677. Single-chip micro-thermostat applying both active heating and active cooling
    D.D.L. Wijngaards; G. de Graaf; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 110, pp. 187-195, 2004. ed. is niet bekend.

  1678. Optical CMOS sensor system for detection of light sources
    G. de Graaf; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 110, pp. 77-81, 2004. ed. is niet bekend.

  1679. Nano-array advances: Light measurement & temperature control
    I.T. Young; V.P. Iordanov; A.R. Kroon; H.R.C. Dietrich; L.R. van den Doel; A. Bossche; P.M. Sarro; G. van DedemWK;
    Cytometry,
    Volume 59A, Issue 1, pp. 53-53, 2004. phpub 31.

  1680. Comparison between bulk micromachined and CMOS X-ray detectors
    J.G. Rocha; C.G.J. Schabmueller; N.F. Ramos; S. Lanceros-Mendez; M.V. Moreira; A.G.R. Evans; R.F. Wolffenbuttel; J.H. Correia;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 115, pp. 215-220, 2004. ed. is niet bekend.

  1681. Blood electrical impedance closely matches whole blood viscosity as parameter of hemorheology and inflammation
    G.A.M. Pop; W.J. Hop; L. Moraru; M. Jagt; J. Quak; D. Dekkers; Z.Y. Chang; F.J. Gijsen; DJ Duncker; C.J. Slager;
    Applied Rheology: Fliessverhalten steuern,
    Volume 13, Issue 6, pp. 305-312, 2004.

  1682. Operation modes of a liquid-crystal modal wave-front corrector
    M. Loktev; G.V. Vdovin; I.R. Guralnik;
    Applied Optics,
    Volume 43, Issue 11, pp. 2209-2225, 2004.

  1683. Catheter-based impedance measurements in the right atrium for continuously monitoring hematocrit and estimating blood viscosity changes; an in vivo feasibility study in swine
    G.A.M. Pop; Z.Y. Chang; C.J. Slager; B.J. Kooij; E.D. van Deel; L. Moraru; J. Quak; G.C.M. Meijer; DJ Duncker;
    Biosensors and Bioelectronics,
    Volume 19, Issue 12, pp. 1685-1693, 2004.

  1684. Through-wafer interconnect technology for silicon
    V.G. Kutchoukov; M. Shikida; J.R. Mollinger; A. Bossche;
    Journal of Micromechanics and Microengineering,
    Volume 14, pp. 1029-1036, 2004.

  1685. Full characterisation of pull-in in single-sided clamped beams
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 110, pp. 301-309, 2004.

  1686. CMOS X-rays detector array based on scintillating light guides
    J.G. Rocha; N.F. Ramos; S. Lanceros-Mendez; R.F. Wolffenbuttel; J.H. Correia;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 110, pp. 119-123, 2004. ed. is niet bekend.

  1687. Ultralow-loss 1 X 8 splitter based on field matching Y junction
    J. Gamet; G. Pandraud;
    IEEE Photonics Technology Letters,
    Volume 16, Issue 9, pp. 2060-2062, 2004.

  1688. Toward the development of a three-dimensional midfield microscope
    Y. Garini; V.G. Kutchoukov; A. Bossche; P.F.A. Alkemade; M.W. Docter; P.W. Verbeek; L. van VlietJ; I.T. Young;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 5327, pp. 115-122, 2004. phpub 13.

  1689. Biological microsystems for measuring uric acid in biological fluids
    G. Minas; J.S. Martins; J.C. Ribeiro; R.F. Wolffenbuttel; J.H. Correia;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 110, pp. 33-38, 2004. ed. is niet bekend.

  1690. Filter-protected photodiodes for high-throughput enzymatic analysis
    V.P. Iordanov; J. Bastemeijer; R. Ishihara; P.M. Sarro; A. Bossche; M.J. Vellekoop;
    IEEE Sensors Journal,
    Volume 4, Issue 5, pp. 584-588, 2004. 50-50 ECTM-EI.

  1691. Behavioural analysis of the pull-in dynamic transition
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 14, pp. S37-S42, 2004.

  1692. Precision temperature measurement using CMOS substrate PNP transistors
    M. A. P. Pertijs; G. C. M. Meijer; J. H. Huijsing;
    IEEE Sensors Journal,
    Volume 4, Issue 3, pp. 294‒300, June 2004. DOI: 10.1109/jsen.2004.826742
    Abstract: ... This paper analyzes the nonidealities of temperature sensors based on substrate pnp transistors and shows how their influence can be minimized. It focuses on temperature measurement using the difference between the base-emitter voltages of a transistor operated at two current densities. This difference is proportional to absolute temperature (PTAT). The effects of series resistance, current-gain variation, high-level injection, and the Early effect on the accuracy of this PTAT voltage are discussed. The results of measurements made on substrate pnp transistors in a standard 0.5μm CMOS process are presented to illustrate the effects of these nonidealities. It is shown that the modeling of the PTAT voltage can be improved by taking the temperature dependency of the effective emission coefficient into account using the reverse Early effect. With this refinement, the temperature can be extracted from the measurement data with an absolute accuracy of ±0.1°C in the range of -50 to 130°C.

  1693. 2nd/3rd mothly report Cavendish Kinetics
    E. Connolly;
    s.n., , 2004.

  1694. Dedicated smart admittance-sensor systems
    B.P. Iliev; G.C.M. Meijer;
    Delft University of Technology, , 2004.

  1695. Research overview of 'Solid-state image sensors in deep sub-micron CMOS technology
    X. Wang; A.J.P. Theuwissen;
    Delft University of Technology, Volume STW-project 5869 , 2004.

  1696. absolute interferometric surface profiling with 1 A accuracy - progress report june-november 2004
    O.A. Soloviev;
    s.n., Volume DMR.5189 , 2004.

  1697. Tracking system for art applications
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    s.n., Volume STW project DET 5100 , 2004.

  1698. Monthly report Cavendish
    E. Connolly;
    Delft University of Technology, , 2004.

  1699. Noise reduction in CMOS image sensors; semi-annual progress report no. 4
    M.F. Snoeij;
    Delft University of Technology, , 2004. Confidential.

  1700. High speed, wide band, digital RF receiver front-end system
    D. Smola; M. Vertregt; H. van der Ploeg; L.J. Breems; J.H. Huijsing; K.A.A. Makinwa; P.G.R. Silva; J.M.V. Misker; Q Sandifort; A Emmerik; {van Donselaar}, B;
    STW, Volume Progress report , 2004.

  1701. Nano impulse progress report May 2004; optical titre plate for molecular detection
    O.M. Piciu; A. Bossche; P.M. Sarro;
    s.n., , 2004.

  1702. Tracking system for art applications - Third report
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    Delft University of Technology EI/ECTM, Volume STW DTE 5100 , 2004.

  1703. CK 4th monthly report
    E. Connolly;
    s.n., , 2004.

  1704. DMR.5189 progress report
    O.A. Soloviev;
    s.n., , 2004.

  1705. Dedicated smart admittance-sensor systems - progress report 7
    B.P. Iliev; G.C.M. Meijer;
    TU Delft Electronic Instrumentation Laboratory, , 2004.

  1706. Nanoscale elecrophoresis: a new technology for biomolecular applications
    V.G. Kutchoukov; A. Bossche;
    FOM, , 2004.

  1707. High speed, wide band, digital RF receiver front-end system
    D. Smola; M. Vertregt; H. van der Ploeg; L.J. Breems; J.H. Huijsing; K.A.A. Makinwa; P.G.R. Silva; J.M.V. Misker; Q Sandifort; A Emmerik; {van Donselaar}, B;
    STW, Volume Progress report , 2004.

  1708. Noise reduction in CMOS image sensors; semi-annual progress report 5
    M.F. Snoeij;
    Delft University of Technology, , 2004. Confidential.

  1709. CK 5th monthly report
    E. Connolly;
    s.n., , 2004.

  1710. Study, modelling and charactirization of silicon surface, interface and bulk effects on the response of a CMOS image sensor in 0.18-micrometer technology
    P. Ramachandra Rao; A.J.P. Theuwissen;
    Technologiestichting STW, Volume STW-project 5869 , 2004. nog niet eeder opgevoerd JH.

  1711. A full-system dynamic model for complex MEMS structures
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Nano Science and Technology Institute, , pp. 203-206, 2004. ed. is niet bekend.

  1712. A MCM-based microsystem for biological fluids analysis by optical absorption
    G. Minas; J.C. Ribeiro; G. de Graaf; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    IEEE, , pp. 223-226, 2004. niet eerder opgevoerd -sb.

  1713. Analytical model for pull-in time low-Q MEMS devices
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    Nanoscience and Technology Intitute, , pp. 271-274, 2004. ed. is niet bekend.

  1714. Quadrature oscillator with pre-distorted waveforms for application in MEMS-based mechanical spectrum analyser
    G. de Graaf; L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    M Steveart; CL Claeys (Ed.);
    IEEE, , pp. 407-410, 2004.

  1715. Harmonic displacement of a parallel-plate electrostatic actuator using a pre-distorted sine wave oscillator
    G. de Graaf; L. Mol; L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n., , pp. 53-56, 2004. ed. is niet bekend.

  1716. Mechanical-thermal and 1/f noise in MEMS devices
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n., , pp. 100-103, 2004. ed. is niet bekend.

  1717. Pull-in dynamics; analysis and modeling of the transitional regime
    L.A. Rocha; E. Cretu; R.F. Wolffenbuttel;
    IEEE, , pp. 249-252, 2004. ed. is niet bekend.

  1718. A systematic approach for sensor bridge linearisation and readout
    G. de Graaf; R.F. Wolffenbuttel;
    S Demidenko; R Ottoboni; D Petri; V Piuri; {Chong Tad Weng}, D (Ed.);
    IEEE, , pp. 1551-1555, 2004.

  1719. Circuit for readout and linearisation of sensor bridges
    G. de Graaf; R.F. Wolffenbuttel;
    M Steveart; CL Claeys (Ed.);
    IEEE, , pp. 151-154, 2004.

  1720. A SU-8 fluidic microsystem for biological fluids analysis
    J.C. Ribeiro; G. Minas; P.B. Turmezei; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    Eurosensors, , pp. 1-4, 2004. Nog niet eerder opgevoerd JH.

  1721. MST-innovatie: kopen, trekken of duwen?
    G.C.M. Meijer;
    s.n., , pp. 1-2, 2004.

  1722. A quadrature downconversion autocorrelation receiver architecture for UWB
    SS. Lee; S. Bagga; W.A. Serdijn;
    s.n., , pp. 1-5, 2004. ed. isniet bekend.

  1723. Light scanner based on stretchable grating
    A.N. Simonov; G.V. Vdovin; O. Akhzar-Mehr;
    In s.n. (Ed.), MME 2004; Proceedings of the 15th micromechanics Europe workshop,
    s.n., pp. 272-275, 2004. Editor onbekend JH - Niet eerder opgevoerd JH.

  1724. Particle size discrimination with a liquid aperture Coulter counter
    J.H. Nieuwenhuis; P. Svasek; P.M. Sarro; M.J. Vellekoop;
    In Palombie (Ed.), Proceedings of Eurosensors XVIII,
    University of Rome, pp. 317-320, 2004.

  1725. Nanofluidic devices in glass with Poly-Si electrodes
    V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; L.K. Nanver; A. Bossche;
    In s.n. (Ed.), SAFE 337f38aeae344dd3ad3d46be444f765b ProRISC 2004; Proceedings of semiconductor advances for future electronics,
    STW Technology Foundation, pp. 764-768, 2004.

  1726. Sensorized nanoliter reactor chamber for DNA multiplication
    V.P. Iordanov; B.P. Iliev; V. Joseph; J. Bastemeijer; P.M. Sarro; I.T. Young; G. van DedemWK; M.J. Vellekoop;
    In D. Rocha; P.M. Sarro; M.J. Vellekoop (Ed.), Proceedings of IEEE Sensors, 2004,
    IEEE, Piscataway, pp. 229-232, 2004. niet eerder opgevoerd 50/50 EI/ECTM.

  1727. Integrated nanoliter sensors reactor chamber for DNA multiplication - thermal characterization
    V.P. Iordanov; B.P. Iliev; J. Bastemeijer; A. Bossche; P.M. Sarro; I.T. Young; G. van DedemWK; M.J. Vellekoop;
    In G.C.M. Meijer (Ed.), The sense of contact VI; sensor workshop for industry and science,
    s.n., pp. 1-6, 2004. verdeling?.

  1728. Integrated nanoliter sensors reactor chamber for PCR analysis - from the idea to a complete system
    B.P. Iliev; V.P. Iordanov; J. Bastemeijer; A. Bossche; P.M. Sarro; I.T. Young; G. van DedemWK; M.J. Vellekoop;
    In G.C.M. Meijer (Ed.), The sense of contact VI,
    s.n., pp. 1-6, 2004. phpub 32.

  1729. The effect of time-constant in a thermopile-based IR detector
    A. Atghiaee; G.C.M. Meijer; C. Guan; H.M.M. Kerkvliet;
    In G.C.M. Meijer (Ed.), The sense of contact VI; sensor workshop for industry and science,
    s.n., pp. 1-6, 2004.

  1730. Twin nanochannels for fluidic applications
    V.G. Kutchoukov; O.M. Piciu; J.R. Mollinger; A. Bossche;
    In G.C.M. Meijer (Ed.), The sense of contact VI; Sensor workshop for industry and science,
    s.n., pp. 1-5, 2004.

  1731. Integrated sensors for nanoliter bioluminescence and fluorescence bio-chemical analysis
    V.P. Iordanov; B.P. Iliev; J. Bastemeijer; A. Bossche; P.M. Sarro; I.T. Young; H.R.C. Dietrich; L.R. van den Doel; G. van DedemWK; A.R. Kroon; M.J. Vellekoop;
    In G.C.M. Meijer (Ed.), The sense of contact VI,
    s.n., pp. 1-6, 2004. phpub 34.

  1732. Microfluidic platform design from photosensitive epoxy for .-TAS
    P.B. Turmezei; J.R. Mollinger; A. Bossche;
    In The sense of contact 6: where industry meets science workshop sensortechnology,
    s.n., pp. 1-4, 2004. ed. is niet bekend.

  1733. Nanochannels in Glass with Poly-Silicon Electrodes
    V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; Y. Garini; L.K. Nanver; A. Bossche;
    In s.n. (Ed.), Technical Digest of Eurosensors XVIII,
    s.n., pp. 32-35, 2004. phpub 40.

  1734. Ultrasound system for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; A. Bossche;
    In The sense of contact 6; workshop sensortechnology 2004,
    STW Technology Foundation, pp. 1-4, 2004. editor onbekend.

  1735. An ultrasound system based on phase switch method for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), Technical Digest of Eurosensors XVIII,
    s.n., pp. 1005-1008, 2004.

  1736. An impedance-measurement system for electrical characerization of rockwool substrates
    B.P. Iliev; G.C.M. Meijer;
    In SIcon2004; Proceedings of the 2004 sensors for industry conference,
    IEEE, pp. 46-49, 2004. ed. is niet bekend.

  1737. The effect of non-idealities in CMOS chopper amplifiers
    J.F. Witte; K.A.A. Makinwa; J.H. Huijsing;
    In SAFE c23891d54bc448e7886feafd1793b771 ProRISC 2004; Proceedings of the program for research on integrated systems and circuits,
    STW Technology Foundation, pp. 616-619, 2004. ed. is niet bekend.

  1738. Motion of particles in in a particle shape detector
    P.B. Turmezei; J.R. Mollinger; A. Bossche;
    In SAFE 7454339981d840bfbfb87060e9d6802e ProRISC 2004; Proceedings of semiconductor advances for future electronics,
    STW Technology Foundation, pp. 1-4, 2004. ed. is niet bekend.

  1739. Electronic interface for thermopile infra-red detectors
    A. Atghiaee; G.C.M. Meijer;
    In SAFE 51dce1c4d4de41c5a2765125ca24b5e2 ProRISC 2004; Proceedings of the program for research on integrated systems and circuits,
    STW Technology Foundation, pp. 457-460, 2004. ed. is niet bekend.

  1740. Titanium nitride for MEMS hotplates
    J.F. Creemer; P.M. Sarro; M. Laros; H. Schellevis; T. Nathoeni; L.A. Steenweg; V. Svetchnikov; H.W. Zandbergen;
    In W Krautschneider; C Claeys (Ed.), SAFE 2004; Semiconductor advances for future electronics,
    STW Technology Foundation, pp. 742-746, 2004.

  1741. Electrical characterization of wetted substrates
    B.P. Iliev; M.D. Verweij; Z.Y. Chang; G.C.M. Meijer;
    In SAFE 09dcb9aaa96a4f04b679e224b65b2df8 ProRISC 2004; Proceedings of semiconductor advances for future electronics,
    STW Technology Foundation, pp. 1-4, 2004. ed. is niet bekend.

  1742. Fabrication of biochemical nanodevices with self-aligned electrodes
    V.G. Kutchoukov; G.O.F. Parikesit; Y. Garini; L.K. Nanver; A. Bossche;
    In s.n. (Ed.), Proceedings of the International conference on electrical engineering 2004 (ICEE 2004), Joint conference with Asia-Pacific conference of transducers and micro-nano technology 2004 (APCOT MNT 2004),
    IEEJ, pp. 1-6, 2004. ed. is niet bekend/100% ECTM.

  1743. Low-cost capacitive personnel detector
    R.N. Aguilar Cardenas; M.C. Roelofsz; H.M.M. Kerkvliet; R.J. van de Ven; G.C.M. Meijer;
    In Proceedings of the thirteenth international scientific and applied science conference electronics ET'2004,
    Technical University of Sofia, pp. 1-6, 2004. ed. is niet bekend.

  1744. 3D-TV rendering on a multiprocessor system on a chip
    X. Li; J.T.J. van Eijndhoven; B.H.H. Juurlink;
    In Proceedings of Pro-RISC 2004,
    Technology Foundation STW, pp. 271-282, 2004. ed. is niet bekend.

  1745. Time of flight technique used for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; J. Bastemeijer; A. Bossche;
    In s.n. (Ed.), Proceedings of the third IEEE international conference on sensors,
    IEEE, pp. 1480-1483, 2004. niet eerder opgevoerd -sb.

  1746. Integrated sensor arrays for bioluminescence and fluorescence bio-chemical analysis
    V.P. Iordanov; B.P. Iliev; A. Bossche; J. Bastemeijer; P.M. Sarro; I.T. Young; G. van DedemWK; M.J. Vellekoop;
    In D. Rocha; P.M. Sarro; M.J. Vellekoop (Ed.), Proceedings of IEEE Sensors, 2004,
    IEEE, Piscataway, pp. 810-813, 2004. niet eerder opgevoerd 50/50 EI/ECTM.

  1747. Particle discrimination with an improved projection cytometer
    J.H. Nieuwenhuis; P. Svasek; P.M. Sarro; M.J. Vellekoop;
    In T Laurell; J Nilsson; K Jensen; JD Harrison; JP Kutter (Ed.), Proceedings of MicroTas 2004,
    Royal Society of Chemistry, pp. 419-421, 2004.

  1748. CMOS quad spinning-current hall-sensor system for compass application
    J. van der MeerC; F.R. Riedijk; P.C. de Jong; E.A. van Kampen; M.J. Meekel; J.H. Huijsing;
    In s.n. (Ed.), Proceedings of IEEE Sensors, 2004,
    IEEE, pp. 1434-1437, 2004. niet eerder opgevoerd - sb.

  1749. A system-level approach for the design of smart sensor interfaces
    C. Guan; X. Li; G.C.M. Meijer;
    In s.n. (Ed.), Proceedings of IEEE Sensors, 2004,
    IEEE, pp. 210-214, 2004. niet eerder opgevoerd -sb.

  1750. A universal sensor interface chip design in 0.5u CMOS process
    G. Chao; G.C.M. Meijer;
    In R Huang; JJ Liou; T Hiramoto; C Claeys (Ed.), ICSICT 2004; Proceedings of the Seventh international conference on solid-state and integrated circuits technology,
    IEEE, pp. 1800-1803, 2004.

  1751. New ultrasound system for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; V.G. Kutchoukov; A. Bossche;
    In ICEE2004; Conference proceedings of the international conference on electrical engineering 2004,
    The Institute of Electrical Engineers of Japan, pp. 847-850, 2004. ed. is niet bekend.

  1752. Design a band-pass pseudo-2-path switched capacitor ladder filter
    Y. Koolivand; A. Zahabi; O. Shoaei; H. Shamsi; A. Atghiaee;
    In M Mirsalehi (Ed.), ICEE2004; Proceedings of the twelfth Iranian conference on electrical engineering,
    Ferdowsi University of Mashhad, pp. 109-115, 2004.

  1753. A novel model of blood impedance for indirect viscosity measurement
    Z.Y. Chang; G.C.M. Meijer; G.A.M. Pop;
    In S Tabakov (Ed.), Electronics ET'2004,
    Technical University Sofia, pp. 15-21, 2004. nog niet eerder opgevoerd JH.

  1754. SU-8 microfluidic platform design
    P.B. Turmezei; M. Achtsnick; J.R. Mollinger; A. Bossche;
    In S.n. (Ed.), EUROSENSORS XVIII; 18th European conference on solid-state sensors,
    s.n., pp. 1-4, 2004. ed. is niet bekend.

  1755. An ammonia sensor based on porous SiC
    E. Connolly;
    In Digest of technical papers; XVIII Eurosensors,
    University of Rome, pp. 1-4, 2004. editor onbekend.

  1756. Low-cost calibration techniques for smart temperature sensors
    M. A. P. Pertijs; J. H. Huijsing;
    In Annual Sensor Technology Workshop Sense of Contact,
    The Netherlands, pp. 17, March 2004.

  1757. A CMOS Semi-Custom Chip for Mixed Signal Designs
    A. J. van Genderen; S. D. Cotofana; G. de Graaf; A. Kaichouhi; J. Liedorp; R. Nouta; M. A. P. Pertijs; C. J. M. Verhoeven;
    In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
    The Netherlands, pp. 491‒496, November 2004.

  1758. Silicon micro-optics for smart light control
    G.V. Vdovin; D.W. de Lima Monteiro; O. Akhzar-Mehr; M. Loktev; S. Sakarya; O.A. Soloviev; P.M. Sarro;
    In H. Urey; DL Dickensheets (Ed.), Proceedings of SPIE MOEMS display and imaging systems II,
    The International Society for Optical Engineering, pp. 135-149, 2004.

  1759. Self-assembly experiments with PNA-derivatized cart nanotubes
    R.C. den Dulk; K.A. Williams; P.T.M. Veenhuizen; M. de Koning; M. Overhand; C. Dekker;
    In H Okabayashi; PS Ho; S Shingubara (Ed.), AIP Conference proceedings 2004,
    AIP, pp. 25-30, 2004.

  1760. Bitstream trimming of a smart temperature sensor
    M. A. P. Pertijs; J. H. Huijsing;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 904‒907, October 2004. DOI: 10.1109/ICSENS.2004.1426317
    Abstract: ... The paper presents a high-resolution trimming technique for use in precision smart temperature sensors. A digital sigma-delta modulator is used to trim the bias current of a bipolar transistor to compensate for process spread. In contrast with conventional trimming techniques, only a small chip area is required. The implementation of this technique in a temperature sensor with a sigma-delta ADC is discussed. On a prototype realized in 0.7μm CMOS, an 8-bit trimming resolution was measured, corresponding to 0.02°C on a range of 4.5°C.

  1761. A second-order sigma-delta ADC using MOS capacitors for smart sensor applications
    M. A. P. Pertijs; A. Bakker; J. H. Huijsing;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 421‒424, October 2004. DOI: 10.1109/ICSENS.2004.1426189
    Abstract: ... This paper presents a second-order sigma-delta ADC designed for use in a smart temperature sensor. It is operated in a 'one-shot' mode, i.e. the converter is powered up, produces a single conversion result, and powers down again. This paper discusses the implications of this mode of operation for the design of the modulator and the decimation filter. A sinc² decimation filter is used, which is shown to provide a higher resolution then a more complex sinc³ with the same conversion time. Through continuous-time integration of the input and reference voltages, the use of a linear sampling capacitor at the input is avoided. The modulator was implemented in a 0.5μm digital CMOS process using MOS capacitors. An effective resolution of 15.5 bits was measured with a conversion time of 25 ms.

  1762. A sigma-delta modulator with bitstream-controlled dynamic element matching
    M. A. P. Pertijs; J. H. Huijsing;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 187‒190, September 2004. DOI: 10.1109/ESSCIR.2004.1356649
    Abstract: ... When dynamic element matching (DEM) techniques are applied to generate a precision reference for a (single-bit) sigma-delta modulator, intermodulation occurs between the DEM residuals and the bitstream, which increases the in-band quantization noise. This can be prevented by deriving the sequence of DEM steps from the bitstream. This technique has been implemented in a second-order sigma-delta modulator with a dynamic bandgap voltage reference, which was realized in a 0.7μm CMOS process. Measurements show complete elimination of intermodulation products in the signal band, corresponding to an 8 dB reduction in quantization noise compared to conventional cyclic DEM.

  1763. Temperature Simulation and Control of a Biochip for DNA Analysis
    Costa, BA; Lemos, JM; Piedade, MS; Sousa, L; Freitas, P; Cardoso, Filipe Arroyo; Vidal, D;
    In 44th IEEE Conference on Decision and Control,
    2004.

  1764. Chopper chopper-stabilized operational amplifiers and methods
    J.H. Huijsing; M.J. Fonderie;
    2004.

  1765. Nanochannel technology
    V.G. Kutchoukov;
    2004.

  1766. Apparatus for measuring a small quantity of a liquid
    M.J. Vellekoop; K.T. Hjelt; G.W. Lubking; G.Y. Warries;
    2004. TU Delft, oc-99-007; US 6.796.174; TU Delft, oc-99-007.

  1767. Calibration and testing of integrated thermal airflow sensors
    SP. Matova;
    PhD thesis, Delft University of Technology, 2004.

  1768. Flow sensing with thermal sigma-delta modulators
    K.A.A. Makinwa;
    PhD thesis, Delft University of Technology, 2004.

  1769. Miniaturized analytical assays in biotechnology
    R.M. van Guijt; R. Moerman; A.R. Kroon; G. van DedemWK; R. van den Doel; L. van Vliet; I.T. Young; F.P.J. Laugere; A. Bossche; P.M. Sarro;
    Biotechnology Advances: research reviews,
    Volume 21, Issue 5, pp. 431-444, 2003. 50/50 EI/ECTM.

  1770. Study on temperature stability improvement of on-chip reference elements using integrated Peltier coolers
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 52, Issue 2, pp. 478-482, 2003.

  1771. Monitoring enzymatic reactions with in situ sensors
    I.T. Young; V.P. Iordanov; A.R. Kroon; H.R.C. Dietrich; R. Moerman; L.R. van den Doel; G. van DedemWK; A. Bossche; B.L. Gray; P.M. Sarro; P.W. Verbeek; L. van VlietJ;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 4966, pp. 76-82, 2003.

  1772. Stability of a micromechanical pull-in voltage reference
    L.A. Machado da Rocha; E. Cretu; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 52, Issue 2, pp. 457-460, 2003.

  1773. Fast sampling multiplex detector for a hetrodyne interferometer with angstrom precision
    O.A. Soloviev; G.V. Vdovin; ML. Krieg;
    Proceedings of SPIE- International Society for Optical Engineering,
    Volume 5036, pp. 25-30, 2003.

  1774. On the possibility of intraocular adaptive optics
    G.V. Vdovin; M. Loktev; A.F. Naumov;
    Optics Express,
    Volume 11, Issue 7, pp. 810-817, 2003.

  1775. Minimization of the mechanical-stress-induced inaccuracy in bandgap voltage reference
    F. Fruett; G.C.M. Meijer; A. Bakker;
    IEEE Journal of Solid State Circuits,
    Volume 38, Issue 7, pp. 1288-1291, 2003.

  1776. Technology and electro-optical properties of modal liquid crystal wavefront correctors
    S.P. Kotova; P. Clark; I.R. Guralnik; N.A. Klimov; M.Y. Kvashnin; M. Loktev; G.D. Love; A.F. Naumov; M.A. Rakhmatulin; C.D. Saunter; G.V. Vdovin; O.A. Zayakin;
    Journal of Optics,
    Volume 5, pp. 231-238, 2003.

  1777. Leakage current modeling of test structures for characterization of dark current in CMOS image sensors
    N.V. Loukianova; H-O. Folkerts; J.P.V. Maas; D.W.E. Verbugt; A.J. Mierop; W. Hoekstra; E. Roks; A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 50, Issue 1, pp. 77-83, 2003.

  1778. A contactless capacitive angular-position sensor
    M. Gasulla; X.J. Li; G.C.M. Meijer; L. van der Ham; J.W. Spronck;
    IEEE Sensors Journal,
    Volume 3, Issue 5, pp. 607-613, 2003.

  1779. Single-mask microfabrication of aspherical optics using KOH anisotropic etching of Si
    D.W. de Lima Monteiro; O. Akhzar-Mehr; P.M. Sarro; G.V. Vdovin;
    Optics Express,
    Volume 11, Issue 18, pp. 2244-2252, 2003.

  1780. Compensation of packaging asymmetry in a 2-D wind sensor
    SP. Matova; K.A.A. Makinwa; J.H. Huijsing;
    IEEE Sensors Journal,
    Volume 3, Issue 6, pp. 761-765, 2003.

  1781. On-chip contactless four-electrode conductivity detection for capillary electrophoresis devices
    F.P.J. Laugere; R.M. van Guijt; J. Bastemeijer; G. van der Steen; A. Berthold; H.A. Baltussen; P.M. Sarro; G. van DedemWK; M.J. Vellekoop; A. Bossche;
    Analytical Chemistry,
    Volume 75, Issue 2, pp. 306-312, 2003.

  1782. X-ray detector based on a bulk micromachined photodiode combined with a scintillating crystal
    J.G. Rocha; C.G.J. Schabmueller; N.F. Ramos; S. Lanceros-Mendez; M.F. Costa; A.G.R. Evans; R.F. Wolffenbuttel; J.H. Correia;
    Journal of Micromechanics and Microengineering,
    Volume 13, Issue 4, pp. 45-50, 2003.

  1783. Integrated flow-cells for novel adjustable sheath flows
    J.H. Nieuwenhuis; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    Lab On a Chip: microfluidic and nanotechnologies for chemistry, biology, and bioengineering,
    Issue 3, pp. 56-61, 2003.

  1784. Monitoring enzymatic reactions in nanolitre wells
    I.T. Young; R. Moerman; L.R. van den Doel; V.P. Iordanov; A.R. Kroon; H.R.C. Dietrich; G. van DedemWK; A. Bossche; B.L. Gray; P.M. Sarro; P.W. Verbeek; L. van VlietJ;
    Journal of Microscopy,
    Volume 212, Issue 3, pp. 254-263, 2003. 50/50 EI/ECTM.

  1785. An image sensor which captures 100 consecutive frames at 1 000 000 frames/s
    T. Goji Etoh; D. Poggemann; G. Kreider; H. Mutoh; A.J.P. Theuwissen; A. Ruckelshausen; Y. Kondo; H. Maruno; K Takubo; H Soya; K Takehara; T Okinaka; Y Takano;
    IEEE Transactions on Electron Devices,
    Volume 50, Issue 1, pp. 144-151, 2003.

  1786. A 35-mm format 11 M pixel full-frame CCD for professional digital still imaging
    J.T. Bosiers; B.G.M. Dillen; C. Draijer; A.C. Kleimann; F.J. Polderdijk; M. de Wolf; W. Klaassens; A.J.P. Theuwissen; H.L. Peek; H-O. Folkerts;
    IEEE Transactions on Electron Devices,
    Volume 50, Issue 1, pp. 254-265, 2003.

  1787. Technique for widening passband of wavelength router
    G. Pandraud; A.P. Vonsovici;
    Electronics Letters,
    Volume 39, Issue 15, pp. 1119-1121, 2003.

  1788. Near-field optical sensors for particle shape measurements
    J.H. Nieuwenhuis; J. Bastemeijer; A. Bossche; M.J. Vellekoop;
    IEEE Sensors Journal,
    Volume 3, Issue 5, pp. 646-651, 2003.

  1789. Tracking system for art applications
    R.A. Cardenas; G.C.M. Meijer;
    Delft University of Technology, Volume DET 5100 , 2003.

  1790. Impedance measurement system for electrical characterization of rockwool substrates
    B.P. Iliev; G.C.M. Meijer;
    Delft University of Technology - Electronic Instrumentation, Volume STW project DMR.5294 , 2003.

  1791. Absolute interferometric surface profiling with 1 Å accuracy
    ML. Krieg; O.A. Soloviev;
    s.n., Volume STW project DMR.5189 , 2003.

  1792. Noise reduction in CMOS image sensors; semi-annual progress report 3
    M.F. Snoeij;
    Delft University of Technology - Electronic Instrumentation, , 2003. Confidential.

  1793. Bio-functional carbon nanotubes
    K.A. Williams; R.C. den Dulk; I. Heller; J. Kong; H.A. Heering; P.T.M. Veenhuizen; M. de Koning; M. Overhand; SG Lemay; C. Dekker;
    conference, 2003.

  1794. Arrays of spherical micromirrors and molded microlenses fabricated with bulk Si micromachining
    G.V. Vdovin; O. Akhzar-Mehr; P.M. Sarro; D.W. de Lima Monteiro; M. Loktev;
    UF Behringer; B Courtois; AM Khounsary; DG Uttamchandani (Ed.);
    The International Society for Optical Engineering, , pp. 107-111, 2003.

  1795. Electro-mechanical feedback for realization of a mechanical spectrum analyzer
    E. Cretu; L.A. Machado da Rocha; R.F. Wolffenbuttel;
    IEEE, , pp. 1407-1410, 2003.

  1796. Biosystem with 16 highly-selective optical-channels for biological fluids anlysis in the visible spectrum
    G. Minas; J.C. Ribeiro; S. Lanceros-Mendez; F. Vaz; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    IEEE, , pp. 1251-1254, 2003.

  1797. Dynamics of pull-in: analysis of the Meta-stable regime
    L.A. Machado da Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    s.n., , pp. 57-60, 2003.

  1798. Integrated silicon infrared microspectrometers
    S.H. Kong; G. de Graaf; R.F. Wolffenbuttel;
    T Gregorkiewicz; RG Elliman; PM Fauchet; JA Hutchby (Ed.);
    Materials Research Society, , pp. 1-10, 2003. CD-ROM.

  1799. Thermo-electric performance of poly-Si0.7Ge0.3
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    T Gregorkiewicz; RG Elliman; PM Fauchet; JA Hutchby (Ed.);
    Materials Research Society, , pp. 1-7, 2003. CD-ROM.

  1800. A 16 fabry-perot optical-channels array for biological fluids analysis using white light
    G. Minas; J.C. Ribeiro; J.S. Martins; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    University of Minho, , pp. 28-30, 2003.

  1801. Performance of integrated silicon infrared microspectrometers
    S.H. Kong; G. de Graaf; L.A. Machado da Rocha; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IEEE, , pp. 707-710, 2003.

  1802. 2-D modeling and simulation of fluidic microsystems for biological fluids analysis
    G. Minas; J.C. Ribeiro; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    s.n., , pp. 239-242, 2003.

  1803. Toward the development of a three-dimentional mid-field microscope
    Y. Garini; V.G. Kutchoukov; A. Bossche; P.F.A. Alkemade; I.T. Young;
    s.n. (Ed.);
    European Optical Society, , pp. 70-71, 2003.

  1804. New concept for the linearisation of sensor bridge circuits
    G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    University of Minho, , pp. 835-838, 2003.

  1805. Electro-mechanical compensation of the temperature coefficient of the pull-in voltage of microstructures
    L.A. Machado da Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    University of Minho, , pp. 68-71, 2003.

  1806. Comparison between bulk micromachined and CMOS detectors for x-ray measurements
    J.G. Rocha; C.G.J. Schabmueller; N.F. Ramos; S. Lanceros-Mendez; M.V. Moreia; A.G.R. Evans; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    University of Minho, , pp. 384-385, 2003.

  1807. Displacement model for dynamic pull-in analysis and application in large-stroke electrostatic actuators
    L.A. Machado da Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n. (Ed.);
    University of Minho, , pp. 448-451, 2003.

  1808. CMOS x-ray imager for dental radiography
    N.F. Ramos; J.G. Rocha; S. Lanceros-Mendez; R.F. Wolffenbuttel; J.H. Correia;
    s.n. (Ed.);
    University of Minho, , pp. 208-209, 2003.

  1809. Linearisation of Piezoresistive pressure sensor readout
    G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    s.n., , pp. 207-210, 2003.

  1810. Low-voltage power-efficient operational amplifier design techniques - an overview
    K-J. de Langen; J.H. Huijsing;
    s.n. (Ed.);
    IEEE, , pp. 1-8, 2003.

  1811. Mechanical spectrum analyzer in silicon using micromachined accelerometers with time-varying electrostatic feedback
    L.A. Machado da Rocha; E. Cretu; G. de Graaf; R.F. Wolffenbuttel;
    s.n. (Ed.);
    IEEE, , pp. 1197-1201, 2003.

  1812. Low-cost microfilter for red blood cell membrane stiffness measurement using photosensitive BCB
    P.B. Turmezei; A. Poliakov; J.R. Mollinger; M. Bartek; A. Bossche; J.N. Burghartz;
    In TRANSDUCERS'03 Twelfth international conference on solid-state sensors, actuators and microsystems,
    IEEE, pp. 107-110, 2003. CD-ROM.

  1813. Processing of inertial sensors using SF6-O2 Cryogenic plasma process
    G. Craciun; H. Yang; L. Pakula; M.A. Blauw;
    In s.n. (Ed.), SAFE 2003 Semiconductor advances for future electronics,
    Stichting voor de Technische Wetenschappen, pp. 683-686, 2003. CD-ROM.

  1814. First particle measurements with an integrated coulter counter based on 2-dimensional aperture control
    J.H. Nieuwenhuis; F. Kohl; J. Bastemeijer; M.J. Vellekoop;
    In s.n. (Ed.), TRANSDUCERS'03 Twelfth international conference on solid-state sensors, actuators and microsystems,
    IEEE, pp. 296-299, 2003.

  1815. Fabrication of nanochannels using glass to glass anodic bonding
    V.G. Kutchoukov; F.P.J. Laugere; W. van der Vlist; L. Pakula; Y. Garini; P.F.A. Alkemade; A. Bossche;
    In s.n. (Ed.), TRANSDUCERS'03 Twelfth international conference on solid-state sensors, actuators and microsystems,
    IEEE, pp. 1327-1330, 2003. CD-ROM.

  1816. Nanochannel fabrication technique for fluidic applications
    V.G. Kutchoukov; L. Pakula; Y. Garini; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), SAFE 2003 Semiconductor advances for future electronics,
    Stichting voor de Technische Wetenschappen, pp. 702-706, 2003. CD-ROM.

  1817. Comparison between non-ideal and ideal-switch model in a CMOS SC integrator
    A. Atghiaee; G.C.M. Meijer; C. Guan; X.J. Li; H.M.M. Kerkvliet;
    In s.n. (Ed.), ProRISC 2003 Program for research on integrated systems and circuits,
    Stichting voor de Technische Wetenschappen, pp. 165-168, 2003. CD-ROM.

  1818. CMOS translinear implementation of the lock-in pixel
    O.A. Soloviev; G.V. Vdovin; ML. Krieg;
    In s.n. (Ed.), ProRISC 2003 Program for research on integrated system and circuits,
    Stichting voor de Technische Wetenschappen, pp. 265-269, 2003. CD-ROM.

  1819. Wafer thinning for high-density, through-wafer interconnects
    L. Wang; C.C.G. Visser; C.R. de Boer; J.M.W. Laros; W. van der Vlist; J. Groeneweg; G. Craciun; P.M. Sarro;
    In JA Yasaitis; MA Perez-Maher; JM Karam (Ed.), Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII,
    The International Society for Optical Enginering, pp. 532-539, 2003.

  1820. Measuretechniques to improve the accuracy of smart sensor systems (invited)
    G.C.M. Meijer; X.J. Li;
    In SJ Prosser; E Lewis (Ed.), Proceedings of the twelfth conference on sensors and their applications,
    Institute of Physics, pp. 223-230, 2003.

  1821. Development of a silicon-based modal liquid crystal wavefront corrector
    M. Loktev; G.V. Vdovin; P.M. Sarro;
    In M Hrabovsky; D Senderakova; P Tomanek (Ed.), Proceedings of SPIE; Photonics, devices, and systems II,
    The International Society for Optical Engineering, pp. 558-564, 2003.

  1822. Modal corrector integrated in silicon: possibilities for implementation
    M. Loktev; G.V. Vdovin; P.M. Sarro;
    In A Kohnle; JD Gonglewski (Ed.), Proceedings of SPIE; optics in atmospheric propagation and adaptive systems V,
    The International Society for Optical Engineering, pp. 196-205, 2003.

  1823. Ultra-low-cost deformable mirror based on thermal expansion
    G.V. Vdovin; M. Loktev;
    In M Hrabovsky; D Sendrakova; P Tomanek (Ed.), Proceedings of SPIE; photonics, devices, and systems II,
    The International Society for Optical Engineering, pp. 460-464, 2003.

  1824. Simulation-based development and characterization of a CCD architecture for 1 million frames per second
    D. Poggemann; A. Ruckelshausen; T. Goji Etoh; A.J.P. Theuwissen; J.T. Bosiers; H. Mutoh; Y. Kondo;
    In MM Blouke; N Sampat; RJ Motta (Ed.), Proceedings of electronic imaging, science, and technology; sensors and camera systems for scientific, industrial, and digital photography applications IV,
    The Society for Imaging Science and Technology, pp. 185-195, 2003.

  1825. Technological aspects of a custom CMOS sensor for adaptive optics
    D.W. de Lima Monteiro; G.V. Vdovin; P.M. Sarro;
    In M Hrabovsky; D Sendrakova; P Tomanek (Ed.), Proceeding of SPIE; photonics, devices, and systems II,
    The International Society for Optical Engineering, pp. 31-36, 2003.

  1826. A low-cost, high-precision sensor interface for platinum temperature sensors
    A. Atghiaee; G.C.M. Meijer; X. Li; C. Guan; H.M.M. Kerkvliet;
    In A Andonova; M Hristov; P Philipov; T Takov (Ed.), MTM 2003 Seventh international symposium on microelectronics technologies and microsystems,
    Technical University of Sofia, pp. 240-243, 2003.

  1827. Fabrication technology for micromachined spatial light modulators
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    In GC Righini (Ed.), Proceedings of SPIE; integrated optical devices: fabrication and testing,
    The International Society for Optical Engineering, pp. 219-226, 2003.

  1828. Adaptive pixel defect correction
    A.A. Tanbakuchi; A. van der Sijde; B. Dillen; A.J.P. Theuwissen; W. de Haan;
    In MM Blouke; N Sampat; RJ Motta (Ed.), Proceedings of electronic imaging, science and technology; sensors and camera systems for scientific, industrial, and digital photography applications IV,
    The Society for Imaging Science and Technology, pp. 360-370, 2003.

  1829. Technological approaches for fabrication of elatomer based spatial light modulators
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    In H. Urey (Ed.), Proceedings of SPIE; MOEMS display and imaging systems,
    The International Society for Optical Engineering, pp. 334-341, 2003.

  1830. Ultrasound system for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; A. Bossche;
    In IEEE Sensors 2003,
    IEEE, pp. 987-990, 2003. CD-ROM.

  1831. PCR Array on chip - thermal characterization
    V.P. Iordanov; J. Bastemeijer; A. Bossche; P.M. Sarro; M. Malatek; I.T. Young; G. van DedemWK; M.J. Vellekoop;
    In s.n. (Ed.), IEEE Sensors 2003,
    IEEE, pp. 1045-1048, 2003. CD-rom 50/50 EI/ECTM.

  1832. Fabrication technology for nanofluidic channel devices for biochemical applications
    V.G. Kutchoukov; L. Pakula; Y. Garini; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), MME 2003 14th Micromechanics Europe workshop,
    s.n., pp. 167-170, 2003.

  1833. Arbitrary optical surfaces anisotropically etched in silicon in a single-mask process
    D.W. de Lima Monteiro; G.V. Vdovin; O. Akhzar-Mehr;
    In s.n. (Ed.), MME 2003 14th Micromechanics Europe workshop,
    s.n., pp. 135-138, 2003.

  1834. First measurement results with an integrated projection citometer
    J.H. Nieuwenhuis; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    In MA Northrup; KF Jensen; DJ Harrison (Ed.), MTAS 2003 Seventh international conference on micro total analysis systems,
    Transducer Research Foundation, pp. 1219-1222, 2003. CD ROM.

  1835. Novel readout electronics for TSM viscosity sensors
    B.H. Jakoby; G. Art; J. Bastemeijer;
    In IEEE Sensors 2003; Proceedings of the Second IEEE international conference on sensors,
    IEEE, pp. 839-842, 2003. Nog niet eerder opgevoerd. ed. niet bekend.

  1836. Molecular nano-biotechnology with emphasis on utilization of DNA and AFM for assay system: a review
    D.H.B. Wickasono;
    In H Gautama; S Roseno (Ed.), ISSM 2003 Proceedings of the eighth Indonesian students' scientific meeting,
    ISTECS-Europe, pp. 125-129, 2003.

  1837. Ultra-high resolution image capturing and processing for digital cinematography
    A.J.P. Theuwissen; J. Coghill; L. Ion; F. Shu; H. Siefken; C. Smith;
    In s.n. (Ed.), ISSCC 2003 IEEE international solid-state circuits conference,
    IEEE, pp. 162-163, 2003.

  1838. Assay of DNA-binding protein bound to Streptavidin-labeled DNA probe by AFM imaging: principles with application in solution-based assay and on-chip biosensing
    D.H.B. Wickasono; T. Ebihara; M. Mie; Y. Yanagida; E. Kobatake; M. Aizawa;
    In H Gautama; S Roseno (Ed.), ISSM 2003 Proceedings of the eighth Indonesian students' scientific meeting,
    ISTECS-Europe, pp. 117-124, 2003.

  1839. Analysis of capacitance and linearity of Gauge characteristic of Coplanar micro-displacement sensor
    M.M. Gorbov; G.M. Gorbova; G.C.M. Meijer;
    In D Ilic; M Borsic; J Butorac (Ed.), IMEKO 2003 17th IMEKO World congress; metrology in the third millennium,
    IMEKO, pp. 1965-1968, 2003.

  1840. Investigating cross correlation method for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), IMTC 2003 20th IEEE instrumentation and measurement technology conference,
    IEEE, pp. 283-286, 2003. CD-ROM.

  1841. A high-speed capacitive-sensor interface using a relaxaton oscillator and a fast counter
    M. Gasulla; X.J. Li; G.C.M. Meijer;
    In s.n. (Ed.), IMTC'03 20th IEEE instrumentation and measurement technology conference,
    IEEE, pp. 811-816, 2003. CD-ROM.

  1842. A readout circuit for measuring the time-domain sensor signal
    G. Chao; G.C.M. Meijer;
    In s.n. (Ed.), IMTC 2003 Proceedings of the 20th IEEE instrumentation and measurement technology conference,
    IEEE, pp. 807-809, 2003.

  1843. Cross-correlation method applied to an ultrasound system for measuring position and orientation of laproscopic surgery tools
    F. Tatar; J.R. Mollinger; P.B. Turmezei; A. Bossche;
    In D Ilic; M Borsic; J Butorac (Ed.), IMEKO 2003 17th IMEKO World congress; Metrology in the third millennium,
    IMEKO, pp. 1506-1509, 2003.

  1844. Liquid crystal wavefront corrector with modal response
    M. Loktev; G.V. Vdovin; P.M. Sarro;
    In s.n. (Ed.), Eurosensors XVII The 17th European conference on solid-state transducers,
    University of Minho, pp. 352-353, 2003.

  1845. Digital processing techniques used to improve the measuring accuracy for the position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), WC 2003 World congress on medical physics and biomedical engineering,
    World Congress on Medical Physics and Biomedical Engineering, pp. 1-4, 2003. CD-ROM.

  1846. Microfluidic device constructed from photosensitive BCB for erythrocyte membrane deformability measurement
    P.B. Turmezei; A. Poliakov; J.R. Mollinger; M. Bartek; A. Bossche; J.N. Burghartz;
    In EUROSENSORS 17th European conference on solid-state transducers,
    University of Minho, pp. 293-296, 2003.

  1847. Perspectives on a CMOS quad-cell matrix for fast wavefront sensing at low-light levels
    D.W. de Lima Monteiro; G.V. Vdovin;
    In s.n. (Ed.), EUROSENSORS 17th European conference on solid-state transducers,
    University of Minho, pp. 181-184, 2003. CD-ROM.

  1848. Fabrication technology for twin nanochannels
    V.G. Kutchoukov; L. Pakula; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), EUROSENSORS 17th European conference on solid-state transducers,
    University of Minho, pp. 623-626, 2003. CD-ROM.

  1849. Robust DC model for the offset trimming of an integrated thermal wind sensor
    SP. Matova; P Matov; J.H. Huijsing;
    In s.n. (Ed.), EUROSENSORS 17th European conference on solid-state transducers,
    University of Minho, pp. 363-366, 2003.

  1850. Digital processing technique applied to new ultrasound system for measuring position and orientation of laparoscopic surgery tools
    F. Tatar; J.R. Mollinger; P.B. Turmezei; A. Bossche;
    In s.n. (Ed.), EUROSENSORS 17th European conference on solid-state transducers,
    University of Minho, pp. 752-755, 2003.

  1851. A switched-capacitor amplifier with dynamic element matching in the feedback network
    Guijie Wang; G.C.M. Meijer;
    In ET'2003; Proceedings of the Twlefth international scientific and applied science conference electronics,
    Technical University Sofia, pp. 13-18, 2003. nog niet eerder opgevoerd. ed. niet bekend.

  1852. Droplet measurement with a capacitive sensor
    A. Atghiaee; G.C.M. Meijer; X. Li; C. Guan; H.M.M. Kerkvliet;
    In ET'2003; Proceedings of the twelth international scientific and applied science conference electronics,
    Technical University of Sofia, pp. 3-6, 2003. Nog niet opgevoerd. ed. niet bekend.

  1853. Smart architecture for 3-D ultrasonic tracking system
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    In ET'2003; Proceedings of the Twelfth international scientific and applied science conference electronics,
    Technical University of Sofia, pp. 7-12, 2003. nog niet eerder opgevoerd. ed. niet bekend.

  1854. Capacitive smart wind sensor
    H.M.M. Kerkvliet; G.C.M. Meijer;
    In S Ovcharov; A Andonova; P Pilipov; N Gradinarov (Ed.), Electronics ET'2002,
    Technical University Sofia, pp. 129-130, 2003.

  1855. Novel flow-cell to create sheath flows with adaptable sample flow dimensions
    J.H. Nieuwenhuis; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    In G Fiedler; D Donhoffer (Ed.), Beiträge der Informationstagung Mikroelektronik 2003,
    Osterreichischer Verband für Elektrotechnik, pp. 1-5, 2003.

  1856. A high-accuracy CMOS smart temperature sensor with fast calibration procedure
    M. A. P. Pertijs; A. Niederkorn; X. Ma; B. McKillop; A. Bakker; J. Huijsing;
    In Annual Sensor Technology Workshop Sense of Contact,
    The Netherlands, pp. 37, March 2003.

  1857. Technology of spatial light modulator based on viscoelastic layers
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    In M Hrabovsky; D Sendrakova; P Tomanek (Ed.), Proceeding of SPIE; Photonics, devices, and systems II,
    The International Society for Optical Engineering, pp. 477-482, 2003.

  1858. A low-cost high-precision sensor interface for platinum temperature sensors
    X. Li; G.C.M. Meijer;
    In s.n. (Ed.), ASICON 2003; proceedings,
    IEEE, pp. 514-517, 2003.

  1859. Electrical characterization of rockwool substrates
    B.P. Iliev; G.C.M. Meijer;
    In ET'2003; Proceedings of the Twelfth international scientific and applied science conference electronics,
    Technical University of Sofia, pp. 49-54, 2003. nog niet eerder opgevoerd. ed. niet bekend.

  1860. SC interface for capacitive and voltage measurements with extended linear range
    V.P. Iordanov; G.C.M. Meijer; S.N. Nihtianov;
    In s.n. (Ed.), ProRISC 2003 Program for research on integrated systems and circuits,
    Stichting voor de Technische Wetenschappen, pp. 195-201, 2003. CD-ROM.

  1861. The improvement in measuring position and orientation of laparoscopic toolls using the cross correlation method
    F. Tatar; J.R. Mollinger; R.C. den Dulk; W.A. van Duyl; J.F.L. Goosen; A. Bossche;
    In s.n. (Ed.), ProRISC 2003 Program for research on integrated systems and circuits,
    Stichting voor de Technische Wetenschappen, pp. 437-440, 2003. CD-ROM.

  1862. A CMOS temperature sensor with a 3σ inaccuracy of ±0.5°C from -50°C to 120°C
    M. Pertijs; A. Niederkorn; X. Ma; B. McKillop; A. Bakker; J. Huijsing;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    IEEE, pp. 200‒201, February 2003. DOI: 10.1109/ISSCC.2003.1234266
    Abstract: ... A temperature sensor in 0.5μm CMOS achieves an accuracy of ±0.5°C (3σ) from -50°C to 120°C. It combines chopping, dynamic element matching and curvature correction with calibration at room temperature. Calibration time has been reduced to less than 1s by using an on-chip transistor to measure the die temperature.

  1863. Amplifier with stabilization means
    J.H. Huijsing; K.J. de Langen;
    2003.

  1864. GM-controlled current-isolated indirect-feedback instrumentation amplifier
    J.H. Huijsing; B. Shahi;
    2003.

  1865. Inrichting en werkwijze voor het bepalen van de vorm en/of grootte van kleine deeltjes
    J.H. Nieuwenhuis; G.W. Lubking; M.J. Vellekoop;
    2003.

  1866. Servo format for hard disks, preferably hard disks
    J.W.M. Bergmans; K.A.A. Makinwa; J.O. Voorman;
    2003.

  1867. Werkwijze voor het uitvoeren van een assay, inrichting daarvoor, alsmede een werkwijze voor het vervaardigen van een inrichting
    V.P. Iordanov; P.M. Sarro; R.F. Wolffenbuttel; M.J. Vellekoop;
    2003. niet eerder opgenomen; 1017989; niet eerder opgenomen.

  1868. Micromachining techniques for fabrication of integrated light modulating devices
    S. Sakarya;
    PhD thesis, Delft University of Technology, 2003.

  1869. Conductivity detection for application in capillary electrophoresis microchips
    F.P.J. Laugere;
    PhD thesis, Delft University of Technology, 2003.

  1870. Systematic design of Sigma-Delta analog-to-digital converters
    O. Bajdechi;
    PhD thesis, Delft University of Technology, 2003.

  1871. Magnetic-based navigation system for endovascular interventions
    D. Tanase;
    PhD thesis, Delft University of Technology, 2003.

  1872. Lateral on-chip integrated peltier elements; based on polycrystalline silicon-germanium
    D.D.L. Wijngaards;
    PhD thesis, Delft University of Technology, 2003.

  1873. CMOS temperature sensor and bandgap reference
    Guijie Wang; G.C.M. Meijer;
    Technical report, 2003.

  1874. Nos limities da visão: um desafio para a óptica adaptativa
    D.W. de Lima Monteiro; G.V. Vdovin;
    Ciencia Hoje,
    Volume 32, Issue 188, pp. 40-45, 2002.

  1875. Evaluation of vascular and interventional procedures with time-action analysis: a pilot study
    N.H. Bakker; D. Tanase; J.A. Reekers; C.A. Grimbergen;
    Journal of Vascular and Interventional Radiology,
    Volume 13, pp. 483-488, 2002.

  1876. Environment-induced failure modes of thin film resensors
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    Journal of Microlithography, Microfabrication, and Microsystems,
    Volume 1, Issue 1, pp. 63-69, 2002.

  1877. Remote sensing and petroleum leakage: a review and case study
    F.D. van der Meer; P. Dijk; H. van der Werff; H. Yang;
    Terra Nova: the European journal of geosciences,
    Volume 24, Issue 1, pp. 1-17, 2002.

  1878. Technological aspects of a custom CMOS sensor for adaptive optics
    D.W. de Lima Monteiro; G.V. Vdovin; P.M. Sarro;
    Proceedings of SPIE- International Society for Optical Engineering,
    pp. 31-36, 2002.

  1879. Universal transducer interface: specifications and applications
    X. Li; F.M.L. van de Goes; G.C.M. Meijer; R. de Boer;
    Sensor Review: the international journal of sensing for industry,
    Volume 22, Issue 1, pp. 51-56, 2002.

  1880. A single-chip CMOS optical microspectrometer with light-to-frequency converter and bus interface
    J.H. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
    IEEE Journal of Solid State Circuits,
    Volume 37, Issue 10, pp. 1344-1347, 2002.

  1881. Modal liquid crystal wavefront corrector
    S.P. Kotova; M.Y. Kvashnin; M.A. Rakhmatulin; O.A. Zayakin; I.R. Guralnik; N.A. Klimov; P. Clark; G.D. Love; A.F. Naumov; C.D. Saunter; M. Loktev; G.V. Vdovin; LV Toporkova;
    Optics Express,
    Volume 10, Issue 22, pp. 1258-1272, 2002. niet eerder opgevoerd.

  1882. Constant power operation of a two-dimensional flow sensor
    K.A.A. Makinwa; J.H. Huijsing;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 51, Issue 4, pp. 840-844, 2002.

  1883. Frame transfer CCDs for digital still cameras: concept, design, and evaluation
    J.T. Bosiers; A.C. Kleimann; H.C. van Kuijk; L. Le Cam; H.L. Peek; J.P. Maas; A.J.P. Theuwissen;
    IEEE Transactions on Electron Devices,
    Volume 49, Issue 3, pp. 377-386, 2002.

  1884. Through-wafer copper electroplating for three-dimensional interconnects
    N.T. Nguyen; E. Boellaard; N.P. Pham; V.G. Kutchoukov; G. Craciun; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    Volume 12, pp. 395-399, 2002.

  1885. Design of an electronic interface for capacitively coupled four-electrode conductivity detection in capillary electrophoresis microchip
    F.P.J. Laugere; G.W. Lubking; J. Bastemeijer; M.J. Vellekoop;
    Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers,
    Volume B 83, pp. 104-108, 2002.

  1886. Technology of reflective manbranes for spatial light modulators
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume A 97-98, pp. 468-472, 2002.

  1887. Technology of spatial light modulators based on viscoelastic layers
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    Proceedings of SPIE- International Society for Optical Engineering,
    pp. 466-471, 2002.

  1888. Silicon thin-film UV filter for NADH fluorescence analysis
    V.P. Iordanov; G.W. Lubking; R. Ishihara; R.F. Wolffenbuttel; P.M. Sarro; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume A 97-98, pp. 161-166, 2002.

  1889. A 1.8-V (delta epsilon) modulator interface for an electric microphone with on-chip reference
    O. Bajdechi; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 37, Issue 3, pp. 279-285, 2002.

  1890. Modal liquid crystal wavefront corrector
    S.P. Kotova; M.Y. Kvashnin; M.A. Rakhmatulin; O.A. Zayakin; I.R. Guralnik; N.A. Kimov; P. Clark; A.F. Naumov; C.D. Saunter; M. Loktev; G.V. Vdovin; LV Toporkova;
    Optics Express,
    Volume 10, Issue 22, pp. 1258-1272, 2002.

  1891. Through-wafer copper electroplating for three-dimensional interconnects
    N.T. Nguyen; E. Boellaard; N.P. Pham; V.G. Kutchoukov; G. Craciun; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    Volume 12, pp. 395-399, 2002.

  1892. A smart wind sensor using thermal sigma-delta modulation techniques
    K.A.A. Makinwa; J.H. Huijsing;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume A 97-98, pp. 15-20, 2002.

  1893. A smart CMOS wind sensor
    K.A.A. Makinwa; J.H. Huijsing;
    IEEE International Solid State Circuits Conference. Digest of Technical Papers,
    Volume 45, pp. 432-544, 2002.

  1894. An accurate interface for capacitive sensors
    X.J. Li; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 51, Issue 5, pp. 935-939, 2002. niet eerder opgevoerd.

  1895. Fabrication of a glass-implemented microcapillary elettrophoresis device integrated contactless conductivity
    A. Berthold; F.P.J. Laugere; H. Schellevis; C.R. de Boer; M. Laros; R.M. van Guijt; P.M. Sarro; M.J. Vellekoop;
    Electrophoresis,
    Volume 23, Issue 21, pp. 3511-3519, 2002. wet 6.

  1896. MEMS technology in eletrical metrology
    R.F. Wolffenbuttel;
    Japanese Jounal of the Society On Instrumentation and Control Engineering,
    Volume 41, Issue 1, pp. 102-107, 2002.

  1897. Considerations on contactless conductivity detection in capillary detection in capillary alectrophoresis
    H.A. Baltussen; R.M. van Guijt; G. van der Steen; F.P.J. Laugere; S. Baltussen; G. van DedemWK;
    Electrophoresis,
    Volume 23, Issue 17, pp. 2888-2893, 2002.

  1898. Deformable mirror with thermal actuators
    G.V. Vdovin; M. Loktev;
    Optics Letters,
    Volume 27, Issue 9, pp. 677-679, 2002.

  1899. A CMOS optical microspectrometer with light-to-frequency converter, bus interface, and stray-light compensation
    J.H. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1530-1537, 2002.

  1900. Electronic protection methods for conductivity detectors in micro capillary electrophoresis devices
    J. Bastemeijer; W. Lubking; F.P.J. Laugere; M.J. Vellekoop;
    Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers,
    Volume B 83, pp. 98-103, 2002.

  1901. The development of micromachined humidity sensors based on a dielectric of porous silicon
    E. Connolly;
    Delft University of Technology, Faculty ITS, , 2002. Meeting 4.

  1902. Dedicated smart admittance-sensor systems (Sensor system for characterization of rockwool material)
    B.P. Iliev; G.C.M. Meijer;
    Delft University of Technology, , 2002.

  1903. Dedicated smart admittance-sensor systems for the oilfield industry
    B.P. Iliev; G.C.M. Meijer;
    Delft University of Technology, , 2002. STW project.

  1904. CMOS active pixel sensors: an overview of publications
    M.F. Snoeij;
    Delft University of Technology, Faculty ITS, , 2002. Confidential.

  1905. The development of micromachined humidity sensors based on a dielectric of porous silicon
    E. Connolly;
    Delft Unverity of Technology, Faculty ITS, , 2002. Meeting 3.

  1906. Fast and reliable capacitive transducers
    X. Li; M. Gasulla; G.C.M. Meijer;
    Delft University of Technology, Faculty ITS, , 2002. Report 8.

  1907. Micro-instrumentation systems in silicon: covering: 2001
    R.F. Wolffenbuttel;
    Delft Univerity of Technology, Faculty ITS, , 2002. Interim report.

  1908. The piezojunction effect in silicon integrated circuits and sensors
    F. Fruett; G.C.M. Meijer;
    Kluwer Academic Publishers, , 2002.

  1909. Noise reduction in CMOS image sensors
    M.F. Snoeij;
    Delft University of Technology, Faculty ITS, , 2002. Confidential.

  1910. Development of liquid crystal multi-element wavefront correctors with modal response
    A. Naumov; G.D. Love; M. Loktev;
    Delft University of Technology, , 2002.

  1911. Airflow sensors for thermal management
    K.A.A. Makinwa;
    Delft University of Technology, Faculty ITS, , 2002. Confidential.

  1912. Tracking system art applications: first year report
    G.C.M. Meijer; R.N. Aguilar Cardenas;
    Delft University of Technology, Faculty ITS, , 2002.

  1913. Noise reduction in CMOS image sensors: semi-annual progress report No. 2
    M.F. Snoeij;
    Delft University of Technology, Volume 939006 , 2002. Confidential.

  1914. Analytical calculation of the capacitance in direct imaging drum used in Océ's copy/printer machine
    G.C.M. Meijer; G.M. Gorbova; M.G. Strunsky;
    Delft University of Technology, Faculty ITS, , 2002.

  1915. Fast and reliable capacitive transducers
    X. Li; M. Gasulla; G.C.M. Meijer;
    Delft University of Technology, Faculty ITS, , 2002. Report 9.

  1916. The pull-in of symmetrically and asymmetrically driven microstructures and the use in DC voltage references
    L.A. Machado da Rocha; E. Cretu; R.F. Wolffenbuttel;
    IEEE, , pp. 759-764, 2002.

  1917. Ultrasonic sensor system for measuring position and orientation of laproscopic surgery tools
    F. Tatar; J.R. Mollinger; R.C. den Dulk; W.A. van Duyl; J.F.L. Goosen; A. Bossche;
    Xiamen University Press, , pp. 457-460, 2002.

  1918. A low-cost and accurate interface for conductivity sensors
    X. Li; G.C.M. Meijer;
    IEEE, , pp. 765-768, 2002. CD-Rom.

  1919. Adsorption-induced failure modes of thin-film resonators
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    CS Ozkan; {et al.} (Ed.);
    Materials Research Society, , pp. 1-6, 2002.

  1920. X-ray detector based on bulk micromachined photodiode
    J.G. Rocha; C.G.J. Schabmueller; N.F. Ramos; S. Lanceros-Mendez; A.G.R. Evans; R.F. Wolffenbuttel; J.H. Correia;
    Nat. Inst. for Res. and Development in Microtechnologies, , pp. 323-326, 2002.

  1921. Design of a single-chip micro-thermostat employing both active heating and active cooling
    D.D.L. Wijngaards; G. de Graaf; R.F. Wolffenbuttel;
    Nat. Inst. of Res. and Development in Microtechnologies, , pp. 189-192, 2002.

  1922. Integrated CMOS optical microsystem for illuminating source identification
    G. de Graaf; R.F. Wolffenbuttel;
    IEEE Instrumentation and Measurement Society, , pp. 1-4, 2002.

  1923. Stability of voltage references based on the pull-in of a micromechanical structure
    L.A. Machado da Rocha; R.F. Wolffenbuttel;
    Czech Technical University, , pp. 723-726, 2002.

  1924. Imaging spectrometry and petroleum geology
    F.D. van der Meer; H. Yang; S.B. Kroonenberg; H. Lang; P. Dijk; K.H. Scholte; H. van der Werff;
    F.D. van der Meer; {de Jong}, S (Ed.);
    Kluwer Academic Publishers, , pp. 219-232, 2002. Nog niet eerder opgevoerd.

  1925. Technology for integrated spatial light modulators based on reflective membranes
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    JD Gonglewski; MA Vorontsov; MT Gruneisen (Ed.);
    SPIE, , pp. 21-28, 2002.

  1926. Hysteresis in the pull-in of microstructures
    L.A. Machado da Rocha; R.F. Wolffenbuttel;
    Nat. Inst. for Res. and Development in Microtechnologies, , pp. 335-338, 2002.

  1927. CMOS sensor system for measuring environmental light conditions
    G. de Graaf; R.F. Wolffenbuttel;
    Czech Technical University, , pp. 415-418, 2002.

  1928. Single-chip micro-thermostat for stabilisation at ambient temperature applying both active cooling and heating
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    Czech Technical University, , pp. 425-428, 2002.

  1929. Lab-on-a-chip for measuring uric acid in biological fluids
    G. Minas; J.S. Martins; C. Pereira; C. Lima; R.F. Wolffenbuttel; J.H. Correia;
    Czech Technical University, , pp. 66-69, 2002.

  1930. Design of low-cost resonant mode sensors
    R. Kazinczi; P.B. Turmezei; J.R. Mollinger; A. Bossche;
    PD Franzon (Ed.);
    SPIE - The International Society for Optical Engineering, , pp. 54-61, 2002.

  1931. Modeling and compensation of packaging asymmetry in a 2-D wind sensor
    SP. Matova; K.A.A. Makinwa; J.H. Huijsing;
    s.n., , pp. 70-73, 2002.

  1932. Stability of silicon microfabricated pull-in voltage references
    L.A. Machado da Rocha; R.F. Wolffenbuttel;
    IEEE, , pp. 172-173, 2002.

  1933. CMOS x-rays microdetector based on scintillating light guides
    J.G. Rocha; N.F. Ramos; M.V. Mareira; S. Lanceros-Mendez; R.F. Wolffenbuttel; J.H. Correia;
    Czech Technical University, , pp. 525-528, 2002.

  1934. ThP39 Temperature stability improvement of on-chip reference elements using integrated Peltier coolers
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    IEEE, , pp. 522-523, 2002.

  1935. Technology for integrated spatial light modulators based on reflective membranes
    S. Sakarya; P.M. Sarro; G.V. Vdovin;
    In SR Restaino; SW Teare (Ed.), Proceedings of the 3rd international workshop on adaptive optics for industry and medicine,
    s.n., pp. 107-114, 2002.

  1936. In-situ doped PECVD SiC for surface micromachined devices
    C.R. de Boer; L. Pakula; P.M. Sarro; T.M.H. Pham;
    In J Saneistr; P Ripka (Ed.), Eurosensors XVI 16th European Conference on Solid-State Transducers,
    Czech Technical University, pp. 232-235, 2002.

  1937. Ultrasonic sensor system for measuring position and orientation of laproscopic instruments in minimal invasive surgery
    F. Tatar; J.R. Mollinger; R.C. den Dulk; W.A. van Duyl; J.F.L. Goosen; A. Bossche;
    In Second annual international IEEE-EMBS special topic conference on microtechnologies in medice and biology: proceedings,
    IEEE, pp. 301-304, 2002.

  1938. Modeling and simulation of thermal sigma-delta modulators
    K.A.A. Makinwa; V. Székely; J.H. Huijsing;
    In The frontier of instrumention and measurement,
    IEEE Instrumentation and Measurement Society, pp. 261-264, 2002.

  1939. Optimal design of delta-sigma ADCs by design space exploration
    O. Bajdechi; G. Gielen; J.H. Huijsing;
    In SIGDA publications on CD-Rom: DAC2002,
    ACM Press, pp. 1-6, 2002. CD-Rom.

  1940. Micromachined spatial light modulators based on viscoalastic layers
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    In Xiamen University Press, pp. 625-628, 2002.

  1941. Micromachined membrane deformable mirrors for laser applications
    G.V. Vdovin; P.M. Sarro; V. Kiyko;
    In SR Restaino; SW Teare (Ed.), Proceedings of the 3rd international workshop on adaptive optics for industry and medicine,
    s.n., pp. 35-48, 2002.

  1942. Control of a modal liquid crystal wavefront corrector
    M. Loktev; G.V. Vdovin; A. Naumov; C.D. Saunter; S.P. Kotova; I.R. Guralnik;
    In SR Restaino; SW Teare (Ed.), Proceedings of the 3rd international workshop on adaptive optics for industry and medicine,
    s.n., pp. 145-153, 2002.

  1943. Integrated Hartmann-Shack wavefront sensor
    D.W. de Lima Monteiro; A. Vilaca; G.V. Vdovin; M. Loktev; P.M. Sarro;
    In SR Restaino; SW Teare (Ed.), Proceedings of the 3rd international workshop on adaptive optics foor industry and medicine,
    s.n., pp. 179-183, 2002.

  1944. 3-D position sensing using the differences in the time-of-flights from the use of multiples ultrasonic sources and to one receiver
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    In Proceedings of the 17th international smposium on the 3-D analysis human movement 2002,
    Univerity of Newcastle, pp. 25-28, 2002.

  1945. An oscillator based on a thermal delay line
    J.F. Witte; K.A.A. Makinwa; J.H. Huijsing;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 696-699, 2002.

  1946. A novel readout system for microacoustic viscosity sensors
    J. Bastemeijer; B.H. Jakoby; A. Bossche; M.J. Vellekoop;
    In s.n. (Ed.), Proceedings of the 2002 IEEE ultrasonics symposium,
    IEEE, pp. 489-492, 2002. CD-ROM.

  1947. Read-out circuits for fixed-pattern noise reduction in a CMOS active pixel sensor
    M.F. Snoeij; A.J.P. Theuwissen; J.H. Huijsing;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 676-676, 2002.

  1948. Technology for integrated spatial light modulators based on viscoelastic layers
    S. Sakarya; G.V. Vdovin; P.M. Sarro;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 672-675, 2002.

  1949. Filtered photodiode arrays for NADH fluorescence analysis
    V.P. Iordanov; J. Bastemeijer; R. Ishihara; P.M. Sarro; A. Bossche; M.J. Vellekoop;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 627-630, 2002.

  1950. Fluorescence measurements in thick-film polymer wells
    B.L. Gray; V.P. Iordanov; P.M. Sarro; A. Bossche;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 622-626, 2002.

  1951. Reconfigurable implementation for the AES Algorithm
    C.M.A. Ashruf; G.N. Gaydadjiev; S. Vassiliadis;
    In Proceedings of ProRISC 2002,
    Dutch Technology Foundation STW, pp. 169-172, 2002.

  1952. Frequency detection method for measuring position and orientation of laproscopic surgery tools
    F. Tatar; J.R. Mollinger; R.C. den Dulk; W.A. van Duyl; J.F.L. Goosen; A. Bossche;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 684-687, 2002.

  1953. P1.1: Dynamic particle-shape measurements using a near-field optical sensor
    J.H. Nieuwenhuis; J. Bastemeijer; A. Bossche; M.J. Vellekoop;
    In Proceedings of IEEE sensors 2002: first international conference on sensors,
    IEEE, pp. 130-133, 2002.

  1954. Thinning of micromachined wafers for high-density, through-wafer interconnects
    L. Wang; C.C.G. Visser; C.R. de Boer; M. Laros; W. van der Vlist; J. Groeneweg; G. Craciun; P.M. Sarro;
    In Proceedings of SAFE 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 121-126, 2002.

  1955. A contactless capacitive angular-position sensor
    M. Gasulla; X. Li; G.C.M. Meijer; L. van der Ham; J.W. Spronck;
    In IEEE sensors 2002,
    IEEE, pp. 880-884, 2002.

  1956. Separation and detection of organic acids in a CE microchip with contactless four-electrode conductivity detection
    F.P.J. Laugere; G. van der Steen; J. Bastemeijer; R.M. van Guijt; P.M. Sarro; M.J. Vellekoop; A. Bossche;
    In Y Baba; S Shoji; {van den Berg}, A (Ed.), Micro total analysis systems 2002: proceedings of the µTAS 2002 symposium, held in Nara, Japan, 3-7 November 2002,
    Kluwer Academic Publishers, pp. 491-493, 2002.

  1957. 34.4: SC interface for capacitive measurements with extended linear range
    V.P. Iordanov; G.C.M. Meijer; S.N. Nihtianov;
    In Proceedings of IEEE sensors: first IEEE international conference on sensors. Vol. II,
    IEEE, pp. 1436-1439, 2002.

  1958. P2-14: Compensation of packaging asymmetry in a 2-D wind sensor
    SP. Matova; K.A.A. Makinwa; J.H. Huijsing;
    In Proceedings of IEEE sensors 2002: first IEEE international conference on sensors. Vol. II,
    IEEE, pp. 1256-1259, 2002.

  1959. 40.1: Smart silicon sensors-examples of Hall-effect sensors
    P.C. de Jong; F.R. Riedijk; J. van der Meer;
    In Proceedings of IEEE sensors 2002: first IEEE international conference on sensors,
    IEEE, pp. 1440-1444, 2002. CD-Rom.

  1960. 9.6: CMOS compatible optical filter for high-throughput enzymatic analysis devices
    V.P. Iordanov; R. Ishihara; P.M. Sarro; J. Bastemeijer; A. Bossche; M.J. Vellekoop;
    In Proceedings of IEEE sensors 2002: first IEEE international conference on sensors. Vol. I,
    IEEE, pp. 225-228, 2002.

  1961. Fast interface electronics for a resistive touch-screen
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    In Proceedings of IEEE Sensors 2002,
    IEEE, pp. 1360-1363, 2002.

  1962. 20.3: Electronic baseline-suppression for liquid conductivity detection in a capillary electrophoresis microchip
    F.P.J. Laugere; J. Bastemeijer; G. van der Steen; M.J. Vellekoop; P.M. Sarro; A. Bossche;
    In Proceedings of IEEE sensors 2002: first IEEE international conference on sensors. Vol. 1,
    IEEE, pp. 450-453, 2002.

  1963. P2-11: Precise calculation of capacitances of complex-shaped capacitive sensor-elements by the methods of direct field-strength determinationby the method of direct
    G.M. Gorbova; M.M. Gorbov; G.C.M. Meijer;
    In Proceedings of IEEE sensors 2002: first IEEE international conference on sensors,
    IEEE, pp. 1239-1243, 2002.

  1964. Copper film microgrid through-wafer metalization
    V.G. Kutchoukov; G. Craciun; S. Sakarya; J.R. Mollinger; A. Bossche;
    In MME'02 micromechanics Europe,
    Nat. Inst. for Res. an developmnet in Microtechnologies, pp. 91-94, 2002.

  1965. SU-8 structures for integrated high-speed screening
    B.L. Gray; V.P. Iordanov; P.M. Sarro; A. Bossche;
    In Y Baba; S Shoji; {van den Berg}, A (Ed.), Micro total analysis systems 2002; proceedings of the µTAS 2002 symposium,
    Kluwer Academic Publishes, pp. 464-466, 2002.

  1966. Integrated particle shape sensor
    P.B. Turmezei; J.H. Nieuwenhuis; J.R. Mollinger; A. Bossche;
    In Kandó conference 2002: 60 years of engineering training,
    Budapest Polytechnic, pp. 1-4, 2002. CD-Rom.

  1967. Virtual flow channel: a novel micro-fluidics system with orthogonal, dynamic control of sample flow dimensions
    J.H. Nieuwenhuis; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    In Y Baba; S Shoji; {van den Berg}, A (Ed.), Micro total analysis systems 2002: proceedings of the µTAS 2002 symposium, held in Nara, Japan,
    Kluwer Academic Publishers, pp. 103-105, 2002.

  1968. Measurement position and orientation of surgery tools inside the human body using ultrasound
    F. Tatar; J.R. Mollinger; R.C. den Dulk; W.A. van Duyl; J.F.L. Goosen; A. Bossche;
    In I Margineanu; {et al.} (Ed.), International conference on optimization of electrical and electronic equipments - OPTM 2002,
    Transilvania University Press, pp. 721-724, 2002.

  1969. Fast exploration of (delta epsilon)ADC design space
    O. Bajdechi; J.H. Huijsing; G. Gielen;
    In ISCAS 2002 Proceedings of the 2002 IEEE international symposium on circuits and systems,
    IEEE, pp. 1-4, 2002. CD-Rom.

  1970. Influence of deposition parameters and temperature on stress and strain of In Situ doped PECVD silicon carbide
    T.M.H. Pham; C.R. de Boer; L. Pakula; P.M. Sarro;
    In S Yoshida (Ed.), ICSCRM2001 Proceedings of the International Conference on Silicon Carbide and Related Materials,
    Trans Tech Publications, pp. 759-762, 2002.

  1971. Full-decoupling technique for onecolumn liquid-conductivity detection in capillary electrophoresis microchip
    F.P.J. Laugere; J. Bastemeijer; M.J. Vellekoop; A. Bossche;
    In Eurosensors 2002,
    Czech Technical University, pp. 505-508, 2002.

  1972. Implementations of phase sensitive detectors for heterodyne interferometer
    O.A. Soloviev; G.V. Vdovin; L. Krieg; D.W. de Lima Monteiro;
    In Eurosensors 2002,
    Czech Technical University, pp. 681-684, 2002.

  1973. Modified Reynolds' equation for squeeze-film air damping of hole-plates
    M. Bao; H. Yang; Y. Sun;
    In Eurosensors 2002,
    Czech Technical University, pp. 43-44, 2002.

  1974. The use of a position sensitive detector for the registration of motion patterns in strips of smooth muscle
    W.A. van Duyl; J.V. de Bakker;
    In s.n. (Ed.), ET 2002 The eleventh international scientific and applied science conference. Book 2,
    Technical University, pp. 132-136, 2002. niet eerder opgevoerd.

  1975. An electrical model of the thermal interactions in an integrated wind sensor
    SP. Matova; J.H. Huijsing;
    In s.n. (Ed.), ET 2002 The eleventh international scientific and applied science conference. Book 2,
    Technical University, pp. 22-27, 2002.

  1976. Through-wafer copper electroplating for RF silicon technology
    N.T. Nguyen; T.K. Ng; E. Boellaard; N.P. Pham; G. Craciun; P.M. Sarro; J.N. Burghartz;
    In ESSDERC 2002 32nd European Solid-State Device Research Conference,
    University of Bologna, pp. 255-258, 2002.

  1977. SC interface with extended linear range
    V.P. Iordanov; G.C.M. Meijer; S. Nihtianov;
    In s.n. (Ed.), ET 2002 The eleventh international scientific and applied science conference. Book 1,
    Technical University, pp. 107-112, 2002. niet eerder opgevoerd.

  1978. Electrical transmission line as a model for catheter-manometer dynamic response
    R.P. van Wijk Van Brievingh; F.J. Pasveer;
    In s.n. (Ed.), ET 2002 The eleventh international scientific and applied science conference. Book 2,
    Technical University, pp. 126-131, 2002.

  1979. Low-drift bandgap voltage references
    F. Fruett; G.C.M. Meijer; A. Bakker;
    In A Baschirotto; P Malcovati (Ed.), ESSCIRC 2002: proceedings of the 28th European solid-state circuit conference,
    University of Bologna, pp. 383-386, 2002.

  1980. Power optimization in (epsilon delta) ADC design
    O. Bajdechi; J.H. Huijsing; G. Gielen;
    In AN Skodras; AG Constantinides (Ed.), DSP2002 14th international conference on digital signal processing proceedings,
    IEEE, pp. 1-6, 2002.

  1981. CMOS-compatible wells for integrated high-speed screening arrays
    B.L. Gray; R. Moerman; L.R. van den Doel; H.R.C. Dietrich; V.P. Iordanov; N.P. Pham; P.M. Sarro; A. Bossche; M.J. Vellekoop;
    In DJ Bornhop; DA Dunn; RP Mariella; CJ Murphy; DV Nicolau; Shuming Nie; M Palmer; R Raghavachari (Ed.), Biomedical Nanotechnology Architectures and Applications, Proceedings,
    SPIE, pp. 103-108, 2002. ISSN 0277-786X, phpub 31.

  1982. A CCD image sensor of 1Mframes/s for continuous image capturing 103 frames
    T. Goji Etoh; D. Poggemann; A. Ruckelshausen; A.J.P. Theuwissen; G. Kreider; H-O. Folkerts; H. Mutoh; Y. Kondo; H. Maruno; K Takubo; H Soya; K Takehara; T Okinaka; Y Takano; T Reisinger; C Lohmann;
    In JH. Wuorinen (Ed.), 2002 IEEE International solid-state circuits conference: 2002 Digest of technical papers,
    IEEE, pp. 46-47, 2002. plus page 433.

  1983. Mechanical-stress effect in the base-emitter voltage of integrated bipolar transistors
    F. Fruett; G.C.M. Meijer;
    In Electronics ET'2001: The tenth international scientific and applied science conference,
    Technical University Sofia, pp. 95-98, 2002. niet eerder opgevoerd.

  1984. A 1/1.8" 3M pixel FT-CCD with on-chip horizontal sub-sampling for DSC applications
    L. Le Cam; J.T. Bosiers; A.C. Kleimann; H.C. van Kuijk; J.P. Maas; M.J. Beenhakkers; H.L. Peek; P.C. van de Rijt; A.J.P. Theuwissen;
    In JH. Wuorinen (Ed.), 2002 IEEE International solid-state circuits conference: 2002 Digest of technical papers,
    IEEE, pp. 34-35, 2002. plus page 442.

  1985. Calibration of Smart Temperature Sensors Using an On-Chip Transistor as Reference Thermometer
    M. A. P. Pertijs; J. H. Huijsing;
    In Annual Workshop on Semiconductor Sensors (SeSens),
    The Netherlands, pp. 657-661, November 2002.

  1986. Smart sensor interface electronics
    G.C.M. Meijer; X. Li;
    In 2002 23rd international conference on microelectronics; proceedings,
    IEEE Electron Devices Society, pp. 67-74, 2002.

  1987. Low-cost ultrasonic fusion sensor for angular position
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    In Proceedings of SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 594-597, 2002.

  1988. Calibration and self-calibration of smart sensors
    M. A. P. Pertijs;
    In Proc. NMI Workshop Internet Measurement and Self-Calibration,
    The Netherlands, May 2002.

  1989. Suitabilty of FEA software for shealth flow simulation
    P.B. Turmezei; J.H. Nieuwenhuis; J.R. Mollinger; A. Bossche;
    In Proceedings od SeSens 2002,
    STW Stichting voor de Technische Wetenschappen, pp. 692-695, 2002.

  1990. Integrated Coulter counter with non-caxial sheath-flow and dynamic aperture control
    J.H. Nieuwenhuis; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    In Eurosensors 2002,
    Czech Technical University, pp. 1194-1197, 2002.

  1991. Non-idealities of temperature sensors using substrate PNP transistors
    M. A. P. Pertijs; G. C. M. Meijer; J. H. Huijsing;
    In Proc. IEEE Sensors Conference,
    IEEE, pp. 1018‒1023, June 2002. DOI: 10.1109/ICSENS.2002.1037251
    Abstract: ... This paper describes the nonidealities of temperature sensors based on substrate pnp transistors and shows how their influence can be minimized The effects of series resistance, current-gain variation, high-level injection and the Early effect on the accuracy of the PTAT voltage are discussed. The results of measurements made on substrate pnp transistors in a standard 0.5μm CMOS process are presented to show the effects of these nonidealities. It is shown that the modeling of the PTAT voltage can be improved by taking the temperature dependency of the effective emission coefficient into account using the reverse Early effect. With this refinement, the temperature can be extracted from the measurement data with an absolute accuracy of ±0.1°C in the range of -50°C to 130°C.

  1992. Transistor temperature measurement for calibration of integrated temperature sensors
    M. A. P. Pertijs; J. H. Huijsing;
    In Proc. IEEE Instrumentation and Measurement Technology Conference (IMTC),
    IEEE, pp. 755‒758, May 2002. DOI: 10.1109/IMTC.2002.1006936
    Abstract: ... A temperature measurement technique is presented for calibrating packaged integrated temperature sensors. An on-chip bipolar transistor is used to accurately determine the sensor's temperature during calibration. The transistor's base-emitter voltage is measured at three collector currents to find the absolute temperature while compensating for series resistances. The technique does not increase the pin count for a typical smart sensor, as the transistor can be accessed via the supply pins and an existing digital input pin. Measurements on substrate pnp's in a standard CMOS process show that the temperature can be determined with an accuracy of ±0.1°C in the range of -50°C to 130°C.

  1993. Amplifier with stabilization means
    J.H. Huijsing; K-J. de Langen;
    2002.

  1994. Method of performing an assay, apparatus therefor, and a method of manufacturing and apparatus
    V.P. Iordanov; P.M. Sarro; R.F. Wolffenbuttel; M.J. Vellekoop;
    2002. niet eerder gehonnoreerd; WO 02/090945 A2; niet eerder gehonnoreerd.

  1995. Non-linear signal correction
    M. A. P. Pertijs; A. Bakker; J. H. Huijsing;
    Patent, United States 6,456,145, September 2002.

  1996. The effect of mechanical stress on bipolar transistor characteristics
    J.F. Creemer;
    PhD thesis, Delft University of Technology, 2002.

  1997. CMOS-based integrated wavefront sensor
    D.W. de Lima Monteiro;
    PhD thesis, Delft University of Technology, 2002.

  1998. Fabrication technology for through-wafer interconnects
    V.G. Kutchoukov;
    PhD thesis, Delft University of Technology, 2002.

  1999. Reliability of micromechanical thin-film resonators
    R. Kazinczi;
    PhD thesis, Delft University of Technology, 2002.

  2000. Infrared micro-spectrometer based on a multi-slit grating
    S.H. Kong;
    PhD thesis, Delft University of Technology, 2002.

  2001. Macroporous silicon based micromachining
    H. Ohji;
    PhD thesis, Delft University of Technology, 2002.

  2002. A wind-sensor interface using thermal sigma-delta modulation techniques
    K.A.A. Makinwa; J.H. Huijsing;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 92, pp. 280-285, 2001.

  2003. A smart and accurate interface for resistive sensors
    X. Li; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1648-1651, 2001.

  2004. The relationship between microsystem technology and metrology
    R.F. Wolffenbuttel; C.J. Mullem;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1469-1475, 2001.

  2005. An interface circuit for R-C impedance sensors with a relaxation oscillator
    S.N. Nihtianov; G.P. Shterev; B.P. Iliev; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1563-1567, 2001.

  2006. IC fabrication-compatible processing for instrumentation and measurement applications
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1475-1484, 2001.

  2007. Capillary electrophoresis with on-chip four-electrode capacitively coupeled conductivity detection for application in bioanalysis
    R.M. van Guijt; E. Baltussen; G. van der Steen; H. Frank; H. Billiet; T.G.M. Schalkhammer; F.P.J. Laugere; M.J. Vellekoop; A. Berthold; P.M. Sarro; G. van Dedem;
    Electrophoresis,
    Volume 22, pp. 2537-2541, 2001.

  2008. Experimental investigation of piezojunction effect in silicon and its temperature dependence
    F. Fruett; G.C.M. Meijer;
    Electronics Letters,
    Volume 37, Issue 22, pp. 1366-1367, 2001.

  2009. Bulk micromachined electrostatic RMS-to-DC converter
    G. de Graaf; M. Bartek; Z. Xiao; C.J. Mullem; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1508-1512, 2001.

  2010. Impedance measurements with second-order harmonic oscillator for testing food sterility
    S. Nihtianov; G.P. Shterev; N. Petrov; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 4, pp. 976-980, 2001.

  2011. Comparison study of the performance of piston, thin plate and membrane mirrors for correction of turbulence-induced phase distortions
    M. Loktev; D.W. De Lima Monteiro; G. Vdovin;
    Optics Communications,
    Volume 192, pp. 91-99, 2001.

  2012. A CMOS nested-chopper instrumentation amplifier with 100-nV offset
    A. Bakker; K. Thiele; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 35, Issue 12, pp. 1877-1883, 2001.

  2013. A quadrature data-dependent DEM algorithm to improve image rejection of a complex sigma delta modulator
    L.J. Breems; EC. Dijkmans; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 36, Issue 12, pp. 1879-1886, 2001.

  2014. A new sensor structure using the piezojunction effect in PNP lateral transistors
    F. Fruett; G.C.M. Meijer;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 92, pp. 197-202, 2001.

  2015. Integrated silicon: microspectrometers
    S.H. Kong; A. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
    IEEE Instrumentation and Measurement Magazine,
    Volume 4, Issue 3, pp. 34-38, 2001.

  2016. A 1.8-mW CMOS Sigma-Delta modulator with integrated mixer for A/D conversion of IF siignals
    L.J. Breems; E.J. van der Zwan; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 35, Issue 4, pp. 468-475, 2001.

  2017. Infrared micro-spectrometer based on a diffraction grating
    S.H. Kong; D.D.L. Wijngaards; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 92, pp. 88-95, 2001.

  2018. Novel liquid-crystal wafefront correctors with modal control
    A.F. Naumov; M. Loktev; I.R. Guralnik; G. Vdovin;
    Rossiiskaya Akademiya Nauk. Izvestiya. Seriya Fizicheskaya,
    Volume 63, Issue 10, pp. 1998-2003, 2001.

  2019. Microchemical voltage reference using the pull-in of a beam
    E. Cretu; L.A. Machado da Rocha; R.F. Wolffenbuttel;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1504-1507, 2001. niet eerder opgevoerd.

  2020. Capillary electrophoresis with on-chip four-electrode capacitively coupled conductivity for application in bioanalysis.
    R.M. van Guijt; H.A. Baltussen; G. van der Steen; H. Frank; H.A. Billiet; T.G.M. Schalkhammer; F.P.J. Laugere; M.J. Vellekoop; A. Berthold; P.M. Sarro; G. van DedemWK;
    Electrophoresis,
    Volume 22, Issue 12, pp. 2537-2541, 2001.

  2021. Temperature sensors and voltage references implemented in CMOS technology
    G.C.M. Meijer; Guijie Wang; F. Fruett;
    IEEE Sensors Journal,
    Volume 1, Issue 3, pp. 225-234, 2001.

  2022. SC front-end with wide dynamic range
    G.C.M. Meijer; V.P. Jordanov;
    Electronics Letters,
    Volume 37, Issue 22, pp. 1377-1378, 2001.

  2023. Downscaling aspects of a conductivity detector for application in on-chip capillary electrophoresis
    F.P.J. Laugere; W. Lubking; A. Berthold; J. Bastemeijer; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 92, pp. 109-114, 2001.

  2024. Patterning of polyimide and metal in deep trenches
    V.G. Kiutchoukov; J.R. Mollinger; M. Shikida; A. Bossche;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 92, pp. 208-213, 2001.

  2025. The development of micromachined humidity sensors based on a dielectric of porous silicon
    E. Connolly;
    Technische Universiteit Delft, Faculty ITS, , 2001. Del4694.

  2026. Fast and reliable capacitive transducers
    X. Li; G.C.M. Meijer;
    s.n., , 2001. DEL 4540.

  2027. Integrated Hartmann(-Shack) wavefront sensor
    D.W. de Lima Monteiro; G. Vdovin; A. Vilaca; M. Loktev;
    DIMES, TU Delft, , 2001.

  2028. Dedicated smart admittance-sensor systems for the oilfield industry
    B. Iliev; G.C.M. Meijer;
    s.n., , 2001. DMR.5294.

  2029. Continuous-time sigma-delta modulation for A/D conversion in radio receivers
    L.J. Breems; J.H. Huijsing;
    Kluwer Academic Publishers, , 2001.

  2030. Universal sensor interface (USI): preliminary specifications (version 1.0)
    X. Li; G.C.M. Meijer;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2031. High resolution micromachined projection display progress report on october 2000 - april 2001
    S. Sakarya;
    s.n., , 2001. DEL.44.3945.

  2032. System design of the Birgit2 ADC: 4th order single-loop sigmadelta modulator
    M.F. Snoeij;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2033. A theoretical and experimental study of the piezojunction effect in silicon and its application in new sensor structures STW: Del.3908-4
    F. Fruett; G.C.M. Meijer;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2034. Non-destructive sterility and leakage testing of packaged food products by smart impendance measurements: voortgangs rapport 4
    S. Nihtianov; G.C.M. Meijer;
    Technische Universiteit Delft, Faculty ITS, , 2001. DEL 66.4369.

  2035. Reliability issues on MEMS resonators
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    s.n., , 2001. DEL.3780.

  2036. Universal sensor interface (USI): application note (version 1.0)
    X. Li; G.C.M. Meijer; M. van de Lee;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2037. Progress report biomas project
    F.P.J. Laugere; M.J. Vellekoop; A. Bossche;
    s.n., , 2001. NV:DST 4351.

  2038. Resonating things
    J.F. Witte;
    s.n., , 2001.

  2039. Operational amplifiers: theory and design
    J.H. Huijsing;
    Kluwer, , 2001.

  2040. A theoretical and experimental study of the piezojunction effect in silicon and its application in new sensor structures STW: Del.3908-5
    F. Fruett; G.C.M. Meijer;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2041. Fast and reliable capactive transducers (DEL 4540) Report 5
    X. Li;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2042. The development of micromachined humidity sensors based on a dielectric of porous silicon
    E. Connolly;
    Technische Universiteit Delft, Faculty ITS, , 2001.

  2043. Electronic protection of the conductivity detector in a micro capillary electrophoresis channel
    J. Bastemeijer; W. Lubking; F.P.J. Laugere; M.J. Vellekoop;
    {E Obermeier} (Ed.);
    Springer, , pp. 1-4, 2001.

  2044. Thermophysical characterisation of PolySi0,7Ce0,3 for use in thermoelectric devices
    D.D.L. Wijngaards; S.H. Kong; P.M. Sarro; R.F. Wolffenbuttel;
    {E Obermeier} (Ed.);
    Springer, , pp. 1010-1013, 2001.

  2045. The emergence of physical chemosensors and biosensors
    M.J. Vellekoop;
    {E Obermeier} (Ed.);
    Springer, , pp. 1-6, 2001.

  2046. Fabrication and optical measurements of multi-slit grating based infrared micro-spectrometer
    S.H. Kong; D.D.L. Wijngaards; G. de Graaf; R.F. Wolffenbuttel;
    {E Obermeier} (Ed.);
    Springer, , pp. 548-551, 2001.

  2047. Si based thin-film filter with high visible-over-UV selectivity for biochemical fluorescence analysis
    V.P. Jordanov; W. Lubking; R. Ishihara; R.F. Wolffenbuttel; P.M. Sarro; M.J. Vellekoop;
    {E Obermeier} (Ed.);
    Springer, , pp. 1-4, 2001.

  2048. Using the pull-in voltage as voltage reference
    E. Cretu; D. Rocha; R.F. Wolffenbuttel;
    {E Obermeier} (Ed.);
    Springer, , pp. 1-3, 2001.

  2049. Evaluation of an oscilloscope training course
    G. de Graaf; D.D.L. Wijngaards; R.F. Wolffenbuttel;
    University of Twente, , pp. 67-74, 2001.

  2050. Silicon photodetectors with a selective spectral response
    R.F. Wolffenbuttel;
    {H. Baltes}; {J Hesse}; {J.G. Korvink} (Ed.);
    Wiley, , pp. 69-101, 2001.

  2051. Polycrystalline silicon thin-film on glass as a UV filter for NADH fluorescence measuremants
    V.P. Jordanov; R. Ishihara; P.M. Sarro; M.J. Vellekoop; R.F. Wolffenbuttel; J. Bastemeijer; A. Bossche;
    STW Technology Foundation, , pp. 799-802, 2001.

  2052. Integrated high rejection filter for NADH fluorescence measuremnts
    V.P. Jordanov; W. Lubking; P.M. Sarro; R.F. Wolffenbuttel; M.J. Vellekoop;
    AMA Service, , pp. 107-111, 2001.

  2053. Design of a pull-in voltage reference structure
    D. Rocha; E. Cretu; R.F. Wolffenbuttel;
    s.n., , pp. 285-288, 2001.

  2054. Temperature profile comparison of various substrate geometries for passive heat sinks
    D.D.L. Wijngaards; G. de Graaf; S.H. Kong; R.F. Wolffenbuttel;
    s.n., , pp. 143-146, 2001.

  2055. Measuring liquid volumes in sub-nanoliter wells.
    I.T. Young; K.T. Hjelt; L.R. van den Doel; M.J. Vellekoop; L. van VlietJ;
    RP Mariella; DV Nicolau (Ed.);
    SPIE, , pp. 75-80, 2001.

  2056. Study of the behaviour of various substrate geometries for use as passive heat sink
    D.D.L. Wijngaards; G. de Graaf; S.H. Kong; R.F. Wolffenbuttel;
    {M Elwenspoek} (Ed.);
    Kluwer, , pp. 47-52, 2001.

  2057. A high-performance universal sensor interface
    X. Li; G.C.M. Meijer; R. de Boer;
    In SIocn'01: conference proceedings,
    IEEE, pp. 19-22, 2001.

  2058. Dedicated interface electronics for capacitively-coupeled conductivity detection in one-chipcapillary electophoresis
    F.P.J. Laugere; W. Lubking; J. Bastemeijer; M.J. Vellekoop;
    In {E Obermeier} (Ed.), Transducers'01: technical papers. Vol. 2,
    Springer, pp. 60-63, 2001.

  2059. CCD or CMOS image sensors for consumer digital still photography?
    A.J.P. Theuwissen;
    In VLSI'2001: proceedings,
    IEEE, pp. 168-171, 2001.

  2060. Experimental verification of an improved method for conductivity detection in on-chip capillary electrophoresis systems
    F.P.J. Laugere; A. Berthold; W. Lubking; J. Bastemeijer; R.M. van Guijt; E. Baltussen; P.M. Sarro; M.J. Vellekoop;
    In {E Obermeier} (Ed.), Transducers'01: technical papers. Vol.2,
    Springer, pp. 1178-1181, 2001.

  2061. CMOS integrated wavefront sensor
    D.W. De Lima Monteiro; G. Vdovin; M. Loktev;
    In Transducers'01: technical papers,
    Springer, pp. 532-535, 2001.

  2062. Single-chip low voltage analog-to-digital interface for encapsulation with electret microphone
    O. Bajdechi; J.H. Huijsing;
    In Transducers'01: technical papers,
    Springer, pp. 122-125, 2001.

  2063. The scaling of multiple sensor signals with a wide dynamic voltage range
    Guijie Wang; G.C.M. Meijer;
    In {E Obermeier} (Ed.), Transducers '01: technical papers Vol 1,
    Springer, pp. 84-87, 2001.

  2064. An electronic technique for the detection of localized tiny motions in the wall of the urinary bladder
    W.A. van Duyl; L.M. Kosterman; J.V. de Bakker;
    In Tenth international scientific and applied science conference electronics ET'2000: proceedings of the conference book 1,
    Technical University Sofia, pp. 67-72, 2001. niet eerder opgevoerd.

  2065. CMOS thermopiles for wafer-thick wind sensor
    SP. Matova; K.A.A. Makinwa; J.H. Huijsing;
    In {et al.}; DR Ivanov (Ed.), The tenth international scientific and applied science conference electronics ET'2001; proceedings of the conference book 1,
    Technical University Sofia, pp. 89-94, 2001.

  2066. Industrial design of a solid-state wind sensor
    K.A.A. Makinwa; J.H. Huijsing; A. Hagedoorn;
    In SIcon'01: proceedings,
    IEEE, pp. 68-71, 2001.

  2067. A single-chip analog-to-digital conversion system for audio codecs
    O. Bajdechi; J.H. Huijsing;
    In SCI 2001: proceedings CD-ROM,
    International Institute of Informatics and Systems, pp. 1-5, 2001.

  2068. Technology of reflective membranes for spatial light modulators
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In {E Obermeier} (Ed.), Tansducers'01: technical papers,
    Springer, pp. 1336-1339, 2001.

  2069. A multi-period interface system for impedance measurements
    B. Iliev; S. Nihtianov; G.P. Shterev; G.C.M. Meijer;
    In SIcon'01:conference proceedings,
    IEEE, pp. 276-280, 2001.

  2070. Dry etching release of structures in post-processing surface micromachining using polyimide as a sacrificial layer
    A. Bagolini; H.M.T. Pham; T.L.M. Scholtes; L. Pakula; P.M. Sarro;
    In SAFE2001: proceedings,
    STW Technology Foundation, pp. 769-772, 2001.

  2071. Photoresist wells for integrated high-speed screening arrays
    B.L. Gray; R. Moerman; L.R. van den Doel; V.P. Jordanov; P.N. Pham; P.M. Sarro; A. Bossche; M.J. Vellekoop;
    In SAFE - ProRISC - SeSense 2001: proceedings. Semiconductor Advances for Future Eelctornics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 791-794, 2001.

  2072. FEM study on the dependence of resonant frequency shift on mechanical stress of thin film resonator
    SS. Lee; R. Kazinczi; J.R. Mollinger; M.J. Vellekoop; A. Bossche;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Fututre Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 817-820, 2001.

  2073. New fabrication technology for wafer-through hole interconnects
    V.G. Kiutchoukov; E. Boellaard; J.R. Mollinger; A. Bossche;
    In SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 813-817, 2001.

  2074. Three dimensional computer model of a smart wind sensor
    SP. Matova; J.H. Huijsing;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductors Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 834-838, 2001.

  2075. Movement sensor for art application
    G. Chao; G.C.M. Meijer;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 795-798, 2001.

  2076. Photodiode structures to measure the shape of particles and cells
    J.H. Nieuwenhuis; SS. Lee; J. Bastemeijer; A. Bossche; M.J. Vellekoop;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 839-842, 2001.

  2077. Flexible silicon micromachined structures for use in integrated spatial light modulators
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 861-864, 2001.

  2078. Acoustic sensor system for measuring position and orientation of laproscopic instruments in minimal invasive surgery
    F. Tatar; J.R. Mollinger; R.C. den Dulk; W.A. van Duyl; A. Bossche;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 873-877, 2001.

  2079. Fast measurement systems for determination the position on a resistive touch-screen
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 761-764, 2001.

  2080. Customized CMOS imager as wavefront sensor
    D.W. De Lima Monteiro; G. Vdovin; M. Loktev;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 821-824, 2001.

  2081. 3- D resonator bridges as sensing elements
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In SAFE - ProRISC - SeSens 2001: proceeding. Semiconductor Advances for Future Electronics - Program for Research on Integrated System and Circuits - Semiconductor sensor and Actuator Technology,
    STW Technology Foundation, pp. 803-808, 2001.

  2082. Optimization of signal-to-noise and signal-to-ofset performance of an integrated thermopile sensor interfaced by a chopper amplifier
    SP. Matova; J.H. Huijsing;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 496-499, 2001.

  2083. A wind sensor with an integrated chopper amplifier
    K.A.A. Makinwa; J.H. Huijsing;
    In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 830-833, 2001.

  2084. A Novell method of reading the time-domain sensor signals
    G. Chao; G.C.M. Meijer;
    In SAFE - ProRISC - SeSens 2001: proceeding. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology,
    STW Technology Foundation, pp. 371-373, 2001.

  2085. Sigma-delta A/D converter using a high-ripple Chebyshev loop filter
    M.F. Snoeij; O. Bajdechi; J.H. Huijsing;
    In ProRISC 2001: proceedings CD-ROM,
    STW Technology Foundation, pp. 619-622, 2001.

  2086. Design of low-cost resonant mode sensors
    R. Kazinczi; P.B. Turmezei; J.R. Mollinger; A. Bossche;
    In {PD Franzon} (Ed.), Proceedings of SPIE Vol. 4593,
    SPIE Press, pp. 54-61, 2001.

  2087. Novel wafer-through technique for interconnects
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    In {PD Franzon} (Ed.), Proceedings of SPIE Vol. 4593,
    SPIE Press, pp. 274-282, 2001.

  2088. Measuring liquid volumes in sub-nanoliter wells
    I.T. Young; K.T. Hjelt; L.R. van den Doel; M.J. Vellekoop; L. van VlietJ;
    In {RP Mariella}; {DV Nicolau} (Ed.), Proceedings of SPIE. Vol. 4265,
    SPIE Press, pp. 75-80, 2001.

  2089. Static and dynamic models of liquid crystal wavefront correctors
    M. Loktev; A.F. Naumov; I.R. Guralnik;
    In {LN Soms}; {VE Sherstobitov} (Ed.), Proceedings of SPIE. Vol. 4353,
    SPIE Press, pp. 9-16, 2001.

  2090. A Quadrature data-dependent DEM alogorithm to improve image rejection of a complex sigma delta Modular
    L.J. Breems; EC. Dijkmans; J.H. Huijsing;
    In Proceedings ISSCC 2001,
    IEEECircuits and Systems Society, pp. 48, 49-en 428, 2001.

  2091. Technology for spatial light modulators based on reflective silicon structures
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 25-30, 2001.

  2092. Forming rounded convex corner by using two-step anisotropic koh wet etching
    V.G. Kiutchoukov; M. Shikida; M. Bao; J.R. Mollinger; A. Bossche;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 161-166, 2001.

  2093. Editorship:
    J.H. Huijsing; A.H.M. van Roermund; M. Steyaert;
    In Proceedings AACD 2001,
    s.n., pp. -, 2001.

  2094. Measurement system for biochemical analysis based on capillary electrophoresis and microscale conductivity detection
    F.P.J. Laugere; A. Berthold; R.M. van Guijt; E. Baltussen; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 1-6, 2001.

  2095. An accurate measurement system for thermopiles
    P. Avramov; X. Li; G.C.M. Meijer; M. van de Lee;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 167-172, 2001.

  2096. A 1.8 Sigma-Delta modulator interface for electret microphone with on-chip reference
    O. Bajdechi; J.H. Huijsing;
    In Proceedings,
    IEEE, pp. 31-34, 2001.

  2097. The piezojunction effect as an alternative to the piezoresistive effect for low-power silicon mechanical-stress micro sensors
    F. Fruett; G.C.M. Meijer;
    In Proceedings,
    s.n., pp. 169-170, 2001.

  2098. Thermopile design for a cmos wind-sensor
    K.A.A. Makinwa; SP. Matova; J.H. Huijsing;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 77-82, 2001.

  2099. A low-cost and accurate conductance-measurement system
    X. Li; G.C.M. Meijer;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 143-147, 2001.

  2100. Coplanar waveguides and butt-joints on InP
    J.H. den Besten; D. Caprioli; L. Pakula; E. Smalbrugge; T. de Vries; J.J.M. Kwaspen; A.W. Roodnat; R. van Dijk; {van Vliet}, FE; XJM Leijtens; MK Smit;
    In {H Thienpont} (Ed.), Proceedings,
    VUBPress, pp. 197-200, 2001.

  2101. Low-cost system to determenate the X-Y position in a resistive touch-screen
    R.N. Aguilar Cardenas; G.C.M. Meijer;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 65-69, 2001.

  2102. Particle-shape sensing-elements for integrated flow cytometer
    J.H. Nieuwenhuis; SS. Lee; J. Bastemeijer; M.J. Vellekoop;
    In {JM Ramsey}; {A Berg}, {van den} (Ed.), Proceedings,
    Kluwer, pp. 357-358, 2001.

  2103. Constant power operation of a two-dimensional flow sensor using thermal sigma-delta modulation techniques
    K.A.A. Makinwa; J.H. Huijsing;
    In IMTC'2001: proceedings,
    IEEE, pp. 1577-1580, 2001.

  2104. Polyimide sacrificial layer for postprocessing surface micromachining
    A. Bagolini; T.L.M. Scholtes; H.M.T. Pham; L. Pakula; P.M. Sarro;
    In MME 2001,
    s.n., pp. 58-61, 2001.

  2105. A wind-sensor with integrated interface electronics
    K.A.A. Makinwa; J.H. Huijsing;
    In ISCAS'2001: CD-ROM,
    IEEE, pp. 356-359, 2001.

  2106. A 4th-order switched-capacitor sigma-delta A/D convertor using a high-ripple Chebyshev loop filter
    M.F. Snoeij; O. Bajdechi; J.H. Huijsing;
    In ISCAS 2001: CD-ROM,
    IEEE, pp. 615-618, 2001.

  2107. IC-compatible optical sensor for adaptive optics
    D.W. De Lima Monteiro; G. Vdovin; M. Loktev;
    In IMOC 2001: proceedings,
    IEEE, pp. 513-516, 2001.

  2108. A wind sensor with an integrated low-offset instrumentation amplifier
    K.A.A. Makinwa; J.H. Huijsing;
    In ICECS 2001: proceedings,
    IEEE, pp. 1505-1508, 2001.

  2109. Corner rounding-powerful tool for uniform photoresist coating
    V.G. Kutchoukov; M. Bao; M. Shikida; J.R. Mollinger; A. Bossche;
    In Electronics ET'2001: proceedings of the conference book 1,
    Technical University Sofia, pp. 73-80, 2001. niet eerder opgevoerd.

  2110. Movement sensor for art application
    C. Guan; G.C.M. Meijer;
    In Electronics ET'2001: proceedings of the conference book 2,
    Technical University Sofia, pp. 81-86, 2001. niet eerder opgevoerd.

  2111. Experimental verification of an improved method for conductivity detection in on-chip capillary electrophoresis systems.
    F.P.J. Laugere; A. Berthold; G.W. Lubking; J. Bastemeijer; R.M. van Guijt; H.A. Baltussen; P.M. Sarro; M.J. Vellekoop;
    In Digest of techn. papers of tranducers '01,
    pp. 1178-1181, 2001.

  2112. A capactive-sensor interface circuit based on a first-order charge-balanced sc-oscillator
    X. Li; G.C.M. Meijer;
    In IMTC 2001: proceedings,
    IEEE, pp. 282-285, 2001.

  2113. A smart wind sensor using time-multiplexed thermal Sigma-Delta modulators
    K.A.A. Makinwa; J.H. Huijsing;
    In ESSCIRC 2001: proceedings,
    Frontier Group, pp. 460-463, 2001.

  2114. A measurement system for thermopiles with temperature compensation
    P.M. Avramov; G.C.M. Meijer; H.M.M. Kerkvliet;
    In Electronics ET'2001: The tenth international scientific and applied science conference,
    Technical University Sofia, pp. 116-120, 2001. niet eerder opgevoerd.

  2115. Low-cost system for measuring plasma resistance
    B.P. Iliev; G.A.M. Pop; G.C.M. Meijer;
    In Electronics ET'2001: proceedings of the conference book 1,
    Technical University Sofia, pp. 44-48, 2001. niet eerder opgevoerd.

  2116. A batch-calibrated smart temperature sensor with second-order curvature correction
    M. A. P. Pertijs; A. Bakker; J. H. Huijsing;
    In Annual Workshop on Semiconductor Sensors (SeSens),
    The Netherlands, pp. 852‒855, November 2001.

  2117. Inexpensive mems packaging
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In {M Elwenspoek} (Ed.), Proceedings,
    Kluwer, pp. 59-64, 2001.

  2118. An Accurate CMOS Smart Temperature Sensor with Dynamic Element Matching and Second-Order Curvature Correction
    M. A. P. Pertijs; A. Bakker; J. H. Huijsing;
    In Proc. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS),
    Springer Berlin Heidelberg, pp. 80‒83, June 2001. DOI: 10.1007/978-3-642-59497-7_18
    Abstract: ... A CMOS temperature sensor with digital bus interface is presented that combines dynamic element matching and second-order curvature correction to improve the accuracy. An error analysis is presented which shows that the remaining inaccuracy is determined by the process spread of substrate bipolar transistors. This spread is significantly less within a batch than between batches. Therefore, all sensors within a batch can be calibrated in the same way, leading to a three-sigma accuracy of ±1.5°C in the range of −50 to 120°C.

  2119. A high-accuracy temperature sensor with second-order curvature correction and digital bus interface
    M. A. P. Pertijs; A. Bakker; J. H. Huijsing;
    In Proc. IEEE International Symposium on Circuits and Systems (ISCAS),
    IEEE, pp. 368‒371, May 2001. DOI: 10.1109/ISCAS.2001.921869
    Abstract: ... A high-accuracy CMOS temperature sensor with integrated bus interface is presented. It is shown that when offset cancellation and dynamic element matching techniques are applied, the accuracy of the sensor is mainly limited by process spread between batches on the substrate bipolar transistors. Therefore, the sensors can be calibrated per batch instead of per sensor. In combination with a second-order curvature correction technique, this results in a three-sigma accuracy of ±1.5°C over the full temperature range.

  2120. A smart wind-sensor based on thermal sigma-delta modulation
    K.A.A. Makinwa; J.H. Huijsing;
    In Transducers ’01 Eurosensors XV,
    Springer, pp. 1-4, 2001. DOI: 10.1007/978-3-642-59497-7

  2121. Voltage and/or current reference circuit
    K.J. de Langen; J.H. Huijsing;
    2001.

  2122. Circuit comprising means for reducing the dc-offset and the noise produced by an amplifier
    A. Bakker; J.H. Huijsing;
    2001.

  2123. Current generator for delivering a reference current of which the value is proportional to the absolute temperature
    A. Bakker; J.H. Huijsing;
    2001.

  2124. Non-linear signal correction
    M. A. P. Pertijs; A. Bakker; J. H. Huijsing;
    Patent, WO PCT/EP2001/011,288, September 2001.

  2125. Design of low power analog to digital converters
    M. Djurica;
    PhD thesis, Delft University of Technology, 2001.

  2126. Continuous-time sigma-delta modulation for IF A/D conversion in radio receivers
    L.J. Breems;
    PhD thesis, Delft University of Technology, 2001.

  2127. Versatile tool for characterising long-term stability and reliabity of micromechanical structures
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, Issue 1-3, pp. 84-89, 2000.

  2128. Spectral analysis through electromechanical coupling
    E. Cretu; M. Bartek; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, Issue 1-3, pp. 23-32, 2000.

  2129. Wave front control systems based on modal liquid crystal lenses
    M. Loktev; V.N. Belopukhov; F.L. Vladimirov; G. Vdovin; G.D. Love; A.F. Naumov;
    Review of Scientific Instruments,
    Volume 71, Issue 9, pp. 3290-3297, 2000.

  2130. Temperature-compensated Love-wave sensors on quartz substrates
    B.H. Jakoby; J. Bastemeijer; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 82, Issue 1-3, pp. 83-88, 2000.

  2131. The temperature characteristics of bipolar transistors fabricated in CMOS technology
    Guijie Wang; G.C.M. Meijer;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 87, pp. 81-89, 2000.

  2132. Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers
    A. Berthold; L. Nicola; P.M. Sarro; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 82, Issue 1-3, pp. 224-238, 2000.

  2133. Ultraviolet-selective avalanche photodiode
    A. Pauchard; P.A. Besse; M. Bartek; R.F. Wolffenbuttel; R.S. Popovic;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 82, Issue 1-3, pp. 128-134, 2000.

  2134. A CMOS nested-chopper instrumentation amplifier with 100-nV offset
    A. Bakker; K. Thiele; J.H. Huijsing;
    IEEE Journal of Solid State Circuits,
    Volume 35, Issue 12, pp. 1877-1883, 2000.

  2135. New photoresist coating method for 3-D structured wafers
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, Issue 1-3, pp. 377-383, 2000.

  2136. Substrates for zero temperature coefficient Love wave sensors
    B.H. Jakoby; M.J. Vellekoop;
    IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control,
    Volume 47, Issue 3, pp. 701-705, 2000.

  2137. Single-chip CMOS optical microspectrometer
    J.H.G. Correia; G. de Graaf; S.H. Kong; M. Bartek; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 82, Issue 1-3, pp. 191-197, 2000.

  2138. Measurement and compensation of Piezoresistive coefficient Pi 44 for minority-carrier concentration
    F. Fruett; G.C.M. Meijer;
    Electronics Letters,
    Volume 36, Issue 2, pp. 173-175, 2000.

  2139. The Piezojunction effect in NPN and PNP vertical transistors and its influence on silicon temperature sensors
    F. Fruett; Guijie Wang; G.C.M. Meijer;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, Issue 1-3, pp. 70-74, 2000.

  2140. Elimination of shunting conductance effects in a low-cost capacitive-sensor interface
    X. Li; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 49, Issue 3, pp. 531-534, 2000.

  2141. High-selectivity single-chip spectrometer in silicon for operation at visible part of the spectrum
    J.H.G. Correia; M. Bartek; R.F. Wolffenbuttel;
    IEEE Transactions on Electron Devices,
    Volume 47, Issue 3, pp. 553-559, 2000.

  2142. Analysis of a biphase-based servo format for hard-disk drives
    K.A.A. Makinwa; J.W.M. Bergmans; J.O. Voorman;
    IEEE Transactions on Magnetics,
    Volume 36, Issue 6, pp. 4019-4027, 2000.

  2143. High-resolution liquid volume detection in sub-nanoliter reactors
    K.T. Hjelt; L.R. van den Doel; W. Lubking; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 83, pp. 61-66, 2000.

  2144. Measuring liquid evaporation from micromachined wells
    K.T. Hjelt; L.R. van den Doel; W. Lubking; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, Issue 1-3, pp. 384-389, 2000.

  2145. Elimination of shunting conductance effects in a low-cost capacitive-sensor interface
    X. Li; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 49, Issue 3, pp. 531-534, 2000.

  2146. FFT-based analysis of periodic structures in microacoustic devices
    B.H. Jakoby; M.J. Vellekoop;
    IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control,
    Volume 47, Issue 3, pp. 651-656, 2000.

  2147. Modulation characteristics of optically controllable transparencies based on a photoconductor-liquid-crystal structure
    F.L. Vladimirov; A.N. Chaika; I.E. Morichev; N.I. Pletneva; A.F. Naumov; M. Loktev;
    Journal of Optical Technology,
    Volume 67, Issue 8, pp. 712-715, 2000.

  2148. Analysis of viscous losses in the chemical interface layer of Love wave sensors
    B.H. Jakoby; M.J. Vellekoop;
    IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control,
    Volume 47, Issue 3, pp. 696-700, 2000.

  2149. The influence of electric-field bending on the nonlinearity of capacitive sensors
    X. Li; G. de Jong; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 49, Issue 2, pp. 256-259, 2000.

  2150. Measuring liquid evaporation from micromachined wells.
    K.T. Hjelt; L.R. van den Doel; G.W. Lubking; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, pp. 384-389, 2000. ISSN: 0924-4247.

  2151. A high-temperature electronic system for pressure-transducers
    P.C. de Jong; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 49, Issue 2, pp. 365-370, 2000.

  2152. Design and fabrication of on-chip integrated polySiGe and polySi Peltier devices
    D.D.L. Wijngaards; S.H. Kong; M. Bartek; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 85, Issue 1-3, pp. 316-323, 2000.

  2153. Focusing of astigmatic laser diode beam by combination of adaptive liquid crystal lenses
    J.J. Kelly; A.F. Naumov; M. Loktev; M.A. Rakhmatulin; O.A. Zayakin;
    Optics Communications,
    Volume 181, pp. 295-301, 2000.

  2154. A Sigma Delta modulator for electret microphone readout: report for project BRIGIT I: part 2 - Circuit design, measurements results [confidential]
    O. Bajdechi;
    s.n., , 2000. IMOi7005G.

  2155. Editorship
    J.H. Huijsing;
    {W Sansen}; {R Plassche}, {van de} (Ed.);
    s.n., , 2000.

  2156. High-accuracy CMOS smart temperature sensors
    A. Bakker; J.H. Huijsing;
    Kluwer, , 2000.

  2157. Fast and reliable capactive transducers (DEL 4540) Report 4
    X. Li;
    Technische Universiteit Delft, Faculty ITS, , 2000.

  2158. High resolution micromachined projection display progress report on February - October 2000
    S. Sakarya;
    s.n., , 2000.

  2159. High resolution micromachined projection display progress report on April 1999 - February 2000
    S. Sakarya;
    s.n., , 2000.

  2160. Sensor application in ATAG ovens
    F.R. Riedijk;
    Faculty of Information Technology and Systems, TU Delft, , 2000.

  2161. A Sigma Delta modulator for electret microphone readout: report for Project Birgit I. Part 1: system level design [confidential: contract IS 990048]
    O. Bajdechi;
    s.n., , 2000. IMOi7005 G.

  2162. Haalbaarheids studie sensoren innovatieve gaskookplaat
    F.R. Riedijk;
    Faculty of Information Technology and Systems, TU Delft, , 2000.

  2163. Report on moulding experiments with soft structured mould inserts
    A. Bossche;
    s.n., , 2000.

  2164. The influence of the Piezojunction effect at different temperatures on the accuracy of silicon temperature sensors
    F. Fruett; G.C.M. Meijer;
    s.n., , pp. 153-157, 2000.

  2165. An accurate, low-cost resistive-sensor interface with a multiple-signal calibration technique
    X. Li; G.C.M. Meijer;
    {C Nemarich} (Ed.);
    IEEE, , pp. 281-284, 2000.

  2166. Interface circuit for impedance measurement to test sterility of food products
    S. Nihtianov; G.P. Shterev; N. Petrov; G.C.M. Meijer;
    {C Nemarich} (Ed.);
    IEEE, , pp. 687-691, 2000.

  2167. A novel technique to measure two independent components of impedance sensors with a simple relaxation oscillator
    S. Nihtianov; G.P. Shterev; B. Iliev; G.C.M. Meijer;
    {C Nemarich} (Ed.);
    IEEE, , pp. 674-678, 2000.

  2168. Nanoliter droplet behavior in micromachined wells
    K.T. Hjelt; W. Lubking; M.J. Vellekoop; L. van VlietJ; L.R. van den Doel; A. Greiner; J.G. Korvink;
    {H. Baltes}; {W Göpel}; {J Hesse} (Ed.);
    Wiley, , pp. 39-70, 2000.

  2169. Nanoliter Droplet Behavior in Micromachined Wells.
    K.T. Hjelt; G.W. Lubking; M.J. Vellekoop; L. van VlietJ; L.R. van den Doel; A. Greiner; J.G. Korvink;
    H. Baltes; W Gopel; J Hesse (Ed.);
    Wiley-VCH, , pp. 39-72, 2000.

  2170. Post-processing modules in IC-compatible microsystem fabrication
    D.D.L. Wijngaards; R.F. Wolffenbuttel;
    {R.F. Wolffenbuttel}; {D.D.L. Wijngaards}; {C.J. Mullem}, van (Ed.);
    s.n., , pp. 41-58, 2000.

  2171. Editorship
    R.F. Wolffenbuttel; D.D.L. Wijngaards; C.J. van Mullem;
    s.n., , pp. -, 2000.

  2172. Optical characterization of silicon-compatible materials
    R.F. Wolffenbuttel;
    {R.F. Wolffenbuttel}; {D.D.L. Wijngaards}; {C.J. Mullem}, van (Ed.);
    s.n., , pp. 79-90, 2000.

  2173. Modelling of integrated Peltier elements
    D.D.L. Wijngaards; E. Cretu; S.H. Kong; R.F. Wolffenbuttel;
    {M Laudon}; {B Romanowicz} (Ed.);
    Computational publications, , pp. 652-655, 2000.

  2174. Fabrication and application of on-chip integrated polySiGe and polySi Peltier elements
    D.D.L. Wijngaards; S.H. Kong; R.F. Wolffenbuttel;
    {Y Bäcklund}; {C Hedlund} (Ed.);
    s.n., , pp. 1-4, 2000.

  2175. Fabrication of an integrated silicon infrared micro-spectrometer
    S.H. Kong; D.D.L. Wijngaards; R.F. Wolffenbuttel;
    {Y Bäcklund}; {C Hedlund} (Ed.);
    s.n., , pp. 1-4, 2000.

  2176. Bulk-micromachined electrostatic RMS-to-DC converter: design and fabrication
    M. Bartek; Z. Xiao; C.J. van Mullem; R.F. Wolffenbuttel;
    s.n., , pp. 1-4, 2000.

  2177. Imaging spectrometry and petroleum geology
    F.D. van der Meer; H. Yang; S.B. Kroonenberg; H. Lang; P. Dijk; K.H. Scholte; H. van der Werff;
    {van der Meer}, F; {de Jong}, S (Ed.);
    Kluwer Academic Publishers, , pp. 219-238, 2000.

  2178. Modelling of integrated polySiGe Peltier elements
    D.D.L. Wijngaards; E. Cretu; S.H. Kong; R.F. Wolffenbuttel;
    s.n., , pp. 1-4, 2000.

  2179. Aantrekkelijk technisch onderwijs (IWEE)
    M.J. Vellekoop;
    s.n., , pp. 1-2, 2000.

  2180. Infrared micro-spectrometer based on a diffraction grating
    S.H. Kong; D.D.L. Wijngaards; M. Bartek; R.F. Wolffenbuttel;
    {R Reus}, de; {S Bouwstra} (Ed.);
    Mikroelektronik Centret, , pp. 321-324, 2000.

  2181. A novel switched-capacitor front end for capacitive sensors with wide dynamic range
    G.C.M. Meijer; V.P. Jordanov;
    In The eight national scientific and applied conference ELECTRONICS '99: proceedings book 1,
    Technical University Sofia, pp. 24-29, 2000.

  2182. A new concept for impedance sensor interfacing with first order oscillator
    S. Nihtianov; G.C.M. Meijer;
    In The eight national scientific and applied conference ELECTRONICS '99: proceedings book 1,
    Technical University Sofia, pp. 62-67, 2000.

  2183. A mechanical stress factor using the Piezojunction effect
    F. Fruett; G.C.M. Meijer;
    In {JP Veen} (Ed.), SAFE-ProRisc-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 633-638, 2000.

  2184. Coating of deep anisotropically etched grooves with polymide and photoresist
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 655-658, 2000.

  2185. Integrated shape sensor for particles and cells based on optical projection
    J.H. Nieuwenhuis; W. Lubking; A. Berthold; P.M. Sarro; M.J. Vellekoop;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 669-672, 2000.

  2186. Long-term stability of SiC resonators
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 647-650, 2000.

  2187. Fluorescence analysis in subnanoliter reactor wells: evaluation of different possible illumination configurations
    V.P. Jordanov; W. Lubking; P.M. Sarro; M.J. Vellekoop;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 643-645, 2000.

  2188. Technology of reflective micromachined pixelated membranes for use in spatial light modulators
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 689-691, 2000.

  2189. A low-cost, high-performance universal sensor interface
    X. Li; G.C.M. Meijer; P. Avramov; M. van de Lee;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 659-663, 2000.

  2190. Two-step glass wet-etching for micro-fluidic devices
    A. Berthold; P.M. Sarro; M.J. Vellekoop;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 613-616, 2000.

  2191. A new concept for impedance sensor interfacing with first order oscillator
    S. Nihtianov; G.C.M. Meijer;
    In Proceedings, book 1,
    Technical University Sofia, pp. 62-67, 2000.

  2192. An accurate switched-capacitor amplifier with a rail-to-rail CM input range
    Guijie Wang; G.C.M. Meijer;
    In {JP Veen} (Ed.), SAFE-ProRISC-SeSens 2000: proceedings,
    STW Technology Foundation, pp. 703-707, 2000.

  2193. Nanometer-scale height measurements in micromachined picoliter vials based on interference fringe analysis
    L.R. van den Doel; L. van VlietJ; K.T. Hjelt; M.J. Vellekoop; F. Gromball; J.G. Korvink; I.T. Young;
    In {A Sanfeliu} (Ed.), Proceedings vol. 3: Image, speech and signal processing,
    IEEE Computer Society, pp. 57-62, 2000.

  2194. A novel switched-capacitor front end for capacitive sensors with wide dynamic range
    G.C.M. Meijer; V.P. Jordanov;
    In Proceedings, book 1,
    Technical University Sofia, pp. 24-29, 2000.

  2195. Features and limitations of CMOS voltage references
    G.C.M. Meijer; Guijie Wang;
    In Proceedings, book 1,
    Technical University Sofia, pp. 17-23, 2000.

  2196. Determination of viscocity channges of cement paste with a smart lamb-wave sensor system
    A. van Beek; A. Fransen; M.J. Vellekoop; K. van Breugel; A. Bosman;
    In A Nonat (Ed.), Proceedings of the international conference on hydration and settin,
    RILEM publications, pp. 329-338, 2000.

  2197. Accurate DEM SC amplification of small differential voltage signal with CM level from ground to Vdd
    Guijie Wang; G.C.M. Meijer;
    In {VK Varadan} (Ed.), Proceedings of SPIE, vol. 3990,
    International Society for Optical Engineering, pp. 36-42, 2000.

  2198. Modal control principle: a new way to the design of liquid crystal adaptive optics devices
    I.R. Guralnik; M. Loktev; A.F. Naumov;
    In {VP Lukin} (Ed.), Proceedings of SPIE Vol. 4338,
    SPIE Press, pp. 171-181, 2000.

  2199. Environment induced failure modes of thin film resonators
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In {AR Wilson}; {H Asanuma} (Ed.), Proceedings of SPIE. Vol. 4234,
    International Society for Optical Engineering, pp. 1-11, 2000.

  2200. Multisensing in subnanoliter high-speed screening (HSS) arrays.
    M.J. Vellekoop; K.H. Hjelt; G.W. Lubking; J. Bastemeijer; P.M. Sarro; T.G.M. Schalkhammer; D. Criado; V.P. Iordanov;
    In Proceedings of Eurosensors XIV. 14th European conference on solid state transducers. Copenhagen, August 2000.,
    pp. 39-42, 2000.

  2201. A low-cost, high-performance universal sensor interface
    X. Li; G.C.M. Meijer; P. Avramov; M. van de Lee;
    In Proceedings,
    STW Technology Foundation, pp. 659-663, 2000.

  2202. Nanometer-Scale Height Measurements in Micromachined Picoliter Vials based on Interference Fringe Analysis.
    L.R. van den Doel; L. van VlietJ; K.T. Hjelt; M.J. Vellekoop; F. Gromball; J.G. Korvink; I.T. Young;
    In A Sanfeliu; JJ Villanueva; M Vanrell; R Alquezar; T Huang; J Serra (Ed.), ICPR15, Proc. 15th Int. Conference on Pattern Recognition,
    IEEE Computer Society Press, pp. 57-62, 2000. ISSN: 1051-4651.

  2203. Microarrays for biotechnology: The imaging challenge.
    L.R. van den Doel; M.J. Vellekoop; P.M. Sarro; R. Moerman; J. Frank; G. van DedemWK; K.T. Hjelt; L. van VlietJ; I.T. Young;
    In YJ Zhang (Ed.), Proceedings ICIG'2000, First International Conference on Image and Graphics,
    pp. 36-41, 2000. ISSN: 1006-8961.

  2204. New failure mechanism in silicon nitride resonators
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In MEMS 2000: proceedings,
    IEEE, pp. 229-234, 2000.

  2205. Down-scale problems of resonant SiC devices
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In {AP Lee} (Ed.), Micro-Electro-Mechanical Systems (MEMS) 2000, vol. 2,
    ASME, pp. 221-225, 2000.

  2206. A wind-sensor interface based on thermal sigma-delta modulation
    K.A.A. Makinwa; J.H. Huijsing;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 294-252, 2000.

  2207. Integration of a Hartmann-Shack wavefront sensor
    D.W. de Lima Monteiro; G. Vdovin; P.M. Sarro;
    In {G.D. Love} (Ed.), Proceedings,
    World Scientific, pp. 215-220, 2000.

  2208. Exploring limits for the design of a miniaturized contactless conductivity detector for on-chip capillary electrophoresis
    F.P.J. Laugere; W. Lubking; A. Berthold; J. Bastemeijer; M.J. Vellekoop;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 791-794, 2000.

  2209. Multisensing in subnanoliter high-speed screening (HSS) arrays
    M.J. Vellekoop; K.T. Hjelt; W. Lubking; J. Bastemeijer; P.M. Sarro; T.G.M. Schalkhammer; D. Criado; V.P. Jordanov;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 39-42, 2000.

  2210. Exploration of the Piezojunction effect using PNP lateral transistors on [100] silicon
    F. Fruett; G.C.M. Meijer;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 519-522, 2000.

  2211. Reflective 2D pixelated membranes for micromachined spatial light modules
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 333-336, 2000.

  2212. A system for testing the sterility of food products with impedance measurement
    G.P. Shterev; S. Nihtianov; N. Petrov; G.C.M. Meijer;
    In ET'2000: proceedings book 1,
    s.n., pp. 79-86, 2000.

  2213. Patterning of polyimide and metal in deep grooves
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 467-470, 2000.

  2214. Etching behavior of KOH at the convex corner
    V.G. Kiutchoukov; M. Bao; A. Bossche;
    In ET'2000: proceedings book 2,
    s.n., pp. 128-133, 2000.

  2215. Universal sensor interface
    X. Li; G.C.M. Meijer; P. Avramov; M. van de Lee;
    In ET'2000: proceedings book 1,
    s.n., pp. 41-46, 2000.

  2216. Interface system for impedance measurement based on a relaxation oscilator
    B. Iliev; S. Nihtianov; G.P. Shterev; G.C.M. Meijer;
    In ET'2000: proceedings book 1,
    s.n., pp. 71-78, 2000.

  2217. Stress sensors based on the use of the piezojunction effect
    F. Fruett; G.C.M. Meijer;
    In ET'2000: proceedings book 1,
    s.n., pp. 47-52, 2000.

  2218. A CMOS nested chopper instrumentation amplifier with 100 nV offset
    A. Bakker; J.H. Huijsing;
    In 47th Annual ISSCC: digest of technical papers,
    IEEE, pp. 156-157, 2000.

  2219. Features and limitations of CMOS voltage references
    G.C.M. Meijer; Guijie Wang;
    In The eight national scientific and applied conference ELECTRONICS '99: proceedings book 1,
    Technical University Sofia, pp. 17-23, 2000.

  2220. Integrated shape sensor for particles and cells based on optical projection
    J.H. Nieuwenhuis; W. Lubking; A. Berthold; P.M. Sarro; M.J. Vellekoop;
    In {R Reus}, de; {S Bouwstra} (Ed.), Eurosensors XIV,
    Mikroelektronik Centret, pp. 891-894, 2000.

  2221. Zekeringhouder met meetinrichting voor meting van het elektriciteitsverbruik van afzonderlijke verbruiksgroepen
    P.J. Trimp; M.J. Pelk;
    2000.

  2222. Device with common mode feedback for a differential output (joint research contract, Philips Semiconductors, Sunnyvale, Ca, USA)
    J.H. Huijsing;
    2000.

  2223. Apparatus for measuring a small quantity of a liquid
    M.J. Vellekoop; K.T. Hjelt; W. Lubking;
    2000.

  2224. Device for determining the direction and speed of an air flow (joint research contract, Philips Semiconductors, Sunnyvale, Ca, USA)
    J.H. Huijsing;
    2000.

  2225. Integrated shape sensor for particles and cells based on optical projection
    J.H. Nieuwenhuis; W. Lubking; M.J. Vellekoop;
    2000.

  2226. Rail-to-rail input stages with constant Gm and constant common-mode output currents (joined research contract, Philips Semiconductors Sunnyvale, Ca, USA - TUD)
    J.H. Huijsing;
    2000.

  2227. Multi-stage amplifier with frequency compensation (joint research contract, Philips Semiconductors, Sunnyvale, Ca, USA)
    J.H. Huijsing;
    2000.

  2228. Combination drive-summing circuit for rail-to-rail differential amplifier (joint research contract, Philips Semiconductors, Sunnyvale, Ca, USA)
    J.H. Huijsing;
    2000.

  2229. Galvanic etching of silicon for fabrication of micromechanical structures
    C.M.A. Ashruf;
    PhD thesis, Delft University of Technology, 2000.

  2230. Low-cost multiple sensor systems
    G.C.M. Meijer;
    Journal {"}A{"},
    Volume 40, Issue 1, pp. 20-25, 1999.

  2231. Bulk-micromachined tunable Fabry-Perot microinterferometer for the visible spectral range
    J.H.G. Correia; M. Bartek; R.F. Wolffenbuttel;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 76, Issue 1-3, pp. 191-196, 1999.

  2232. Silver-based reflective coatings for micromachined optical filters
    M. Bartek; J.H.G. Correia; R.F. Wolffenbuttel;
    Journal of Micromechanics and Microengineering,
    Volume 9, pp. 162-165, 1999.

  2233. Integrated interfaces for low-cost multiple-sensor systems
    G.C.M. Meijer; F.M.L. van der Goes; P.C. de Jong; X. Li; F.N.Toth;
    Journal of Intelligent Material Systems and Structures,
    Volume 10, pp. 105-115, 1999.

  2234. Application of the integrated reliability analysis system (IRAS)
    G. Kócza; A. Bossche;
    Reliability Engineering & System Safety,
    Volume 64, pp. 99-107, 1999.

  2235. Low-cost CMOS smart temperature sensor with digital bus interface
    A. Bakker; J.H. Huijsing;
    Journal {"}A{"},
    Volume 40, Issue 1, pp. 31-35, 1999.

  2236. Liquid-crystal lenses with a controlled focal length. II. Numerical optimisation and experiments
    G. Vdovin; I.R. Guralnik; S.P. Kotova; M. Loktev; A.F. Naumov;
    Quantum Electronics,
    Volume 29, Issue 3, pp. 261-264, 1999.

  2237. Liquid-crystal lenses with a controlled focal length. I. Theory
    G. Vdovin; I.R. Guralnik; S.P. Kotova; M. Loktev; A.F. Naumov;
    Quantum Electronics,
    Volume 29, Issue 3, pp. 256-260, 1999.

  2238. Finite element analysis of the open window plastic package for optical sensors
    C.V.B. Cotofana; A. Bossche;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 76, Issue 1-3, pp. 386-394, 1999.

  2239. Compensation of piezoresistivity effect in p-type implanted resistors
    F. Fruett; G.C.M. Meijer;
    Electronics Letters,
    Volume 35, Issue 18, pp. 1587-1588, 1999.

  2240. A novel molecularly imprinted thin film applied to a Love wave gas sensor
    B.H. Jakoby; G.M. Ismail; M.P. Byfield; M.J. Vellekoop;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 76, pp. 93-97, 1999.

  2241. A theoretical and experimental study of the piezojunction effect in silicon and its application in new sensor structures STW: Del.3908-3
    F. Fruett; G.C.M. Meijer;
    Technische Universiteit Delft, Faculty ITS, , 1999.

  2242. Fast and reliable capactive transducers (DEL 4540) Report 3
    X. Li;
    Technische Universiteit Delft, Faculty ITS, , 1999.

  2243. Devices for catheter localization inside the human body
    D. Tanase;
    s.n., , 1999.

  2244. Fast and reliable capactive transducers (DEL 4540) Report 2
    X. Li;
    Technische Universiteit Delft, Faculty ITS, , 1999.

  2245. Micro-instrumentation systems in silicon
    R.F. Wolffenbuttel;
    Delft University of Technology, , 1999.

  2246. A theoretical and experimental study of the piezojunction effect in silicon and its application in new sensor structures STW: Del.3908-2
    F. Fruett; G.C.M. Meijer;
    Technische Universiteit Delft, Faculty ITS, , 1999.

  2247. Final Technical Report of project BE-1167 MULTISTRESS (period 1-1-96 to 31-12-98) Improving multilayered metallic materials by controlling stress, strain and interface quality and new equipment for determing these characteristics.
    O. Thomas; B. Chenevier; E.J. Mittemeijer; J.E. Sundgren; D. de Boer; A. Charaï; L. Roux; P. Gergaud; A Böttger; H. Yang; F Torregrossa; A Leenaers; P Sandstrom;
    TU Delft, , 1999.

  2248. Compact low-voltage and high-speed CMOS, BiCMOS and bipolar operational amplifiers
    K.J. de Langen; J.H. Huijsing;
    Kluwer, , 1999.

  2249. Hermetic packages and feedthroughs for neural prostheses (Quarterly progress report 5)
    R.F. Wolffenbuttel;
    National Institutes of Health, NINDS, , 1999. N01-NS-8-2387.

  2250. Spectral analysis through electromechanical coupling
    E. Cretu; M. Bartek; R.F. Wolffenbuttel;
    {M. Bartek} (Ed.);
    Delft University of Technology, , pp. 789-790, 1999.

  2251. A low-cost high-accuracy CMOS smart temperature sensor
    A. Bakker; J.H. Huijsing;
    {BJ Hosticka}; {G Zimmer}; {H Grünbacher} (Ed.);
    Editions Frontieres, , pp. 302-305, 1999.

  2252. A first year course in integrative learning: a practical example of back to the basics
    O. Rompelman; M.J. Vellekoop;
    European Society for Engineering Education, , pp. 225-230, 1999.

  2253. Reliability of silicon nitride as structural material in MEMS
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    {Y Vladimirsky}; {CR Friedrich} (Ed.);
    International Society for Optical Engineering, , pp. 174-183, 1999.

  2254. On-chip integrated CMOS optical microspectrometer with light-to-frequency converter and bus interface
    G. de Graaf; J.H.G. Correia; M. Bartek; R.F. Wolffenbuttel;
    {JH. Wuorinen} (Ed.);
    IEEE, , pp. 208-209, 1999.

  2255. A smart accurate presure-transducer for high-temperature applications
    P.C. de Jong; G.C.M. Meijer;
    {V Piuri}; {M Savino} (Ed.);
    IEEE, , pp. 309-314, 1999.

  2256. A low-cost and reliable interface for capacitive sensors
    X. Li; G.C.M. Meijer;
    {V Piuri}; {M Savino} (Ed.);
    IEEE, , pp. 1256-1259, 1999.

  2257. The effect of electric-field bending on the linearity of capacitive position sensors with various elecrode structures
    X. Li; G. de Jong; G.C.M. Meijer;
    {V Piuri}; {M Savino} (Ed.);
    IEEE, , pp. 1348-1351, 1999.

  2258. Optical microspectrometer using a micro-instrumentation platform
    M. Bartek; J.H.G. Correia; G. de Graaf; R.F. Wolffenbuttel;
    s.n., , pp. 99-106, 1999.

  2259. Stray-light compensation in thin-film Fabry-Perot optical filters: application to an on-chip spectrometer
    M. Bartek; J.H.G. Correia; S.H. Kong; R.F. Wolffenbuttel;
    Institute of Electrical Engineers of Japan, , pp. 240-243, 1999.

  2260. Thermal stabilisation of integrated silicon platforms using polysilicon and SiGe Peltier elements
    D.D.L. Wijngaards; S.H. Kong; M. Bartek; R.F. Wolffenbuttel;
    Institute of Electrical Engineers of Japan, , pp. 310-313, 1999.

  2261. Accelerometer with electrically tunable spectral sensitivity
    E. Cretu; M. Bartek; R.F. Wolffenbuttel;
    Institute of Electrical Engineers of Japan, , pp. 1298-1301, 1999.

  2262. Ultraviolet-selective avalanche photodiode
    A. Pauchard; P.A. Besse; M. Bartek; R.F. Wolffenbuttel; R.S. Popovic;
    Institute of Electrical Engineers of Japan, , pp. 236-239, 1999.

  2263. Analytical modelling for accelerometers with electrically tunable sensitivity
    E. Cretu; M. Bartek; R.F. Wolffenbuttel;
    s.n., , pp. 601-604, 1999.

  2264. Single-chip CMOS optical microspectrometer
    J.H.G. Correia; G. de Graaf; S.H. Kong; M. Bartek; R.F. Wolffenbuttel;
    Institute of Electrical Engineers of Japan, , pp. 869-899, 1999.

  2265. Fluorescence detection in (sub-)nanoliter microarrays
    L.R. van den Doel; M.J. Vellekoop; P.M. Sarro; S. Picioreanu; R. Moerman; J. Frank; G. van DedemWK; K.T. Hjelt; L. van VlietJ; I.T. Young;
    M Ferrari (Ed.);
    , pp. 28-39, 1999. ISSN: 0277-786X.

  2266. Study of active on-chip cooling using integrated Peltier elements
    S.H. Kong; D.D.L. Wijngaards; M. Bartek; R.F. Wolffenbuttel;
    {M. Bartek} (Ed.);
    Delft University of Technology, , pp. 319-322, 1999.

  2267. Microinjection of beta-D-glucose standards and Amplex Red reagent on microarrays
    R. Moerman; L.R. van den Doel; S. Picioreanu; J. Frank; J.C.M. Marijnissen; G. van DedemWK; K.T. Hjelt; M.J. Vellekoop; P.M. Sarro; I.T. Young;
    M Ferrari (Ed.);
    , pp. 119-128, 1999. ISSN: 0277-786X Proc. SPIE, Progress in Biomedical Optics, Vol: 3606.

  2268. Lamb wave sensor with tensile ZnO for liquid property sensing
    S. Koller; O. Brand; H. Baltes; B.H. Jakoby; P.M. Sarro; M.J. Vellekoop;
    In Transducers '99: digest of technical papers. Vol. 2,
    Institute of Electrical Engineers of Japan, pp. 1512-1515, 1999.

  2269. Novel zero temperature-coefficient Love-wave sensors
    B.H. Jakoby; J. Bastemeijer; M.J. Vellekoop;
    In Transducers '99: digest of technical papers. Vol. 2,
    Institute of Electrical Engineers of Japan, pp. 1258-1261, 1999.

  2270. A novel technological process for glass-to-glass anodic bonding
    M. Berthold; L. Nicola; P.M. Sarro; M.J. Vellekoop;
    In Transducers '99: digest of technical papers. Vol. 2,
    Institute of Electrical Engineers of Japan, pp. 1324-1327, 1999.

  2271. Measurement of liquid volumes in sub-nanoliter reactors
    K.T. Hjelt; P. Szczaurski; L.R. van den Doel; W. Lubking; B.H. Jakoby; M.J. Vellekoop;
    In Transducers '99: digest of technical papers. Vol. 1,
    Institute of Electrical Engineers of Japan, pp. 748-751, 1999.

  2272. A microacoustic wave based biosensor utilizing molecularly imprinted materials - device aspects
    B.H. Jakoby; M.J. Vellekoop; E. Chastaing; J.F. Lipskier;
    In {P Vincenzini}; {L Dori} (Ed.), Solid state chemical and biochemical sensors (Advances in science and technology 26),
    Techna, pp. 455-462, 1999.

  2273. Uniform photoresist coating of anisotropically etched cavities in silicon
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    In SAFE99: proceedings. ProRISC99:proceedings,
    STW Technology Foundation, pp. 697-700, 1999.

  2274. Technology of pixelated reflective membranes for spatial light modulators
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 671-675, 1999.

  2275. Mechanical aspects of reliability of micromechanical structures
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 225-232, 1999.

  2276. Glass-to-glass anodic bonding
    M. Berthold; L. Nicola; P.M. Sarro; M.J. Vellekoop;
    In SAFE99:proceedings. ProRISC99: proceedings,
    STW Technology Foundation, pp. 33-36, 1999.

  2277. Position-sensitive detectors for a wavefront sensor
    D.W. de Lima Monteiro; G. Vdovin; P.M. Sarro;
    In SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 287-293, 1999.

  2278. Monitoring of sub-nanoliter liquid volumes in miniaturized chemical reactors
    K.T. Hjelt; L.R. van den Doel; W. Lubking; M.J. Vellekoop;
    In SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 199-204, 1999.

  2279. An experimental study of the influence of the piezojunction effect on the accuracy of silicon temperature sensors
    F. Fruett; G.C.M. Meijer;
    In {JP Veen} (Ed.), SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 143-146, 1999.

  2280. A low-power CMOS ED modulator for IF A/D conversion in GSM based receivers
    L.J. Breems; E.J. van der Zwan;
    In SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 63-67, 1999.

  2281. A Love-wave ice detector
    M.J. Vellekoop; B.H. Jakoby; J. Bastemeijer;
    In Proceedings vol. 1,
    IEEE, pp. 453-456, 1999.

  2282. Micro-injection of b-D-glucose standards and Amplex Red reagent on micro-arrays
    R. Moerman; L.R. van den Doel; S. Picioreanu; J. Frank; J.C.M. Marijnissen; G. van Dedem; K.T. Hjelt; M.J. Vellekoop; P.M. Sarro; I.T. Young;
    In {M Ferrari} (Ed.), Progress in biomedical optics (Proceedings SPIE 3606),
    International Society for Optical Engineering, pp. 119-128, 1999.

  2283. A CMOS spinning-current Hall effect sensor with integrated submicrovolt offset instrumentation amplifier
    A. Bakker; J.H. Huijsing;
    In SAFE99: proceedings. ProRISC99: proceedings [CD-ROM],
    STW Technology Foundation, pp. 17-20, 1999.

  2284. Integral first-year tutorial based on learning by doing
    M.J. Vellekoop; E.D.U. de Graaff;
    In {J Conway}; {D Melville}; {A Williams} (Ed.), Research and development in problem based learning. Vol. 5. PBL: a way forward,
    University of Newcastle, pp. 240-245, 1999.

  2285. Fluorescence detection in (sub-)nanoliter microarrays
    L.R. van den Doel; M.J. Vellekoop; P.M. Sarro; S. Picioreanu; R. Moerman; J.E. Frank; G. van Dedem; K.T. Hjelt; L. van VlietJ; I.T. Young;
    In {M Ferrari} (Ed.), Progress in biomedical optics (Proceedings SPIE 3606),
    International Society for Optical Engineering, pp. 28-39, 1999.

  2286. Various layouts of analog CMOS optical position-sensitive detectors
    D.W. de Lima Monteiro; G. Vdovin; P.M. Sarro;
    In {SM Goodnick} (Ed.), Proceedings of SPIE, vol. 3794,
    International Society for Optical Engineering, pp. 134-142, 1999.

  2287. Micromachined SLM based on pixelated reflective membranes
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In {JD Gonglewski}; {MA Vorontsov} (Ed.), Proceedings of SPIE, vol. 3760,
    International Society for Optical Engineering, pp. 23-31, 1999.

  2288. High power laser diode to fiber coupling using a membrane mirror
    G. Vdovin; S. Sakarya; F. Gonté; A. Courteville; E. Rochat; K. Haroud; N. Collings; R. Dandliker;
    In Proceedings,
    World Scientific, pp. 346-351, 1999.

  2289. Modal liquid crystal wavefront correctors
    G. Vdovin; G.D. Love; I.R. Guralnik; M. Loktev; A.F. Naumov;
    In Proceedings,
    World Scientific, pp. 123-129, 1999.

  2290. Integration of a Hartmann-shack wavefront sensor
    D.W. de Lima Monteiro; G. Vdovin; P.M. Sarro;
    In Proceedings,
    World Scientific, pp. 215-220, 1999.

  2291. A first year course in integrative learning: a practical example of 'back to the basics
    O. Rompelman; M.J. Vellekoop;
    In Proceedings,
    SEFI HQ, pp. 225-230, 1999.

  2292. An experimental study of the influence of the piezojunction effect on the accuracy of silicon temperature sensors
    F. Fruett; G.C.M. Meijer;
    In ICMP 99 technical digest,
    s.n., pp. 75-80, 1999.

  2293. Dynamic voltage references in CMOS technology
    G.C.M. Meijer; Guijie Wang;
    In ICMP 99 technical digest,
    s.n., pp. 1-8, 1999.

  2294. A 1.8mW CMOS ED modulator with integrated mixer for A/D conversion of IF signals
    L.J. Breems; W.F. van der Zwan; C. Dijkmans; J.H. Huijsing;
    In ISSCC 1999: digest of technical papers,
    IEEE, pp. 52-53, 1999.

  2295. Technology of pixelated flexible silicon structures for spatial light modulators
    S. Sakarya; G. Vdovin; P.M. Sarro;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings [CD-ROM],
    Delft University of Technology, pp. 737-740, 1999.

  2296. A test structure to characterize the piezojunction effect and its influence on silicon temperature sensors
    F. Fruett; G.C.M. Meijer;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings [CD-ROM],
    Delft University of Technology, pp. 53-56, 1999.

  2297. Versatile tool for characterising long term stability and reliability of micromechanical structures
    R. Kazinczi; J.R. Mollinger; A. Bossche;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings [CD-ROM],
    Delft University of Technology, pp. 1-5, 1999.

  2298. Novel method for spinning of photoresist on wafers with through-holes
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings [CD-ROM],
    Delft University of Technology, pp. 277-280, 1999.

  2299. All-glass microstructures for (bio)chemical analysis systems
    M. Berthold; L. Nicola; P.M. Sarro; M.J. Vellekoop; G. Pignatel;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings,
    Delft University of Technology, pp. 975-978, 1999.

  2300. Monitoring of liquid evaporation in sub-nanoliter reactors
    K.T. Hjelt; L.R. van den Doel; P. Szczaurski; W. Lubking; M.J. Vellekoop;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings,
    Delft University of Technology, pp. 695-698, 1999.

  2301. A novel high-resolution liquid-conductivity detector
    F.P.J. Laugere; W. Lubking; M. Berthold; J. Bastemeijer; M.J. Vellekoop;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings,
    Delft University of Technology, pp. 211-214, 1999.

  2302. Novel method for spinning of photoresist on wafers with through-holes
    V.G. Kiutchoukov; A. Bossche; J.R. Mollinger;
    In {M. Bartek} (Ed.), Eurosensors XIII: book of abstracts,
    Delft University of Technology, pp. 137-138, 1999.

  2303. A Love-wave detector for a road-condition control system
    M.J. Vellekoop; J. Bastemeijer; B.H. Jakoby;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings,
    Delft University of Technology, pp. 243-246, 1999.

  2304. Piezoelectric ZnO membrane resonators for liquid property sensing
    S. Koller; O. Brand; P.M. Sarro; M.J. Vellekoop; H. Baltes;
    In {M. Bartek} (Ed.), Eurosensors XIII: proceedings,
    Delft University of Technology, pp. 677-680, 1999.

  2305. Monitoring of liquid evaporation in subnanoliter reactors
    K.T. Hjelt; L.R. van den Doel; P. Szczaurski; W. Lubking; M.J. Vellekoop;
    In Eurosensors XIII, Proc. 13th European Conference on Solid-State Transducers,
    pp. 695-698, 1999.

  2306. The temperature characteristics of bipolar transistors for CMOS temperature sensors
    Guijie Wang; G.C.M. Meijer;
    In Eurosensors XIII,
    s.n., pp. 553-556, 1999.

  2307. Design for optimum performance-to-power ratio of a continuous-time ED modulator
    L.J. Breems; W.F. van der Zwan; J.H. Huijsing;
    In {BJ Hosticka}; {G Zimmer}; {H Grünbacher} (Ed.), ESSIRC '99: proceedings,
    Editions Frontieres, pp. 318-321, 1999.

  2308. Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching
    V.G. Kiutchoukov; J.R. Mollinger; A. Bossche;
    In Electronics '99,
    Technical University Sofia, pp. 102-106, 1999.

  2309. Non-destructive on-line sterility testing of long-shelf-life aseptically packaged food products by impedance mearurements
    S. Nihtianov; G.C.M. Meijer;
    In 1999 IEEE Autotestcon proceedings,
    IEEE, pp. 243-249, 1999.

  2310. A novel low-cost noncontact resistive potentiometric sensor for the measurement of low speeds [niet eerder opgevoerd]
    X. Li; G.C.M. Meijer;
    IEEE Transactions on Instrumentation and Measurement,
    Volume 47, Issue 3, pp. 776-781, 1998.

  2311. Magnetic-field measurements using an integrated resonant magnetic-field sensor [niet eerder opgevoerd]
    Z. Kádár; A. Bossche; P.M. Sarro; J.R. Mollinger;
    Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
    Volume 70, pp. 225-232, 1998.

  2312. VIERS-1 scatterometer model [niet eerder opgevoerd]
    PA.E.M. Janssen; H. Wallbrink; C.J. Calkoen; D. van Halsema; W.A. Oost; M.F. Snoeij;
    Journal Of Geophysical Research-Oceans,
    Volume 103, Issue C4, pp. 7807-7831, 1998.

  2313. Fluorescence detection in (sub)-nano liter microarrays [niet eerder opgevoerd]
    L.R. van den Doel; M.J. Vellekoop; P.M. Sarro; S. Picioreanu; R. Moerman; H. Frank; G. van Dedem; K.T. Hjelt; I.T. Young;
    In {BM Haar Romeny}, ter; {D.H.J. Epema}; {JFM Tonino}; {AA Wolters} (Ed.), ASCI'98: proceedings,
    Advanced School for Computing and Imaging, pp. 58-62, 1998.

  2314. A low-cost and accurate interface for voltage-generating sensors [niet eerder opgevoerd]
    X. Li; G.C.M. Meijer;
    In Proceedings of the conference. Book 1,
    Technical University Sofia, pp. 82-86, 1998.

  2315. Fluorescence detection in (sub-)nano liter microarrays
    L.R. van den Doel; M.J. Vellekoop; P.M. Sarro; S. Picioreanu; R. Moerman; H. Frank; G. van DedemWK; K.T. Hjelt; I.T. Young;
    In {ter Haar Romeny}, BM; D.H.J. Epema; JFM Tonino; AA Wolters (Ed.), Proc. ASCI'98, 4th Annual Conf. of the Advanced School for Computing and Imaging,
    pp. 58-62, 1998.

  2316. Reducing the temperature sensitivity of Love-wave sensors [niet eerder opgevoerd]
    B.H. Jakoby; M.J. Vellekoop;
    In {SC Schneider}; {M Levy}; {BR Mcavoy} (Ed.), Proceedings,
    IEEE, pp. 447-450, 1998.

  2317. Viscous losses of shear waves in layered structures used for biosensing [niet eerder opgevoerd]
    B.H. Jakoby; M.J. Vellekoop;
    In {SC Schneider}; {M Levy}; {BR Mcavoy} (Ed.), Proceedings. Vol. 1,
    IEEE, pp. 493-496, 1998.

  2318. LightPipes: software for education in coherent optics
    G.V. Vdovin; H. van Brug; F.A. van Goor;
    In CHF Velzel (Ed.), Fifth International Topical Meeting on Education and Training in Optics,
    pp. 82-93, 1997. zie ook E.T..

  2319. Magnetoresistive Sensors for Biological and Biomedical Applications
    Freitas, PP; Cardoso, FA; Martins, VC; Loureiro, J; Amaral, J; Chaves, RC; Cardoso, S;

  2320. COMPARISON OF SPIN VALVE AND MAGNETIC TUNNEL JUNCTION MAGNETO RESISTIVE SENSORS IN EDDY CURRENT TESTING PROBES
    Rosado, Luis S; Cardoso, Filipe A; Cardoso, Susana; Santos, Telmo G; Ramos, Pedro M; Freitas, Paulo P; Piedade, Mois{\'e}s;

  2321. D1L-A: Amperometric Lab on CMOS Systems
    Moser, N; Leong, C; Hu, Y; Boutelle, M; Georgiou, P; Parsnejad, S; Li, H; Mason, A; Rate, Acidification; Nabovati, G; others;

  2322. ISCAS 2016 SPECIAL ISSUE
    Wang, G; Poscente, MD; Park, SS; Andrews, CN; Yadid-Pecht, O; Mintchev, MP; Costa, T; Cardoso, FA; Germano, J; Freitas, PP; others;

  2323. BIOLOGICAL DETECTION LIMIT OF A GMR-BASED BIOCHIP FOR PATHOGENIC ANALYSIS
    Martins, VC; Cardoso, FA; Cardoso, S; Fonseca, LP; Freitas, PP;

  2324. SPECIAL SECTION ON THE 2008 ADVANCED METHODS FOR UNCERTAINTY ESTIMATION IN MEASUREMENT WORKSHOP
    Djikpesse, H; Armstrong, P; Rufino, R; Hawthorn, A; Mencattini, A; Salicone, S; Rabottino, G; Salmeri, M; Germano, J; de Almeida, TM; others;

  2325. ISSCC 2021/SESSION 19/OPTICAL SYSTEMS FOR EMERGING APPLICATIONS/19.2
    Moazeni, Sajjad; Pollmann, Eric H; Boominathan, Vivek; Cardoso, Filipe A; Robinson, Jacob T; Veeraraghavan, Ashok; Shepard, Kenneth L;

  2326. ieeetranbstctl,

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