[2023] 3D Integration and Packaging Schemes for Smart Ultrasound Devices

• Conventional ultrasound probes contain a transducer array connected using a bundle of cables to an imaging system. To enable 3D imaging, which requires far more transducer elements than can be realistically connected via cables, chips have been integrated directly underneath the transducer array to locally process the signals. In a pitch-matched design, the amount of chip area available to process the signals of one transducer element equals the size of that element. With element dimensions in the order of 100s of um, the functionality that can thus be realized is very limited.
• 3D packaging techniques, such as the stacking of multiple dies, can break this limitation. In this project we aim to develop and prototype an innovative integration scheme that allows multiple dies to be combined in order to significantly increase the available die area for in-probe signal processing.

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Last modified: 2023-02-12