Daniel Tyukov
Daniel Tyukov joined the Electronic Instrumentation group in September 2026, from the Electrical Engineering department (MSc Microelectronics track). His research interests are precision analog and mixed-signal integrated-circuit design and sensor readout. For his MSc thesis, in collaboration with NXP, he is designing and taping out an on-chip solder-joint resistance sensor for early detection of degrading board interconnects in automotive and robotics systems (project: "An on-chip resistance sensor for solder-joint degradation monitoring"). Outside the lab he enjoys hands-on electronics, designing and hand-soldering his own PCBs and building small analog and embedded measurement circuits, the same tinkering that drew him to precision sensing in the first place.
Advisor(s): Kofi Makinwa
Program: MSc Microelectronics
